FPAB30BH60B [ONSEMI]
用于单相升压功率因数校正的 PFC SPM® 3 系列;型号: | FPAB30BH60B |
厂家: | ONSEMI |
描述: | 用于单相升压功率因数校正的 PFC SPM® 3 系列 局域网 电动机控制 功率因数校正 光电二极管 |
文件: | 总13页 (文件大小:1043K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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2014 年 9 月
FPAB30BH60B
用于单相升压功率因数校正的 PFC SPM® 3 系列
特性
概述
• 通过 UL 第 E209204 号认证 (UL1557)
FPAB30BH60B 是一种先进的 PFC SPM® 3 模块,为消
费、医药和工业应用提供非常全面的高性能升压功率因数
校正输入功率平台。这些单相模块综合优化了内置 IGBT
的栅极驱动以最小化电磁干扰和能量损耗。同时也提供多
重模组保护特性,集成欠压闭锁,过流保护,热量监测和
故障报告。这些模块内的全波整流器和高性能输出二极
管,为额外节省空间和方便安装起到了重要作用。
• 600 V - 30 A 单相升压功率因数校正,包含栅极驱动和
保护的控制 IC
• 采用 DBC (Al2O3) 基板实现非常低的热阻
• 全波桥式整流器和高性能输出二极管
• 内置负温度系数热敏电阻可实现温度监测
• 针对 20 kHz 开关频率进行优化
• 绝缘等级:2500 Vrms / 分钟
应用
• 单相升压功率因数校正转换器
相关资料
• AN-9090 - PFC SPM 3 Series User’s Guide
• AN-9091 - Boost PFC Inductor Design Guide
图 1. 封装概览
封装标识与定购信息
器件
器件标识
封装
包装类型
数量
FPAB30BH60B
FPAB30BH60B
SPMIC-027
Rail
10
©2010 飞兆半导体公司
1
www.fairchildsemi.com
FPAB30BH60B Rev. C4
集成的功率功能
PFC 转换器,适用于单相 AC/DC 功率变换 (请参见图 3)
•
集成的驱动、保护和系统控制功能
•
•
•
•
对于 IGBT:栅极驱动电路、过流保护 (OCP)、控制电源欠压锁定 (UVLO) 保护
故障信号:对应 OC 和 UV 故障
内置热敏电阻:温度监控
输入接口:高电平有效接口,可用于 3.3 / 5 V 逻辑电平,施密特触发脉冲输入
引脚配置
Top View
12.205
CC
(1)V
(21)P
(2)COM
(3)COM
(4)COM
(5)IN
(22)P
FO
(6)V
(23)N.C
FOD
(7)C
(8)C
SC
TH
(9)R
(10)V
(24)L
(25)PR
(26)R
(27)S
C
Case Temperature (T )
TH
Detecting Point
(11)N.C
(12)N.C
(13)N
(14)N
(15)N
(16)N
(17)NR
(18)NR
DBC Substrate
(19)NR
(20)NR
图 2. 俯视图
注:
1. 关于壳体温度 (T ) 的测量点,请参见图 2。
C
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
2
www.fairchildsemi.com
引脚描述
引脚号
引脚名
VCC
COM
IN
引脚描述
1
2,3,4
5
驱动 IC 和 IGBT 的通用偏置电压
公共电源接地
IGBT 信号输入
6
VFO
CFOD
CSC
R(TH)
V(TH)
N.C
N
故障输出
7
设置故障输出持续时间的电容
过电流感测电容 (低通滤波器)
供热敏电阻使用的串联电阻器
热敏电阻偏压
8
9
10
*
11,12
13~16
17~20
21,22
23
无连接
IGBT 发射极
整流器直流负端
直流正端
NR
P
N.C
L
无连接
24
电感器连接引脚
整流器直流正端
R 相的交流输入
S 相的交流输入
25
PR
26
R
27
S
* 引脚 11 和引脚 12 被切除。更多详细信息请参照产品封装外形图。
内部等效电路与输入 / 输出引脚
(10) VTH
NTC
Thermistor
(21,22) P
(24) L
(9) RTH
(8) CSC
(7) CFOD
(6) VFO
CSC
CFOD
VFO
(25) PR
(5) IN
IN
OUT
(26) R
(27) S
(2~4) COM
(1) VCC
COM
VCC
(13~16) N
(17~20) NR
图 3. 内部框图
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
3
www.fairchildsemi.com
绝对最大额定值 (TJ = 25°C,除非另有说明。)
转换器部分
符号
Vi
项目
条件
额定值
264
单位
Vrms
V
施加在 R - S 之间
施加在 R - S 之间
施加在 P - N 之间
