FIN1049MTCX [ONSEMI]

带双线路接收器的 LVDS 双线路驱动器;
FIN1049MTCX
型号: FIN1049MTCX
厂家: ONSEMI    ONSEMI
描述:

带双线路接收器的 LVDS 双线路驱动器

驱动 驱动器
文件: 总14页 (文件大小:1129K)
中文:  中文翻译
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April 2013  
FIN1049  
LVDS Dual-Line Driver with Dual-Line Receiver  
Features  
Description  
.
.
.
.
.
.
.
.
.
Greater than 400 Mbps Data Rate  
This dual driver-receiver is designed for high-speed  
interconnects utilizing Low Voltage Differential  
Signaling (LVDS) technology. The driver accepts  
LVTTL inputs and translates them to LVDS outputs.  
The receiver accepts LVDS inputs and translates them  
to LVTTL outputs. The LVDS levels have a typical  
differential output swing of 350 mV, which provides for  
low EMI at ultra-low power dissipation even at high  
frequencies. The FIN1049 can accept LVPECL inputs  
for translating from LVPECL to LVDS. The En and Enb  
inputs are AND-ed together to enable / disable the  
outputs. The enables are common to all four outputs. A  
single-line driver and single-line receiver function is  
also available in the FIN1019.  
3.3 V Power Supply Operation  
Low Power Dissipation  
Fail-Safe Protection for Open-Circuit Conditions  
Meets or Exceeds TIA/EIA-644-A LVDS Standard  
16-pin TSSOP Package Saves Space  
Flow-Through Pinout Simplifies PCB Layout  
Enable/Disable for all Outputs  
Industrial Operating Temperature Range:  
-40°C to +85°C  
Ordering Information  
Operating  
Temperature Range  
Packing  
Part Number  
Package  
Method  
16-Lead Thin Shrink Small Outline Package  
Tape and Reel  
FIN1049MTCX  
-40 to +85°C  
(TSSOP), JEDEC MO-153, 4.4mm Wide  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
Pin Configuration  
Functional Diagram  
Figure 1. Pin Configuration  
Figure 2. Functional Diagram  
Pin Definitions  
Pin #  
2, 3  
Name  
RIN1+, RIN2+  
RIN1-, RIN2-  
DOUT1+, DOUT2+  
DOUT1-, DOUT2-  
EN, ENb  
Description  
Non-Inverting LVDS Inputs  
Inverting LVDS Inputs  
1, 4  
7, 6  
Non-Inverting Driver Outputs  
Inverting Driver Outputs  
8, 5  
16, 9  
15, 14  
10, 11  
12  
Driver Enable Pins for All Outputs  
LVTTL Output Pins for ROUT1 and ROUT2  
LVTTL Input Pins for DIN1 and DIN2  
Power Supply (3.3 V)  
ROUT1, ROUT2  
DIN1, DIN2  
VCC  
13  
GND  
Ground  
Function Table  
Inputs  
Outputs (LVTTL)  
Inputs (LVDS)(1)  
RINn+ RINn-  
Outputs (LVDS)  
EN  
H
ENb  
ROUT1  
ROUT2  
DOUTn+  
DOUTn-  
L
H
H
L
ON  
Z
ON  
Z
ON  
Z
ON  
Z
H
L
Z
Z
Z
Z
L
Z
Z
Z
Z
Open Current  
Fail-Safe Condition  
H
L
H
H
Legend:  
H=HIGH Logic Level  
L=LOW Logic Level or OPEN  
X=Don't Care  
Z=High Impedance  
Note:  
1. Any unused receiver Inputs should be left open.  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
2
 
