FPF2214 [ONSEMI]

集成式负载开关,带可调高精度电流限值;
FPF2214
型号: FPF2214
厂家: ONSEMI    ONSEMI
描述:

集成式负载开关,带可调高精度电流限值

开关 驱动 光电二极管 接口集成电路 驱动器
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February 2009  
FPF2213-FPF2215  
tm  
Integrated Load Switch with Adjustable High Precision Current Limit  
Features  
General Description  
¢ 1.8 to 5.5V Input Voltage Range  
The FPF2213-FPF2215 are low R  
P-Channel MOSFET  
DS(ON)  
load switches with high precision current limit value. The input  
voltage range operates from 1.8V to 5.5V to fulfill today's Ultra  
Portable Device's supply requirement. Switch control is by a  
logic input (ON) capable of interfacing directly with low voltage  
control signal. On-chip pull-down is available for output quick  
discharge when switch is turned off.  
¢ Typical R  
¢ Typical R  
= 250m@ V = 5.5V  
IN  
DS(ON)  
DS(ON)  
= 275m@ V = 3.3V  
IN  
¢ 100-250mA (min) Adjustable Current Limit  
¢ 5% Current Limit Tolerance @ 250mA (min)  
¢ 72(typ) Output Discharge Resistance  
¢ ESD Protected, Above 8000V HBM and 2000V CDM  
For the FPF2214, if the constant current condition still persists  
after 30ms, these parts will shut off the switch and pull the fault  
signal pin (FLAGB) low. The FPF2213 has an auto-restart  
feature, which will turn the switch on again after 450mS if the  
ON pin is still active. The FPF2214 do not have this auto-restart  
feature so the switch will remain off until the ON pin is cycled.  
For the FPF2215, a current limit condition will immediately pull  
the fault signal pin low and the part will remain in the constant-  
current mode until the switch current falls below the current  
limit. For the FPF2213 through FPF2215, the current limit is set  
by an external resistor and the minimum current limit is 100mA.  
Applications  
¢ PDAs  
¢ Cell Phones  
¢ GPS Devices  
¢ MP3 Players  
¢ Digital Cameras  
¢ Peripheral Ports  
¢ Notebook Computer  
Pin 1  
BOTTOM  
TOP  
Ordering Information  
Current Limit  
Blanking Time  
(mS)  
Current Limit  
Auto-Restart Time  
(mS)  
ON Pin  
Activity  
Part  
(mA)  
FPF2213  
FPF2214  
FPF2215  
100-250  
100-250  
100-250  
30  
450  
NA  
NA  
Active HI  
Active HI  
Active HI  
30  
NA  
©2008 Fairchild Semiconductor Corporation  
FPF2213-FPF2215 Rev. C  
1
www.fairchildsemi.com  
Typical Application Circuit  
TO LOAD  
FPF2213/4/5  
V
V
OUT  
IN  
FLAGB  
OFF ON  
ON  
I
SET  
GND  
Functional Block Diagram  
V
IN  
UVLO  
THERMAL  
SHUTDOWN  
CONTROL  
LOGIC  
ON  
CURRENT  
LIMIT  
V
OUT  
I
SET  
Output Discharge  
FLAGB  
GND  
2
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Pin Configuration  
ON  
6
5
4
1
2
3
I
SET  
GND  
V
V
IN  
FLAGB  
OUT  
MicroFET 2x2 6L  
(BOTTOMVIEW)  
Pin Description  
Pin  
Name  
Function  
1
2
3
I
Current Limit Set Input : A resistor from I  
to ground sets the current limit for the switch  
SET  
SET  
V
Supply Input: Input to the power switch and the supply voltage for the IC  
Switch Output: Output of the power switch  
IN  
V
OUT  
Fault Output: Active LO, open drain output which indicates an over current, supply  
under voltage or over temperature state  
4
FLAGB  
5
6
GND  
ON  
Ground  
ON/OFF Control Input  
Absolute Maximum Ratings  
Parameter  
Min.  
-0.3  
Max.  
