FPF1015 [ONSEMI]
IntelliMAX™ 1V额定高级负载管理产品;
| 型号： | FPF1015 |
| 厂家： | 
ONSEMI |
| 描述： | IntelliMAX™ 1V额定高级负载管理产品 驱动 接口集成电路 驱动器 |
| 文件： | 总12页 (文件大小：558K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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June 2009
FPF1015/6/7/8
tm
IntelliMAXTM 1V Rated Advanced Load Management Products
Features
General Description
0.8 to 1.8V Input Voltage Range
The FPF1015/6/7/8 series is an IntelliMAX advanced slew rate
loadswitch offering a very low operating voltage. These devices
consist of a 34mΩ N-channel MOSFET that supports an input
voltage up to 2.0V. These slew rate devices control the switch
turn-on and prevent excessive in-rush current from the supply
rails. The input voltage range operates from 0.8V to 1.8V to
fulfill today's lowest Ultraportable Device's supply requirements.
Switch control is via a logic input (ON) capable of interfacing
directly with low voltage control signals.
Typical RDS(ON) = 34mΩ @ VON - VIN = 2.0V
Output Discharge Function
Internal Pull down at ON Pin
Accurate Slew Rate Controlled Turn-on time
Low < 1µA Quiescent Current
ESD Protected, above 8000V HBM, 2000V CDM
RoHS Compliant
The FPF1016 and FPF1018 have an On-Chip pull down
allowing for quick and controlled output discharge when switch
is turned off. The FPF1015/6/7/8 series is available in a
space-saving 2X2 MLP-6L package.
Free from Halogenated Compounds and Antimony Oxides
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Notebook Computers
PIN 1
TOP
BOTTOM
Typical Application Circuit
TO LOAD
VOUT
VIN
FPF1015/6/7/8
OFF ON
ON
COUT
-
GND
CIN
Ordering Information
Part
Switch
Turn-on Time Output Discharge ON Pin Activity
Package
MLP 2x2
MLP 2x2
MLP 2x2
MLP 2x2
FPF1015
FPF1016
FPF1017
FPF1018
34mΩ, NMOS
34mΩ, NMOS
34mΩ, NMOS
34mΩ, NMOS
43us
43us
NA
60Ω
NA
Active HI
Active HI
Active HI
Active HI
165us
165us
60Ω
©2009 Fairchild Semiconductor Corporation
FPF1015/6/7/8 Rev. D
1
www.fairchildsemi.com
Functional Block Diagram
VIN
CONTROL
LOGIC
ON
Turn-on Slew Rate
Controlled Driver
VOUT
ESD protection
Output Discharge
(Optional for FPF1016/18)
FPF1015/6/7/8
GND
Pin Configuration
GND
6
5
4
1
2
3
ON
VIN
VIN
VOUT
VOUT
MicroFET 2x2 6L BOTTOM VIEW
Pin Description
Pin
1
Name
ON
Function
ON/OFF Control Input, 2nd Supply
Supply Input: Input to the power switch
Switch Output.
2, 3
4, 5
6
VIN
VOUT
GND
Ground
Absolute Maximum Ratings
Parameter
Min
-0.3
-0.3
Max
Unit
V
VIN, VOUT to GND
2
VON to GND
4.2
1.5
1.2
85
V
Maximum Continuous Switch Current
Power Dissipation @ TA = 25°C (Note 1)
Operating Temperature Range
Storage Temperature
A
W
-40
-65
°C
°C
°C/W
V
150
86
Thermal Resistance, Junction to Ambient
HBM
CDM
8000
2000
Electrostatic Discharge Protection
V
Recommended Operating Range
Parameter
Min
0.8
Max
1.8
Unit
V
VIN
Ambient Operating Temperature, TA
-40
85
°C
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board
FPF1015/6/7/8 Rev. D
2
www.fairchildsemi.com
Electrical Characteristics
VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 1.8V and TA = 25°C.
