FPF2003 [ONSEMI]
全功能负载开关;
| 型号： | FPF2003 |
| 厂家： | 
ONSEMI |
| 描述： | 全功能负载开关 开关 光电二极管 |
| 文件： | 总12页 (文件大小：308K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IntelliMAXt Advanced Load
Management Products
FPF2000 - FPF2007
General Description
The FPF2000 through FPF2007 is a family of load switches which
provide full protection to systems and loads which may encounter large
current conditions. These devices contain a 0.7 W current−limited
P−channel MOSFET which can operate over an input voltage range of
1.8 − 5.5 V. Switch control is by a logic input (ON) capable of
interfacing directly with low voltage control signals. Each part contains
thermal shutdown protection which shuts off the switch to prevent
damage to the part when a continuous over−current condition causes
excessive heating.
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SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
When the switch current reaches the current limit, the part operates
in a constant current mode to prohibit excessive currents from causing
damage. For the FPF2000 − FPF2002 and FPF2004 − FPF2006, if the
constant current condition still persists after 10ms, these parts will shut
off the switch and pull the fault signal pin (FLAGB) low. The
FPF2000, FPF2001, FPF2004 and FPF2005, have an auto−restart
feature which will turn the switch on again after 80 ms if the ON pin is
still active. The FPF2002 and FPF2006 do not have this auto−restart
feature so the switch will remain off until the ON pin is cycled. For the
FPF2003 and FPF2007, a current limit condition will immediately pull
the fault signal pin low and the part will remain in the constant−current
mode until the switch current falls below the current limit. For the
FPF2000 through FPF2003, the minimum current limit is 50 mA while
that for the FPF2004 through FPF2007 is 100 mA.
MARKING DIAGRAM
&Y
&O20x&C
&O&V
20x = Device Code (x = 0, 1, 2, 3, 4, 5, 6, 7)
&Y = Binary Calendar Year Coding Scheme
&O = Plant Code Identifier on Tiny Logic Package
&C = Single Digit Die Run Code
&V = Eight−Week Binary Datacoding Scheme
These parts are available in a space−saving 5 pin SC−70 package.
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
Features
• 1.8 to 5.5 V Input Voltage Range
• Controlled Turn−On
• 50 mA and 100 mA Current Limit Options
• Undervoltage Lockout
• Thermal Shutdown
• <1 mA Shutdown Current
• Auto Restart
• Fast Current Limit Response Time
♦ 3 ms to Moderate Over Currents
♦ 20 ns to Hard Shorts
Applications
• PDAs
• Cell Phones
• GPS Devices
• MP3 Players
• Digital Cameras
• Peripheral Ports
• Hot Swap Supplies
• Fault Blanking+
• These Devices are Pb−Free and are RoHS Compliant
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
July, 2021 − Rev. 8
FPF2001/D
FPF2000 − FPF2007
ORDERING INFORMATION
Current Limit
Auto−Restart Time
Blanking Time (ms)
(ms)
Part
Current Limit (mA)
ON Pin Activity
Active HI
Top Mark
200
FPF2000
FPF2001
FPF2002
FPF2003
FPF2004
FPF2005
FPF2006
FPF2007
50
50
10
10
10
0
80
80
Active LO
Active HI
201
50
NA
NA
80
202
50
Active HI
203
100
100
100
100
10
10
10
0
Active HI
204
80
Active LO
Active HI
205
NA
NA
206
Active HI
207
TYPICAL APPLICATION CIRCUIT
TO LOAD
V
V
OUT
IN
FPF2000 − FPF2007
ON FLAGB
OFF ON
+
GND
−
Figure 1. Typical Application Circuit
FUNCTIONAL BLOCK DIAGRAM
V
IN
UVLO
ON
CONTROL
LOGIC
CURRENT
LIMIT
V
OUT
THERMAL
SHUTDOWN
FLAGB
GND
Figure 2. Functional Block Diagram
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2
FPF2000 − FPF2007
PIN CONFIGURATION
V
5
4
V
IN
1
OUT
GND
2
3
ON
FLAGB
SC70−5
Figure 3. Pin Configuration
PIN DESCRIPTION
Pin
1
Name
Function
V
OUT
Switch Output: Output of the power switch
Ground
2
GND
3
FLAGB
Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over
temperature state.