6
Unit  
V
V
, V  
, ON, FLAGB TO GND  
OUT  
IN  
I
TO GND  
-0.3  
0.3  
1.2  
125  
86  
V
SET  
Power Dissipation @ T = 25°C  
W
A
Operating and Storage Junction Temperature  
Thermal Resistance, Junction to Ambient  
Electrostatic Discharge Protection  
-65  
°C  
°C/W  
V
HBM  
MM  
8000  
400  
V
CDM  
2000  
V
Recommended Operating Range  
Parameter  
Min.  
1.8  
Max.  
5.5  
Unit  
V
V
IN  
Ambient Operating Temperature, T  
-40  
85  
°C  
A
Electrical Characteristics  
V
=1.8to5.5V, T =-40to+85°Cunlessotherwisenoted.TypicalvaluesareatV =3.3V andT =25°C.  
IN  
A
IN  
A
Parameter  
Symbol  
Conditions  
Min. Typ. Max. Units  
Basic Operation  
Operating Voltage  
V
1.8  
5.5  
75  
V
IN  
I
I
I
=0mA, V = V =1.8V, R =26.8K  
SET  
45  
50  
60  
OUT  
OUT  
OUT  
IN  
ON  
Quiescent Current  
I
=0mA, V = V =3.3V, R =26.8K  
SET  
85  
A  
A  
Q
IN  
ON  
=0mA, V = V =5.5V, R =26.8K  
SET  
95  
IN  
ON  
V
Shutdown Current  
V
=0V, V =5.5V, V  
=short to GND  
2.5  
IN  
ON  
IN  
OUT  
3
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Parameter  
Symbol  
Conditions  
Min. Typ. Max. Units  
V
Shutdown Current  
V
V
V
V
V
=0V, V  
=5.5V, V =short to GND  
1
A  
OUT  
ON  
OUT  
OUT  
OUT  
OUT  
OUT  
IN  
=5.5V, I  
=3.3V, I  
=1.8V, I  
=3.3V, I  
=200mA, T =25°C  
250  
275  
350  
325  
360  
455  
IN  
IN  
IN  
IN  
A
=200mA, T =25°C  
A
On-Resistance  
R
mꢀ  
ON  
=200mA, T =25°C  
A
=200mA,  
135  
450  
105  
T =-40 to +80°C  
A
Output Discharge Resistance  
V
V
V
V
V
V
V
V
V
=3.3V, V =0V, I =10mA  
OUT  
72  
IN  
IN  
IN  
IN  
IN  
ON  
ON  
=1.8V  
=5.5V  
=1.8V  
=5.5V  
0.8  
1.4  
ON Input Logic High Voltage (ON)  
V
V
V
IH  
IL  
0.5  
1.0  
1
ON Input Logic Low Voltage (OFF)  
On Input Leakage  
V
A  
V
= V or GND  
-1  
IN  
=5.5V, I  
=1.8V, I  
=100A  
0.05  
0.12  
0.1  
0.25  
1
IN  
IN  
IN  
SINK  
SINK  
FLAGB Output Logic Low Voltage  
FLAGB Output High Leakage Current  
=100A  
=5.5V, Switch on  
A  
Protections  
V
=3.3V, V  
= 3.0V, R  
=26.8K,  
SET  
IN  
OUT  
Current Limit  
I
250  
263  
276  
mA  
°C  
LIM  
T =25°C  
A
Shutdown Threshold  
Return from Shutdown  
Hysteresis  
140  
130  
10  
Thermal Shutdown  
Under Voltage Shutdown  
Under Voltage Shutdown Hysteresis  
Dynamic  
UVLO  
V
increasing  
1.55  
1.65  
50  
1.75  
V
IN  
mV  
Turn On Time  
t
t
t
t
t
t
R =500, C =0.001uF  
70  
600  
40  
S  
nS  
S  
nS  
mS  
mS  
ON  
L
L
Turn Off Time  
R =500, C =0.001uF  
L L  
OFF  
V
V
Rise Time  
Fall Time  
R =500, C =0.001uF  
L L  
OUT  
OUT  
RISE  
FALL  
BLANK  
RSTRT  
R =500, C =0.001uF  
100  
30  
L
L
Over Current Blanking Time  
Auto-Restart Time  
FPF2213, FPF2214  
FPF2213  
15  
60  
225  
450  
900  
V
= V = 3.3V. Over-Current  
ON  
IN  
Current Limit Response Time  
5
S  
Condition: R  
=V /(I x4)  
LOAD  
IN LIM  
4
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Typical Characteristics  