施加在 P - N 之间
电源电压
Vi (浪涌)
VPN
500
电源电压 (浪涌)
输出电压
450
V
VPN (浪涌)
VCES
IC
500
V
输出电压 (浪涌)
集电极 - 发射极之间电压
单个 IGBT 的集电极电流
单个 IGBT 的集电极电流 (峰值)
集电极功耗
600
V
TC = 25°C, TJ < 150°C
30
A
ICP
TC = 25°C, TJ < 150°C, 脉冲宽度小于 1ms
TC = 25°C
60
A
PC
104
W
V
VRRM
IFSM
600
重复反向峰值电压
正向浪涌峰值电流
工作结温
350
A
单一正弦半波
TJ
-40 ~ 150
°C
控制部分
符号
VCC
VIN
项目
控制电源电压
条件
施加在 VCC - COM 之间
施加在 IN - COM 之间
施加在 VFO - COM 之间
额定值
20
单位
V
-0.3 ~ VCC+0.3
-0.3 ~ VCC+0.3
5
V
输入信号电压
VFO
IFO
V
故障输出电源电压
故障输出电流
V
FO 引脚处的灌电流
mA
V
VSC
施加在 CSC - COM 之间
-0.3 ~ VCC+0.3
电流感测输入电压
整个系统
符号
TSTG
VISO
项目
存储温度
条件
额定值
-40 ~ 125
2500
单位
°C
60 Hz,正弦波形,交流 1 分钟,连接陶瓷基板
到引脚
Vrms
绝缘电压
热阻
符号
项目
条件
最小值 典型值 最大值 单位
R
IGBT
FRD
-
-
-
-
-
-
1.2
1.4
1.7
°C/W
°C/W
°C/W
结点 - 壳体的热阻
(j-c)Q
θ
R
R
(j-c)F
θ
整流器 (每 1 / 4 模块)
(j-c)R
θ
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
4
www.fairchildsemi.com
电气特性 (TJ = 25°C,除非另有说明。)
转换器部分
符号
VCE(SAT)
VFF
项目
条件
VCC = 15 V, VIN = 5 V, IC = 30 A
IF = 30 A
最小值 典型值 最大值 单位
-
-
-
-
-
-
-
-
-
-
2.2
1.9
1.2
500
200
420
100
60
2.8
V
V
IGBT 饱和电压
2.6
快速恢复二极管正向电压
整流器正向电压
开关时间
VFR
IF = 30 A
1.5
V
tON
VPN = 400 V, VCC = 15V, IC = 30 A
-
ns
ns
ns
ns
ns
A
V
IN = 0 V ↔ 5 V,电感负载
tC(ON)
tOFF
tC(OFF)
trr
-
(注 2)
-
-
-
-
Irr
7
ICES
VCE = VCES
-
250
μA
集电极 - 发射极间漏电流
注:
2. t 和 t
包括模块内部驱动 IC 的传输延迟时间。 t
和 t
指在内部给定的栅极驱动条件下, IGBT 本身的开关时间。详细信息,请参见图 4。
ON
OFF
C(ON)
C(OFF)
Irr
120%of IC
100%of IC
VCE
IC
90% of IC
15% of VCE
10%of IC
15%of VCE
10%of IC
IC
VCE
V
V
IN
IN
tON
trr
tC(ON)
tC(OFF)
tOFF
(a) Turn-on
(b) Turn-off
图 4. 开关时间的定义
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
5
www.fairchildsemi.com
控制部分
符号
IQCCL
VFOH
项目
条件
最小值 典型值 最大值 单位
V
CC 静态电源电流
VCC = 15 V, IN = 0 V VCC - COM
VSC = 0 V, VFO 电路:4.7 kΩ 至 5 V 上拉
VSC = 1 V, VFO 电路:4.7 kΩ 至 5 V 上拉
VCC = 15 V
-
4.5
-
-
-
26
-
mA
V
故障输出电压
VFOL
-
0.8
0.55
13.0
13.2
2.0
-
V
VSC(ref)
UVCCD
UVCCR
tFOD
0.45
10.7
11.2
1.4
2.8
-
0.50
11.9
12.4
1.8
-
V
过电流保护触发电平
电源电路欠压保护
V
检测电平
V
复位电平
CFOD = 33 nF (注 3)
施加在 IN - COM 之间
ms
V
故障输出脉宽
导通阈值电压
关断阈值电压
热敏电阻的阻值
VIN(ON)
VIN(OFF)
RTH
-
0.8
-
V
当 TTH = 25°C 时 (注 4,图 5)
当 TTH = 100°C 时 (注 4,图 5)
-
47.0
2.9
kΩ
kΩ
-
-
注:
3. 故障输出脉宽 t
-6
取决于电容 C
的值,可采用下面的近似公式进行计算:C
= 18.3 x 10 x t
[F]。
FOD
FOD
FOD
FOD
4. T 是壳体温度 (T ) 的温度,请根据具体应用进行试验。
TH
C
R-T Curve
200
150
100
50
MIN
TYP
