FGY100T120SWD [ONSEMI]

1200V, 100A Field Stop VII (FS7) Discrete IGBT in Power TO247-3L Packaging;
FGY100T120SWD
型号: FGY100T120SWD
厂家: ONSEMI    ONSEMI
描述:

1200V, 100A Field Stop VII (FS7) Discrete IGBT in Power TO247-3L Packaging

双极性晶体管
文件: 总8页 (文件大小:281K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT - Power, Co-PAK  
N-Channel, Field Stop VII  
BV  
V
I
C
CES  
CE(SAT)  
1200 V  
1.7 V  
100 A  
(FS7), Non-SCR, TO247-3L  
1200 V, 1.7 V, 100 A  
PIN CONNECTIONS  
C
FGY100T120SWD  
Description  
Using the novel field stop 7th generation IGBT technology and the  
Gen7 Diode in TO247 3lead package, FGY100T120SWD offers the  
optimum performance with low switching and conduction losses for  
highefficiency operations in various applications like Solar, UPS,  
and ESS.  
G
E
Features  
Maximum Junction Temperature T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operation  
High Current Capability  
Smooth and Optimized Switching  
Low Switching Loss  
RoHS Compliant  
G
C
Applications  
E
Boost and Inverter in Solar System  
TO2473LD  
CASE 340CD  
UPS  
Energy Storage System  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
MARKING DIAGRAM  
J
Parameter  
CollectortoEmitter Voltage  
GatetoEmitter Voltage  
Symbol  
Value  
1200  
20  
Unit  
V
V
CES  
V
GES  
V
$Y&Z&3&K  
FGY100T  
120SWD  
Transient GatetoEmitter Voltage  
30  
V
Collector Current  
T
= 25°C  
I
C
200  
A
C
(Note 1)  
T
= 100°C  
= 25°C  
100  
866  
433  
400  
C
Power Dissipation  
T
P
W
A
C
D
$Y  
&Z  
&3  
&K  
= onsemi Logo  
= Assembly Plant Code  
= 3Digit Date Code  
T
T
= 100°C  
C
Pulsed Collector Current  
= 25°C,  
= 10 ms  
(Note 2)  
I
CM  
C
P
= 2Digit Lot Traceability Code  
t
FGY100T120SWD = Specific Device code  
Diode Forward Current  
T
= 25°C  
I
200  
100  
400  
A
A
C
F
T
C
= 100°C  
ORDERING INFORMATION  
Pulsed Diode Maximum  
Forward Current  
T
P
= 25°C,  
= 10 ms  
I
FM  
C
Device  
Package  
Shipping  
t
(Note 2)  
FGY100T120SWD TO2473LD  
(PbFree)  
30 Units /  
Tube  
Operating Junction and Storage  
Temperature Range  
T , T  
55 to  
°C  
°C  
J
STG  
+175  
Lead Temperature for Soldering Purposes  
T
L
260  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
2. Repetitive rating: Pulse width limited by max. Junction temperature  
© Semiconductor Components Industries, LLC, 2023  
1
Publication Order Number:  
March, 2023 Rev. 0  
FGY100T120SWD/D  
 
