FPF2202 [ONSEMI]
集成式负载开关，带 500mA 高精度电流限值;
| 型号： | FPF2202 |
| 厂家： | 
ONSEMI |
| 描述： | 集成式负载开关，带 500mA 高精度电流限值 开关 驱动 接口集成电路 驱动器 |
| 文件： | 总14页 (文件大小：1250K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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June 2008
FPF2200-FPF2202
Integrated Load Switch with 500mA High Precision Current Limit
Features
General Description
¢ 1.8 to 5.5V Input Voltage Range
The FPF2200-FPF2202 are low R
P-Channel MOSFET
DS(ON)
load switches with high precision current limit value. The input
voltage range operates from 1.8V to 5.5V to fulfill today's Ultra
Portable Device's supply requirement. Switch control is by a
logic input (ON) capable of interfacing directly with low voltage
control signal. On-chip pull-down is available for output quick
discharge when switch is turned off.
¢ Typical R
¢ Typical R
= 140mꢀ @ V = 5.5V
IN
DS(ON)
DS(ON)
= 160mꢀ @ V = 3.3V
IN
¢ Fixed 500mA Current Limit (min)
¢ 5% Accurate Current Limit
¢ 72ꢀ (typ) Output Discharge Resistance
¢ ESD Protected, above 8kV HBM and 2kV CDM
For the FPF2201, if the constant current condition still persists
after 30ms, these parts will shut off the switch and pull the fault
signal pin (FLAGB) low. The FPF2200 has an auto-restart
feature which will turn the switch on again after 450ms if the ON
pin is still active. The FPF2201 do not have this auto-restart
feature so the switch will remain off until the ON pin is cycled.
For the FPF2202, a current limit condition will immediately pull
the fault signal pin low and the part will remain in the constant-
current mode until the switch current falls below the current
limit. For the FPF2200 through FPF2202, the minimum current
limit is 500mA with 5% accuracy.
Applications
¢ PDAs
¢ Cell Phones
¢ GPS Devices
¢ MP3 Players
¢ Digital Cameras
¢ Peripheral Ports
¢ Notebook Computer
Pin 1
BOTTOM
TOP
Ordering Information
Current Limit
Blanking Time
(mS)
Current Limit
Auto-Restart Time
(mS)
ON Pin
Activity
Part
(mA)
FPF2200
FPF2201
FPF2202
500
500
500
30
450
NA
NA
Active HI
Active HI
Active HI
30
NA
©2008 Fairchild Semiconductor Corporation
FPF2200-FPF2202 Rev. B
1
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Typical Application Circuit
TO LOAD
V
V
OUT
IN
FPF2200/1/2
FLAGB
OFF ON
ON
GND
Functional Block Diagram
V
IN
UVLO
THERMAL
SHUTDOWN
CONTROL
LOGIC
ON
CURRENT
LIMIT
V
OUT
Output Discharge
FLAGB
GND
2
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FPF2200-FPF2202 Rev. B
Pin Configuration
ON
6
5
4
1
2
3
N/C
GND
V
IN
FLAGB
V
OUT
MicroFET 2x2 6L
(BOTTOMVIEW)
Pin Description
Pin
Name
Function
1
2
3
N/C
No Connection
V
Supply Input: Input to the power switch and the supply voltage for the IC
Switch Output: Output of the power switch
IN
V
OUT
Fault Output: Active LO, open drain output which indicates an over current, supply
under voltage or over temperature state
4
FLAGB
5
6
GND
ON
Ground
ON/OFF Control Input
Absolute Maximum Ratings
Parameter
Min.
-0.3
Max.
6
Unit
V
V
, V
, ON, FLAGB TO GND
OUT
IN
Power Dissipation @ T = 25°C
1.2
125
86
W
A
Operating and Storage Junction Temperature
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Protection
-65
°C
°C/W
V
HBM
MM
8000
400
V
CDM
2000
V
Recommended Operating Range
Parameter
Min.
1.8
Max.
5.5
Unit
V
V
IN
Ambient Operating Temperature, T
-40
85
°C
A
Electrical Characteristics
V
=1.8to5.5V, T =-40to+85°Cunlessotherwisenoted.TypicalvaluesareatV =3.3V andT =25°C.
