FPF3042UCX [ONSEMI]
18 V-Rated, Dual-Input, Single-Output, Power-Source-Selector Switch;型号: | FPF3042UCX |
厂家: | ONSEMI |
描述: | 18 V-Rated, Dual-Input, Single-Output, Power-Source-Selector Switch |
文件: | 总16页 (文件大小:998K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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April 2017
FPF3042
IntelliMAX™ 18 V-Rated, Dual-Input, Single-Output,
Power-Source-Selector Switch
Features
Description
The FPF3042 is an 18 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from 4.0 V
to 12.4 V at both VBUS and VIN to align with the needs of
high-voltage portable device power rails.
.
.
Dual-Input, Single-Output Load Switch (DISO)
Input Supply Operating Range:
• 4.0 V~12.4 V at VIN
• 4.0 V~12.4 V at VBUS
.
Typical RON:
•
•
95 mΩ at VIN=5 V
70 mΩ at VBUS=5 V
Both VIN and VBUS have the over-voltage protection of
14 V (typical) to avoid damage to the system.
.
.
Bidirectional Switch for VIN and VBUS
Slew Rate Controlled:
VIN and VBUS bidirectional switching allows reverse
current from VOUT to VIN or VBUS for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
VIN_SEL is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
•
•
50 µs at VIN for < 4.7 µF COUT
90 µs at VBUS for < 4.7 µF COUT
.
.
.
.
.
.
Maximum ISW: 2.7 A per Channel
Break-Before-Make Transition
Under-Voltage Lockout (UVLO)
Over-Voltage Lockout (OVLO)
Thermal Shutdown
FPF3042 is available in 1.76 mm x 1.96 mm Wafer-
Level Chip-Scale Package (WLCSP), 16-bump, 0.4 mm
pitch.
Applications
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
.
.
Input Power-Selection Block Supporting USB and
Wireless Charging
.
ESD Protected:
Smart Phone / Tablet PC
• Human Body Model: >3 kV
• Charged Device Model: >1.5 kV
• IEC 61000-4-2 Air Discharge: >15 kV
• IEC61000-4-2 Contact Discharge: >8 kV
Ordering Information
Top
Mark
Typical RON per
Channel at 5 VIN
Part Number
Channel
Rise Time (tR)
Package
95 mΩ for VIN
50 µs for VIN
16-Bump, 1.76 mm x 1.96 mm,
Wafer-Level Chip-Scale Package
(WLCSP), 0.4 mm Pitch
FPF3042UCX
TR
DISO
70 mΩ for VBUS
90 µs for VBUS
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
Application Diagram
V
VOUT
VOUT
VOUT
VOUT
IN
V
IN
CIN1
COUT
V
IN
VBUS
VBUS
CIN2
V_I/O
VBUS
FPF3042
EN
V
ON
DF_IN
OFF
Other_V
IN_SEL
IN_AVA
GND GND
Figure 1. Typical Application
EN
VOUT
FPF3042
Charger
R1
20 kΩ
5V charging voltage at VOUT creates 3V at EN when
Q1 gate is LOW (OFF)
Note:
Q1 gate should be HIGH (ON) when not in OTG mode.
R2
30 kΩ
Q1
1.8V GPIO
Figure 2. Example Circuit for OTG Operation with Low-Voltage GPIO
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
2
Block Diagram
FPP3042
VOUT
VIN
VIN
VIN
HV Power Device
SW1
VOUT
C1
OVP
VOUT
HV Power Device
SW2
VBUS
VBUS
VBUS
VOUT
C2
VMAX
VCC
VCC
C1
C2
VGATE
VREF
Startup
EN
Reference Voltage
Reference Current
Thermal Protection
Other_VIN_AVA
Gate Driver
&
Logic Control
TSD
VIN_SEL
DF_IN
GND
GND
Figure 3. Functional Block Diagram
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
3
Pin Configuration
Figure 4. Pin Assignment (Top View)
Figure 5. Pin Assignment (Bottom View)
Description
Pin Description
Pin #
Name
Input / Output
VBUS at USB: Power input / output; bi-directional switch when
VIN_SEL = LOW.
A1, B1, C1
VBUS
Input / Output
VIN Supply Input: Power input / output; bi-directional switch
when VIN_SEL = HIGH.
A4, B4, C4
VIN
Input / Output
Input / Output
Switch Output: Power input / output
Enable: Active HIGH;
A2, A3, B3, C3
VOUT
EN voltage ≥ 2.5 V can power internal circuit when VIN and VBUS
are absent.