80  
80  
70  
60  
50  
40  
30  
20  
10  
VON = VIN  
VON=VIN  
70  
VIN=5.5V  
60  
85oC  
50  
VIN=3.3V  
25oC  
VIN=1.8V  
40  
-40oC  
30  
20  
10  
-40  
-15  
10  
35  
60  
85  
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)  
SUPPLY VOLTAGE (V)  
Figure 1. Quiescent Current vs. Input Voltage  
Figure 2. Quiescent Current vs. Temperature  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
V
IN=5.5V  
V
VIN=3.3V  
IH  
V
IL  
V
IN=1.2V  
-40  
-15  
10  
35  
60  
85  
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)  
V , SUPPLY VOLTAGE (V)  
IN  
Figure 3. V vs. Input Voltage  
Figure 4. V  
High Voltage vs. Temperature  
ON  
ON  
1.6  
1.4  
1.2  
1
0.05  
0.04  
0.03  
0.02  
0.01  
0.00  
-0.01  
V
IN=5.5V  
V
IN=3.3V  
VON = 5.5V  
0.8  
0.6  
0.4  
VIN=1.2V  
VON = 0V  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTIONTEMPERATURE (oC)  
Figure 5. V Low Voltage vs. Temperature  
Figure 6. On Pin Current vs. Temperature  
ON  
5
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Typical Characteristics  
290  
285  
280  
275  
270  
265  
260  
255  
250  
300  
250  
200  
150  
100  
50  
R
= 26.8K  
SET  
V
IN = 1.8V  
V
IN = 3.3V  
VIN = 5.5V  
0
-40  
-15  
10  
35  
60  
85  
0
1
2
3
4
5
6
TJ, JUNCTION TEMPERATURE (oC)  
V -VOUT (V)  
IN  
Figure 7. Current Limit vs. Output Voltage  
Figure 8. Current Limit vs. Temperature  
470  
430  
390  
350  
310  
270  
230  
190  
150  
500  
450  
400  
350  
300  
250  
200  
150  
VIN=1.8V  
85oC  
VIN=3.3V  
25oC  
VIN=5.5V  
-40oC  
-40  
-15  
10  
35  
60  
85  
1.5  
2.5  
3.5  
4.5  
5.5  
V , SUPPLY VOLTAGE (V)  
IN  
TJ, JUNCTION TEMPERATURE ( C)  
Figure 9. R  
vs. Input Voltage  
Figure 10. R  
vs. Temperature  
ON  
ON  
1000  
100  
10  
100  
10  
1
V
IN = 3.3V  
RL = 500 Ohms  
COUT = 0.11uF  
TRISE  
TON  
VIN = 3.3V  
RL = 500 Ohms  
COUT = 0.11uF  
TOFF  
TFALL  
1
0.1  
0.1  
-40  
-15  
10  
35  
60  
85  
-40  
-15  
10  
35  
60  
85  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTIONTEMPERATURE (oC)  
Figure 11. T / T  
vs. Temperature  
Figure 12. T  
/ T  
vs. Temperature  
ON  
OFF  
RISE  
FALL  
6
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Typical Characteristics  
V
V
IN  
IN  
2V/DIV  
2V/DIV  
I
I
OUT  
OUT  
10mA/DIV  
10mA/DIV  
V
V
ON  
ON  
2V/DIV  
2V/DIV  
V
=3.3V,  
V =3.3V,  
IN  
IN  
V
R =500,  
R =500,  
V
OUT  
L
L
OUT  
2V/DIV  
C
R
=10uF,  
C
R
=10uF,  
=26.8Kꢀ  
2V/DIV  
IN  
IN  
SET  
=26.8Kꢀ  
SET  
100s/DIV  
Figure 13. Turn On Reponse  
500ns/DIV  
Figure 14. Turn Off Reponse  
V
=3.3V, R =5,  
V =5V, R =5,  
IN L  
IN  
L
C
C
R
=10uF,  
C
C
R
=10uF,  
IN  
IN  
OUT  
=1uF,  
=10uF,  
=26.8Kꢀ  
OUT  
V
V
ON  
2V/DIV  
ON  
=26.8Kꢀ  
SET  
SET  
2V/DIV  
I
I
OUT  
OUT  
200mA/DIV  
200mA/DIV  
V
V
FLAG  
FLAG  
2V/DIV  
2V/DIV  
V
V
OUT  
OUT  
2V/DIV  
2V/DIV  
200s/DIV  
200s/DIV  