4
5
ON
On Control Input
V
IN
Supply Input: Input to the power switch and the supply voltage for the IC
ABSOLUTE MAXIMUM RATINGS
Parameter
Min
−0.3
−
Max
6
Unit
V
V
, V
, ON, FLAGB to GND
IN
OUT
Power Dissipation @ T = 25°C (Note 1)
250
125
150
400
−
mW
°C
A
Operating Junction Temperature
Storage Temperature
−40
−65
−
°C
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Protection
°C/W
V
HBM
MM
4000
400
−
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Package power dissipation on 1 square inch pad, 2 oz. copper board.
RECOMMENDED OPERATING CONDITIONS
Parameter
Min
1.8
Max
5.5
85
Unit
V
V
IN
Ambient Operating Temperature, T
−40
°C
A
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
FPF2000 − FPF2007
ELECTRICAL CHARACTERISTICS (V = 1.8 to 5.5 V, T = −40 to +85°C unless otherwise noted. Typical values are at V = 3.3 V
IN
A
IN
and T = 25°C.)
A
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
BASIC OPERATION
Operating Voltage
Quiescent Current
V
1.8
−
−
60
−
5.5
−
V
IN
I
Q
I
= 0 mA
active
V
V
= 1.8 to 3.3 V
= 3.3 to 5.5 V
mA
OUT
ON
IN
V
−
100
1
IN
Shutdown Current
I
−
−
mA
mA
W
SHDN
Latch−Off Current (Note 2)
On−Resistance
I
V
V
V
V
V
V
V
V
V
V
= V , after an overcurrent fault
−
40
0.7
0.85
−
−
LATCHOFF
ON
IN
= 3.3 V, I
= 20 mA, T = 25°C
−
1
IN
OUT
OUT
OUT
A
R
ON
= 3.3 V, I
= 3.3 V, I
= 1.8 V
= 5.5 V
= 1.8 V
= 5.5 V
= 20 mA, T = 85°C
−
1.2
1.2
−
IN
A
= 20 mA, T = −40°C to +85°C 0.27
IN
A
ON Input Logic High Voltage
ON Input Logic Low Voltage
V
IH
0.8
1.5
−
−
V
V
IN
−
−
IN
V
−
0.5
0.9
1
IL
IN
−
−
IN
ON Input Leakage
Off Switch Leakage
= V or GND
−
−
−
mA
mA
ON
IN
I
= 0 V, V
IN
= 0 V
−
1
SWOFF
ON
OUT
@ V = 5.5 V, T = 85°C
A
V
= 0 V, V
IN
= 0 V
A
−
10
100
nA
V
ON
OUT
@ V = 3.3 V, T = 25°C
FLAGB Output Logic Low Voltage
V
IN
V
IN
V
IN
= 5 V, I
= 10 mA
−
−
−
0.1
0.1
−
0.2
0.3
1
SINK
= 1.8 V, I
= 10 mA
SINK
FLAGB Output High Leakage Current
PROTECTIONS
= 5 V, Switch on
mA
Current Limit
I
V
V
= 3.3 V,
OUT
FPF2000, FPF2001,
FPF2002, FPF2003
50
75
100
200
mA
LIM
IN
= 3.0 V
FPF2004, FPF2005,
FPF2006, FPF2007
100
150
Thermal Shutdown
Shutdown Threshold
Return from Shutdown
Hystersis
−
−
140
130
10
−
−
°C
−
−
Under Voltage Shutdown
Under Voltage Shutdown Hysteresis
DYNAMIC
UVLO
V
IN
Increasing
1.5
−
1.6
50
1.7
−
V
mV
Turn On Time
t
R = 500 W, C = 0.1 mF
−
−
−
−
5
50
0.5
10
−
−
ms
ms
ms
ms
ms
ON
L
L
Turn Off Time
t
R = 500 W, C = 0.1 mF
L L
OFF
V
OUT
V
OUT
Rise Time
Fall Time
t
R
R = 500 W, C = 0.1 mF
−
L
L
t
F
R = 500 W, C = 0.1 mF
0.1
10
−
L
L
Over Current Blanking Time
t
t
FPF2000, FPF2001, FPF2002, FPF2004,
FPF2005, FPF2006
20
BLANK
Auto−Restart Time
FPF2000, FPF2001, FPF2004, FPF2005
40
80
3
160
ms
RSTRT
Short Circuit Response Time
V
= V = 3.3 V. Moderate Over−Current
−
−
ms
IN
ON
Condition.