FGY100T120SWD  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Value  
0.17  
0.29  
40  
Unit  
Thermal Resistance, JunctiontoCase for IGBT  
Thermal Resistance, JunctiontoCase for Diode  
Thermal Resistance, JunctiontoAmbient  
R
°C/W  
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS OF IGBT (T = 25°C unless otherwise noted)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
CollectortoEmitter Breakdown Voltage  
BV  
V
GE  
= 0 V, I = 5 mA  
1200  
V
CES  
C
CollectortoEmitter Breakdown Voltage  
DBV  
/
1.5  
V/°C  
CES  
Temperature Coefficient  
DT  
J
CES  
GES  
Zero Gate Voltage Collector Current  
GatetoEmitter Leakage Current  
ON CHARACTERISTICS  
I
V
= 0 V, V = V  
CES  
40  
mA  
GE  
CE  
I
V
= 20 V, V = 0 V  
400  
nA  
GE  
CE  
Gate Threshold Voltage  
V
V
= V , I = 100 mA  
5.6  
6.55  
1.69  
2.26  
7.4  
2.0  
V
GE(TH)  
GE  
CE  
C
CollectortoEmitter Saturation Voltage  
V
V
= 15 V, I = 100 A, T = 25°C  
1.35  
CE(SAT)  
GE  
C
J
V
GE  
= 15 V, I = 100 A, T = 175°C  
C J  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
= 0 V, V = 30 V, f = 1 MHz  
8489  
320  
pF  
nC  
IES  
GE  
CE  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
C
OES  
C
RES  
41.4  
284  
Q
V
= 600 V, V = 15 V, I = 100 A  
G
CE GE C  
GatetoEmitter Charge  
GatetoCollector Charge  
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
TurnOff Delay Time  
Rise Time  
Q
72.4  
101  
GE  
GC  
Q
t
t
V
CE  
= 600 V, V = 0/15 V, I = 50 A,  
46.4  
209.6  
30.4  
58  
ns  
d(on)  
GE  
C
R
= 4.7 W, T = 25°C  
G
J
d(off)  
t
r
Fall Time  
t
f
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
TurnOff Delay Time  
Rise Time  
E
E
3.1  
mJ  
ns  
on  
off  
1.6  
E
4.7  
ts  
t
t
V
= 600 V, V = 0/15 V,  
46.4  
168  
72  
d(on)  
d(off)  
CE  
GE  
I
C
= 100 A, R = 4.7 W, T = 25°C  
G J  
t
r
Fall Time  
t
51.2  
8.1  
f
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
E
on  
E
off  
mJ  
2.8  
E
ts  
10.9  
www.onsemi.com  
2
FGY100T120SWD  
ELECTRICAL CHARACTERISTICS OF IGBT (T = 25°C unless otherwise noted)  
J
Parameter  
TurnOn Delay Time  
Symbol  
Test Condition  
Min  
Typ  
38.4  
244.8  
28.8  
92.8  
4.9  
Max  
Unit  
t
t
V
= 0/15 V, I = 50 A, V = 600 V,  
ns  
d(on)  
d(off)  
GE  
C
CE  
R
= 4.7 W, T = 175°C  
G
J
TurnOff Delay Time  
Rise Time  
t
r
Fall Time  
t
f
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
TurnOff Delay Time  
Rise Time  
E
on  
E
off  
mJ  
ns  
2.4  
E
ts  
7.3  
t
t
V
GE  
= 0/15 V, I = 100 A,  
41.6  
196.8  
64  
d(on)  
d(off)  
C
V
= 600 V, R = 4.7 W, T = 175°C  
CE  
G J  
t
r
Fall Time  
t
76.8  
11.3  
3.9  
f
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTICS  
Forward Voltage  
E
on  
E
off  
mJ  
V
E
ts  
15.2  
V
I = 100 A, T = 25°C  
1.62  
1.82  
1.87  
2.22  
F
F
J
I = 100 A, T = 175°C  
F
J
DIODE SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Reverse Recovery Time  
t
V
= 600 V, I = 50 A,  
152  
2977  
0.9  
ns  
nC  
mJ  
A
rr  
R
F
dI /dt = 1000 A/ms, T = 25°C  
F
J
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
E
rec  
I
39  
RRM  
t
rr  
V
R
= 600 V, I = 100 A,  
261  
5636  
1.8  
ns  
nC  
mJ  
A
F
dI /dt = 1000 A/ms, T = 25°C  
F
J