Figure 16. Current Limit Response  
Figure 15. Current Limit Response  
(Output is loaded with 5resistor and C  
=1F)  
(Output is loaded with 5resistor and C  
=10F)  
OUT  
OUT  
V
=5V, R =5,  
L
IN  
C
C
R
=10uF,  
IN  
OUT  
=100uF,  
=26.8Kꢀ  
V
=V  
V
IN  
ON  
ON  
SET  
2V/DIV  
2V/DIV  
I
I
OUT  
OUT  
V
=V =3.3V,  
ON  
IN  
200mA/DIV  
200mA/DIV  
R =5,  
L
C
C
R
=10uF,  
=1uF,  
IN  
V
FLAG  
OUT  
2V/DIV  
=26.8Kꢀ  
SET  
V
V
OUT  
OUT  
2V/DIV  
2V/DIV  
50s/DIV  
Figure 18. Current Limit Response  
(Switch is powered into a short - input and enable pin  
are tied together)  
500s/DIV  
Figure 17. Current Limit Response  
(Output is loaded with 5resistor and C  
=100F)  
OUT  
7
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Typical Characteristics  
V
=3.3V,  
IN  
V
=3.3V,  
V
IN  
V
ON  
R =100,  
ON  
L
R =100,  
2V/DIV  
L
2V/DIV  
C
C
R
=10uF,  
IN  
OUT  
C
C
R
=10uF,  
IN  
=100uF,  
=26.8Kꢀ  
=1uF,  
OUT  
SET  
I
I
OUT  
200mA/DIV  
=26.8Kꢀ  
OUT  
5A/DIV  
SET  
V
FLAG  
2V/DIV  
V
V
OUT  
OUT  
2V/DIV  
2V/DIV  
500s/DIV  
Figure 19. Current Limit Response  
20s/DIV  
Figure 20. Current Limit Response  
(Output is loaded with large capacitor)  
(Output shorted to GND while the switch is  
in normal operation)  
8
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Description of Operation  
Undervoltage Lockout (UVLO)  
The FPF2213, FPF2214, and FPF2215 are state of the art  
Adjustable High Precision Current Limit switches that protect  
systems and loads which can be damaged or disrupted by the  
application of high currents. The core of each device is a 0.27ꢀ  
P-channel MOSFET and a controller capable of functioning over  
an input operating range of 1.8V - 5.5V. The controller protects  
offers current limiting, UVLO(undervoltage lockout) and thermal  
shutdown protection. The current limit is adjustable from 100mA  
to 250mA through the selection of an external resistor.  
The undervoltage lockout turns-off the switch if the input voltage  
drops below the undervoltage lockout threshold. With the ON  
pin active the input voltage rising above the undervoltage  
lockout threshold will cause a controlled turn-on of the switch  
which limits current over-shoots.  
Output Discharge Resistor  
The FPF2213/4/5 family contains an 80on-chip load resistor  
for quick output discharge when the switch is turned off. This  
features become more attractive when application requires  
large output capacitor to be discharge when the switch tunrs off.  
On/Off Control  
The ON pin is active high, and controls the state of the switch.  
Applying a continuous high signal will hold the switch in the on  
state. The switch will move into the OFF state when the active  
high is removed, or if a fault is encountered. For all versions, an  
undervoltage on VIN or a junction temperature in excess of  
140°C overrides the ON control to turn off the switch.  
