FPF2214 [ONSEMI]
集成式负载开关,带可调高精度电流限值;型号: | FPF2214 |
厂家: | ONSEMI |
描述: | 集成式负载开关,带可调高精度电流限值 开关 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总15页 (文件大小:1337K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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February 2009
FPF2213-FPF2215
tm
Integrated Load Switch with Adjustable High Precision Current Limit
Features
General Description
¢ 1.8 to 5.5V Input Voltage Range
The FPF2213-FPF2215 are low R
P-Channel MOSFET
DS(ON)
load switches with high precision current limit value. The input
voltage range operates from 1.8V to 5.5V to fulfill today's Ultra
Portable Device's supply requirement. Switch control is by a
logic input (ON) capable of interfacing directly with low voltage
control signal. On-chip pull-down is available for output quick
discharge when switch is turned off.
¢ Typical R
¢ Typical R
= 250mꢀ @ V = 5.5V
IN
DS(ON)
DS(ON)
= 275mꢀ @ V = 3.3V
IN
¢ 100-250mA (min) Adjustable Current Limit
¢ 5% Current Limit Tolerance @ 250mA (min)
¢ 72ꢀ (typ) Output Discharge Resistance
¢ ESD Protected, Above 8000V HBM and 2000V CDM
For the FPF2214, if the constant current condition still persists
after 30ms, these parts will shut off the switch and pull the fault
signal pin (FLAGB) low. The FPF2213 has an auto-restart
feature, which will turn the switch on again after 450mS if the
ON pin is still active. The FPF2214 do not have this auto-restart
feature so the switch will remain off until the ON pin is cycled.
For the FPF2215, a current limit condition will immediately pull
the fault signal pin low and the part will remain in the constant-
current mode until the switch current falls below the current
limit. For the FPF2213 through FPF2215, the current limit is set
by an external resistor and the minimum current limit is 100mA.
Applications
¢ PDAs
¢ Cell Phones
¢ GPS Devices
¢ MP3 Players
¢ Digital Cameras
¢ Peripheral Ports
¢ Notebook Computer
Pin 1
BOTTOM
TOP
Ordering Information
Current Limit
Blanking Time
(mS)
Current Limit
Auto-Restart Time
(mS)
ON Pin
Activity
Part
(mA)
FPF2213
FPF2214
FPF2215
100-250
100-250
100-250
30
450
NA
NA
Active HI
Active HI
Active HI
30
NA
©2008 Fairchild Semiconductor Corporation
FPF2213-FPF2215 Rev. C
1
www.fairchildsemi.com
Typical Application Circuit
TO LOAD
FPF2213/4/5
V
V
OUT
IN
FLAGB
OFF ON
ON
I
SET
GND
Functional Block Diagram
V
IN
UVLO
THERMAL
SHUTDOWN
CONTROL
LOGIC
ON
CURRENT
LIMIT
V
OUT
I
SET
Output Discharge
FLAGB
GND
2
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FPF2213-FPF2215 Rev. C
Pin Configuration
ON
6
5
4
1
2
3
I
SET
GND
V
V
IN
FLAGB
OUT
MicroFET 2x2 6L
(BOTTOMVIEW)
Pin Description
Pin
Name
Function
1
2
3
I
Current Limit Set Input : A resistor from I
to ground sets the current limit for the switch
SET
SET
V
Supply Input: Input to the power switch and the supply voltage for the IC
Switch Output: Output of the power switch
IN
V
OUT
Fault Output: Active LO, open drain output which indicates an over current, supply
under voltage or over temperature state
4
FLAGB
5
6
GND
ON
Ground
ON/OFF Control Input
Absolute Maximum Ratings
Parameter
Min.
-0.3
Max.
6
Unit
V
V
, V
, ON, FLAGB TO GND
OUT
IN
I
TO GND
-0.3
0.3
1.2
125
86
V
SET
Power Dissipation @ T = 25°C
W
A
Operating and Storage Junction Temperature
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Protection
-65
°C
°C/W
V
HBM
MM
8000
400
V
CDM
2000
V
Recommended Operating Range
Parameter
Min.
1.8
Max.