C2
D4
EN
Input
1 MΩ pull-down resistor is included.
Supply Selector & Status: Input power source selection input
and status output. This signal is ignored during EN=LOW.
Selector input during EN=HIGH:
VIN_SEL
Input / Output
HIGH = switch VIN to VOUT / LOW = switch VBUS to VOUT
.
Status output during EN=LOW:
HIGH = VIN is used for VOUT / LOW = VBUS is used for VOUT
.
Default Supply Selector during EN=LOW:
Floating = VBUS connects to VOUT
LOW = VIN connects to VOUT
.
D3
DF_IN
Input
.
This signal is ignored during EN=HIGH. 1 µA pull-up current
source is included.
Other Supply Input Status: Open-drain output.
HIGH-Z = both VIN and VBUS are valid.
B2
Other_VIN_AVA
GND
Output
LOW = the other power source is not valid.
Ground
D1, D2
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
4
Table 1.
Truth Table
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN
Other_VIN_AVA
VOUT
Comment
HI-Z if VIN & VBUS >VUVLO
LOW if VIN or VBUS <VUVLO
HIGH
X
X
LOW
X
VBUS
VOUT is selected by
VIN_SEL
HI-Z if VIN & VBUS >VUVLO
LOW if VIN or VBUS <VUVLO
Bidirectional channel
HIGH
LOW
LOW
LOW
LOW
X
X
HIGH
HIGH
LOW
X
X
X
VIN
VIN
YES
NO
NO
LOW
LOW
Automatic selection to
valid input
YES
YES
YES
NO
VBUS
VBUS
VIN
VIN_SEL is output.
YES
YES
NO
LOW Floating
HIGH-Z
HIGH-Z
Floating
VOUT is selected by
DF_IN
HIGH
NO
LOW
X
VIN_SEL is output.
OFF
LOW
Floating
Notes:
1. Internal pull-down at EN.
2. 1 µA pull-up current source at DF_IN.
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
5
Absolute Maximum Ratings
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameters
Continuous
Pulsed, 100 ms Maximum Non-Repetitive
Min. Max.
Unit
-1.4
18.0
-2.0
VIN, VBUS to GND
VOUT to GND(3)
VPIN
V
-0.3
-0.3
16.0
6.0
EN, DF_IN, VIN_SEL, Other_VIN_AVA to GND
TA=25°C
TA=65°C
TA=75°C
TA=85°C
2.70
2.70
2.50
2.25
2.25
+150
+150
55(4)
ISW
Maximum Continuous Switch Current per Channel
A
tPD
TJ
Total Power Dissipation at TA=25°C
Operating Junction Temperature
Storage Junction Temperature
W
°C
-40
-65
TSTG
ϴJA
°C
Thermal Resistance, Junction-to-Ambient (1in. Square Pad of 2 oz. Copper)
Human Body Model, ANSI/ESDA/JEDEC JS-001-2012
Charged Device Model, JESD22-C101
°C/W
3.0
1.5
Electrostatic
Discharge Capability
Air Discharge
(VIN, VBUS to GND)
ESD
kV
15.0
8.0
IEC61000-4-2 System Level(5)
Contact Discharge
(VIN, VBUS to GND)
Notes:
3. If an external voltage of more than 13 V is applied to VOUT, the slew rate should be <1 V/ms from 13 V.
4. Measured using 2S2P JEDEC standard PCB.
5. System-level ESD can be guaranteed by design.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor
does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameters
Min. Max. Unit
VIN
4.0
4.0
-40
12.4
12.4
+85
VPIN
TA
V
VBUS
Ambient Operating Temperature
°C
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
6
Electrical Characteristics
VIN=4 to 12.4 V, VBUS=4 to 12.4 V, TA=-40 to 85°C unless otherwise noted. Typical values are at VIN=VBUS=5 V,
EN=HIGH and TA=25°C unless otherwise noted.