A IN A
IN
Parameter
Symbol
Conditions
Min.
Typ.
Max. Units
Basic Operation
Operating Voltage
V
1.8
5.5
65
75
85
V
IN
I
I
I
=0mA, V =V =1.8V
40
45
55
OUT
OUT
OUT
IN
ON
Quiescent Current
I
=0mA, V =V =3.3V
ꢁA
Q
IN
ON
=0mA, V =V =5.5V
IN
ON
V
GND
=0V, V =5.5V, V
=short to
OUT
ON
IN
V
Shutdown Current
2.5
ꢁA
IN
3
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FPF2200-FPF2202 Rev. B
Parameter
Symbol
Conditions
Min.
Typ.
Max. Units
V
GND
=0V, V
=5.5V, V =short to
OUT IN
ON
V
Shutdown Current
1
ꢁA
OUT
V
V
V
V
=5.5V, I
=3.3V, I
=1.8V, I
=3.3V, I
=200mA, T =25°C
140
160
230
185
210
300
IN
IN
IN
IN
OUT
OUT
OUT
OUT
A
=200mA, T =25°C
A
On-Resistance
R
mꢀ
ON
=200mA, T =25°C
A
=200mA,
90
265
105
T =-40°C to 85°C
A
Output Discharge Resistance
V
V
V
V
V
V
V
V
V
=3.3V, V =0V, I =10mA
OUT
72
ꢀ
IN
IN
IN
IN
IN
ON
ON
=1.8V
=5.5V
=1.8V
=5.5V
0.8
1.4
ON Input Logic High Voltage (ON)
V
V
V
IH
IL
0.5
1.0
1
ON Input Logic Low Voltage (OFF)
On Input Leakage
V
ꢁA
V
= V or GND
-1
IN
=5.5V, I
=1.8V, I
=100ꢁA
0.05
0.12
0.1
0.25
1
IN
IN
IN
SINK
SINK
FLAGB Output Logic Low Voltage
FLAGB Output High Leakage Current
=100ꢁA
=5.5V, Switch on
ꢁA
Protections
Current Limit
I
V
=3.3V, V
= 3.0V, T =25°C
504
530
140
130
10
557
mA
°C
LIM
IN
OUT
A
Shutdown Threshold
Return from Shutdown
Hysteresis
Thermal Shutdown
Under Voltage Shutdown
Under Voltage Shutdown Hysteresis
Dynamic
UVLO
V
increasing
1.55
1.65
50
1.75
V
IN
mV
Turn On Time
t
t
t
t
t
t
R =500ꢀ, C =0.001uF
70
600
40
ꢁS
nS
ꢁS
nS
mS
mS
ON
L
L
Turn Off Time
R =500ꢀ, C =0.001uF
L L
OFF
V
V
Rise Time
Fall Time
R =500ꢀ, C =0.001uF
L L
OUT
OUT
RISE
FALL
BLANK
RSTRT
R =500ꢀ, C =0.001uF
100
30
L
L
Over Current Blanking Time
Auto-Restart Time
FPF2200, FPF2201
FPF2200
15
60
225
450
900
V
= V = 3.3V. Over-Current
ON
IN
Current Limit Response Time
5
ꢁS
Condition: R
=1.55ꢀ
LOAD
4
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FPF2200-FPF2202 Rev. B
Typical Characteristics
70
80
70
60
50
40
30
20
10
VON = VIN
VON=V
IN
60
V =3.3V
IN
50
85oC
V =5.5V
IN
25oC
-40oC
40
V =1.8V
IN
30
20
10
1
2
3
4
5
6
-40
-15
10
35
60
85
85
85
SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (oC)
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
1.6
1.4
1.2
1.0
0.8
0.6
0.4
1.30
1.15
1.00
0.85
0.70
0.55
0.40
V =5.5V
V
IH
V
IN
IL
V =3.3V
IN
V =1.8V
IN
1
2
3
4
5
6
-40
-15
10
35
60
V , SUPPLYVOLTAGE (V)
IN
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. V vs. Input Voltage
Figure 4. V
High Voltage vs. Temperature
ON
ON
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
V =5.5V
IN
V =3.3V
IN
VON = 5.5V
V =1.8V
IN
VON = 0V
-40
-15
10
35
60
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 5. V Low Voltage vs. Temperature
Figure 6. On Pin Current vs. Temperature
ON
5
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FPF2200-FPF2202 Rev. B
Typical Characteristics
600