5.5
Unit
V
V
IN
Ambient Operating Temperature, T
-40
85
°C
A
Electrical Characteristics
V
=1.8to5.5V, T =-40to+85°Cunlessotherwisenoted.TypicalvaluesareatV =3.3V andT =25°C.
IN
A
IN
A
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Basic Operation
Operating Voltage
V
1.8
5.5
75
V
IN
I
I
I
=0mA, V = V =1.8V, R =26.8K
SET
45
50
60
OUT
OUT
OUT
IN
ON
Quiescent Current
I
=0mA, V = V =3.3V, R =26.8K
SET
85
ꢁA
ꢁA
Q
IN
ON
=0mA, V = V =5.5V, R =26.8K
SET
95
IN
ON
V
Shutdown Current
V
=0V, V =5.5V, V
=short to GND
2.5
IN
ON
IN
OUT
3
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FPF2213-FPF2215 Rev. C
Parameter
Symbol
Conditions
Min. Typ. Max. Units
V
Shutdown Current
V
V
V
V
V
=0V, V
=5.5V, V =short to GND
1
ꢁA
OUT
ON
OUT
OUT
OUT
OUT
OUT
IN
=5.5V, I
=3.3V, I
=1.8V, I
=3.3V, I
=200mA, T =25°C
250
275
350
325
360
455
IN
IN
IN
IN
A
=200mA, T =25°C
A
On-Resistance
R
mꢀ
ON
=200mA, T =25°C
A
=200mA,
135
450
105
T =-40 to +80°C
A
Output Discharge Resistance
V
V
V
V
V
V
V
V
V
=3.3V, V =0V, I =10mA
OUT
72
ꢀ
IN
IN
IN
IN
IN
ON
ON
=1.8V
=5.5V
=1.8V
=5.5V
0.8
1.4
ON Input Logic High Voltage (ON)
V
V
V
IH
IL
0.5
1.0
1
ON Input Logic Low Voltage (OFF)
On Input Leakage
V
ꢁA
V
= V or GND
-1
IN
=5.5V, I
=1.8V, I
=100ꢁA
0.05
0.12
0.1
0.25
1
IN
IN
IN
SINK
SINK
FLAGB Output Logic Low Voltage
FLAGB Output High Leakage Current
=100ꢁA
=5.5V, Switch on
ꢁA
Protections
V
=3.3V, V
= 3.0V, R
=26.8K,
SET
IN
OUT
Current Limit
I
250
263
276
mA
°C
LIM
T =25°C
A
Shutdown Threshold
Return from Shutdown
Hysteresis
140
130
10
Thermal Shutdown
Under Voltage Shutdown
Under Voltage Shutdown Hysteresis
Dynamic
UVLO
V
increasing
1.55
1.65
50
1.75
V
IN
mV
Turn On Time
t
t
t
t
t
t
R =500ꢀ, C =0.001uF
70
600
40
ꢁS
nS
ꢁS
nS
mS
mS
ON
L
L
Turn Off Time
R =500ꢀ, C =0.001uF
L L
OFF
V
V
Rise Time
Fall Time
R =500ꢀ, C =0.001uF
L L
OUT
OUT
RISE
FALL
BLANK
RSTRT
R =500ꢀ, C =0.001uF
100
30
L
L
Over Current Blanking Time
Auto-Restart Time
FPF2213, FPF2214
FPF2213
15
60
225
450
900
V
= V = 3.3V. Over-Current
ON
IN
Current Limit Response Time
5
ꢁS
Condition: R
=V /(I x4)
LOAD
IN LIM
4
www.fairchildsemi.com
FPF2213-FPF2215 Rev. C
Typical Characteristics
80
80
70
60
50
40
30
20
10
VON = VIN
VON=VIN
70
VIN=5.5V
60
85oC
50
VIN=3.3V
25oC
VIN=1.8V
40
-40oC
30
20
10
-40
-15
10
35
60
85
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)
SUPPLY VOLTAGE (V)
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
1.4
1.2
1.0
0.8
0.6
0.4
0.2
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
V
IN=5.5V
V
VIN=3.3V
IH
V
IL
V
IN=1.2V
-40
-15
10
35
60
85
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)
V , SUPPLY VOLTAGE (V)
IN
Figure 3. V vs. Input Voltage
Figure 4. V
High Voltage vs. Temperature
ON
ON
1.6
1.4
1.2
1
0.05
0.04
0.03
0.02
0.01
0.00
-0.01
V
IN=5.5V
V
IN=3.3V
VON = 5.5V
0.8
0.6
0.4
VIN=1.2V
VON = 0V
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTIONTEMPERATURE (oC)
Figure 5. V Low Voltage vs. Temperature
Figure 6. On Pin Current vs. Temperature
ON
5
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FPF2213-FPF2215 Rev. C
Typical Characteristics
290
285
280
275
270
265
260
255
250
300
250
200
150
100
50
R
= 26.8Kꢀ
SET
V
IN = 1.8V
V
IN = 3.3V
VIN = 5.5V
0
-40
-15
10
35
60
85
0
