FFSP0665A

更新时间:2024-10-30 05:39:02
品牌:ONSEMI
描述:Silicon Carbide (SiC) Schottky Diode – EliteSiC, 6 A, 650 V, D1, TO-220-2L

FFSP0665A 概述

Silicon Carbide (SiC) Schottky Diode – EliteSiC, 6 A, 650 V, D1, TO-220-2L

FFSP0665A 数据手册

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DATA SHEET  
www.onsemi.com  
Silicon Carbide (SiC)  
Schottky Diode – EliteSiC,  
6 A, 650 V, D1, TO-220-2L  
1. Cathode  
2. Anode  
FFSP0665A  
Schottky Diode  
Description  
Silicon Carbide (SiC) Schottky Diodes use a completely new  
technology that provides superior switching performance and higher  
reliability compared to Silicon. No reverse recovery current,  
temperature independent switching characteristics, and excellent  
thermal performance sets Silicon Carbide as the next generation of  
power semiconductor. System benefits include highest efficiency,  
faster operating frequency, increased power density, reduced EMI, and  
reduced system size and cost.  
1
2
TO2202LD  
CASE 340BB  
Features  
Max Junction Temperature 175°C  
Avalanche Rated 36 mJ  
MARKING DIAGRAM  
High Surge Current Capacity  
Positive Temperature Coefficient  
Ease of Paralleling  
No Reverse Recovery/No Forward Recovery  
This Device is PbFree, Halogen Free/BFR Free and RoHS  
AXYYKK  
FFSP  
0665A  
Compliant  
Applications  
General Purpose  
SMPS, Solar Inverter, UPS  
Power Switching Circuits  
A
XYY  
KK  
= Assembly Plant Code  
= Date Code (Year & Week)  
= Lot Traceability Code  
FFSP0665A = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
February, 2023 Rev. 3  
FFSP0665A/D  
FFSP0665A  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Symbol  
V
Parameter  
Value  
Unit  
V
Peak Repetitive Reverse Voltage  
Single Pulse Avalanche Energy (Note 1)  
Continuous Rectified Forward Current @ T < 153°C  
650  
RRM  
E
AS  
36  
mJ  
A
I
F
6
C
Continuous Rectified Forward Current @ T < 135°C  
8.8  
A
C
I
Non-Repetitive Peak Forward Surge Current  
430  
A
T
C
T
C
= 25°C, 10 ms  
= 150°C, 10 ms  
F,Max  
415  
A
I
Non-Repetitive Forward Surge Current  
Repetitive Forward Surge Current  
Power Dissipation  
HalfSine Pulse, t = 8.3 ms  
42  
A
F,SM  
p
I
HalfSine Pulse, t = 8.3 ms  
28  
A
F,RM  
p
P
T
= 25°C  
65  
11  
W
W
°C  
TOT  
C
C
T
= 150°C  
T , T  
J
Operating and Storage Temperature Range  
55 to +175  
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. E of 36 mJ is based on starting T = 25°C, L = 0.5 mH, I = 12 A, V = 50 V.  
AS  
J
AS  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance, Junction to Case, Max  
2.3  
°C/W  
q
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Forward Voltage  
Test Condition  
I = 6 A, T = 25°C  
Min  
Typ  
1.50  
1.6  
1.72  
Max  
1.75  
2.0  
2.4  
200  
400  
600  
Unit  
V
F
V
F
C
I = 6 A, T = 125°C  
F
C
I = 6 A, T = 175°C  
F
C
I
R
Reverse Current  
V
R
V
R
V
R
= 650 V, T = 25°C  
mA  
C
= 650 V, T = 125°C  
C
= 650 V, T = 175°C  
C
Q
Total Capacitive Charge  
Total Capacitance  
V = 400 V  
22  
nC  
pF  
C
C
V
R
V
R
V
R
= 1 V, f = 100 kHz  
= 200 V, f = 100 kHz  
= 400 V, f = 100 kHz  
361  
41  
32  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Quantity  
FFSP0665A  
FFSP0665A  
TO2202LD  
Tube  
50 Units  
www.onsemi.com  
2
 
