FODM181AR2 [ONSEMI]

Single Channel, DC Sensing Input, Phototransistor Optocoupler In Full-Pitch Mini-Flat 4-Pin Package;


型号：	FODM181AR2
厂家：	ONSEMI
描述：	Single Channel, DC Sensing Input, Phototransistor Optocoupler In Full-Pitch Mini-Flat 4-Pin Package
文件：	总8页 (文件大小：378K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

www.onsemi.com

Single Channel, DC Sensing

Input, Phototransistor

Optocoupler In Full-Pitch

Mini-Flat 4-Pin Package

MFP4 4.10 x 4.4, 2.54P

100EC

Product Preview

MARKING DIAGRAM

FODM181 Series

The FODM181 series consist of a gallium arsenide infrared emitting

diode driving a phototransistor. It built in a compact, half−pitch,

mini−flat, 4−pin package. The lead pitch is 2.54 mm.

181x

V X YY R

Features

• Current Transfer Ratio Ranges from 20 to 600%

• at I = 5 mA, V = 5 V, T = 25°C

181x

= onsemi Logo

= Device Number

= DIN EN/IEC60747−5−5 Option

= One−Digit Year Code

= Digit Work Week

♦ FODM181A − 80 to 160%

♦ FODM181B − 130 to 260%

♦ FODM181C − 200 to 400%

♦ FODM181D − 300 to 600%

• Safety and Regulatory Approvals:

= Assembly Package Code

♦ UL1577, 3750 VAC

for 1 min

RMS

♦ DIN EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

(Pending)

PIN CONNECTIONS

• Applicable to Infrared Ray Reflow, 260°C

Typical Applications

ANODE

COLLECTOR

EMITTER

• Primarily Suited for DC−DC Converters

• For Ground Loop Isolation, Signal to Noise Isolation

• Communications – Adapters, Chargers

• Consumer – Appliances, Set Top Boxes

CATHODE

FODM181

• Industrial – Power Supplies, Motor Control, Programmable Logic

Control

ORDERING INFORMATION

See detailed ordering and shipping information on page 6 of

this data sheet.

This document contains information on a product under development. onsemi reserves

the right to change or discontinue this product without notice.

Publication Order Number:

September, 2022 − Rev. P0

FODM181/D

FODM181 Series

SAFETY AND INSULATIONS RATING

As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.

Compliance with the safety ratings shall be ensured by means of protective circuits.

Parameter

Characteristics

Installation Classifications per DIN VDE 0110/1.89 Table 1,

For Rated Mains Voltage

< 150 V_RMS

< 300 V_RMS

I − IV

I − III

55/110/21

Climatic Classification

Pollution Degree (DIN VDE 0110/1.89)

Comparative Tracking Index

175

Symbol

Parameter

Input−to−Output Test Voltage, Method A, V

Value

Unit

x 1.6 = V

904

Vpeak

IORM

Type and Sample Test with t = 10 s, Partial Discharge < 5 pC

Input−to−Output Test Voltage, Method B, V

x 1.875 = V

1060

Vpeak

IORM

100% Production Test with t = 1 s, Partial Discharge < 5 pC

Maximum Working Insulation Voltage

565

4,000

≥ 5

Vpeak

°C

IORM

Highest Allowable Over−Voltage

External Creepage

IOTM

≥ 5

External Clearance

≥ 0.4

150

DTI

Distance Through Insulation (Insulation Thickness)

Case Temperature (Note 1)

Insulation Resistance at T , V = 500 V (Note 1)

> 10

1. Safety limit values – maximum values allowed in the event of a failure.

ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specified.)

Symbol

Parameter

Value

Units

Storage Temperature

Operating Temperature

Junction Temperature

Lead Solder Temperature

−55 to +150

−55 to +110

−55 to +125

260 for 10 sec

°C

STG

OPR

SOL

(Refer to Reflow Temperature Profile)

EMITTER

Continuous Forward Current

Peak Forward Current (1 s pulse, 300 pps)

Reverse Input Voltage

F(average)

(peak)

Power Dissipation (Note 2)

LED

DETECTOR

Continuous Collector Current

Collector−Emitter Voltage

C(average)

CEO

ECO

Emitter−Collector Voltage

Collector Power Dissipation (Note 2)

150

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected to conditions outside

these ratings.

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FODM181 Series

ELECTRICAL CHARACTERISTICS T = 25°C unless otherwise specified

Symbol

Parameter

Device

Conditions

Min.

Typ.

Max.

Units

EMITTER

I_F

Forward Current

FODM181

All

I_F= 20 mA

−

1.2

−

1.4

I_R

Reverse Current

Input Capacitance

V_R= 4 V

C_in

V = 0 V, f = 1 kHz

250

DETECTOR

Collector−Emitter Breakdown Voltage

Emitter−Collector Breakdown Voltage

Collector Dark Current

All

= 0.1 mA, IF = 0 mA

= 0.01 mA, IF = 0 mA

−

CEO

ECO

= 20 V, IF = 0 mA

−

100

CEO

TRANSFER CHARACTERISTICS T =25°C unless otherwise specified

Symbol

CTR

Parameter

Device

Conditions

Min.

Typ.

−

Max.