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)
V -VOUT (V)
IN
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
470
430
390
350
310
270
230
190
150
500
450
400
350
300
250
200
150
VIN=1.8V
85oC
VIN=3.3V
25oC
VIN=5.5V
-40oC
-40
-15
10
35
60
85
1.5
2.5
3.5
4.5
5.5
V , SUPPLY VOLTAGE (V)
IN
TJ, JUNCTION TEMPERATURE ( C)
Figure 9. R
vs. Input Voltage
Figure 10. R
vs. Temperature
ON
ON
1000
100
10
100
10
1
V
IN = 3.3V
RL = 500 Ohms
COUT = 0.11uF
TRISE
TON
VIN = 3.3V
RL = 500 Ohms
COUT = 0.11uF
TOFF
TFALL
1
0.1
0.1
-40
-15
10
35
60
85
-40
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTIONTEMPERATURE (oC)
Figure 11. T / T
vs. Temperature
Figure 12. T
/ T
vs. Temperature
ON
OFF
RISE
FALL
6
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FPF2213-FPF2215 Rev. C
Typical Characteristics
V
V
IN
IN
2V/DIV
2V/DIV
I
I
OUT
OUT
10mA/DIV
10mA/DIV
V
V
ON
ON
2V/DIV
2V/DIV
V
=3.3V,
V =3.3V,
IN
IN
V
R =500ꢀ,
R =500ꢀ,
V
OUT
L
L
OUT
2V/DIV
C
R
=10uF,
C
R
=10uF,
=26.8Kꢀ
2V/DIV
IN
IN
SET
=26.8Kꢀ
SET
100ꢁs/DIV
Figure 13. Turn On Reponse
500ns/DIV
Figure 14. Turn Off Reponse
V
=3.3V, R =5ꢀ,
V =5V, R =5ꢀ,
IN L
IN
L
C
C
R
=10uF,
C
C
R
=10uF,
IN
IN
OUT
=1uF,
=10uF,
=26.8Kꢀ
OUT
V
V
ON
2V/DIV
ON
=26.8Kꢀ
SET
SET
2V/DIV
I
I
OUT
OUT
200mA/DIV
200mA/DIV
V
V
FLAG
FLAG
2V/DIV
2V/DIV
V
V
OUT
OUT
2V/DIV
2V/DIV
200ꢁs/DIV
200ꢁs/DIV
Figure 16. Current Limit Response
Figure 15. Current Limit Response
(Output is loaded with 5ꢀ resistor and C
=1ꢁF)
(Output is loaded with 5ꢀ resistor and C
=10ꢁF)
OUT
OUT
V
=5V, R =5ꢀ,
L
IN
C
C
R
=10uF,
IN
OUT
=100uF,
=26.8Kꢀ
V
=V
V
IN
ON
ON
SET
2V/DIV
2V/DIV
I
I
OUT
OUT
V
=V =3.3V,
ON
IN
200mA/DIV
200mA/DIV
R =5ꢀ,
L
C
C
R
=10uF,
=1uF,
IN
V
FLAG
OUT
2V/DIV
=26.8Kꢀ
SET
V
V
OUT
OUT
2V/DIV
2V/DIV
50ꢁs/DIV
Figure 18. Current Limit Response
(Switch is powered into a short - input and enable pin
are tied together)
500ꢁs/DIV
Figure 17. Current Limit Response
(Output is loaded with 5ꢀ resistor and C
=100ꢁF)
OUT
7
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FPF2213-FPF2215 Rev. C
Typical Characteristics
V
=3.3V,
IN
V
=3.3V,
V
IN
V
ON
R =100ꢀ,
ON
L
R =100ꢀ,
2V/DIV
L
2V/DIV
C
C
R
=10uF,
IN
OUT
C
C
R
=10uF,
IN
=100uF,
=26.8Kꢀ
=1uF,
OUT
SET
I
I
OUT
200mA/DIV
=26.8Kꢀ
OUT
5A/DIV
SET
V
FLAG
2V/DIV
V
V
OUT
OUT
2V/DIV
2V/DIV
500ꢁs/DIV
Figure 19. Current Limit Response
20ꢁs/DIV
Figure 20. Current Limit Response
(Output is loaded with large capacitor)
(Output shorted to GND while the switch is
in normal operation)
8
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FPF2213-FPF2215 Rev. C
Description of Operation
Undervoltage Lockout (UVLO)
The FPF2213, FPF2214, and FPF2215 are state of the art
Adjustable High Precision Current Limit switches that protect
systems and loads which can be damaged or disrupted by the
application of high currents. The core of each device is a 0.27ꢀ
P-channel MOSFET and a controller capable of functioning over
an input operating range of 1.8V - 5.5V. The controller protects
offers current limiting, UVLO(undervoltage lockout) and thermal
shutdown protection. The current limit is adjustable from 100mA
to 250mA through the selection of an external resistor.
The undervoltage lockout turns-off the switch if the input voltage