Parameter
Symbol
Conditions
Min
Typ
Max Unit
Basic Operation
Operating Voltage
VIN
0.8
1.8
2.8
1.8
4.0
4.0
1
V
V
VON(MIN) VIN = 0.8V
2.8
3.8
ON input Voltage
VON(MAX) VIN = 1.8V(Note2)
ICC VIN = 1V, VON = 3.3V, VOUT = Open
IQ VIN = 1V, VON = VOUT = Open
V
Operating Current
Quiescent Current
Off Switch Current
µA
µA
µA
2
ISWOFF VIN = 1.8V, VON = GND, VOUT = GND
2
VIN = 1V, VON = 3V, ILOAD = 1A, TA = 25°C
RON
34
41
45
55
On-Resistance
mΩ
VIN = 1V, VON = 2.3V, ILOAD = 1A, TA = 25°C
VIN = 1V, VON = 0V, TA = 25°C, ILOAD = 1mA,
FPF1016, FPF1018
Output Pull Down Resistance
RPD
60
120
Ω
VIN = 0.8V, RLOAD = 1KΩ
VIL
0.3
0.8
1
ON Input Logic Low Voltage
ON Input Leakage
V
VIN = 1.8V, RLOAD = 1KΩ
VON = VIN or GND
-1
µA
Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C)
FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF
FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF
FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF
FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF
FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF
FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF
FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF
FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF
FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF
FPF1016, FPF1018,
28
114
38
VOUT Rise Time
TR
µs
µs
155
43
165
58
Turn ON
TON
228
105
15
80
RPD = 60Ω, RL = 500Ω, CL = 0.1µF
VOUT Fall Time
TF
µs
µs
FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF
FPF1016, FPF1018
74
RPD = 60Ω, RL = 3.3Ω, CL = 10µF
FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF
150
53
FPF1016, FPF1018
RPD = 60Ω, RL = 500Ω, CL = 0.1µF
Turn Off
TOFF
FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF
102
96
FPF1016, FPF1018
RPD = 60Ω, RL = 3.3Ω, CL = 10µF
Note 2: VON(MAX) is limited by the absolute rating.
FPF1015/6/7/8 Rev. D
3
www.fairchildsemi.com
Typical Characteristics
0.02
12
10
8
0.018
VON = 0V
OUT = Open
VON = 0V
0.016
VIN = 1.8V
V
0.014
0.012
0.01
VIN = 1.0V
6
0.008
4
VON =3.3V
0.006
0.004
0.002
0
2
VIN = 0.8V
0
-50
-25
0
25
50
75
100 125
0.8
1
1.2
1.4
1.6
1.8
T, Junction Temperature oC
Supply Voltage (V)
J
Figure 1. Supply Current vs.VIN
Figure 2. Quiescent Current vs. Temperature
0.16
0.14
0.12
0.1
10
9
8
7
6
5
4
3
2
1
0
V
V
IN = 1.8V
ON = 0V
VOUT = 0V
VON = 3.3V
VOUT = Open
V
IN = 1.8V
0.08
0.06
0.04
0.02
0
V
IN = 1.0V
VIN = 0.8V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
TJ, Junction Temperature (oC)
T, Junction Temperature oC
J
Figure 3. Operating Current vs. Temperature
Figure 4. Off Switch Current vs. Temperature
45
40
35
30
25
20
60
55
50
45
40
35
30
25
20
VON = 3V
IOUT = 1A
V = 1 V
VON = 3 V
IOUT = 1 A
IN
-50
-25
0
25
50
75
100
125
1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9
2
2.1 2.2 2.3 2.4 2.5 2.6 2.7
TJ, Junction Temperature (oC)
VON - V (V)
IN
Figure 5. RON vs. Temperature