V
IN
= V = 3.3V. Hard Short.
−
20
−
ns
ON
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Applicable only to FPF2002 and FPF2006. Latchoff current does not include current flowing into FLAGB.
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4
FPF2000 − FPF2007
TYPICAL CHARACTERISTICS
90
75
70
65
60
55
50
VON = VIN
V
= V
ON IN
85
80
75
70
65
60
55
50
45
40
V
IN
= 5.5 V
V
IN
= 3.3 V
V
= 1.8 V
IN
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
−40
−15
10
35
60
85
85
6
SUPPLY VOLTAGE (V)
T , JUNCTION TEMPERATURE (°C)
J
Figure 4. Quiescent Current vs. Input Voltage
Figure 5. Quiescent Current vs. Temperature
35
35
I_SHDN
30
25
20
15
10
5
30
25
20
15
10
5
V
IN
= 5 V
V
= 5 V
V
IN
= 3.3 V
60
V
IN
= 3.3 V
IN
0
−40
0
−40
−15
10
35
60
85
−15
10
35
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 6. ISHUTDOWN Current vs. Temperature
Figure 7. ISWITCH−OFF Current vs. Temperature
52
48
44
40
36
32
28
1.5
V
IN
= 3.3 V
FPF2000, 2002, 2003, 2004, 2006, 2007
1.25
1
0.75
0.5
FPF2001, 2005
0.25
0
1.5
−40
−15
10
35
60
85
2
2.5
3
3.5
V , INPUT VOLTAGE (V)
IN
4
4.5
5
5.5
T , JUNCTION TEMPERATURE (°C)
J
Figure 8. ILATCHOFF vs. Temperature
Figure 9. VIH vs. VIN
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5
FPF2000 − FPF2007
TYPICAL CHARACTERISTICS (continued)
160
140
120
100
80
180
160
FPF2004, 2005, 2006, 2007
140
120
100
80
FPF2004, 2005, 2006, 2007
FPF2000, 2001, 2002, 2003
FPF2000, 2001, 2002, 2003
60
60
40
40
20
20
0
0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3
5.5
85
−40
−15
10
35
60
85
85
85
V
IN
− V
(V)
T , JUNCTION TEMPERATURE (°C)
J
OUT
Figure 10. Current Limit vs. Output Voltage
Figure 11. Current Limit vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
V
IN
= 1.8 V
V
IN
= 3.6 V
V
= 5 V
35
IN
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
−40
−15
10
60
V
IN
, INPUT VOLTAGE (V)
T , JUNCTION TEMPERATURE (°C)
J
Figure 12. RON vs. VIN
Figure 13. RON vs. Temperature
100
10
100
10
I
V
= 10 mA
= 3.3 V
LOAD
CC
T
ON
T
Rise
I
= 10 mA
= 3.3 V
LOAD
V
CC
1
1
T
Fall
0.1
T
OFF
0.1
−40
0.01
−15
10
35
60
−40
−15
10
35
60
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 14. TON/TOFF vs. Temperature
Figure 15. TRISE/TFALL vs. Temperature
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6
FPF2000 − FPF2007
TYPICAL CHARACTERISTICS (continued)
12
11
10
9
100
80
60
8
−40
40
−40
−15
10
35
60
85
−15
10
35
60
85
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 16. TBLANK vs. Output Voltage
Figure 17. TRESTART vs. Temperature
3
3
V
DRV
V
DRV
2 V/DIV
2 V/DIV
V
OUT
V
OUT
2 V/DIV
2 V/DIV
I
I
OUT
OUT
50 mA/DIV
50 mA/DIV
V
V
FLAGB
FLAGB
2 V/DIV
2 V/DIV
5 ms/DIV
10 ms/DIV
Figure 18. TBLANK Response
Figure 19. TRESTART Response
R = 500 W, C = 0.1 mF
R = 500 W, C = 0.1 mF
L L
L
L
Active High Devices
Active High Devices
V
ON
V
ON
2 V/DIV
2 V/DIV
I
I
OUT
OUT
10 mA/DIV
10 mA/DIV
50 ms/DIV
100 ns/DIV
Figure 20. TON Response
Figure 21. TOFF Response
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7
FPF2000 − FPF2007
TYPICAL CHARACTERISTICS (continued)
V
IN
2 V/DIV
V /V
IN ON
2 V/DIV
I
OUT
2 A/DIV
I
OUT
200 mA/DIV
C
= 10 mF
IN
V
OUT
C
= 1 mF
OUT
2 V/DIV
Active High Devices
20 ms/DIV
20 ms/DIV
Figure 22. Short Circuit Response Time
(Output Shorted to GND)
Figure 23. Current Limit Response
(Switch Power Up to Hard Short)
V
IN
2 V/DIV
C
C
= 10 mF
IN
= 1 mF
OUT
V
ON
Active High Devices
2 V/DIV
I
OUT
100 mA/DIV
V
OUT
(SHORTED
TO GND)
20 ms/DIV
Figure 24. Current Limit Response Time
NOTE:
3. VDRV signal forces the device to go into overcurrent condition.
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8
FPF2000 − FPF2007
DESCRIPTION OF OPERATION
The FPF2000 − FPF2007 are current limited switches that
protect systems and loads which can be damaged or
disrupted by the application of high currents. The core of
each device is a 0.7 W P−channel MOSFET and a controller
capable of functioning over a wide input operating range of
1.8 − 5.5 V. The controller protects against system
malfunctions through current limiting, under− voltage
lockout and thermal shutdown. The current limit is preset for
either 50 mA or 100 mA.
MOSFET which requires a pull−up resistor between V and
FLAGB. During shutdown, the pull−down on FLAGB is
disabled to reduce current draw from the supply.
IN
Current Limiting
The current limit ensures that the current through the
switch doesn’t exceed a maximum value while not limiting
at less than a minimum value. For the FPF2000 − FPF2003
the minimum current is 50 mA and the maximum current is
100 mA and for the FPF2004 − FPF2007 the minimum
current is 100 mA and the maximum current is 200 mA. The
FPF2000 − FPF2002 and the FPF2004 − FPF2006, have a
blanking time of 10 ms, nominally, during which the switch
will act as a constant current source. At the end of the
blanking time, the switch will be turned−off and the FLAGB
pin will activate to indicate that current limiting has
occurred. The FPF2003 and FPF2007 have no current limit
blanking period so immediately upon a current limit
condition FLAGB is activated. These parts will remain in a
constant current state until the ON pin is deactivated or the
thermal shutdown turns−off the switch.
On/Off Control
The ON pin controls the state of the switch. Active HI and
LO versions are available. Refer to the Ordering
Information for details. Activating ON continuously holds
the switch in the on state so long as there is no fault. For all
versions, an under− voltage on VIN or a junction
temperature in excess of 150°C overrides the ON control to
turn off the switch. In addition, excessive currents will cause
the switch to turn off in FPF2000 − FPF2002 and FPF2004 −
FPF2007. The FPF2000, FPF2001, FPF2004 and FPF2005
have an Auto−Restart feature which will automatically turn
the switch on again after 80 ms. For the FPF2002 and
FPF2006, the ON pin must be toggled to turn−on the switch
again. The FPF2003 and FPF2007 do not turn off in
response to a over current condition but instead remain
operating in a constant current mode so long as ON is active
and the thermal shutdown or under−voltage lockout have not
activated.
Reverse Voltage
If the voltage at the V
pin is larger than the V pin,
IN
OUT
large currents may flow and can cause permanent damage to
the device. FPF2000 − FPF2007 is designed to control
current flow from V to V
.
IN
OUT
Under−Voltage Lockout
The under−voltage lockout turns−off the switch if the
input voltage drops below the under−voltage lockout
threshold. With the ON pin active the input voltage rising
above the under−voltage lockout threshold will cause a
controlled turn−on of the switch which limits current
over−shoots.
Fault Reporting
Upon the detection of an over−current, an input
under−voltage, or an over−temperature condition, the
FLAGB signals the fault mode by activating LO. For the
FPF2000 − FPF2002 and FPF2004 − FPF2006, the FLAGB
goes LO at the end of the blanking time while FLAGB goes
LO immediately for the FPF2003 and FPF2007. FLAGB
remains LO through the Auto−Restart Time for the
FPF2000, FPF2001 FPF2004 and FPF2005. For the
FPF2002 and FPF2006, FLAGB is latched LO and ON must
be toggled to release it. With the FPF2003 and FPF2007,
FLAGB is LO during the faults and immediately returns HI
at the end of the fault condition. FLAGB is an open−drain
Thermal Shutdown
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an
over− temperature condition the FLAGB is activated and the
switch is turned−off. The switch automatically turns−on
again if temperature of the die drops below the threshold
temperature.