drops below the undervoltage lockout threshold. With the ON
pin active the input voltage rising above the undervoltage
lockout threshold will cause a controlled turn-on of the switch
which limits current over-shoots.
Output Discharge Resistor
The FPF2213/4/5 family contains an 80ꢀ on-chip load resistor
for quick output discharge when the switch is turned off. This
features become more attractive when application requires
large output capacitor to be discharge when the switch tunrs off.
On/Off Control
The ON pin is active high, and controls the state of the switch.
Applying a continuous high signal will hold the switch in the on
state. The switch will move into the OFF state when the active
high is removed, or if a fault is encountered. For all versions, an
undervoltage on VIN or a junction temperature in excess of
140°C overrides the ON control to turn off the switch.
However, V
pin should not be connected directly to the
OUT
battery source due to the discharge mechanism of the load
switch.
Thermal Shutdown
In addition, excessive currents will cause the switch to turn off in
the FPF2213 and FPF2214. The FPF2213 has an Auto-Restart
feature which will automatically turn the switch on again after
450ms. For the FPF2214, the ON pin must be toggled to turn-on
the switch again. The FPF2215 does not turn off in response to
an over current condition but instead remains operating in a
constant current mode so long as ON is active and the thermal
shutdown or UVLO have not activated.
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
Fault Reporting
Upon the detection of an over-current condition, an input UVLO,
or an over-temperature condition, the FLAGB signals the fault
mode by activating LO. In the event of an over-current condition
for the FPF2213 and FPF2214, the FLAGB goes LO at the end
of the blanking time while FLAGB goes LO immediately for the
FPF2215. If the over-current condition lasts longer than
blanking time, FLAGB remains LO through the Auto-Restart
Time for the FPF2213 while for the FPF2214, FLAGB is latched
LO and ON must be toggled to release it. With the FPF2215,
FLAGB is LO during the faults and immediately returns HI at the
end of the fault condition. FLAGB is an open-drain MOSFET
which requires a pull-up resistor between VIN and FLAGB.
During shutdown, the pull-down on FLAGB is disabled to reduce
current draw from the supply. A 100Kꢀ pull up resistor is
recommended to be used in the application.
Current Limiting
The current limit ensures that the current through the switch
doesn't exceed a maximum value while not limiting at less than
a minimum value. The current at which the parts will limit is
adjustable through the selection of an external resistor
connected to the ISET pin. Information for selecting the resistor
is found in the Application Information section of this datasheet.
The FPF2213 and FPF2214 have a blanking time of 30ms
(nominal) during which the switch will act as a constant current
source. At the end of the blanking time, the switch will be
turned-off. The FPF2215 has no current limit blanking period so
it will remain in a constant current state until the ON pin is
deactivated or the thermal shutdown turns-off the switch.
