FODM3011R2 [ONSEMI]
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers;
| 型号： | FODM3011R2 |
| 厂家： | 
ONSEMI |
| 描述： | 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers 三端双向交流开关 输出元件 光电 |
| 文件： | 总12页 (文件大小：942K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
FODM3011, FODM3012, FODM3022, FODM3023,
FODM3052, FODM3053
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac
Driver Output Optocouplers
Features
Description
•
Compact 4-pin Surface Mount Package
(2.4 mm Maximum Standoff Height)
Peak Blocking Voltage
The FODM301X, FODM302X, and FODM305X series
consists of a GaAs infrared emitting diode driving a
silicon bilateral switch housed in a compact 4-pin mini-
flat package. The lead pitch is 2.54 mm. They are
designed for interfacing between electronic controls and
power triacs to control resistive and inductive loads for
115 V/240 V operations.
•
– 250V (FODM301X)
– 400V (FODM302X)
– 600V (FODM305X)
•
Safety and Regulatory Approvals:
– UL1577, 3,750 VACRMS for 1 Minute
– DIN-EN/IEC60747-5-5, 565 V Peak Working
Insulation Voltage
Applications
•
•
•
•
•
•
•
•
•
Industrial Controls
Traffic Lights
Vending Machines
Solid State Relay
Lamp Ballasts
Solenoid/Valve Controls
Static AC Power Switch
Incandescent Lamp Dimmers
Motor Control
Functional Schematic
Package Outlines
MAIN
TERMINAL
1
4
3
ANODE
MAIN
TERMINAL
CATHODE 2
Figure 2. Package Outlines
Figure 1. Functional Schematic
©2003 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Publication Order Number:
FODM3053-NF098/D
Safety and Insulation Ratings
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit
data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Parameter
Installation Classifications per DIN VDE
Characteristics
< 150 VRMS
< 300 VRMS
I–IV
I–III
0110/1.89 Table 1, For Rated Mains Voltage
Climatic Classification
40/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Comparative Tracking Index
175
Symbol
Parameter
Value
Unit
Vpeak
Vpeak
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR
Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC
,
904
VPR
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR
100% Production Test with tm = 1 s, Partial Discharge < 5 pC
,
1060
VIORM
VIOTM
Maximum Working Insulation Voltage
Highest Allowable Over-Voltage
External Creepage
565
6000
5
Vpeak
Vpeak
mm
mm
mm
°C
External Clearance
5
DTI
TS
Distance Through Insulation (Insulation Thickness)
Case Temperature(1)
0.4
150
IS,INPUT
Input Current(1)
200
mA
PS,OUTPUT Output Power(1)
RIO
Insulation Resistance at TS, VIO = 500 V(1)
Note:
300
> 109
mW
1. Safety limit values – maximum values allowed in the event of a failure.
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2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA = 25°C unless otherwise specified.
Symbol
TSTG
TOPR
TJ
Parameter
Value
Unit
°C
Storage Temperature
Operating Temperature
Junction Temperature
Lead Solder Temperature
-55 to +150
-40 to +100
-40 to +125
260 for 10 sec
°C
°C
TSOL
°C
EMITTER
IF (avg)
IF (pk)
Continuous Forward Current
60
1
mA
A
Peak Forward Current (1 μs pulse, 300 pps.)
Reverse Input Voltage
VR
3
V
PD
Power Dissipation (No derating required over operating temp. range)
100
mW
DETECTOR
mA
(RMS)
IT(RMS)
On-State RMS Current
FODM3011, FODM3012
70
250
400
600
300
VDRM
Off-State Output Terminal Voltage
FODM3022, FODM3023
FODM3052, FODM3053
V
PD
Power Dissipation (No derating required over operating temp. range)
mW
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3
Electrical Characteristics
TA = 25°C unless otherwise specified.
Individual Component Characteristics
Symbol
EMITTER
VF
Parameter
Test Conditions
Device
All
Min.