590
580
570
560
550
540
530
600
500
400
300
200
100
0
V
IN = 3.3V
V
IN = 1.8V
V
IN = 5.5V
-40
-15
10
35
60
85
0
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)
V -VOUT (V)
IN
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
300
270
240
210
180
150
120
90
300
270
240
210
180
150
120
90
V =1.8V
IN
85oC
25oC
V =3.3V
IN
-40oC
V =5.5V
IN
60
-40
-15
10
35
60
85
1.5
2.5
3.5
4.5
5.5
TJ, JUNCTION TEMPERATURE (oC)
V , SUPPLY VOLTAGE (V)
IN
Figure 9. RON vs. Input Voltage
Figure 10. RON vs. Temperature
1000
100
10
100
10
1
TFALL
VIN = 3.3V
RL = 500 Ohms
COUT = 0.11uF
TOFF
TON
TRISE
VIN = 3.3V
1
RL = 500 Ohms
COUT = 0.11uF
0.1
0.1
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
Figure 11. TON / TOFF vs. Temperature
Figure 12. TRISE / TFALL vs. Temperature
6
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FPF2200-FPF2202 Rev. B
Typical Characteristics
40
38
36
34
32
30
28
VIN
2V/DIV
IOUT
10mA/DIV
VON
2V/DIV
VIN=3.3V,
RL=500ꢀ,
CIN=10ꢁF
VOUT
2V/DIV
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE ( C)
100ꢁs/DIV
Figure 13. TBLANK vs Temperature
Figure 14. TON Response
VIN
2V/DIV
VON
5V/DIV
VIN=3.3V,
RL=500ꢀ,
C
IN=10ꢁF
VIN=3.3V,
RL=5ꢀ,
IN=10ꢁF
IOUT
500mA/DIV
IOUT
10mA/DIV
C
VFLAGB
2V/DIV
TBLANK
VON
2V/DIV
VOUT
2V/DIV
VOUT
2V/DIV
500ns/DIV
10ms/DIV
Figure 15. TOFF Response
Figure 16. TBLANK Response
VIN=3.3V,
RL=1.2ꢀ,
CIN=10ꢁF
COUT=10ꢁF
VIN=5V,
RL=1.2ꢀ,
CIN=10ꢁF
COUT=10ꢁF
VON
2V/DIV
VON
2V/DIV
IOUT
IOUT
500mA/DIV
500mA/DIV
VIN
VIN
2V/DIV
2V/DIV
VOUT
VOUT
2V/DIV
2V/DIV
100ꢁs/DIV
500ꢁs/DIV
Figure 17. Current Limit Response
(Output is loaded with 1.2ꢀ resistor and COUT=10ꢁF)
Figure 18. Current Limit Response
(Output is loaded with 1.2ꢀ resistor and COUT=100ꢁF)
7
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FPF2200-FPF2202 Rev. B
Typical Characteristics
VIN=3.3V,
RL=100ꢀ,
CIN=10ꢁF
COUT=1ꢁF
VON
2V/DIV
VON
2V/DIV
IOUT
5A/DIV
IOUT
500mA/DIV
VIN=VON=,3.
3V, RL=1.2ꢀ,
CIN=10ꢁF
COUT=1ꢁF
VOUT
VOUT
2V/DIV
2V/DIV
100ꢁs/DIV
20ꢁs/DIV
Figure 19. Current Limit Response
(Switch is powered into a short - Input and
enable pins are tied together)
Figure 20. Current Limit Response
(Output shorted to GND while the switch is in normal operation)
8
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FPF2200-FPF2202 Rev. B
Description of Operation
The FPF2200, FPF2201, and FPF2202 are state of the art High
Precision Current Limit switches designed to meet USB OTG
(On-The-Go) applications with optimum current for a safe
design practice. The core of each device is a 0.16ꢀ P-channel
MOSFET and a controller capable of functioning over an input
operating range of 1.8- 5.5V. The controller protects or offers
current limiting, UVLO(undervoltage lockout) and thermal
shutdown protection. The minimum current limit value is set to
500mA allowing to draw as much as 500mA from the USB port.
