FGH40N60SMD-F085 [ONSEMI]

IGBT,场截止,600 V,40 A,1.9 V;
FGH40N60SMD-F085
型号: FGH40N60SMD-F085
厂家: ONSEMI    ONSEMI
描述:

IGBT,场截止,600 V,40 A,1.9 V

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IGBT - Field Stop  
600 V, 40 A  
FGH40N60SMD-F085  
Description  
Using Novel Field Stop IGBT Technology, ON Semiconductor’s  
new series of Field Stop IGBTs offer the optimum performance for  
Automotive Chargers, Inverter, and other applications where low  
conduction and switching losses are essential.  
www.onsemi.com  
Features  
C
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
G
E
E
Low Saturation Voltage: V  
High Input Impedance  
= 1.9 V(Typ.) @ I = 40 A  
C
CE(sat)  
Tightened Parameter Distribution  
AEC Qualified and PPAP Capable  
IGBT: AECQ101  
This Device is PbFree and is RoHS Compliant  
C
G
Applications  
Automotive Chargers, Converters, High Voltage Auxiliaries  
Inverters, SMPS, PFC, UPS  
ABSOLUTE MAXIMUM RATINGS  
TO2473LD  
CASE 340CK  
Rating  
Symbol  
Ratings  
600  
Unit  
V
Collector to Emitter Voltage  
Gate to Emitter Voltage  
V
CES  
V
GES  
20  
V
MARKING DIAGRAM  
Collector Current  
@ TC = 25°C  
I
C
A
80  
40  
@ TC = 100°C  
$Y&Z&3&K  
FGH40N60  
SMD  
Pulsed Collector Current  
I
120  
A
A
CM  
(Note 1)  
Diode Forward Current  
@ TC = 25°C  
I
F
40  
20  
@ TC = 100°C  
Pulsed Diode Maximum Forward  
Current  
I
120  
A
FM  
(Note 1)  
Maximum Power Dissipation  
@ TC = 25°C  
P
W
D
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
349  
174  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
@ TC = 100°C  
Operating Junction Temperature  
Storage Temperature Range  
T
55 to +175  
55 to +175  
300  
°C  
°C  
°C  
J
FGH40N60SMD  
= Specific Device Code  
T
stg  
Maximum Lead Temperature  
for Soldering, 1/8from Case  
for 5 Seconds  
T
L
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: Pulse width limited by max. junction temperature.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
FGH40N60SMDF085/D  
February, 2020 Rev. 4  
 
FGH40N60SMDF085  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
R (Note 2)  
JC  
Ratings  
0.43  
1.8  
Unit  
°C/W  
°C/W  
Thermal Resistance JunctiontoCase, for IGBT  
Thermal Resistance JunctiontoCase, for Diode  
Parameter  
R
JC  
Symbol  
Typ.  
45  
Thermal Resistance JunctiontoAmbient (PCB Mount) (Note 2)  
R
°C/W  
JA  
2. R  
for TO247: according to Mil standard 8831012 test method. R  
for TO247 : according to JESD512, test method environmental  
JA  
JC  
condition and JESD5110, test boards for through hole perimeter leaded package thermal measurements. JESD513 : Low Effective  
Thermal Conductivity Test Board for Leaded Surface Mount Package.  
PACKAGE MARKING AND ORDERING INFORMATION  
Device Marking  
Device  
Package  
Package Type  
Quantity  
FGH40N60SMD  
FGH40N60SMDF085  
TO2473  
Tube  
30 Units  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter Breakdown Voltage  
BV  
V
V
= 0 V, I = 250 A  
600  
V
CES  
GE  
C
Temperature Coefficient of Breakdown  
Voltage  
B
V
/T  
= 0 V, I = 250 A  
0.6  
V/°C  
CES  
J
GE  
C
Collector CutOff Current  
I
V
= V  
, V = 0 V  
250  
800  
400  
A
CES  
CE  
CES  
GE  
I
at 80% * B  
, 175°C  
CES  
VCES  
GE Leakage Current  
I
V
GE  
= V  
, V = 0 V  
CE  
nA  
GES  
GES  
ON CHARACTERISTICs  
GE Threshold Voltage  
V
I
C
I
C
I
C
= 250 A, V = V  
GE  
3.5  
4.5  
1.9  
2.1  
6.0  
2.5  
V
V
V
GE(th)  
CE  
Collector to Emitter Saturation Voltage  
V
= 40 A, V = 15 V  
CE(sat)  
GE  
= 40 A, V = 15 V, T = 175°C  
GE  
C
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
CE  
= 30 V, V = 0 V, f = 1 MHz  
1880  
180  
50  
2500  
240  
65  
pF  
pF  
pF  
ies  
GE  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
C
res  
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
= 400 V, I = 40 A,  
18  
24  
ns  
ns  
d(on)  
CC  
G
C
R
= 6 ꢃ ꢄ V = 15 V,  
GE  
Rise Time  
t
r
28  
36.4  
143  
18.5  
1.2  
Inductive Load, T = 25°C  
C
TurnOff Delay Time  
Fall Time  
t
110  
13.2  
0.92  
0.3  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
Rise Time  
E
on  
E
off  
mJ  
mJ  
mJ  
ns  
0.39  
1.59  
23.8  
35.1  
151  
81  
E
ts  
1.22  
16.7  
27  
t
t
V
= 400 V, I = 40 A,  
= 6 ꢃ ꢄ V = 15 V,  
GE  
d(on)  
CC C  
R
G
t
r
ns  
Inductive Load, T = 175°C  
C
TurnOff Delay Time  
Fall Time  
116  
56.5  
1.47  
0.73  
2.20  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
on  
E
off  
1.91  
0.95  
2.86  
mJ  
mJ  
mJ  
E
ts  
www.onsemi.com  
2
 