However, V  
pin should not be connected directly to the  
OUT  
battery source due to the discharge mechanism of the load  
switch.  
Thermal Shutdown  
In addition, excessive currents will cause the switch to turn off in  
the FPF2213 and FPF2214. The FPF2213 has an Auto-Restart  
feature which will automatically turn the switch on again after  
450ms. For the FPF2214, the ON pin must be toggled to turn-on  
the switch again. The FPF2215 does not turn off in response to  
an over current condition but instead remains operating in a  
constant current mode so long as ON is active and the thermal  
shutdown or UVLO have not activated.  
The thermal shutdown protects the die from internally or  
externally generated excessive temperatures. During an over-  
temperature condition the FLAGB is activated and the switch is  
turned-off. The switch automatically turns-on again if  
temperature of the die drops below the threshold temperature.  
Fault Reporting  
Upon the detection of an over-current condition, an input UVLO,  
or an over-temperature condition, the FLAGB signals the fault  
mode by activating LO. In the event of an over-current condition  
for the FPF2213 and FPF2214, the FLAGB goes LO at the end  
of the blanking time while FLAGB goes LO immediately for the  
FPF2215. If the over-current condition lasts longer than  
blanking time, FLAGB remains LO through the Auto-Restart  
Time for the FPF2213 while for the FPF2214, FLAGB is latched  
LO and ON must be toggled to release it. With the FPF2215,  
FLAGB is LO during the faults and immediately returns HI at the  
end of the fault condition. FLAGB is an open-drain MOSFET  
which requires a pull-up resistor between VIN and FLAGB.  
During shutdown, the pull-down on FLAGB is disabled to reduce  
current draw from the supply. A 100Kpull up resistor is  
recommended to be used in the application.  
Current Limiting  
The current limit ensures that the current through the switch  
doesn't exceed a maximum value while not limiting at less than  
a minimum value. The current at which the parts will limit is  
adjustable through the selection of an external resistor  
connected to the ISET pin. Information for selecting the resistor  
is found in the Application Information section of this datasheet.  
The FPF2213 and FPF2214 have a blanking time of 30ms  
(nominal) during which the switch will act as a constant current  
source. At the end of the blanking time, the switch will be  
turned-off. The FPF2215 has no current limit blanking period so  
it will remain in a constant current state until the ON pin is  
deactivated or the thermal shutdown turns-off the switch.  
9
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Application Information  
305  
275  
245  
215  
185  
155  
125  
95  
Setting Current Limit  
The FPF2213, FPF2214, and FPF2215 have adjustable high  
precision current limit which is set with an external resistor  
connected between ISET and GND. Please see the layout  
recommendation section of the application note for the  
recommended R  
layout. The R  
resistance is selected by  
SET  
SET  
using the following equation:  
7050  
I
(mA) =  
Max  
Typ  
Min  
LIM (Typ)  
R
(K)  
SET  
26  
32  
38  
44  
50  
56  
62  
For a particular I (min) value, R  
can be calculated from  
LIM  
SET  
RSET (KOhms)  
below formula:  
Figure 21. I  
vs R  
SET  
LIM  
7050  
(mA) + 10 +  
R
(K) =  
SET  
750  
Input Capacitor  
To limit the voltage drop on the input supply caused by transient  
in-rush currents when the switch is turned on into a discharged  
load capacitor or a short-circuit, a capacitor is recommended to  
I
LIM (Min)  
I
(mA)  
LIM (Min)  
be placed between V and GND. A 1uF ceramic capacitor, C  
,
IN  
IN  
FPF221X family has 5% precision at higher load current. The  
and tolerance of current limit value can be determined  
placed close to the pins is usually sufficient. Higher values of  
can be used to further reduce the voltage drop.  