Typ. Max. Unit
Input Forward Voltage
IF = 10 mA
1.20
0.01
1.50
100
V
IR
Reverse Leakage Current
VR = 3 V, TA = 25°C
All
μA
DETECTOR
Peak Blocking Current Either
Direction
IDRM
Rated VDRM, IF = 0(2)
All
2
100
nA
FODM3011,
FODM3012,
FODM3022,
FODM3023
10
Critical Rate of Rise of
Off-State Voltage
dV/dt
IF = 0 (Figure 8)(3)
V/μs
FODM3052,
FODM3053
1,000
Notes:
2. Test voltage must be applied within dv/dt rating.
3. This is static dv/dt. See Figure 1 for test circuit Commutating dv/dt is function of the load-driving thyristor(s) only.
Transfer Characteristics
Symbol
Parameter
Test Conditions
Device
Min.
Typ. Max. Unit
FODM3011,
FODM3022,
FODM3052
10
mA
5
Main Terminal
Voltage = 3 V(4)
IT
LED Trigger Current
FODM3012,
FODM3023,
FODM3053
Holding Current, Either
Direction
IH
All
All
450
2.2
µA
V
Peak On-State Voltage Either
Direction
VTM
I
TM = 100 mA peak
3
Notes:
4. All devices are guaranteed to trigger at an IF value of less than or equal to the max IFT specification. For optimum
operation over temperature and lifetime of the device, the LED should be biased with an IF that is at least 50%
higher than the maximum IFT specification. The IFT should not exceed the absolute maximum rating of 60 mA.
Example: For FODM0353M, the minimum IF bias should be 5 mA x 150% = 7.5 mA
Isolation Characteristics
Symbol
Parameter
Test Conditions
Device
All
Min.
Typ. Max.
Unit
1 Minute,
R.H. = 40% to 60%
Steady State Isolation
Voltage
VISO
3,750
VACRMS
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4
Typical Performance Characteristics
1.8
1.7
1.6
1.5
1.4
1000
100
10
VDRM = 600 V
TA = -40 °C
1.3
25 °C
1.2
100 °C
1
1.1
1.0
0.9
0.1
1
10
100
-40
-20
0
20
40
60
80
100
IF - FORWARD CURRENT (mA)
TA - AMBIENT TEMPERATURE (°C)
Figꢀ3.ꢀLEDꢀForwardꢀVoltageꢀvs.ꢀForwardꢀCurrent
Figꢀ4.ꢀLeakageꢀCurrentꢀvs.ꢀAmbientꢀTemperature
10
1.4
1.3
1.2
1.1
1.0
0.9
0.8
VTM = 3 V
NORMALIZED TO TA = 25 °C
NORMALIZED TO TA = 25 °C
1
0.1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (°C)
TA - AMBIENT TEMPERATURE (°C)
Fig 5. Normalized Holding Current vs. Ambient Temperature
Fig 6. Normalized Trigger Current vs. Ambient Temperature
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5
Typical Performance Characteristics (Continued)
12
10
8
1.4
TA = 25 °C
NORMALIZED TO PWIN >> 100 µs
NORMALIZED TO TA = 25 °C
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
6
4
2
0
1
10
100
-40
-20
0
20
40
60
80
100
PWIN - LED TRIGGER PULSE WIDTH (µs)
TA - AMBIENT TEMPERATURE (°C)
Fig 7. LED Current Required to Trigger vs. LED Pulse Width
Fig 8. Normalized Off-State Output Terminal Voltage vs. Ambient Temperature
400
TA = 25 °C
300
200
100
0
-100
-200
-300
-400
-4
-3
-2
-1
0
1
2
3
4
VTM - ON-STATE VOLTAGE (V)
Fig 9. On-State Characteristics
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6
Typical Application Information
600 V (FODM3052)
(FODM3053)
400 V (FODM3022)
(FODM3023)
250 V (FODM3011)
(FODM3012)
1. The mercury wetted relay provides a high speed
repeated pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current,
RTEST
Vdc
R = 10 kΩ
CTEST
PULSE
INPUT
MERCURY
WETTED
RELAY
then removing the current.The variable R
allows the
TEST
X100
SCOPE
PROBE
dv/dt to be gradually increased until the D.U.T. continues
to trigger in response to the applied voltage pulse, even
after the LED current has been removed. The dv/dt is
D.U.T.
then decreased until the D.U.T. stops triggering. τ is
RC
measured at this point and recorded.