FGH40N60SMDF085  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted) (continued)  
C
Parameter  
Total Gate Charge  
Symbol  
Test Conditions  
= 400 V, I = 40 A, V = 15 V  
Min  
Typ  
119  
13  
Max  
180  
20  
Unit  
nC  
Q
V
CE  
g
C
GE  
Gate to Emitter Charge  
Gate to Collector Charge  
Q
ge  
Q
gc  
nC  
58  
90  
nC  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
J
Parametr  
Symbol  
Test Conditions  
Min  
Typ  
2.3  
Max  
2.8  
Unit  
Diode Forward Voltage  
V
FM  
I = 20 A  
T
C
T
C
T
C
T
C
T
C
T
C
T
C
= 25°C  
V
F
= 175°C  
= 175°C  
= 25°C  
1.67  
48.9  
36  
Reverse Recovery Energy  
E
rec  
I = 20 A, di /dt = 200 A/s  
J
F
F
Diode Reverse Recovery Time  
t
rr  
47  
ns  
= 175°C  
= 25°C  
110  
46.8  
470  
Diode Reverse Recovery Charge  
Q
61  
nC  
rr  
= 175°C  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGH40N60SMDF085  
TYPICAL CHARACTERISTICS  
120  
100  
80  
120  
12 V  
12 V  
V
= 20 V  
V
GE  
= 20 V  
15 V  
GE  
10 V  
10 V  
100  
80  
15 V  
60  
40  
60  
40  
20  
0
8 V  
8 V  
6
20  
0
T
C
= 175°C  
T
C
= 25°C  
4
6
8
10  
0
2
4
8
10  
2
0
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 2. Typical Output Characteristics  
Figure 1. Typical Output Characteristics  
120  
120  
Common Emitter  
100  
80  
V
= 20 V  
100  
80  
60  
40  
20  
0
CE  
T
T
= 25°C  
C
C
= 175°C  
60  
40  
Common Emitter  
V
= 15 V  
GE  
20  
0
T
T
= 25°C  
C
C
= 175°C  
4
5
1
2
3
0
0
2
4
6
8
10  
12  
CollectorEmitter Voltage, V [V]  
GateEmitter Voltage, V [V]  
CE  
GE  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
3
20  
16  
12  
8
Common Emitter  
GE  
Common Emitter  
C
V
= 15 V  
T
= 40°C  
80 A  
40 A  
80 A  
40 A  
2
1
I
= 20 A  
C
4
I
C
= 20 A  
125  
0
16  
8
12  
20  
4
100  
150  
175  
25  
50  
75  
GateEmitter Voltage, V [V]  
GE  
CollectorEmitter Case Temperature, T [°C]  
C
Figure 6. Saturation Voltage vs. VGE  
Figure 5. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
www.onsemi.com  
4
FGH40N60SMDF085  
TYPICAL CHARACTERISTICS  
20  
16  
12  
8
20  
Common Emitter  
= 25°C  
Common Emitter  
C
T
C
T
= 175°C  
14  
12  
80 A  
80 A  
40 A  
40 A  
8
4
0
I
= 20 A  
C
4
I
= 20 A  
C
0
20  
20  
8
12  
16  
4
8
12  
16  
4
GateEmitter Voltage, V [V]  
GateEmitter Voltage, V [V]  
GE  
GE  
Figure 8. Saturation Voltage vs. VGE  
Figure 7. Saturation Voltage vs. VGE  
4000  
1000  
15  
12  
C
ies  
V
CC  
= 200 V  
400 V  
9
6
C
300 V  
oes  
C
res  
Common Emitter  
V
T
= 0 V, f = 1 MHz  
3
0
GE  
C
100  
50  
= 25°C  
Common Emitter  
= 25°C  
T
C
30  
1
10  
CollectorEmitter Voltage, V [V]  
120  
0
100  
50  
Gate Charge, Q [nC]  
CE  
g
Figure 9. Capacitance Characteristics  
