FFSD10120A [ONSEMI]

碳化硅肖特基二极管;
FFSD10120A
型号: FFSD10120A
厂家: ONSEMI    ONSEMI
描述:

碳化硅肖特基二极管

局域网 功效 光电二极管 肖特基二极管
文件: 总6页 (文件大小:395K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
10 A, 1200 V, D1, DPAK  
1, 3 Cathode  
2 Anode  
Schottky Diode  
FFSD10120A  
Description  
3
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size and cost.  
1
2
DPAK  
CASE 369AS  
Features  
MARKING DIAGRAM  
Max Junction Temperature 175°C  
Avalanche Rated 100 mJ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
FFS  
D10120A  
AYWWZZ  
No Reverse Recovery/No Forward Recovery  
This Device is PbFree, Halogen Free/BFR Free and RoHS  
Compliant  
Applications  
General Purpose  
SMPS, Solar Inverter, UPS  
Power Switching Circuits  
FFSD10120A  
A
Y
WW  
ZZ  
= Specific Device Code  
= Assembly Location  
= Year  
= Work Week  
= Assembly Lot Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
February, 2023 Rev. 4  
FFSD10120A/D  
FFSD10120A  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
V
Parameter  
Value  
1200  
100  
Unit  
V
Peak Repetitive Reverse Voltage  
Single Pulse Avalanche Energy (Note 1)  
Continuous Rectified Forward Current @ T < 164°C  
RRM  
E
AS  
mJ  
A
I
F
10  
C
Continuous Rectified Forward Current @ T < 135°C  
22  
A
C
I
Non-Repetitive Peak Forward Surge Current  
850  
A
T
C
T
C
= 25°C, 10 ms  
= 150°C, 10 ms  
F,Max  
800  
A
I
Non-Repetitive Forward Surge Current  
Repetitive Forward Surge Current  
Power Dissipation  
HalfSine Pulse, t = 8.3 ms  
90  
A
F,SM  
p
I
HalfSine Pulse, t = 8.3 ms  
35  
A
F,RM  
p
P
T
= 25°C  
283  
W
W
°C  
TOT  
C
C
T
= 150°C  
47  
T , T  
J
Operating and Storage Temperature Range  
55 to +175  
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 100 mJ is based on starting T = 25°C, L = 0.5 mH, I = 20 A, V = 150 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max  
0.53  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 10 A, T = 25°C  
Min  
Typ  
1.45  
1.7  
2.0  
Max  
1.75  
2.0  
2.4  
200  
300  
400  
Unit  
V
F
V
F
C
I = 10 A, T = 125°C  
F
C
I = 10 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 1200 V, T = 25°C  
mA  
C
= 1200 V, T = 125°C  
C
= 1200 V, T = 175°C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 800 V  
62  
612  
58  
47  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 400 V, f = 100 kHz  
= 800 V, f = 100 kHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
FFSD10120A  
FFSD10120A  
DPAK  
Tape & Reel  
13″  
N/A  
2500 Units  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
www.onsemi.com  
2
 
FFSD10120A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
1
20  
15  
10  
T = 55°C  
T = 25°C  
J
J
0
10  
T = 75°C  
J
T = 175°C  
J
T = 125°C  
J
1  
10  
5
10  
T = 125°C  
J
T = 175°C  
J
2  
10  
10  
T = 25°C  
J
T = 75°C  
J
T = 55°C  
J
3  
0
0
1
2
3
4
200  
400  
600  
800  
1000  
1200  
V , Forward Voltage (V)  
F
V , Reverse Voltage (V)  
R
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
250  
200  
150  
100  
50  
T = 55°C  
T = 25°C  
J
J
D = 0.1  
T = 75°C  
J
D = 0.2  
D = 0.3  
D = 0.5  
T = 125°C  
J
T = 175°C  
J
D = 0.7  
D = 1  
0
1000  
1100  
1200  
1300  
1400  
1500  
25  
50  
75  
100  
125  
150  
175  
V , Reverse Voltage (V)  
T , Case Temperature (5C)  
R
C
Figure 4. Current Derating  
Figure 3. Reverse Characteristics  
300  
250  
200  
150  
100  
50  
80  
60  
40  
20  
0
0
0
200  
400  
600  
800  
1000  
25  
50  
75  
100  
125  
150  
175  
V , Reverse Voltage (V)  
T , Case Temperature (5C)  
R
C
Figure 5. Power Derating  
Figure 6. Capacitive Charge vs. Reverse Voltage  
www.onsemi.com  
3
FFSD10120A  
TYPICAL CHARACTERISTICS (CONTINUED)  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
5000  
1000  
30  
20  
10  
0
100  
10  
0.1  
1
10  
100  
1000  
0
200  
400  
600  
800  
1000  
V , Reverse Voltage (V)  
R
V , Reverse Voltage (V)  
R
Figure 7. Capacitance vs. Reverse Voltage  
Figure 8. Capacitance Stored Energy  
2
DUTY CIRCLEDESCENDING ORDER  
1
D=0.5  
PDM  
0.2  
t1  
t2  
0.1  
0.05  
0.02  
NOTES:  
Z
(t) = r(t) × R  
q
JC  
= 0.53°C/W  
q
JC  
R
q
JC  
0.01  
Peak T = P  
× Z (t) + T  
q
JC C  
J
DM  
Duty Cycle, D = t / t  
SINGLE PULSE  
0.1  
1
2
4  
3  
2  
1  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
10  
1
Figure 9. JunctiontoCase Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
DUT  
V
DD  
t
0
t
1
t
2
t
Figure 10. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
DPAK3 (TO252 3 LD)  
CASE 369AS  
ISSUE A  
DATE 28 SEP 2022  
GENERIC  
MARKING DIAGRAM*  
XXXXXX  
XXXXXX  
AYWWZZ  
XXXX = Specific Device Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON13810G  
DPAK3 (TO252 3 LD)  
PAGE 1 OF 1  
DESCRIPTION:  
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are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves  
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© Semiconductor Components Industries, LLC, 2019  
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TECHNICAL PUBLICATIONS:  
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