Figure 6. RON vs. VON - VIN
FPF1015/6/7/8 Rev. D
4
www.fairchildsemi.com
Typical Characteristics
1.4
1.2
1
1.5
1.2
0.9
0.6
0.3
0
V
IN = 1.8V
0.8
0.6
0.4
0.2
0
VIN = 1.0V
VIN = 0.8V
-50
-25
0
25
50
75
100
125
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
T , Junction Temperature (oC)
Supply Voltage (V)
J
Figure 7. VIL vs. VIN
Figure 8. VIL vs. Temperature
200
300
250
200
150
100
50
FPF1017 / 18 TRISE
FPF1017 / 18 TON
FPF1016 / 18 TOFF
FPF1015 / 16 TON
V
= 1V
IN
150
100
50
V
= 1V
IN
VON = 3V
VON = 3V
R = 3.3 Ohm
L
R = 3.3 Ohm
L
C = 10uF
L
C = 10uF
L
FPF1016 / 18 TFALL
FPF1015 / 16 TRISE
0
0
-40
-15
10
35
60
85
-40
-15
10
35
60
85
T , Junction temperature (oC)
T , Junction Temperature (oC)
J
J
Figure 9. TRISE/TFALL vs. Temperature
Figure 10. TON/TOFF vs. Temperature
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1V
ON = 2.6V
IN = 10uF
VIN = 1V
ON = 2.6V
CIN = 10uF
VIN
500mV/DIV
VIN
500mV/DIV
V
C
V
CL= 10uF
RL = 3.3Ω
CL = 4.7uF
RL = 1Ω
VOUT
500mV/DIV
VOUT
500mV/DIV
100us/DIV
Figure 11. FPF1015 / 16 Turn ON response
100us/DIV
Figure 12. FPF1015 / 16 Turn ON response
FPF1015/6/7/8 Rev. D
5
www.fairchildsemi.com
Typical Characteristics
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1V
ON = 2.6V
IN = 10uF
VIN = 1V
ON = 2.6V
CIN = 10uF
VIN
500mV/DIV
VIN
500mV/DIV
V
C
V
CL = 10uF
RL = 3.3Ω
CL = 47uF
RL = 1Ω
VOUT
500mV/DIV
VOUT
500mV/DIV
100us/DIV
Figure 13. FPF1017 / 18 Turn On response
100us/DIV
Figure 14. FPF1017 / 18 Turn On response
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1V
ON = 2.6V
IN = 10uF
VIN = 1V
ON = 2.6V
IN = 10uF
IVIN
500mV/DIV
VIN
500mV/DIV
V
C
V
C
CL= 10uF
RL = 3.3Ω
CL = 47uF
RL = 1Ω
VOUT
500mV/DIV
VOUT
500mV/DIV
100us/DIV
Figure 15. FPF1015 / 17 Turn OFF response
100us/DIV
Figure 16. FPF105 / 17 Turn OFF response
VON
VON
2V/DIV
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN = 1V
ON = 2.6V
IN = 10uF
VIN = 1V
ON = 2.6V
IN = 10uF
VIN
500mV/DIV
VIN
500mV/DIV
V
C
V
C
CL = 4.7uF
RL = 1Ω
CL = 10uF
RL = 3.3Ω
VOUT
500mV/DIV
VOUT
500mV/DIV
100us/DIV
Figure 17. FPF1016 / 18 Turn OFF response
100us/DIV
Figure 18. FPF1016 / 18 Turn OFF response
FPF1015/6/7/8 Rev. D
6
www.fairchildsemi.com
Typical Characteristics
VON
2V/DIV
VIN
500mV/DIV
VIN = 1V
ON = 2.6V
IN = 10uF
RL = 499Ω
V
C
VOUT
500mV/DIV
20us/DIV
Figure 19. FPF1016 / 18 Output Pull Down response
FPF1015/6/7/8 Rev. D
7
www.fairchildsemi.com
Description of Operation
Timing Diagram
The FPF1015/6/7/8 are low RDS(ON) N-Channel load switches
with controlled turn-on. The core of each device is a 34mΩ
(VIN = 1V, VON = 3V) N-Channel MOSFET and is customized for
a low input operating range of 0.8 to 1.8V. The ON pin controls
the state of the switch.
90%
VON
10%
The FPF1016 and FPF1018 contain a 60Ω(typ) on-chip resistor
which is connected internally from VOUT to GND for quick output
discharge when the switch is turned off.