160

260

400

600

0.2

Units

Current Transfer Ratio

(Collector−Emitter)

FODM181A

FODM181B

FODM181C

FODM181D

I = 5 mA, V = 5 V

F CE

130

200

300

−

Collector−Emitter Saturation Voltage

FODM181

series

I = 20 mA, I = 1.0 mA

0.1

CE(SAT)

SWITCHING CHARACTERISTICS T = 25°C unless otherwise specified

Symbol

Parameter

Rise Time

Fall Time

Conditions

= 2 mA, V = 2 V, R = 100 W

Min.

−

Typ.

Max.

Units

= 2 mA, V = 2 V, R = 100 W

−

ISOLATION CHARACTERISTICS

Symbol

Parameter

Input−Output Isolation Voltage

Isolation Resistance

Conditions

Freq = 60 Hz, t = 1.0 min

= 500 V (Note 3)

Min.

Typ.

−

Max.

−

Units

ISO

3,750

VAC

RMS

I−O

5 x 10

−

Isolation Capacitance

Frequency = 1 MHz

−

0.6

1.0

3. Device is considered a two terminal device: Pin 1 and 2 are shorted together and Pins 3 and 4 are shorted together.

4. 3,750 VAC_RMSfor 1 minute duration is equivalent to 4,500 VAC_RMSfor 1 second duration.

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FODM181 Series

TYPICAL PERFORMANCE CURVES

100

400

= 5 V

T = 110°C

350

300

250

T = 25°C

85°C

25°C

0°C

−55°C

200

150

100

0.5

1.0

1.5

2.0

100

V , FORWARD VOLTAGE (V)

I , FORWARD CURRENT (mA)

Figure 2. Current Transfer Ratio vs. Forward

Current

Figure 1. Forward Current vs. Forward Voltage

120

100

T = 25°C

0.5 mA

1 mA

3 mA

5 mA

7 mA

−60 −40 −20

60 80

100 120

0.0

2.5

5.0

7.5

10.0

12.5

15.0

T , AMBIENT TEMPERATURE (°C)

− FORWARD CURRENT (mA)

Figure 4. Collector−Emitter Saturation

Figure 3. Relative Current Ratio vs. Ambient

Temperature

Voltage vs. Forward Current

0.14

T = 25°C

I = 10 mA

I = 30 mA

= 1 mA

0.12

0.10

0.08

0.06

0.04

0.02

0.00

I = 20 mA

I = 10 mA

I = 5 mA

−60 −40 −20

80 100 120

, COLLECTOR−EMITER VOLTAGE (V)

T , AMBIENT TEMPERATURE (°C)

Figure 6. Collector−Emitter Saturation Voltage

Figure 5. Collector Current vs. Collector−Emitter

vs. Ambient Temperature

Voltage

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FODM181 Series

TYPICAL PERFORMANCE CURVES (CONTINUE)

100

10000

= 5 V

= 20 V

OFF

I = 5 mA

1000

100

0.1

0.01

0.1

−60 −40 −20

20 40

80 100 120

R , LOAD RESISTANCE (kW)

T , AMBIENT TEMPERATURE (°C)

Figure 7. Switching Time vs. Load Resistance

Figure 8. Collector Dark Current vs. Ambient

Temperature

160

140

120

100

125

100

125

T , AMBIENT TEMPERATURE (°C)

Figure 10. Max Allowable Power Dissipation

(Detector) vs. Ambient Temperature

Figure 9. Max Allowable Power Dissipation (LED)

vs. Ambient Temperature

TEST CIRCUIT

90%

10%

I Monitor

OFF

Figure 11. Test Circuit for Switching Time

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FODM181 Series

REFLOW PROFILE

Max. Ramp−up Rate = 3°C/S

Max. Ramp−down Rate = 6°C/S

260

240

220

200

180

160

Tsmax

Tsmin

Preheat Area

140

120

100

120

240

360

Time 25°C to Peak

Proﬁle Freature

Pb−Free Assembly Proﬁle

150°C

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (t ) from (Tsmin to Tsmax)

200°C

60 − 120 seconds

3°C / second max.

181°C

Ramp−up Rate (t to t )

Liquidous Temperature (T )

Time (t ) Maintained Above (T )

60 − 150 seconds

260°C +0°C / −5°C

30 seconds

Peak Body Package Temperature

Time (t ) within 5°C of 260°C

Ramp−down Rate (T to T )

6°C / second max.

8 minutes max.

Time 25°C to Peak Temperature

ORDERING INFORMATION (Note 5)

Part Number

Package

Packing Method

FODM181A

SOP 4−Pin

Tube (100 units)

FODM181AR2

FODM181AV

FODM181AR2V

Tape and Reel (3000 units)

Tube (100 units)

SOP 4−Pin, DIN EN/IEC60747−5−5 Option

Tape and Reel (3000 units)

5. The product orderable part number system listed in this table also applies to the FODM181, FODM181A, FODM181B, FODM181C, and

FODM181D products.

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FODM181 Series

PACKAGE DIMENSIONS

MFP4 4.1x4.4, 2.54P

CASE 100EC

ISSUE O

*For additional information on our Pb−Free strategy

and soldering details, please download the

onsemi Soldering and Mounting

Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

FODM181 Series

onsemi,

, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates

and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.

A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any

products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the

information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use

of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products

and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information

provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license

under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems

or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should

Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Email Requests to: orderlit@onsemi.com

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

onsemi Website: www.onsemi.com

◊

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FODM181AR2 [ONSEMI]

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