FFSP0665A  
TYPICAL CHARACTERISTICS  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
6  
6
5
4
3
2
1
0
10  
7  
10  
T = 175°C  
J
8  
10  
T = 175°C  
J
T = 75°C  
J
J
T = 25°C  
T = 55°C  
J
T = 125°C  
J
J
T = 125°C  
T = 75°C  
J
T = 25°C  
J
T = 55°C  
J
9  
10  
0.0  
0.5  
1.0  
1.5  
2.0  
200  
300  
400  
500  
600 650  
V , Forward Voltage (V)  
F
V , Reverse Voltage (V)  
R
Figure 1. Forward Characteristics  
Figure 2. Reverse Characteristics  
100  
80  
80  
D = 0.1  
D = 0.2  
60  
40  
20  
0
60  
D = 0.3  
D = 0.5  
40  
20  
0
D = 0.7  
D = 1  
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
T , Case Temperature (5C)  
Figure 3. Current Derating  
T , Case Temperature (5C)  
C
C
Figure 4. Power Derating  
1000  
100  
10  
30  
25  
20  
15  
10  
5
0
0
100 200 300 400  
500 600 650  
0.1  
1
10  
100  
650  
V , Reverse Voltage (V)  
R
V , Reverse Voltage (V)  
R
Figure 5. Capacitive Charge vs. Reverse  
Voltage  
Figure 6. Capacitance vs. Reverse Voltage  
www.onsemi.com  
3
FFSP0665A  
TYPICAL CHARACTERISTICS (CONTINUED)  
(T = 25°C UNLESS OTHERWISE NOTED)  
J
8
6
4
2
0
0
100 200 300 400 500 600 650  
V , Reverse Voltage (V)  
R
Figure 7. Capacitance Stored Energy  
2
1
DUTY CIRCLEDESCENDING ORDER  
D=0.5  
0.2  
PDM  
0.1  
t1  
0.1  
t2  
0.05  
0.01  
NOTES:  
0.02  
0.01  
Z
(t) = r(t) × R  
= 2.3°C/W  
q
JC  
q
JC  
R
q
JC  
Peak T = P  
Duty Cycle, D = t / t  
× Z (t) + T  
q
JC  
J
DM  
C
SINGLE PULSE  
1
2
0.001  
6  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
10  
1
t, Rectangular Pulse Duration (s)  
Figure 8. JunctiontoCase Transient Thermal Response Curve  
TEST CIRCUIT AND WAVEFORMS  
L = 0.5 mH  
R < 0.1 W  
V
DD  
= 50 V  
EAVL = 1/2LI2 [V  
/ (V V )]  
R(AVL) DD  
R(AVL)  
Q1 = IGBT (BV  
> DUT V  
)
CES  
R(AVL)  
V
AVL  
L
R
+
V
CURRENT  
SENSE  
DD  
I
L
I
L
Q1  
I V  
DUT  
V
DD  
t
0
t
1
t
2
t
Figure 9. Unclamped Inductive Switching Test Circuit & Waveform  
www.onsemi.com  
4
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2202LD  
CASE 340BB  
ISSUE O  
DATE 31 AUG 2016  
4.09  
3.50  
M
M
B A  
0.36  
10.67  
9.65  
B
A
8.89  
6.86  
3.43  
2.54  
1.40  
0.51  
6.86  
5.84  
7°  
3°  
13.40  
12.19  
16.51  
14.22  
16.15  
15.75  
9.40  
8.38  
5°  
3°  
5°  
3°  
6.35 MAX  
1
2
0.60 MAX  
C
14.73  
13.60  
1.65  
1.25  
1.91  
0.61  
0.33  
2.54  
5.08  
2.92  
2.03  
1.02  
0.38  
M
0.36  
C
A
B
NOTES:  
5°  
3°  
5°  
3°  
A. PACKAGE REFERENCE: JEDEC TO220,ISSUE K,  
VARIATION AC,DATED APRIL 2002.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSION AND TOLERANCE AS PER ASME  
Y14.52009.  
4.80  
4.30  
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13832G  
TO2202LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
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ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
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