Symbol
VIN
Parameters
Input Voltage from VIN
Input Voltage from VBUS
Condition
Min. Typ. Max. Unit
4.0
4.0
12.4
12.4
120
70
V
V
VBUS
IOUT=0 mA, EN=HIGH, VIN or VBUS=5 V
IOUT=0 mA, EN=5 V, VIN and VBUS=GND
VIN=12 V, IOUT=200 mA, TA=25°C
VIN=8 V, IOUT=200 mA, TA=25°C
VIN=5 V, IOUT=200 mA, TA=25°C
55
33
95
95
95
μA
μA
IQ
Quiescent Current
On Resistance for VIN
mΩ
mΩ
150
200
VIN=5 V, IOUT=200 mA,
TA=25°C to 85°C(6)
RON
VBUS=12 V, IOUT=200 mA, TA=25°C
VBUS=6 V, IOUT=200 mA, TA=25°C
VBUS=5 V, IOUT=200 mA, TA=25°C
70
70
70
On Resistance for VBUS
100
140
VBUS=5 V, IOUT=200 mA,
TA=25°C to 85°C(6)
VIH
VIL
Input Logic High Voltage
Input Logic Low Voltage
VIN, VBUS = 4.0 V~12.4 V
1.15
2.5
V
V
VIN, VBUS =4.0 V~12.4 V
0.52
VEN(OTG) EN Voltage in OTG Mode(6)
REN_PD Pull-Down Resistance at EN
Protection
VIN & VBUS=Float or VIN & VBUS <VUVLO
V
1000
kΩ
VIN or VBUS Rising
VIN or VBUS Falling
3.05 3.50 4.00
V
V
VUVLO Under-Voltage Lockout Threshold
VUVHYS Under-Voltage Lockout Hysteresis
2.55 3.00 3.55
0.5
V
VIN Rising Threshold
VIN Falling Threshold
VBUS Rising Threshold
VBUS Falling Threshold
VIN
12.9 14.0 15.0
V
12.4 13.5 14.5
V
VOVLO Over-Voltage Lockout Threshold
VOVHYS Over-Voltage Lockout Hysteresis
12.9 14.0 15.0
V
12.4 13.5 14.5
V
0.5
0.5
150
20
V
VBUS
V
TSDN
Thermal Shutdown Threshold
°C
°C
TSDNHYS Thermal Shutdown Hysteresis
Reverse Current Blocking (RCB)
IRCB
VIN or VBUS Current During RCB
VOUT=8 V, VIN or VBUS=GND
30
μA
Dynamic Characteristics
VOUT Rise Time, VBUS(6,7)
90
50
tR
μs
VOUT Rise Time, VIN(6,7)
VOUT Fall Time(6,7)
VIN=VBUS=5 V, RL=150 Ω, CL=4.7 μF,
TA=25°C
tF
tTRAN
tSD
1.4
ms
ms
μs
Transition Delay(6,7)
Selection Delay(6,7)
50
100
50
Notes:
6. This parameter is guaranteed by characterization and/or design; not production tested.
7. tSD/tTRAN/tR/tF are defined in Figure 6.
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
7
Timing Diagram
Figure 6. Transition Delay (VIN=VBUS=5 V)
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
8
Typical Characteristics
Figure 7. VIN Quiescent Current (Iq) vs. Temperature Figure 8. VBUS Quiescent Current (Iq) vs. Temperature
Figure 9. VIN Quiescent Current vs. Supply Voltage Figure 10.VBUS Quiescent Current vs. Supply Voltage
Figure 11.VIN On Resistance (mΩ) vs. Temperature
Figure 12.VBUS On Resistance (mΩ) vs. Temperature
Figure 13.VIN On Resistance (mΩ) vs. Supply Voltage Figure 14.VBUS On Resistance (mΩ) vs. Supply Voltage
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
9
Typical Characteristics (Continued)
Figure 15.VIN_SEL Input Logic HIGH & Low Voltage
vs. Temperature
Figure 16.EN Input Logic HIGH & Low Voltage
vs. Temperature
Figure 17.DF_IN Logic HIGH & Low Voltage
vs. Temperature
Figure 18.VIN_VULVO vs. Temperature
Figure 19.VBUS
_
VULVO vs. Temperature
Figure 20.VIN_VOVLO vs. Temperature
Figure 21.VBUS
_
VOVLO vs. Temperature
Figure 22.VOUT tR vs. Temperature
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
10
Typical Characteristics (Continued)
Figure 23.VOUT tF vs. Temperature
Figure 24.tTRAN vs. Temperature
Figure 25.Power Source Transition (VIN=VBUS=5 V,
EN=HIGH, VIN_SEL=LOWHIGHLOW,
COUT=4.7 µF, RL=150 Ω)
Figure 26.VIN On Response (VIN=GND5 V,
VBUS=EN=GND, COUT=4.7 µF, RL=150 Ω)
Figure 27.VBUS On Response (VBUS=GND5 V,
VIN=EN=GND, COUT=4.7 µF, RL=150 Ω)
Figure 28.Off Response (VIN=VBUS=5 V, EN=HIGH,
VIN_SEL=LOHIGH or HIGHLOW, COUT=4.7 µF,
RL=150 Ω)
Figure 29.VIN Over-Voltage Protection Response
(VIN=5 V15 V, VBUS=5 V, EN=VIN_SEL=HIGH,
COUT=4.7 µF, RL=150 Ω)
Figure 30.VBUS Over-Voltage Protection Response
(VBUS=5 V15 V, VIN=5 V, EN=HIGH,
VIN_SEL=LOW, COUT=4.7 µF, RL=150 Ω)
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
11
Operation and Application Information
The FPF3042 is an 18 V, 2.7 A-rated, Dual-Input Single-
Output (DISO) N-channel MOSFET load switch with
slew-rate-controlled and low on resistance. The input
operating range is from 4 V to 12.4 V at VBUS and at VIN.