I
LIM (Max)  
C
IN  
using Figure 21 (I  
vs R  
) and the following formula:  
SET  
LIM  
Output Capacitor  
A 0.1uF capacitor C  
, should be placed between V  
and  
OUT  
OUT  
I
- I  
LIM (Typ) LIM (Min)  
GND. This capacitor will prevent parasitic board inductances  
from forcing V below GND when the switch turns-off. For the  
Tolerance (%) = 100 *  
I
LIM (Typ)  
OUT  
FPF2213 and FPF2214, the total output capacitance needs to  
be kept below a maximum value, C (max), to prevent the  
OUT  
part from registering an over-current condition and turning-off  
the switch. The maximum output capacitance can be  
determined from the following formula:  
I
* Tolerance (%)  
100  
LIM (Typ)  
I
=
I
LIM (Typ) +  
LIM (Max)  
I
* t  
LIM (Max) BLANK (Min)  
The table and figure below can be used to select R  
:
C
=
SET  
OUT (Max)  
V
IN  
R
Min. Current Typ. Current Max. Current  
Tol  
SET  
[k]  
26.8  
28.0  
29.4  
30.0  
32.4  
36.5  
40.2  
48.7  
60.0  
Limit [mA]  
Limit [mA]  
Limit [mA]  
[%]  
Power Dissipation  
250  
263  
276  
265  
253  
249  
232  
208  
190  
161  
135  
5.0  
5.4  
During normal on-state operation, the power dissipated in the  
device will depend upon the level at which the current limit is  
set. The maximum allowed setting for the current limit is 250mA  
and will result in a power dissipation of:  
238  
252  
226  
240  
5.7  
221  
235  
5.8  
2
2
204  
218  
6.4  
P = (I ) * R = (0.25) * 0.275 = 17mW  
LIM  
DS  
179  
193  
7.5  
If the part goes into current limit, maximum power dissipation  
will occur when the output is shorted to ground. For the  
FPF2213, the power dissipation will be scaled by the Auto-  
160  
175  
8.5  
129  
145  
11.1  
15.0  
Restart Time, t  
, and the Over Current Blanking Time,  
100  
118  
RSTRT  
t
. Therefore, the maximum power dissipated is:  
BLANK  
Table 1: R  
Selection Guide  
SET  
t
BLANK  
P
=
* V  
* I  
IN (Max) LIM (Max)  
(Max)  
t
+ t  
RSTRT  
BLANK  
30  
=
* 5.5 * 0.276 = 94mW  
30 + 450  
10  
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Take note that this is below the maximum package power  
dissipation, and the thermal shutdown feature will act as  
additional safety to protect the part from damage due to  
excessive heating. The junction temperature is only able to  
increase to the thermal shutdown threshold. Once this  
temperature has been reached, toggling ON will not turn-on the  
switch until the junction temperature drops. For the FPF2215, a  
short on the output will cause the part to operate in a constant  
current state dissipating a worst case power of:  
The following techniques have been identified to improve the  
thermal performance of this family of devices. These  
techniques are listed in order of the significance of their impact.  
1. Thermal performance of the load switch can be improved by  
connecting pin7 of the DAP (Die Attach Pad) to the GND plane  
of the PCB.  
2. Embedding two exposed through-hole vias into the DAP  
(pin7) provides a path for heat to transfer to the back GND  
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with  
1-ounce copper plating is recommended to result in appropriate  
solder reflow. A smaller size hole prevents the solder from  
penetrating into the via, resulting in device lift-up. Similarly, a  
larger via-hole consumes excessive solder, and may result in  
voiding of the DAP.  
P
= V  
* I  
= 5.5 * 0.276 = 1.5W  
LIM (MAX)  
(Max)  
IN (MAX)  
This large amount of power will activate the thermal shutdown  
and the part will cycle in and out of thermal shutdown so long as  
the ON pin is active and the short is present.  
PCB Layout Recommendations  
In order to benefit from adjustable, high-precision load switch  
devices, a high-precision R  
value must be used to set a tight  
SET  
current limit tolerance. Since I  
(current limit value) is  
LIMIT  
determined by the voltage drop across the R , a poor PCB  
SET  
layout can introduce parasitic noise on the I  
pin resulting in a  
stability, parasitic  
SET  
. To improve the I  
LIMIT  
minor variation of I  
LIMIT  
noise coupling mechanisms from  
I
to GND must be  
SET  
minimized. This becomes more critical when I  
is set close  
LIMIT  
to the nominal load current operation where parasitic effects  
could cause the device to go in and out of current limit and  
result in an error flag report.  