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VCC  
Parameter  
Min.  
-0.5  
-0.5  
-0.5  
Max.  
+4.6  
+4.6  
+4.6  
Unit  
V
Supply Voltage  
VIN  
LVDS DC Input Voltage  
V
VOUT  
IOSD  
TSTG  
TJ  
LVDS DC Output Voltage  
V
Driver Short-Circuit Current (Continuous)  
Storage Temperature Range  
10  
mA  
°C  
°C  
°C  
-65  
+150  
+150  
Max Junction Temperature  
TL  
Lead Temperature (Soldering, 10 Seconds)  
Human Body Model, JESD22-A114  
Machine Model, JESD22-A115  
+260  
7000  
250  
ESD  
V
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
VCC  
Parameter  
Min.  
3.0  
Max.  
3.6  
Unit  
V
Supply Voltage  
|VID|  
Magnitude of Differential Voltage  
Operating Temperature  
100  
-40  
VCC  
mV  
°C  
TA  
+85  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
3
DC Electrical Characteristics  
Over-supply voltage and operating temperature ranges, unless otherwise specified. All typical values are at TA=25°C  
and with VCC=3.3 V.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Units  
LVDS Input DC Specifications (RIN1+, RIN1-, RIN2+, RIN2-) See Figure 3 and Table 1  
VCM=1.2 V, 0.05 V,  
2.35 V  
VTH  
VTL  
VIC  
Differential Input Threshold HIGH  
Differential Input Threshold LOW  
Common Mode Voltage Range  
0
0
35  
mV  
mV  
V
-100  
VID/2  
VCC  
(VID/2)  
-
VID=100 mV, VCC=3.3 V  
VCC=0 V or 3.6 V,  
VIN=0 V or 2.8 V  
IIN  
Input Current  
±20  
mA  
CMOS/ LVTTL Input DC Specifications (EN, ENb, DIN1, DIN2  
)
VIH  
VIL  
Input High Voltage (LVTTL)  
2.0  
VCC  
0.8  
V
V
Input Low Voltage (LVTTL)  
GND  
Input Current (EN, ENb, DIN1, DIN2, RINx+  
,
IIN  
VIN=0 V or VCC  
VIK=-18 mA  
±20  
µA  
V
RINx-  
)
VIK  
Input Clamp Voltage  
-1.5  
250  
-0.7  
350  
LVDS Output DC Specifications (DOUT1+, DOUT1-, DOUT2+, DOUT2-  
)
VOD  
Output Differential Voltage  
VOD Magnitude Change from  
Differential LOW-to-HIGH  
Offset Voltage  
See Figure 4  
RL=100   
450  
35  
mV  
mV  
VOD  
Driver Enabled  
See Figure 4  
VOS  
1.125 1.250 1.375  
25  
V
Offset Magnitude Change from Differential  
LOW-to-HIGH  
mV  
VOS  
DOUT+=0V & DOUT-=0 V,  
Driver Enabled  
IOS  
IOSD  
IOFF  
-9  
-9  
mA  
mA  
mA  
Short-Circuit Output Current  
VOD=0 V, Driver Enabled  
VCC=0 V, VOUT=0 V or  
VCC  
Power-Off Input or Output Current  
Disabled Output Leakage Current  
±20  
Driver Disabled,  
DOUT+=0 V or VCC or  
DOUT-=0V or VCC  
IOZD  
±10  
mA  
CMOS/LVTTL Output DC Specifications (ROUT1, ROUT2  
)
VOH  
VOL  
Output High Voltage  
Output Low Voltage  
IOH=-2 mA, VID=200 mV  
IOL=2 mA, VID=200 mV  
2.7  
V
V
0.25  
Driver Disabled,  
ROUTn=0 V or VCC  
IOZ  
ICC  
Disabled Output Leakage Current  
Power Supply Current(2)  
±10  
25  
mA  
mA  
Drivers Enabled, Any  
Valid Input Condition  
ICCZ  
CIND  
COUT  
CINT  
Power Supply Current  
Input Capacitance  
Output Capacitance  
Input Capacitance  
Drivers Disabled  
LVDS Input  
10  
mA  
pF  
pF  
pF  
3.0  
4.0  
3.5  
LVDS Output  
LVTTL Input  
Note:  
2. Both driver and receiver inputs are static. All LVDS outputs have 100 load. None of the outputs have any  
lumped capacitive load.  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
4
 
AC Electrical Characteristics  
Over-supply voltage and operating temperature ranges, unless otherwise specified. All typical values are at TA=25°C  
and with VCC=3.3 V.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Units  
Switching Characteristics - LVDS Outputs  
tPLHD  
tPHLD  
tTLHD  
tTHLD  
tSK(P)  
Differential Propagation Delay LOW-to-HIGH See Figure 5, Figure 6  
Differential Propagation Delay HIGH-to-LOW  
2
2
ns  
ns  
ns  
ns  
ns  
Differential Output Rise Time (20% to 80%)  
0.2  
0.2  
1.0  
1.0  
0.35  
Differential Output Fall Time (80% to 20%)  
Pulse Skew |tPLH - tPHL  
|
tSK(LH),  
tSK(HL)  
Channel-to-Channel Skew(3)  
0.35  
ns  
tSK(PP)  
tPZHD  
tPZLD  
tPHZD  
tPLZD  
fMAXD  
Part-to-Part Skew(4)  
1
6
6
3
3
ns  
ns  
Differential Output Enable Time, Z-to-HIGH  
Differential Output Enable Time, A-to-LOW  
Differential Output Disable Time, HIGH-to-Z  
Differential Output Disable Time, LOW-to-Z  
Maximum Frequency(5)  
See Figure 7, Figure 8  
See Figure 5  
ns  
ns  
ns  
200  
0.5  
MHz  
Switching Characteristics - LVTTL Outputs  
Measured from 20% to  
80% Signal  
tPHL  
Propagation Delay HIGH-to-LOW  
1.0  
3.5  
ns  
tPLH  
tSK1  
Propagation Delay LOW-to-HIGH  
Pulse Skew  
VID=200 mV  
0.5  
0
1.0  
35  
50  
3.5  
400  
500  
1
ns  
ps  
Distributed Load  
CL=15 pF and 50   
RL=1 k  
tSK2  
Channel-to-Channel Skew  
Part-to-Part Skew  
0
ps  
tSK3  
0
ns  
tLHR  
Transition Time LOW-to-HIGH  
Transition Time HIGH-to-LOW  
Disable Time HIGH-to-Z  
Disable Time LOW-to-Z  
Enable Time Z-to-HIGH  
Enable Time Z-to-LOW  
Maximum Frequency(6)  
VOS=1.2 V  
0.10  
0.10  
2.2  
1.3  
1.8  
0.9  
200  
0.25  
0.18  
4.5  
1.40  
1.40  
8.0  
8.0  
7.0  
7.0  
ns  
tHLR  
See Figure 9, Figure 10  
See Figure 11, Figure 12  
ns  
tPHZ  
ns  
tPLZ  
3.5  
ns  
tPZH  
3.0  
ns  
tPZL  
1.4  
ns  
fMAXT  
Notes:  
See Figure 9  
MHz  
3. tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and  
are switching in the same direction.  
4. tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two  
devices switching in the same direction (either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with  
the same supply voltage, same temperature, and have identical test circuits.  
5. fMAXD generator input conditions: tr=tf < 1 ns (10% to 90%), 50% duty cycle, 0 V to 3 V. Output criteria: duty  
cycle=45% / 55%, VOD > 250 mV, all channels switch.  
6. fMAXT generator input conditions: tr=tf < 1 ns (10% to 90%), 50% duty cycle, VID=200 mV, VCM=1.2 V. Output  
criteria: duty cycle=45% / 55%, VOH > 2.7 V. VOL < 0.25 V, all channels switching.  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
5
 