The internal circuitry is powered from the highest
voltage source among VIN, VBUS, and EN.
is highest voltage among VIN, VBUS, and EN if none of
them is higher than 5.3 V.
EN Voltage for Control Logic Power Supply
Internal control logic is powered from the highest
voltage among VIN, VBUS, and VEN. If valid VIN or VBUS
higher than UVLO is applied, ON/OFF control by EN
should be accomplished with VIH/VIL. If EN powers the
internal control block without valid VIN and VBUS, more
than 2.5 V is required on the EN pin to operate properly.
Input Power-Source Selection
The input power source can be selected by VIN_SEL and
DF_IN, respectively, depending on the EN state. When
EN is HIGH, the input source is selected by VIN_SEL
regardless of DF_IN. If VIN_SEL is LOW, VBUS is selected.
If VIN_SEL is HIGH, VIN is selected.
Over-Voltage Protection (OVP)
The FPF3042 includes over-voltage protection at both VIN
and VBUS. If VIN or VBUS is higher than 14 V (typical), the
power switch is off until input voltage is lower than the
over-voltage trip level by a hysteresis voltage of 0.5 V.
Table 2. Input Power Selection by VIN_SEL
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN VOUT
Reverse Power Supply for OTG
HIGH
HIGH
X
X
X
X
LOW
X
X
VBUS
VIN
HIGH
The bidirectional switch allows reverse power for On-The-
Go (OTG) operation. Even if both VIN and VBUS are
unavailable, reverse power can be supported if internal
control circuitry is powered by EN.
When EN is LOW, the input source is selected by
DF_IN and the number of valid input sources. If only
one input source is valid (greater than VUVLO(MAX)), the
source is selected automatically, regardless of DF_IN,
to make charging path in case the battery is depleted. If
both VBUS and VIN have valid input sources, the input
source is selected by DF_IN. If DF_IN is LOW, VIN is
selected. If DF_IN is HIGH or floating, VBUS is selected.
DF_IN is biased HIGH with an internal 1 µA pull-up
current source.
Reverse-Current Blocking (RCB)
FPF3042 supports reverse-current blocking during EN
LOW and an unselected channel.
Thermal Shutdown
During thermal shutdown, the power switch is turned off
if junction temperature exceeds 150°C to avoid damage.
Table 3. Input Power Selection by DF_IN
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN VOUT
Wireless Charging System
FPF3042 can be used as an input power selector
supporting Travel Adaptor (TA) and Wireless Charging
(WC) with a single-input-based battery charger or Power
Management IC (PMIC), including a charging block as
shown in Figure 31. The system can recognize an input
power source change between 5 V TA and 5 V WC
without detection circuitry because FPF3042 has a
100 ms transition delay. OTG Mode can be supported
without an additional power path, such as a MOSFET.
LOW
LOW
LOW
LOW
LOW
YES
NO
NO
YES
YES
YES
NO
HIGH
LOW
X
X
VIN
VBUS
YES
YES
NO
LOW Floating VBUS
HIGH LOW
VIN
X
X
Floating
VIN_SEL can be the status output to indicate which input
power source is used during EN is LOW. If VIN is used,
VIN_SEL shows HIGH. If VBUS is used, VIN_SEL shows
LOW. The voltage level of HIGH signal is 5.3 V if any
one of VIN, VBUS, or EN is higher than 5.3 V. The signal
FPF3042
VBUS
PMIC
with
Travel Adaptor
System
VOUT
BAT Charger &
OTG Boost &
VIN
Wireless Charging
Power Path
Li-Pol
BAT
VIN_SEL, Other_VIN_Ava
EN, VIN_SEL, DF_IN
Figure 31.Input Power Selector for Wireless Charging System
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
12
Product Specific Package Information
D
E
X
Y
1.96 mm 0.03 mm
1.76 mm 0.03 mm
0.28 mm
0.38 mm
© 2013 Semiconductor Components Industries, LLC.
FPF3042 • Rev. 1.0.1
www.fairchildsemi.com
www.onsemi.com
13
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
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