MAX
4
3
2
1
MIN
TYP
MAX
95
100
105
110
115
120
125
Temperature TTH[∩ ]
0
0
25
50
75
100
125
Temperature TTH[∩ ]
图 5. 内置热敏电阻的 R-T 曲线
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
6
www.fairchildsemi.com
推荐工作条件
符号
项目
条件
最小值 典型值 最大值 单位
Vrms
Vi
VPN
施加在 R - S 之间
施加在 P - N 之间
187
220
380
253
400
16.5
1
输入电源电压
-
13.5
-1
-
V
V
输出电压
VCC
dVCC/dt
fPWM
Ii
施加于 VCC(L) - COM 之间
15.0
-
控制电源电压
控制电源波动
PWM 输入频率
允许的输入电流
V/μs
kHz
Apeak
TJ ≤ 150°C
20
-
-
TC < 90°C, Vi = 220 V, VPN = 380 V
VPWM = 20 kHz
-
30
机械特性和额定值
项目
条件
最小值 典型值 最大值 单位
安装螺钉:M3
见图 6
建议 0.62 N•m
0.51
0.62
-
0.72
+120
-
N•m
μm
g
安装扭矩
器件平面度
重量
0
-
15.00
(+)
(+)
(+)
图 6. 平面度测量位置
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
7
www.fairchildsemi.com
保护功能时序图
Input Signal
Internal IGBT
Gate-Emitter Voltage
P3
P2
UV
reset
P5
Control Supply Voltage
UV
detect
P6
P1
Output Current
P4
Fault Output Signal
P1 : 正常工作:IGBT 导通并传导电流。
P2 : 欠压检测。
P3 : IGBT 栅极中断。
P4 : 故障信号产生。
P5 : 欠压复位。
P6 : 正常工作:IGBT 导通并传导电流。
图 7. 欠压保护
P 5
In p u t S ig n a l
P 6
In te rn a l IG B T
G a te -E m itte r V o lta g e
O C D e te ctio n
P 1
P 4
P 7
O u tp u t C u rre n t
P 2
O C R e fe re n ce
V o lta g e (0 .5 V )
S e n sin g V o lta g e
R C F ilte r D e la y
P 8
F a u lt O u tp u t S ig n a l
P 3
P1 : 正常工作:IGBT 导通并传导电流。
P2 : 过流检测。
P3 : IGBT 栅极中断 / 故障信号产生。
P4 : IGBT 缓慢关断。
P5 : IGBT 关断信号。
P6 : IGBT 导通信号:但是在故障输出有效的时间内, IGBT 不导通。
P7 : IGBT 关断状态。
P8 : 故障输出复位并启动正常工作。
图 8. 过流保护
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
8
www.fairchildsemi.com
+5 V
VTH
RTH
NTC
Thermistor
P
L
+5 V
CSC
CFOD
VFO
CSC
PR
CFOD
VFO
PFC
R
S
Controller
OUT
VAC
IN
IN
COM
VCC
COM
VCC
+15 V
N
NR
图 9. 应用实例
注:
®
5. 每个电容都应尽可能地靠近 PFC SPM 产品的引脚安装。
6. 建议将反向并联二极管与 IGBT 相连接。
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
9
www.fairchildsemi.com
封装轮廓详图
封装图纸作为一项服务,提供给考虑飞兆半导体元件的客户。具体参数可能会有变化,且不会做出相应通知。请注意图纸上的版本和
/ 或日期,并联系飞兆半导体代表核实或获得最新版本。封装规格并不扩大飞兆公司全球范围内的条款与条件,尤其是其中涉及飞兆
公司产品保修的部分。
随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸:
http://www.fairchildsemi.com/dwg/MO/MOD27BE.pdf
©2010 飞兆半导体公司
FPAB30BH60B Rev. C4
10
www.fairchildsemi.com
©2010 飞兆半导体公司
11
www.fairchildsemi.com
FPAB30BH60B Rev. C4
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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