Undervoltage Lockout (UVLO)
The undervoltage lockout turns-off the switch if the input voltage
drops below the undervoltage lockout threshold. With the ON
pin active the input voltage rising above the undervoltage
lockout threshold will cause a controlled turn-on of the switch
which limits current over-shoots.
Output Discharge Resistor
The FPF2200/1/2 family contains an 80ꢀ on-chip load resistor
for quick output discharge when the switch is turned off. This
features become more attractive when application requires
large output capacitor to be discharged when switch turns-off.
However, VOUT pin should not be connected directly to the
battery source due to the discharge mechanism of the load
switch.
On/Off Control
The ON pin is active high, and controls the state of the switch.
Applying a continuous high signal will hold the switch in the ON
state. The switch will move into the OFF state when the active
high is removed, or if a fault is encountered. For all versions, an
undervoltage on VIN or a junction temperature in excess of
140°C overrides the ON control to turn off the switch.
Thermal Shutdown
In addition, excessive currents will cause the switch to turn off in
the FPF2200 and FPF2201. The FPF2200 has an Auto-Restart
feature which will automatically turn the switch ON again after
450ms. For the FPF2201, the ON pin must be toggled to turn-on
the switch again. The FPF2202 does not turn off in response to
an over current condition but instead remains operating in a
constant current mode so long as ON is active and the thermal
shutdown or UVLO have not activated.
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
Fault Reporting
Upon the detection of an over-current condition, an input UVLO,
or an over-temperature condition, the FLAGB signals the fault
mode by activating LO. In the event of an over-current condition
for the FPF2200 and FPF2201, the FLAGB goes LO at the end
of the blanking time while FLAGB goes LO immediately for the
FPF2202. If the over-current condition lasts longer than
blanking time, FLAGB remains LO through the Auto-Restart
Time for the FPF2200 while for the FPF2201, FLAGB is latched
LO and ON must be toggled to release it. With the FPF2202,
FLAGB is LO during the faults and immediately returns HI at the
end of the fault condition. FLAGB is an open-drain MOSFET
which requires a pull-up resistor between VIN and FLAGB.
During shutdown, the pull-down on FLAGB is disabled to reduce
current draw from the supply. A 100Kꢀ pull up resistor is
recommended to be used in the application.
Current Limiting
The current limit ensures that the current through the switch
doesn't exceed a maximum value while not limiting at less than
a minimum value. The minimum current at which the parts will
limit is set to 500mA. The FPF2200 and FPF2201 have a
blanking time of 30ms (nominal) during which the switch will act
as a constant current source. At the end of the blanking time,
the switch will be turned-off. The FPF2202 has no current limit
blanking period so it will remain in a constant current state until
the ON pin is deactivated or the thermal shutdown turns-off the
switch.
9
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FPF2200-FPF2202 Rev. B
Application Information
PCB Layout Recommendations
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch is turned on into a discharged
load capacitor or a short-circuit, a capacitor is recommended to
be placed between VIN and GND. A 1uF ceramic capacitor, CIN
placed close to the pins is usually sufficient. Higher values of
CIN can be used to further reduce the voltage drop.
For best performance, all traces should be as short as possible.
To be more effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
,
Output Capacitor
Improving Thermal Performance
A 0.1uF capacitor COUT, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. For the
FPF2200 and FPF2201, the total output capacitance needs to
be kept below a maximum value, COUT(max), to prevent the
part from registering an over-current condition and turning-off
the switch. The maximum output capacitance can be
determined from the following formula:
An improper layout could result in higher junction temperature
and triggering the thermal shutdown protection feature. This
concern applies when the switch is set at higher current limit
value and an over-current condition occurs. In this case, the
power dissipation of the switch, from the formula below, could
exceed the maximum absolute power dissipation of 1.2W.
