FFSH10120A [ONSEMI]

SiC 二极管,1200V,10A,TO-247-2;
FFSH10120A
型号: FFSH10120A
厂家: ONSEMI    ONSEMI
描述:

SiC 二极管,1200V,10A,TO-247-2

二极管
文件: 总7页 (文件大小:350K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
10 A, 1200 V, D1, TO-247-2L  
1. Cathode  
2. Anode  
Schottky Diode  
FFSH10120A  
Description  
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size & cost.  
1
2
TO2472LD  
CASE 340CL  
MARKING DIAGRAM  
Features  
Max Junction Temperature 175°C  
Avalanche Rated 100 mJ  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
AYWWZZ  
FFSH  
10120A  
No Reverse Recovery/No Forward Recovery  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Applications  
General Purpose  
SMPS, Solar Inverter, UPS  
Power Switching Circuits  
A
YWW  
ZZ  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot Code  
FFSH10120A  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
January, 2023 Rev. 2  
FFSH10120A/D  
FFSH10120A  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Value  
1200  
100  
Unit  
V
V
RRM  
Peak Repetitive Reverse Voltage  
Single Pulse Avalanche Energy (Note 1)  
Continuous Rectified Forward Current @ T < 158°C  
E
AS  
mJ  
A
I
F
10  
C
Continuous Rectified Forward Current @ T < 135°C  
17  
C
I
Non-Repetitive Peak Forward Surge Current  
850  
A
A
T
C
T
C
= 25°C, 10 ms  
= 150°C, 10 ms  
F, Max  
800  
I
Non-Repetitive Forward Surge Current  
Repetitive Forward Surge Current  
Power Dissipation  
Half-Sine Pulse, t = 8.3 ms  
90  
A
F,SM  
p
I
Half-Sine Pulse, t = 8.3 ms  
35  
A
F,RM  
p
Ptot  
T
= 25°C  
193  
W
C
C
T
= 150°C  
32  
W
T , T  
Operating and Storage Temperature Range  
55 to +175  
60  
°C  
Ncm  
J
STG  
TO247 Mounting Torque, M3 Screw  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 100 mJ is based on starting T = 25°C, L = 0.5 mH, I = 20 A, V = 50 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max  
0.78  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 10 A, T = 25°C  
Min  
Typ  
1.45  
1.7  
2.0  
Max  
1.75  
2.0  
2.4  
200  
300  
400  
Unit  
V
F
V
F
C
I = 10 A, T = 125°C  
F
C
I = 10 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 1200 V, T = 25°C  
mA  
C
= 1200 V, T = 125°C  
C
= 1200 V, T = 175°C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 800 V  
62  
612  
58  
47  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 400 V, f = 100 kHz  
= 800 V, f = 100 kHz  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Shipping  
FFSH10120A  
FFSH10120A  
TO2472LD  
(Pb-Free / Halogen Free)  
30 Units / Tube  
www.onsemi.com  
2
 
FFSH10120A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
20  
15  
10  
5
10  
1
TJ = 55 oC  
TJ = 25 o  
J = 75oC  
C
T
o
= 175 C  
T
J
o
= 125 C  
101  
T
J
TJ = 125 oC  
TJ = 175 o  
o
= 75 C  
T
J
C
102  
o
T
= 25  
C
J
o
= 55 C  
T
J
103  
0
0
1
2
3
4
200  
400  
600  
800  
1000  
1200  
VF , FORWARD CURRENT (V)  
VR, REVERESE VOLTAGE (V)  
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
120  
90  
60  
30  
0
TJ = 55oC  
D = 0.1  
TJ = 25oC  
D = 0.2  
D = 0.3  
D = 0.5  
T
J = 75oC  
TJ = 125oC  
TJ = 175oC  
D = 0.7  
D = 1  
1000  
1100  
1200  
1300  
1400  
1500  
25  
50  
75  
100  
125  
150  
175  
TC , CASE TEMPERATURE (oC)  
V
, REVERSE VOLTAGE (V)  
R
Figure 3. Reverse Characteristics  
Figure 4. Current Derating  
200  
80  
60  
40  
20  
0
150  
100  
50  
0
0
200  
400  
600  
800  
1000  
25  
50  
75  
100  
125  
150  
175  
TC , CASE TEMPERATURE (oC)  
VR, REVERSE VOLTAGE (V)  
Figure 5. Power Derating  
Figure 6. Capacitive Charge vs. Reverse  
Voltage  
www.onsemi.com  
3
FFSH10120A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
30  
20  
10  
0
5000  
1000  
100  
10  
0.1  
1
10  
100  
1000  
0
200  
400  
600  
800  
1000  
VR, REVERESE VOLTAGE (V)  
VR, REVERVE VOLTAGE (V)  
Figure 7. Capacitance vs. Reverse Voltage  
Figure 8. Capacitance Stored Energy  
2
DUTY CIRCLEDESCENDING ORDER  
1
101  
102  
103  
104  
P
DM  
D=0.5  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
t
1
t
2
NOTES:  
Z
(t) = r(t) x R  
qJC  
qJC  
o
R
= 0.78 C/W  
qJC  
Peak T = P  
Duty Cycle, D = t / t  
x Z (t) + T  
J
DM  
qJC C  
SINGLE PULSE  
106 105  
1
2
104  
t, RECTANGULAR PULSE DURATION (sec)  
103  
102  
101  
1
Figure 9. Junction-to-Case Transient Thermal Response Curve  
www.onsemi.com  
4
FFSH10120A  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
DUT  
V
DD  
t
0
t
1
t
2
t
Figure 10. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2472LD  
CASE 340CL  
ISSUE A  
DATE 03 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
AYWWZZ  
XXXXXXX  
XXXXXXX  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13850G  
TO2472LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
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