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
E
rec  
I
43  
RRM  
t
rr  
V
= 600 V, I = 50 A,  
192  
5275  
1.6  
ns  
nC  
mJ  
A
R
F
dI /dt = 1000 A/ms, T = 175°C  
F
J
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Reverse Recovery Time  
Q
rr  
E
rec  
I
55  
RRM  
t
rr  
V
R
= 600 V, I = 100 A,  
358  
10858  
3.6  
ns  
nC  
mJ  
A
F
dI /dt = 1000 A/ms, T = 175°C  
F
J
Reverse Recovery Charge  
Reverse Recovery Energy  
Peak Reverse Recovery Current  
Q
rr  
E
rec  
I
61  
RRM  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGY100T120SWD  
TYPICAL CHARACTERISTICS  
400  
350  
300  
250  
200  
150  
100  
50  
400  
T
T
J=55°C  
J=25°C  
VGE=8V  
VGE=8V  
350  
300  
250  
200  
150  
100  
50  
V
=10V  
V =10V  
GE  
GE  
VGE=12V  
GE=15V  
GE=20V  
VGE=12V  
GE=15V  
VGE=20V  
V
V
V
0
0
0
1
2
3
4
5
0
1
2
3
4
5
VCE, Collector to Emitter Voltage (V)  
VCE, Collector to Emitter Voltage (V)  
Figure 1. Output Characteristics  
Figure 2. Output Characteristics  
400  
350  
300  
250  
200  
150  
100  
50  
200  
150  
100  
50  
T
J=175°C  
Common Emitter  
VCE=20V  
VGE=8V  
V
=10V  
GE  
V
GE=12V  
VGE=15V  
VGE=20V  
T
J=25°C  
T
J=175°C  
0
0
0
1
2
3
4
5
0
2
4
6
8
10  
12  
VCE, Collector to Emitter Voltage (V)  
VGE, Gate to Emitter Voltage (V)  
Figure 3. Output Characteristics  
Figure 4. Transfer Characteristics  
400  
350  
300  
250  
200  
150  
100  
50  
3
2.5  
2
Common Emitter  
VGE=15V  
T
J=25°C  
T
J=175°C  
Common Emitter  
VGE=15V  
1.5  
1
0.5  
0
IC=50A  
IC=100A  
IC=150A  
0
0
1
2
3
4
5
100  
50  
0
50  
100  
150  
200  
VCE, Collector to Emitter Voltage (V)  
T
J, CollectorEmitter Junction Temperature (°C)  
Figure 5. Saturation Characteristics  
Figure 6. Saturation Voltage vs. Junction  
Temperature  
www.onsemi.com  
4
FGY100T120SWD  
TYPICAL CHARACTERISTICS  
100000  
10000  
1000  
100  
Common Emitter  
VGE=0V f=1MHz  
J=25°C  
Common Emitter  
IC=100A  
14  
12  
10  
8
T
6
4
VCC=200V  
CC=400V  
CC=600V  
CIES  
COES  
CRES  
2
V
V
10  
0
0.1  
1
10  
0
50  
100  
150  
200  
250 300  
350  
VCE, Collector to Emitter Voltage (V)  
QG, Gate Charge (nC)  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
1000  
100  
10  
Common Emitter  
VGE=15V  
VCE=600V  
IC=100A  
*Note:  
T
C=25°C,  
T
J=175°C  
100  
Single Pulse  
pulseDuration=10us  
pulseDuration=100us  
pulseDuration=1ms  
pulseDuration=10ms  
pulseDuration=DC  
td(on)_T  
J=25°C  
1
td(on)_T  
J=175°C  
t _T  
J=25°C  
r
t _T  
J=175°C  
r
10  
0.1  
1
10  
100  
1000  
0
5
10  
15  
20  
R
G, Gate Resistance (W)  
25  
30  
35  
40  
45  
50  
VCE, Collector to Emitter Voltage (V)  
Figure 9. SOA Characteristics  
Figure 10. TurnOn Switching Time vs. Gate  
Resistance  
Common Emitter  
Common Emitter  
VGE=15V  
VCE=600V  
IC=100A  
VGE=15V  
VCE=600V  
IC=100A  
1000  
100  
10  
10  
EON_T  
J=25°C  
td(off)_T  
td(off)_T  
J=25°C  
t_T  
EON_T  
J=175°C  
J=175°C  
EOFF_T  
J=25°C  
J=25°C  
f
EOFF_T  
J=175°C  
t_T  
J=175°C  
f
1
0
5
10  
15  
R
20  
25  
30  
35  
40  
45  
50  
0
5
10  
15  
20  
R
G, Gate Resistance (W)  
25  
30  
35  
40  
45  
50  
G, Gate Resistance (W)  
Figure 11. TurnOff Switching Time vs. Gate  
