FFSB1065A [ONSEMI]

SiC 二极管 - 650V,10A,D2PAK;
FFSB1065A
型号: FFSB1065A
厂家: ONSEMI    ONSEMI
描述:

SiC 二极管 - 650V,10A,D2PAK

功效 测试 光电二极管
文件: 总6页 (文件大小:295K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
10 A, 650 V, D1, D2PAK-2L  
1.,3. Cathode  
2. Anode  
Schottky Diode  
FFSB1065A  
3
Description  
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size and cost.  
1
2
D2PAK2L (TO2632L)  
CASE 418BK  
MARKING DIAGRAM  
Features  
AYWWZZ  
FFSB  
1065A  
Max Junction Temperature 175°C  
Avalanche Rated 64 mJ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
A
YWW  
ZZ  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot Code  
No Reverse Recovery/No Forward Recovery  
This Device is PbFree, Halogen Free/BFR Free and RoHS  
Compliant  
FFSB1065A = Specific Device Code  
Applications  
General Purpose  
SMPS, Solar Inverter, UPS  
Power Switching Circuits  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
January, 2023 Rev. 7  
FFSB1065A/D  
FFSB1065A  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Value  
Unit  
V
V
RRM  
Peak Repetitive Reverse Voltage  
Single Pulse Avalanche Energy (Note 1)  
Continuous Rectified Forward Current @ T < 152°C  
650  
E
AS  
64  
mJ  
A
I
F
10  
C
Continuous Rectified Forward Current @ T < 135°C  
14  
760  
C
I
Non-Repetitive Peak Forward Surge Current  
A
A
T
C
T
C
= 25°C, 10 ms  
= 150°C, 10 ms  
F, Max  
740  
I
Non-Repetitive Forward Surge Current  
Repetitive Forward Surge Current  
Power Dissipation  
Half-Sine Pulse, t = 8.3 ms  
56  
A
F,SM  
p
I
Half-Sine Pulse, t = 8.3 ms  
38  
A
F,RM  
p
Ptot  
T
= 25°C  
106  
W
W
°C  
C
C
T
= 150°C  
18  
T , T  
J
Operating and Storage Temperature Range  
55 to +175  
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 64 mJ is based on starting T = 25°C, L = 0.5 mH, I = 16 A, V = 50 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max  
1.4  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 10 A, T = 25°C  
Min  
Typ  
1.5  
1.6  
1.72  
Max  
1.75  
2.0  
2.4  
200  
400  
600  
Unit  
V
F
V
F
C
I = 10 A, T = 125°C  
F
C
I = 10 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 650 V, T = 25°C  
mA  
C
= 650 V, T = 125°C  
C
= 650 V, T = 175°C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 400 V  
34  
575  
62  
47  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 200 V, f = 100 kHz  
= 400 V, f = 100 kHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Reel Size  
Tape Width  
Shipping  
FFSB1065A  
FFSB1065A  
D2PAK2L  
(TO2632L)  
PbFree/Halogen  
Free  
330 mm  
24 mm  
800 Units /  
Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
FFSB1065A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
105  
106  
107  
10  
8
o
C
6
T
= 175  
o
J
4
T
= 125  
C
J
TJ = 175 o  
TJ = 125 o  
C
o
= 75 C  
108  
109  
T
J
TJ = 25 o  
TJ = 55oC  
C
2
C
TJ = 75 o  
C
o
= 25 C  
T
J
o
= 55 C  
T
J
0
0.0  
0.5  
1.0  
1.5  
2.0  
200  
300  
400  
500  
600 650  
V , FORWARD VOLTAGE (V)  
VR, REVERSE VOLTAGE (V)  
F
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
150  
100  
50  
120  
100  
80  
60  
40  
20  
0
D = 0.1  
D = 0.2  
D = 0.3  
D = 0.5  
D = 0.7  
D = 1  
0
25  
50  
75  
100 125 150 175  
25  
50  
75  
100 125 150 175  
C, CASE TEMPERATUREo(C)  
C, CASE TEMPERATUREo(C)  
T
T
Figure 3. Current Derating  
Figure 4. Power Derating  
1000  
100  
10  
50  
40  
30  
20  
10  
0
0.1  
1
10  
100  
650  
0
100 200 300 400 500 600650  
VR, REVERSE VOLTAGE (V)  
VR, REVERSE VOLTAGE (V)  
Figure 5. Capacitive Charge vs. Reverse Voltage  
Figure 6. Capacitance vs. Reverse Voltage  
www.onsemi.com  
3
FFSB1065A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
12  
10  
8
6
4
2
0
0
100 200 300 400 500 600650  
VR, REVERSE VOLTAGE (V)  
Figure 7. Capacitance Stored Energy  
2
1
DUTY CYCLEDESCENDING ORDER  
D=0.5  
101  
102  
103  
104  
PDM  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
t1  
t2  
D=0.01  
NOTES:  
Z
R
(t) = r(t) x R  
qJC  
qJC  
o
= 1.4 C/W  
qJC  
Peak T = P  
Duty Cycle, D = t / t  
x Z (t) + T  
J
DM  
qJC C  
SINGLE PULSE  
105  
1
2
106  
104  
t, RECTANGULAR PULSE DURATION (sec)  
103  
102  
101  
1
Figure 8. Junction-to-Case Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
V
DD  
DUT  
t
0
t
1
t
2
t
Figure 9. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D2PAK2 (TO2632L)  
CASE 418BK  
ISSUE O  
DATE 02 AUG 2018  
GENERIC  
MARKING DIAGRAM*  
XXXXXXXXG  
AYWW  
XXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93788G  
D2PAK2 (TO2632L)  
PAGE 1 OF 1  
onsemi and  
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation  
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
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