 
 
 
Required Specifications and Test Diagrams  
Notes:  
7. Electrostatic Discharge Capability: Human Body Model and Machine Model ESD should be measured using MIL-  
STD-883C method 3015.7 standard.  
8. Latch-up immunity should be tested to the EIA/JEDEC Standard Number 78 (EIA/JESD78).  
Figure 3. Differential Receiver Voltage Definitions Test Circuit  
Note:  
9. CL=15 pF, includes all probe and jig capacitances.  
Table 1.  
Receiver Minimum and Maximum Input Threshold Test Voltages  
Resulting Differential  
Applied Voltages (V)  
Resulting Common  
Mode Input Voltage (V)  
Input Voltage (mV)  
VIA  
1.25  
1.15  
VCC  
VIB  
1.15  
1.25  
VCC - 0.1  
VCC  
VID  
100  
VIC  
1.2  
-100  
100  
1.2  
VCC - 0.05  
VCC - 0.05  
0.05  
VCC - 0.1  
0.1  
-100  
100  
0.0  
0.0  
0.1  
-100  
1100  
-1100  
1100  
-1100  
1100  
-1100  
0.05  
1.75  
0.65  
VCC  
0.65  
1.75  
VCC - 1.1  
VCC  
1.2  
1.2  
VCC - 0.55  
VCC - 0.55  
0.55  
VCC - 1.1  
1.1  
0.0  
0.0  
1.1  
0.55  
Figure 4. LVDS Output Circuit for DC Test  
Note:  
10. RL=100   
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
6
Required Specifications and Test Diagrams (Continued)  
Figure 5. LVDS Output Propagation Delay and Transition Time Test Circuit  
Notes:  
11. A: RL=100   
12. B: ZO=50 and CT=15 pF distributed.  
Figure 6. LVTTL Input to LVDS Output AC Waveform  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
7
Required Specifications and Test Diagrams (Continued)  
Figure 7. LVDS Output Enable / Disable Delay Test Circuit  
Notes:  
13. A: RL=100   
14. B: ZO=50 and CT=15 pF distributed.  
15. R1=1000 , RS=950   
16. VTST=2.4 V.  
Figure 8. LVDS Output Enable / Disable Timing Waveforms  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
8
Required Specifications and Test Diagrams (Continued)  
Figure 9. LVTTL Output Propagation Delay and Transition Time Test Circuit  
Notes:  
17. A: ZO=50 and CT=15 pF distributed.  
18. RL=100 and RS=950   
Figure 10.LVDS Input to LVTTL Output Propagation Delay and Transition Time Waveforms  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
9
Required Specifications and Test Diagrams (Continued)  
Figure 11.LVTTL Output Enable / Disable Test Circuit  
Notes:  
19. A: ZO=50 and CT=15 pF distributed.  
20. RL=100 , R1=1000 , and RS=950   
Figure 12.LVTTL Output Enable / Disable Timing Waveforms  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
10  
Physical Dimensions  
5.00±0.10  
4.55  
5.90  
4.45 7.35  
0.65  
4.4±0.1  
1.45  
5.00  
0.11  
12°  
MTC16rev4  
Figure 13.16-Lead, Thin-Shrink Small-Outline Package (TSSOP), JEDEC MO-153, 4.4 mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
11  
© 2003 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FIN1049 • Rev. 1.0.3  
12  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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