Figure 12. Switching Loss vs. Gate Resistance  
Resistance  
www.onsemi.com  
5
FGY100T120SWD  
TYPICAL CHARACTERISTICS  
1000  
Common Emitter  
VGE=15V  
Common Emitter  
VGE=15V  
VCE=600V  
VCE=600V  
R
G=4.7W  
RG=4.7W  
100  
100  
10  
1
td(on)_T  
J=25°C  
td(off)_T  
J=25°C  
td(on)_T  
J=175°C  
td(off)_T  
J=175°C  
t _T  
J=25°C  
t_T  
J=25°C  
r
f
t _T  
J=175°C  
t_T  
J=175°C  
r
f
10  
0
50  
100  
150  
200  
0
50  
100  
150  
200  
IC, Collector Current (A)  
IC, Collector Current (A)  
Figure 13. TurnOn Switching Time vs. Collector  
Figure 14. TurnOff Switching Time vs. Collector  
Current  
Current  
400  
VGE=0V  
Common Emitter  
VGE=15V  
350  
300  
250  
200  
150  
100  
50  
VCE=600V  
R
G=4.7W  
10  
1
EON_T  
EON_T  
J=25°C  
EOFF_T  
J=175°C  
T
J=175°C  
J=25°C  
T
EOFF_T  
J=25°C  
J=175°C  
0.1  
0
0
50  
100  
150  
200  
0
1
2
3
4
5
IC, Collector Current (A)  
VF, Forward Voltage (V)  
Figure 15. Switching Loss vs. Collector Current  
Figure 16. Diode Forward Characteristics  
600  
500  
400  
100  
80  
VR=600V  
IF=100A  
VR=600V  
IF=100A  
T
J=25°C  
T
J=175°C  
60  
40  
300  
200  
100  
20  
0
T
J=25°C  
T
J=175°C  
400  
600  
800  
1000  
1200  
1400  
1600  
400  
600  
800  
1000  
1200  
1400  
1600  
diF /dt, Diode Current Slope (A/us)  
diF/dt, Diode Current Slope (A/us)  
Figure 17. Diode Reverse Recovery Current  
Figure 18. Diode Reverse Recovery Time  
www.onsemi.com  
6
FGY100T120SWD  
TYPICAL CHARACTERISTICS  
16000  
12000  
8000  
=600V  
IF=100A  
VR  
4000  
0
T
J=25°C  
T
J=175°C  
400  
600  
800  
1000  
1200  
1400  
1600  
diF /dt, Diode Current Slope (A/us)  
Figure 19. Diode Stored Charge Characteristics  
1
0.1  
D=0 is Single Pulse  
D=0.00  
D=0.01  
D=0.02  
D=0.05  
D=0.10  
D=0.20  
D=0.50  
0.01  
0.001  
Notes:  
ZθJC(t)=0.17°C/W Max  
TJM=PDMxZθJC(t(t)+TTC  
P
DM  
t
1
Duty Cycle,D=t/t /t2  
1  
t
1e06  
1e05  
1e04  
1e03  
1e02  
1e01  
1e+00  
1e+01  
t, Rectangular Pulse Duration (sec)  
Figure 20. Transient Thermal Impedance of IGBT  
1
0.1  
D=0 is Single Pulse  
0.01  
0.001  
D=0.00  
D=0.01  
D=0.02  
D=0.05  
D=0.10  
D=0.20  
D=0.50  
Notes:  
(t)=0.29°C/W Max  
ZθJC  
P
DM  
TJM=PDMxZθJC(t()t+)+TTC  
Duty Cycle,D=t/t /t 2  
1  
t
1
t
2
1e+01  
1e06  
1e05  
1e04  
1e03  
1e02  
1e01  
1e+00  
t, Rectangular Pulse Duration (sec)  
Figure 21. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
FGY100T120SWD  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CD  
ISSUE A  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
Email Requests to: orderlit@onsemi.com  
TECHNICAL SUPPORT  
North American Technical Support:  
Voice Mail: 1 8002829855 Toll Free USA/Canada  
Phone: 011 421 33 790 2910  
Europe, Middle East and Africa Technical Support:  
Phone: 00421 33 790 2910  
For additional information, please contact your local Sales Representative  
onsemi Website: www.onsemi.com  
www.onsemi.com  

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SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

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SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

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