V
= 600 V (FODM3052, FODM3053)
= 400 V (FODM3022, FODM3023)
= 250 V (FODM3011, FODM3012)
max
APPLIED VOLTAGE
WAVEFORM
378 V (FODM3052, FODM3053)
252 V (FOMD3022, FODM3023)
158 V (FODM3011, FODM3012)
0.63 V
378
max
dv/dt =
=
(FODM3053)
(FODM3052)
τ
τ
0 VOLTS
RC
RC
τ
RC
252
=
=
(FODM3023)
(FODM3022)
τ
RC
158
(FODM3011)
(FODM3012)
τ
RC
NOTE: This optoisolator should not be used to drive a load directly. It is
intended to be a trigger device only.
Figure 10. Static dv/dt Test Circuit
RL
Rin
Ω
180
1
2
4
3
VCC
120 V
60 Hz
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
Figure 11. Resistive Load
ZL
Rin
Ω
Ω
2.4 k
180
1
2
4
3
VCC
FODM3011
FODM3012
FODM3022
FODM3023
FODM3052
FODM3053
120 V
60 Hz
C1
0.1 μF
Figure 12. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)
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7
Typical Application Information (Continued)
Rin
360 Ω
470 Ω
1
4
HOT
VCC
FODM3022
FODM3023
FODM3052
FODM3053
39 Ω
0.05 μF
240
VAC
2
3
0.01 μF
LOAD
GROUND
In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.
The 39 Ω resistor and 0.01μF capacitor are for snubbing of the triac, and the 470 Ω resistor and 0.05 μF capacitor are
for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.
Figure 13.Typical Application Circuit
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8
Reflow Profile
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
T
P
260
240
220
200
180
160
140
120
100
80
t
P
T
L
Tsmax
t
L
Preheat Area
Tsmin
t
s
60
40
20
0
120
Time 25°C to Peak
240
360
Time (seconds)
Profile Freature
Pb-Free Assembly Profile
150°C
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
200°C
Time (t ) from (Tsmin to Tsmax)
60–120 seconds
3°C/second max.
217°C
S
Ramp-up Rate (t to t )
L
P
Liquidous Temperature (T )
L
Time (t ) Maintained Above (T )
60–150 seconds
260°C +0°C / –5°C
30 seconds
L
L
Peak Body Package Temperature
Time (t ) within 5°C of 260°C
P
Ramp-down Rate (T to T )
6°C/second max.
8 minutes max.
P
L
Time 25°C to Peak Temperature
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9
Ordering Information
Part Number
Package
Full Pitch Mini-Flat 4-Pin
Full Pitch Mini-Flat 4-Pin
Packing Method
Tube (100 units)
FODM3011
FODM3011R2
FODM3011V
FODM3011R2V
Tape and Reel (2500 Units)
Tube (100 Units)
Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option
Full Pitch Mini-Flat 4-Pin, DIN EN/IEC60747-5-5 Option
Tape and Reel (2500 Units)
Note:
The product orderable part number system listed in this table also applies to the FODM3012, FODM3022, FODM3023,
FODM3052, and FODM3053 products.
Marking Information
1
2
3011
6
V X YY R
3
4
5
Figure 14. Top Mark
Table 1. Top Mark Definitions
1
2
3
4
5
6
ON Semiconductor Logo
Device Number
DIN EN/IEC60747-5-5 Option (only appears on component ordered with this option)
One-Digit Year Code, e.g., “6”
Digit Work Week, Ranging from “01” to “53”
Assembly Package Code
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10
Tape Specifications
P
2
D0
P
0
t
K0
E
A0
W
W
1
B0
F
d
D1
P
2.54 Pitch
Description
Symbol
Dimensions
12.00 0.4
0.35 0.02
4.00 0.20
1.55 0.20
1.75 0.20
5.50 0.20
2.00 0.20
8.00 0.20
4.75 0.20
7.30 0.20
2.30 0.20
1.55 0.20
9.20
Tape Width
W
t
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Dia.
Sprocket Hole Location
Pocket Location
P
0
D0
E
F
P2
P
Pocket Pitch
Pocket Dimension
A0
B0
K0
D1
W1
d
Pocket Hole Dia.
Cover Tape Width
Cover Tape Thickness
0.065 0.02
Max. Component Rotation or Tilt
Devices Per Reel
20° max
2500
Reel Diameter
330 mm (13")
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11
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