PD = (VIN - VOUT) x ILIM (Max)
ILIM (Max) X tBLANK (Min)
The following techniques have been identified to improve the
COUT (Max)
=
thermal performance of this family of devices.
These
VIN
techniques are listed in order of the significance of their impact.
Power Dissipation
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
During normal on-state operation, the power dissipated in the
device will depend upon the level at which the current limit is
set. The maximum allowed setting for the current limit is 500mA
and will result in a power dissipation of:
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
P = (ILIM)2 * RON = (0.5)2 * 0.16 = 40mW
If the part goes into current limit, the maximum power
dissipation will occur when the output is shorted to ground. For
the FPF2200, the power dissipation will scale by the Auto-
Restart Time, tRSTRT, and the Over Current Blanking Time,
tBLANK, so that the maximum power dissipated is:
tBLANK
P (Max)
=
* VIN (Max) * ILIM (Max)
tBLANK + tRSTRT
30
=
* 5.5 * 0.5 = 0.17W
30 + 450
Note this is below the maximum package power dissipation, and
the thermal shutdown feature will act as additional safety to
protect the part from damage due to excessive heating. The
junction temperature is only able to increase to the thermal
shutdown threshold. Once this temperature has been reached,
toggling ON will not turn-on the switch until the junction
temperature drops. For the FPF2202, a short on the output will
cause the part to operate in a constant current state dissipating
a worst case power of:
Figure 21: Two through hole open vias embedded in DAP
3. The VIN, VOUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 23 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The low-power FLAGB and ON pin traces may be
laid-out diagonally from the device to maximize the area
available to the ground pad. Placing the input and output
capacitors as close to the device as possible also contributes to
heat dissipation, particularly during high load currents.
P (Max) = VIN (MAX) * ILIM (MAX) = 5.5 * 0.557 = 3.064W
This large amount of power will activate the thermal shutdown
and the part will cycle in and out of thermal shutdown so long as
the ON pin is active and the short is present.
10
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FPF2200-FPF2202 Rev. B
Figure 22: X-Ray result (bottom view with 45o angle)
Figure 25: Bottom and ASB Layers
Figure 26: Zoom in to Top layer
Figure 23: Proper layout of output and ground copper area
FPF22XX Demo Board
FPF22XX Demo board has components and circuitry to
demonstrate FPF2223/4/5 load switches functions and features.
R4 resistor with 0ꢀ value is used for measuring the output
current. Load current can be scoped by removing the R4
resistor and soldering a current loop to the R4 footprint. Thermal
performance of the board is improved using a few techniques
recommended in the layout recommendations section of
datasheet. R3 resistor should be left open for FPF220X family.
Figure 24: Top, SST, and AST Layers
11
www.fairchildsemi.com
FPF2200-FPF2202 Rev. B
0.05 C
2.0
A
1.72
1.68
2X
B
4
6
0.15
1.21
2.0
0.90
2.25
0.52(6X)
0.05 C
1
3
PIN#1 IDENT
TOP VIEW
2X
0.42(6X)
0.65
RECOMMENDED
LAND PATTERN
ꢂꢁꢈꢃꢂꢁꢂꢃ
0.10 C
ꢂꢁꢀꢂꢂꢁꢂꢃ
NOTES:
0.08 C
SIDE VIEW
C
ꢂꢁꢂꢀꢃꢂꢁꢂꢀꢃ
A. PACKAGE DOES NOT FULLY CONFORM
TO JEDEC MO-229 REGISTRATION
SEATING
PLANE
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
ꢀꢁꢂꢂꢂꢁꢂꢃ
ꢄꢁꢅꢂꢂꢁꢂꢃ
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.70)
PIN #1 IDENT
(0.20)4X
E. DRAWING FILENAME: MKT-MLP06Krev5.
1
6
3
(0.40)
ꢂꢁꢇꢀꢂꢁꢂꢃ
(6X)
ꢂꢁꢆꢂꢂꢁꢂꢃ
(0.60)
4
(6X)
C A B
ꢂꢁꢇꢂꢂꢁꢂꢃ
0.10
0.65
1.30
0.05
C
BOTTOM VIEW
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