FGL35N120FTDTU [ONSEMI]

1200V,35A,场截止沟道 IGBT;
FGL35N120FTDTU
型号: FGL35N120FTDTU
厂家: ONSEMI    ONSEMI
描述:

1200V,35A,场截止沟道 IGBT

栅 双极性晶体管
文件: 总11页 (文件大小:2815K)
中文:  中文翻译
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2013 年 3 月  
FGL35N120FTD  
1200V35A 场截止沟槽式 IGBT  
特性  
概述  
场截止沟槽技术  
飞兆半导体®1200V 沟槽式 IGBT 系列采用先进的场截止沟  
IGBT 技术,为太阳能逆变器、UPS 和焊机等硬开关应用提  
供最佳性能  
高速开关  
低饱和电压: 当 IC = 35 A , VCE(sat)= 1.68 V  
高输入阻抗  
应用  
太阳能逆变器,不间断电源,电焊机,功率因素校正  
C
G
TO-264 3L  
G C E  
E
绝对最大额定值  
符号  
说明  
额定值  
1200  
± 25  
单位  
VCES  
集电极-发射极之间电压  
栅极-发射极间电压  
集电极电流  
V
V
A
VCES  
@ TC = 25oC  
@ TC = 100oC  
@ TC = 25oC  
70  
IC  
集电极电流  
35  
A
A
ICM (1)  
IF  
集电极脉冲电流  
105  
二极管正向连续电流  
最大功耗  
@ TC = 100oC  
@ TC = 25oC  
@ TC = 100oC  
40  
368  
A
W
W
oC  
oC  
oC  
PD  
最大功耗  
147  
TJ  
工作结温  
-55 to +150  
-55 to +150  
300  
Tstg  
TL  
存储温度范围  
适用的最大引脚温度,距离外壳 1/8 英寸处焊接 5 秒  
注意:  
1:可重复的规格: 脉宽受最大结温限制  
热性能  
符号  
参数  
额定值  
0.34  
0.9  
单位  
oC/W  
oC/W  
oC/W  
RθJC(IGBT)  
RθJC(Diode)  
RθJA  
结点-壳体的热阻  
结点-壳体的热阻  
结至环境热阻  
25  
1
封装标识与定购信息  
器件标识  
设备  
封装  
规格  
带宽  
数量  
FGL35N120FTD  
FGL35N120FTDT  
TO-264  
-
-
30  
IGBT 的电气特性 TC = 25°C除非另有说明  
符号  
参数  
测试条件  
最小值 典型值  
最大值  
单位  
关断特性  
BVCES  
ICES  
IGES  
集电极-发射极击穿电压  
集电极切断电流  
G-E 漏电流  
VGE = 0 V, IQ = 250 μA  
VCE = VQES, VGE = 0 V  
VGE = VGES, VQE = 0 V  
1200  
-
-
-
-
1
V
-
-
mA  
nA  
±250  
导通特性  
VGE(th)  
G-E 阈值电压  
IQ = 35 mA, VCE = VGE  
IC = 35 A, VGE = 15 V  
3.5  
-
6.2  
7.5  
2.2  
V
V
1.68  
VCE(sat)  
集电极-发射极间饱和电压  
IC = 35 A, VGE = 15 V, TC=125oC  
-
2.0  
-
V
动态特性  
Cies  
Coes  
直流母线电容值  
输出电容  
-
-
-
5090  
180  
95  
-
-
-
pF  
pF  
pF  
VCE = 30 V VGE = 0 V,  
f = 1MHz '  
Cres  
反向传输电容  
开关特性  
td(on)  
tr  
导通延迟时间  
上升时间  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
34  
63  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
td(off)  
tf  
关断延迟时间  
下降时间  
172  
107  
2.5  
1.7  
4.2  
33  
ns  
VCC = 600 V, IQ = 35 A,  
RG = 10, VGE = 15 V电感负  
TC = 25oC  
ns  
Eon  
Eoff  
Ets  
导通开关损耗  
关断开关损耗  
总开关损耗  
mJ  
mJ  
mJ  
ns  
td(on)  
tr  
导通延迟时间  
上升时间  
66  
ns  
td(off)  
tf  
关断延迟时间  
下降时间  
180  
146  
3.1  
2.1  
5.2  
210  
42  
ns  
VCC = 600 VIC = 35 A,  
RG = 10, VGE = 15 V, Inductive  
Load, TC = 125oC  
ns  
Eon  
Eoff  
Ets  
导通开关损耗  
关断开关损耗  
总开关损耗  
mJ  
mJ  
mJ  
nC  
nC  
nC  
Qg  
总栅极电荷  
VCE = 600 V, IC = 35 A,  
VGE = 15 V  
Qge  
Qgc  
栅极-发射极间电荷  
栅极-发射极间电荷  
101  
2
二极管的电气特性 TC - 25°C除非另有说明  
符号  
参数  
测试条件  
最小值 典型值  
最大值 单位  
TC = 25oC  
-
-
-
-
-
-
-
-
2.7  
2.5  
3.4  
VFM  
trr  
二极管正向电压  
IF = 35 A  
V
TC = 125oC  
TC = 25oC  
TC = 125oC  
TC = 25oC  
TC = 125oC  
TC = 25oC  
TC = 125oC  
-
337  
520  
7.6  
-
二极管反向恢复时间  
二极管反向恢复峰值电流  
二极管反向恢复电荷  
ns  
-
-
IF = 35 A,  
di/dt = 200 A/μs  
Irr  
A
12.9  
1292  
3377  
-
-
Qrr  
nC  
-
3
典型性能特征  
1型输出特性  
图 2.典型输出特性  
图 3.典型饱和电压特性  
图 4.转换特性  
图 5.饱和电压与不同电流强度下壳温的关系  
图 6.饱和电压与 VGE 的关系  
4
典型性能特征  
图 7.饱和电压与 VGE 的关系  
图 8.负载电流与频率的关系  
图 9.电容特性  
图 10.栅极电荷特性  
图 11.SOA 特性  
图 12.开通特性与栅极电阻的关系  
5
典型性能特征  
图 13.关断特性与栅极电阻的关系  
图 14.开通特性与集电极电流的关系  
图 16.开关损耗与栅极电阻的关系  
图 18.关断开关 SOA 特性  
图 15.关断特性与 集电极电流  
图 17.开关损耗与集电极电流的关系  
6
典型性能特征  
图 19.正向特性  
图 20.反向恢复电流  
图 21.存储电荷  
图 22.反向恢复时间  
图 23.IGBT 的瞬态热阻抗  
PDM  
t1  
t2  
7
机械尺寸  
TO-264  
* 前/后侧隔离电压AC 2700V  
8
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
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