9
www.fairchildsemi.com
FPF2213-FPF2215 Rev. C
Application Information
305
275
245
215
185
155
125
95
Setting Current Limit
The FPF2213, FPF2214, and FPF2215 have adjustable high
precision current limit which is set with an external resistor
connected between ISET and GND. Please see the layout
recommendation section of the application note for the
recommended R
layout. The R
resistance is selected by
SET
SET
using the following equation:
7050
I
(mA) =
Max
Typ
Min
LIM (Typ)
R
(Kꢀ)
SET
26
32
38
44
50
56
62
For a particular I (min) value, R
can be calculated from
LIM
SET
RSET (KOhms)
below formula:
Figure 21. I
vs R
SET
LIM
7050
(mA) + 10 +
R
(Kꢀ) =
SET
750
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch is turned on into a discharged
load capacitor or a short-circuit, a capacitor is recommended to
I
LIM (Min)
I
(mA)
LIM (Min)
be placed between V and GND. A 1uF ceramic capacitor, C
,
IN
IN
FPF221X family has 5% precision at higher load current. The
and tolerance of current limit value can be determined
placed close to the pins is usually sufficient. Higher values of
can be used to further reduce the voltage drop.
I
LIM (Max)
C
IN
using Figure 21 (I
vs R
) and the following formula:
SET
LIM
Output Capacitor
A 0.1uF capacitor C
, should be placed between V
and
OUT
OUT
I
- I
LIM (Typ) LIM (Min)
GND. This capacitor will prevent parasitic board inductances
from forcing V below GND when the switch turns-off. For the
Tolerance (%) = 100 *
I
LIM (Typ)
OUT
FPF2213 and FPF2214, the total output capacitance needs to
be kept below a maximum value, C (max), to prevent the
OUT
part from registering an over-current condition and turning-off
the switch. The maximum output capacitance can be
determined from the following formula:
I
* Tolerance (%)
100
LIM (Typ)
I
=
I
LIM (Typ) +
LIM (Max)
I
* t
LIM (Max) BLANK (Min)
The table and figure below can be used to select R
:
C
=
SET
OUT (Max)
V
IN
R
Min. Current Typ. Current Max. Current
Tol
SET
[kꢀ]
26.8
28.0
29.4
30.0
32.4
36.5
40.2
48.7
60.0
Limit [mA]
Limit [mA]
Limit [mA]
[%]
Power Dissipation
250
263
276
265
253
249
232
208
190
161
135
5.0
5.4
During normal on-state operation, the power dissipated in the
device will depend upon the level at which the current limit is
set. The maximum allowed setting for the current limit is 250mA
and will result in a power dissipation of:
238
252
226
240
5.7
221
235
5.8
2
2
204
218
6.4
P = (I ) * R = (0.25) * 0.275 = 17mW
LIM
DS
179
193
7.5
If the part goes into current limit, maximum power dissipation
will occur when the output is shorted to ground. For the
FPF2213, the power dissipation will be scaled by the Auto-
160
175
8.5
129
145
11.1
15.0
Restart Time, t
, and the Over Current Blanking Time,
100
118
RSTRT
t
. Therefore, the maximum power dissipated is:
BLANK
Table 1: R
Selection Guide
SET
t
BLANK
P
=
* V
* I
IN (Max) LIM (Max)
(Max)
t
+ t
RSTRT
BLANK
30
=
* 5.5 * 0.276 = 94mW
30 + 450
10
www.fairchildsemi.com
FPF2213-FPF2215 Rev. C
Take note that this is below the maximum package power
dissipation, and the thermal shutdown feature will act as
additional safety to protect the part from damage due to
excessive heating. The junction temperature is only able to
increase to the thermal shutdown threshold. Once this
temperature has been reached, toggling ON will not turn-on the
switch until the junction temperature drops. For the FPF2215, a
short on the output will cause the part to operate in a constant
current state dissipating a worst case power of:
The following techniques have been identified to improve the
thermal performance of this family of devices. These
techniques are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
P
= V
* I
= 5.5 * 0.276 = 1.5W
LIM (MAX)
(Max)
IN (MAX)
This large amount of power will activate the thermal shutdown
and the part will cycle in and out of thermal shutdown so long as
the ON pin is active and the short is present.