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9
FPF2000 − FPF2007
APPLICATION INFORMATION
Typical Application
LOAD
V
V
OUT
IN
R1 = 100 kW
C2 = 0.1 mF
FPF2000 − FPF2007
ON FLAGB
R2 = 500 W
OFF ON
C1 = 4.7 mF
1.8 V − 5.5 V
+
GND
−
Figure 25. Typical Application
Input Capacitor
If the part goes into current limit the maximum power
dissipation will occur when the output is shorted to ground.
For the FPF2000, FPF2001, FPF2004 and FPF2005, the
power dissipation will scale by the Auto−Restart Time,
To limit the voltage drop on the input supply caused by
transient in−rush currents when the switch turns−on into a
discharged load capacitor or a short−circuit, a capacitor
needs to be placed between V and GND. A 4.7 mF ceramic
t , and the Over Current Blanking Time, t , so
RESTART BLANK
IN
capacitor, C , must be placed close to the V pin. A higher
that the maximum power dissipated is,
IN
IN
value of C can be used to further reduce the voltage drop
IN
tBLANK
P(max) +
(VIN(max)) ILIM(max)
experienced as the switch is turned on into a large capacitive
load.
t
RESTART ) tBLANK
10
+
5.5 0.2 + 1.22 mW
Output Capacitor
A 0.1 mF capacitor C
(eq. 3)
80 ) 10
, should be placed between V
OUT OUT
When using the FPF2002 and FPF2006 attention must be
given to the manual resetting of the part. Continuously
resetting the part at a high duty cycle when a short on the
output is present can cause the temperature of the part to
increase. The junction temperature will only be allowed to
increase to the thermal shutdown threshold. Once this
temperature has been reached, toggling ON will not turn−on
the switch until the junction temperature drops. For the
FPF2003 and FPF2007, a short on the output will cause the
part to operate in a constant current state dissipating a worst
case power as calculated in (eq. 3) until the thermal
shutdown activates. It will then cycle in and out of thermal
shutdown so long as the ON pin is active and the short is
present.
and GND. This capacitor will prevent parasitic board
inductances from forcing V below GND when the
switch turns−off. For the FPF2000 − FPF2002 and the
FPF2004 − FPF2006, the total output capacitance needs to
OUT
be kept below a maximum value, C (max), to prevent the
OUT
part from registering an over−current condition and
turning−off the switch. The maximum output capacitance
can be determined from the following formula,
ILIM(max) tBLANK(min)
+
COUT
(eq. 1)
VIN
Due to the integral body diode in the PMOS switch, a C
IN
greater than C
is highly recommended. A C
greater
OUT
OUT
than C can cause V
to exceed V when the system
IN
OUT
IN
supply is removed. This could result in current flow through
Board Layout
the body diode from V
to V .
OUT
IN
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize
the effects that parasitic trace inductances may have on
normal and short−circuit operation. Using wide traces for
Power Dissipation
During normal operation as a switch, the power
dissipation is small and has little effect on the operating
temperature of the part. The parts with the higher current
limits will dissipate the most power and that will only be,
2
V , V
IN OUT
and GND will help minimize parasitic electrical
effects along with minimizing the case to ambient thermal
impedance.
P + (ILIM
)
RDS + (0.2)2 0.7 + 28 mW
(eq. 2)
IntelliMAX is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC−01
ISSUE A
DATE 29 JUN 2010
SYMBOL
MIN
NOM
MAX
D
0.80
A
1.10
e
e
A1
A2
0.00
0.80
0.10
1.00
b
c
0.15
0.10
1.80
1.80
1.15
0.30
0.18
2.20
2.40
1.35
D
2.00
2.10
E1
E
E
E1
e
1.25
0.65 BSC
0.36
L
0.26
0.46
L1
L2
0.42 REF
0.15 BSC
TOP VIEW
0º
4º
8º
θ
10º
θ1
q1
A2
A1
A
q
L
b
L1
q1
c
L2
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON34260E
SC−88A (SC−70 5 LEAD), 1.25X2
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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