Figure 10. Gate Charge Characteristics  
100  
300  
t
r
100  
10 s  
100 s  
1 ms  
DC  
t
d(on)  
10  
1
10 ms  
10  
Common Emitter  
= 400 V, V = 15 V  
V
C
CC  
GE  
*Notes:  
I
= 40 A  
1. T = 25°C  
C
J
T
C
T
C
= 25°C  
= 175°C  
2. T 175°C  
3. Single Pulse  
0.1  
1
50  
30  
40  
10  
20  
0
1
10  
100  
1000  
Gate Resistance, R []  
CollectorEmitter Voltage, V [V]  
G
CE  
Figure 12. Turnon Characteristics vs. Gate  
Figure 11. SOA Characteristics  
Resistance  
www.onsemi.com  
5
FGH40N60SMDF085  
TYPICAL CHARACTERISTICS  
100  
10000  
1000  
100  
Common Emitter  
= 400 V, V = 15 V  
V
CC  
GE  
t
r
I
= 40 A  
C
T
C
T
C
= 25°C  
= 175°C  
t
d(off)  
t
d(on)  
10  
Common Emitter  
t
f
V
= 15 V, R = 6 ꢃ  
GE  
G
T
C
T
C
= 25°C  
= 175°C  
1
20  
10  
50  
0
10  
20  
30  
40  
40  
60  
80  
Gate Resistance, R []  
Collector Current, I [A]  
G
C
Figure 14. Turnon Characteristics vs.  
Figure 13. Turnoff Characteristics vs. Gate  
Collector Current  
Resistance  
1000  
100  
Common Emitter  
V
C
= 400 V, V = 15 V  
CC  
GE  
I
= 40 A  
t
d(off)  
T
C
T
C
= 25°C  
= 175°C  
100  
10  
1
10  
1
t
f
E
on  
Common Emitter  
GE  
V
= 15 V, R = 6 ꢃ  
G
E
off  
T
C
T
C
= 25°C  
= 175°C  
0.1  
20  
40  
60  
80  
50  
0
10  
20  
30  
40  
Collector Current, I [A]  
C
Gate Resistance, R []  
G
Figure 15. Turnoff Characteristics vs.  
Figure 16. Switching Loss vs. Gate  
Resistance  
Collector Current  
10  
200  
100  
Common Emitter  
V
T
= 15 V, R = 6 ꢃ  
GE  
G
E
on  
= 25°C  
C
C
T
= 175°C  
1
10  
1
E
off  
Safe Operating Area  
V
= 15 V, T 175°C  
GE  
C
0.1  
20  
40  
60  
80  
1
Collector Current, I [A]  
CollectorEmitter Voltage, V [V]  
C
CE  
Figure 17. Switching Loss vs. Collector  
Current  
Figure 18. Turnoff Switching SOA  
Characteristics  
www.onsemi.com  
6
FGH40N60SMDF085  
TYPICAL CHARACTERISTICS  
120  
110  
100  
90  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Square Wave  
T 175°C, D = 0.5, V = 400 V  
J
V
CE  
= 15/0 V, R = 6 ꢃ  
GE  
G
80  
T
C
= 75°C  
70  
60  
T
C
= 100°C  
50  
40  
30  
20  
10  
0
0
25  
50  
75 100 125 150 175  
1k  
10k  
100k  
1M  
CollectorEmitter Case Temperature, T [°C]  
Switching Frequency, f [Hz]  
C
Figure 20. Load Current vs. Frequency  
Figure 19. Current Derating  
1000  
100  
10  
100  
10  
1
T
= 175°C  
C
T
C
= 175°C  
T
= 100°C  
C
1
T
C
= 25°C  
0.1  
T
= 25°C  
C
0.01  
0
1
2
3
0
200  
400  
600  
Collector to Emitter Voltage, V  
[V]  
Forward Voltage, V [V]  
CES  
F
Figure 22. Reverse Current  
Figure 21. Forward Characteristics  
200  
150  
100  
50  
600  
500  
400  
300  
200  
100  
0
T
C
T
C
= 25°C  
= 175°C  
T
T
= 25°C  
C
di/dt = 100 A/s  
= 175°C  
C
200 A/s  
di/dt = 200 A/s  