PCB Layout Recommendations
In order to benefit from adjustable, high-precision load switch
devices, a high-precision R
value must be used to set a tight
SET
current limit tolerance. Since I
(current limit value) is
LIMIT
determined by the voltage drop across the R , a poor PCB
SET
layout can introduce parasitic noise on the I
pin resulting in a
stability, parasitic
SET
. To improve the I
LIMIT
minor variation of I
LIMIT
noise coupling mechanisms from
I
to GND must be
SET
minimized. This becomes more critical when I
is set close
LIMIT
to the nominal load current operation where parasitic effects
could cause the device to go in and out of current limit and
result in an error flag report.
Care must be taken to provide a direct current return path
Figure 23: Two through hole open vias embedded in DAP
between the R
ground pad and the device ground pad
SET
(pin5). Please see current pad #2 in figure below.
1)Power current path
2)RSET current path
Figure 22: Eliminate parasitic noise of ISET-GND by providing a
separate ground route, unique from the power ground plane
o
Figure 24: X-Ray result (bottom view with 45 angle)
3. The V , V
and GND pins will dissipate most of the heat
OUT
IN
Improving Thermal Performance
generated during a high load current condition. Using wide
traces will help minimize parasitic electrical effects along with
minimizing the case to ambient thermal impedance. The layout
suggested in Figure 25 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The low-power FLAGB and ON pin traces may be
laid-out diagonally from the device to maximize the area
available to the ground pad. Placing the input and output
capacitors as close to the device as possible also contributes to
heat dissipation, particularly during high load currents.
An improper layout could result in higher junction temperature
and triggering the thermal shutdown protection feature. This
concern applies when the switch is set at higher current limit
value and an over-current condition occurs. In this case, the
power dissipation of the switch, from the formula below, could
exceed the maximum absolute power dissipation of 1.2W.
PD = (V - V
) x I
LIM (Max)
IN
OUT
11
www.fairchildsemi.com
FPF2213-FPF2215 Rev. C
Figure 28: Zoom in to Top layer
Figure 25: Proper layout of output and ground copper area
FPF22XX Demo Board
FPF22XX Demo board has components and circuitry to
demonstrate FPF2213/4/5 load switches functions and features.
R4 resistor with 0ꢀ value is used for measuring the output
current. Load current can be scoped by removing the R4
resistor and soldering a current loop to the R4 footprint. Thermal
performance of the board is improved using a few techniques
recommended in the layout recommendations section of
datasheet.
Figure 26: Top, SST, and AST Layers
Figure 27: Bottom and ASB Layers
12
www.fairchildsemi.com
FPF2213-FPF2215 Rev. C
0.05 C
2.0
A
1.72
1.68
2X
B
4
6
0.15
1.21
2.0
0.90
2.25
0.52(6X)
0.05 C
1
3
PIN#1 IDENT
TOP VIEW
2X
0.42(6X)
0.65
RECOMMENDED
LAND PATTERN
ꢂꢁꢈꢃꢂꢁꢂꢃ
0.10 C
ꢂꢁꢀꢂꢂꢁꢂꢃ
NOTES:
0.08 C
SIDE VIEW
C
ꢂꢁꢂꢀꢃꢂꢁꢂꢀꢃ
A. PACKAGE DOES NOT FULLY CONFORM
TO JEDEC MO-229 REGISTRATION
SEATING
PLANE
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
ꢀꢁꢂꢂꢂꢁꢂꢃ
ꢄꢁꢅꢂꢂꢁꢂꢃ
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
(0.70)
PIN #1 IDENT
(0.20)4X
E. DRAWING FILENAME: MKT-MLP06Krev5.
1
6
3
(0.40)
ꢂꢁꢇꢀꢂꢁꢂꢃ
(6X)
ꢂꢁꢆꢂꢂꢁꢂꢃ
(0.60)
4
(6X)
C A B
ꢂꢁꢇꢂꢂꢁꢂꢃ
0.10
0.65
1.30
0.05
C
BOTTOM VIEW
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