Care must be taken to provide a direct current return path  
Figure 23: Two through hole open vias embedded in DAP  
between the R  
ground pad and the device ground pad  
SET  
(pin5). Please see current pad #2 in figure below.  
1)Power current path  
2)RSET current path  
Figure 22: Eliminate parasitic noise of ISET-GND by providing a  
separate ground route, unique from the power ground plane  
o
Figure 24: X-Ray result (bottom view with 45 angle)  
3. The V , V  
and GND pins will dissipate most of the heat  
OUT  
IN  
Improving Thermal Performance  
generated during a high load current condition. Using wide  
traces will help minimize parasitic electrical effects along with  
minimizing the case to ambient thermal impedance. The layout  
suggested in Figure 25 provides each pin with adequate copper  
so that heat may be transferred as efficiently as possible out of  
the device. The low-power FLAGB and ON pin traces may be  
laid-out diagonally from the device to maximize the area  
available to the ground pad. Placing the input and output  
capacitors as close to the device as possible also contributes to  
heat dissipation, particularly during high load currents.  
An improper layout could result in higher junction temperature  
and triggering the thermal shutdown protection feature. This  
concern applies when the switch is set at higher current limit  
value and an over-current condition occurs. In this case, the  
power dissipation of the switch, from the formula below, could  
exceed the maximum absolute power dissipation of 1.2W.  
PD = (V - V  
) x I  
LIM (Max)  
IN  
OUT  
11  
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
Figure 28: Zoom in to Top layer  
Figure 25: Proper layout of output and ground copper area  
FPF22XX Demo Board  
FPF22XX Demo board has components and circuitry to  
demonstrate FPF2213/4/5 load switches functions and features.  
R4 resistor with 0value is used for measuring the output  
current. Load current can be scoped by removing the R4  
resistor and soldering a current loop to the R4 footprint. Thermal  
performance of the board is improved using a few techniques  
recommended in the layout recommendations section of  
datasheet.  
Figure 26: Top, SST, and AST Layers  
Figure 27: Bottom and ASB Layers  
12  
www.fairchildsemi.com  
FPF2213-FPF2215 Rev. C  
0.05 C  
2.0  
A
1.72  
1.68  
2X  
B
4
6
0.15  
1.21  
2.0  
0.90  
2.25  
0.52(6X)  
0.05 C  
1
3
PIN#1 IDENT  
TOP VIEW  
2X  
0.42(6X)  
0.65  
RECOMMENDED  
LAND PATTERN  
ꢂꢁꢈꢃ“ꢂꢁꢂꢃ  
0.10 C  
ꢂꢁꢀꢂ“ꢂꢁꢂꢃ  
NOTES:  
0.08 C  
SIDE VIEW  
C
ꢂꢁꢂꢀꢃ“ꢂꢁꢂꢀꢃ  
A. PACKAGE DOES NOT FULLY CONFORM  
TO JEDEC MO-229 REGISTRATION  
SEATING  
PLANE  
B. DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS AND TOLERANCES PER  
ASME Y14.5M, 2009.  
ꢀꢁꢂꢂ“ꢂꢁꢂꢃ  
ꢄꢁꢅꢂ“ꢂꢁꢂꢃ  
D. LAND PATTERN RECOMMENDATION IS  
EXISTING INDUSTRY LAND PATTERN.  
(0.70)  
PIN #1 IDENT  
(0.20)4X  
E. DRAWING FILENAME: MKT-MLP06Krev5.  
1
6
3
(0.40)  
ꢂꢁꢇꢀ“ꢂꢁꢂꢃ  
(6X)  
ꢂꢁꢆꢂ“ꢂꢁꢂꢃ  
(0.60)  
4
(6X)  
C A B  
ꢂꢁꢇꢂ“ꢂꢁꢂꢃ  
0.10  
0.65  
1.30  
0.05  
C
BOTTOM VIEW  
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