di/dt = 100 A/s  
di/dt = 100 A/s  
200 A/s  
0
0
10 15  
5
20 25 30 35 40 45  
0
5
10 15 20 25 30 35 40 45  
Forward Current, I [A]  
Forward Current, I [A]  
F
F
Figure 24. Reverse Recovery Time  
Figure 23. Stored Charge  
www.onsemi.com  
7
FGH40N60SMDF085  
0.5  
0.1  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.01  
P
DM  
Single Pulse  
t
1
t
2
Duty Factor, D = t1/t2  
Peak T = Pdm x Zjc + T  
J
C
1E3  
1E5  
1E4  
1E3  
0.01  
0.1  
Rectangular Pulse Duration [sec]  
Figure 25. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.05  
0.1  
P
DM  
0.02  
0.01  
t
1
t
2
Duty Factor, D = t1/t2  
Peak T = Pdm x Zjc + T  
ulse  
single p  
J
C
0.01  
1E5  
1E4  
1E3  
0.01  
0.1  
1
Rectangular Pulse Duration [sec]  
Figure 26. Transient Thermal Impedance of Diode  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD SHORT LEAD  
CASE 340CK  
ISSUE A  
DATE 31 JAN 2019  
P1  
D2  
A
E
P
A
A2  
Q
E2  
S
D1  
D
E1  
B
2
2
1
3
L1  
A1  
b4  
L
c
(3X) b  
(2X) b2  
M
M
B A  
0.25  
MILLIMETERS  
MIN NOM MAX  
4.58 4.70 4.82  
2.20 2.40 2.60  
1.40 1.50 1.60  
1.17 1.26 1.35  
1.53 1.65 1.77  
2.42 2.54 2.66  
0.51 0.61 0.71  
20.32 20.57 20.82  
(2X) e  
DIM  
A
A1  
A2  
b
b2  
b4  
c
GENERIC  
D
MARKING DIAGRAM*  
D1 13.08  
~
~
D2  
E
0.51 0.93 1.35  
15.37 15.62 15.87  
AYWWZZ  
XXXXXXX  
XXXXXXX  
E1 12.81  
~
~
E2  
e
L
4.96 5.08 5.20  
5.56  
15.75 16.00 16.25  
3.69 3.81 3.93  
3.51 3.58 3.65  
XXXX = Specific Device Code  
~
~
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ = Assembly Lot Code  
L1  
P
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
P1 6.60 6.80 7.00  
Q
S
5.34 5.46 5.58  
5.34 5.46 5.58  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13851G  
TO2473LD SHORT LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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相关型号:

SI9130DB

5- and 3.3-V Step-Down Synchronous Converters

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SI9135LG-T1

SMBus Multi-Output Power-Supply Controller

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SI9135LG-T1-E3

SMBus Multi-Output Power-Supply Controller

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SI9135_11

SMBus Multi-Output Power-Supply Controller

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SI9136_11

Multi-Output Power-Supply Controller

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SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

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SI9130_11

Pin-Programmable Dual Controller - Portable PCs

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SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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