90%
90%
VOUT
10%
10%
td
tR
td
tF
OFF
ON
OFF
On/Off Control
tON
t
The ON pin is active high and it controls the state of the switch.
Applying a continuous high signal will hold the switch in the ON
state. In order to minimize the switch on resistance, the ON pin
voltage should exceed the input voltage by 2V. This device is
compatible with a GPIO (General Purpose Input/Output) port,
where:
tdON
tR
tON
tdOFF
tF
=
=
=
=
=
=
Delay On Time
VOUT Rise Time
Turn On Time
Delay Off Time
VOUT Fall Time
Turn Off Time
where the logic voltage level can be configured to 4V ≥ VON
≥
VIN+2V and power consumed is less than 1µA in steady state.
tOFF
Application Information
Typical Application
VOUT
VIN
ON
FPF1015/6/7/8
CIN
RL
CL
VIN = 0.8-1.8V
OFF ON
GND
Input Capacitor
Board Layout
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on, a capacitor must be
placed between VIN and GND. For minimized voltage drop,
especially when the operating voltage approaches 1V and a fast
slew rate part (FPF1015 and FPF1016) is selected, a 10µF
ceramic capacitor should be placed close to the VIN pins. Higher
values of CIN can be used to further reduce the voltage drop
during higher current modes of operation.
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces or large copper planes for all pins
(VIN, VOUT, ON and GND) will help minimize the parasitic
electrical effects along with minimizing the case to ambient
thermal impedance.
Output Capacitor
A 0.1µF capacitor, CL, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductance
from forcing VOUT below GND when the switch turns-off. If the
application has a capacitive load, the FPF1016 and FPF1018
can be used to discharged that load through an on-chip output
discharge path.
FPF1015/6/7/8 Rev. D
8
www.fairchildsemi.com
Improving Thermal Performance
Demo Board Layout
An improper layout could result in higher junction temperature.
This concern applies when the current is at its continuous
maximum value and is then switched into a large capacitive
load that introduces a large transient current. Since the
FPF1015/6/7/8 does not have thermal shutdown capability, a
proper layout is essential to improving power dissipation of the
switch in transient events and prevents the switch from
exceeding the maximum absolute power dissipation of 1.2W.
FPF1015/6/7/8 Demo board has the components and circuitry
to demonstrate FPF1015/6/7/8 load switches functions.
Thermal performance of the board is improved using a few
techniques recommended in the layout recommendations
section of datasheet.
The following techniques have been identified to improve the
thermal performance of this family of devices. These techniques
are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
Figure 21. FPF1015/6/7/8 Demo board TOP, SST, ASTOP
and DRL layers
1 4
M i l
1 5
M i l
Figure 19: Two through hole open vias embedded in DAP
3. The VIN, VOUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 20 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The ON pin trace may be laid-out diagonally from
the device to maximize the area available to the ground pad.
Placing the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly during
high load currents.
Figure 20: Proper layout of output, input and ground copper
area
FPF1015/6/7/8 Rev. D
9
www.fairchildsemi.com
2.00±0.10
A
B
1.60
1.50
6
4
0.50 (6X)
2.00±0.10
PIN #1
IDENT
1.40
0.85
2.40
0.28
TOP VIEW
0.15±0.05
1
3
0.30 (6X)
0.50±0.05
0.65
SEATING PLANE
SIDE VIEW
RECOMMENDED LAND PATTERN
NOTES:
C
0.025±0.025
A. CONFORM TO JEDEC REGISTRATIONS
MO-229,VARIATION VCCC, EXCEPT
WHERE NOTED.
B. DIMENSIONS ARE IN MILLIMETERS.
C. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
D. DRAWING FILENAME: MKT-UMLP16ErevC
1.40±0.05
(0.20) 4X
1
PIN #1
IDENT
3
(0.60)
0.75±0.05
0.30±0.05 (6X)
0.30±0.05 (6X)
6
4
0.65
0.10 C A B
0.05 C
1.30
BOTTOM VIEW
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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