FPF3042UCX [ONSEMI]

18 V-Rated, Dual-Input, Single-Output, Power-Source-Selector Switch;
FPF3042UCX
型号: FPF3042UCX
厂家: ONSEMI    ONSEMI
描述:

18 V-Rated, Dual-Input, Single-Output, Power-Source-Selector Switch

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April 2017  
FPF3042  
IntelliMAX18 V-Rated, Dual-Input, Single-Output,  
Power-Source-Selector Switch  
Features  
Description  
The FPF3042 is an 18 V-rated Dual-Input Single-Output  
(DISO) load switch consisting of two channels of slew-  
rate-controlled, low-on-resistance, N-channel MOSFET  
switches with protection features. The slew-rate-  
controlled turn-on characteristic prevents inrush current  
and the resulting excessive voltage droop on the input  
power rails. The input voltage range operates from 4.0 V  
to 12.4 V at both VBUS and VIN to align with the needs of  
high-voltage portable device power rails.  
.
.
Dual-Input, Single-Output Load Switch (DISO)  
Input Supply Operating Range:  
4.0 V~12.4 V at VIN  
4.0 V~12.4 V at VBUS  
.
Typical RON:  
95 mΩ at VIN=5 V  
70 mΩ at VBUS=5 V  
Both VIN and VBUS have the over-voltage protection of  
14 V (typical) to avoid damage to the system.  
.
.
Bidirectional Switch for VIN and VBUS  
Slew Rate Controlled:  
VIN and VBUS bidirectional switching allows reverse  
current from VOUT to VIN or VBUS for On-The-Go, (OTG)  
Mode. The switching is controlled by logic input EN and  
VIN_SEL is capable of interfacing directly with low-voltage  
control signal General-Purpose Input / Output (GPIO).  
50 µs at VIN for < 4.7 µF COUT  
90 µs at VBUS for < 4.7 µF COUT  
.
.
.
.
.
.
Maximum ISW: 2.7 A per Channel  
Break-Before-Make Transition  
Under-Voltage Lockout (UVLO)  
Over-Voltage Lockout (OVLO)  
Thermal Shutdown  
FPF3042 is available in 1.76 mm x 1.96 mm Wafer-  
Level Chip-Scale Package (WLCSP), 16-bump, 0.4 mm  
pitch.  
Applications  
Logic CMOS IO Meets JESD76 Standard for GPIO  
Interface and Related Power Supply Requirements  
.
.
Input Power-Selection Block Supporting USB and  
Wireless Charging  
.
ESD Protected:  
Smart Phone / Tablet PC  
Human Body Model: >3 kV  
Charged Device Model: >1.5 kV  
IEC 61000-4-2 Air Discharge: >15 kV  
IEC61000-4-2 Contact Discharge: >8 kV  
Ordering Information  
Top  
Mark  
Typical RON per  
Channel at 5 VIN  
Part Number  
Channel  
Rise Time (tR)  
Package  
95 for VIN  
50 µs for VIN  
16-Bump, 1.76 mm x 1.96 mm,  
Wafer-Level Chip-Scale Package  
(WLCSP), 0.4 mm Pitch  
FPF3042UCX  
TR  
DISO  
70 for VBUS  
90 µs for VBUS  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 • Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
Application Diagram  
V
VOUT  
VOUT  
VOUT  
VOUT  
IN  
V
IN  
CIN1  
COUT  
V
IN  
VBUS  
VBUS  
CIN2  
V_I/O  
VBUS  
FPF3042  
EN  
V
ON  
DF_IN  
OFF  
Other_V  
IN_SEL  
IN_AVA  
GND GND  
Figure 1. Typical Application  
EN  
VOUT  
FPF3042  
Charger  
R1  
20 kΩ  
5V charging voltage at VOUT creates 3V at EN when  
Q1 gate is LOW (OFF)  
Note:  
Q1 gate should be HIGH (ON) when not in OTG mode.  
R2  
30 kΩ  
Q1  
1.8V GPIO  
Figure 2. Example Circuit for OTG Operation with Low-Voltage GPIO  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
2
Block Diagram  
FPP3042  
VOUT  
VIN  
VIN  
VIN  
HV Power Device  
SW1  
VOUT  
C1  
OVP  
VOUT  
HV Power Device  
SW2  
VBUS  
VBUS  
VBUS  
VOUT  
C2  
VMAX  
VCC  
VCC  
C1  
C2  
VGATE  
VREF  
Startup  
EN  
Reference Voltage  
Reference Current  
Thermal Protection  
Other_VIN_AVA  
Gate Driver  
&
Logic Control  
TSD  
VIN_SEL  
DF_IN  
GND  
GND  
Figure 3. Functional Block Diagram  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
3
Pin Configuration  
Figure 4. Pin Assignment (Top View)  
Figure 5. Pin Assignment (Bottom View)  
Description  
Pin Description  
Pin #  
Name  
Input / Output  
VBUS at USB: Power input / output; bi-directional switch when  
VIN_SEL = LOW.  
A1, B1, C1  
VBUS  
Input / Output  
VIN Supply Input: Power input / output; bi-directional switch  
when VIN_SEL = HIGH.  
A4, B4, C4  
VIN  
Input / Output  
Input / Output  
Switch Output: Power input / output  
Enable: Active HIGH;  
A2, A3, B3, C3  
VOUT  
EN voltage ≥ 2.5 V can power internal circuit when VIN and VBUS  
are absent.  
C2  
D4  
EN  
Input  
1 MΩ pull-down resistor is included.  
Supply Selector & Status: Input power source selection input  
and status output. This signal is ignored during EN=LOW.  
Selector input during EN=HIGH:  
VIN_SEL  
Input / Output  
HIGH = switch VIN to VOUT / LOW = switch VBUS to VOUT  
.
Status output during EN=LOW:  
HIGH = VIN is used for VOUT / LOW = VBUS is used for VOUT  
.
Default Supply Selector during EN=LOW:  
Floating = VBUS connects to VOUT  
LOW = VIN connects to VOUT  
.
D3  
DF_IN  
Input  
.
This signal is ignored during EN=HIGH. 1 µA pull-up current  
source is included.  
Other Supply Input Status: Open-drain output.  
HIGH-Z = both VIN and VBUS are valid.  
B2  
Other_VIN_AVA  
GND  
Output  
LOW = the other power source is not valid.  
Ground  
D1, D2  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
4
Table 1.  
Truth Table  
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN  
Other_VIN_AVA  
VOUT  
Comment  
HI-Z if VIN & VBUS >VUVLO  
LOW if VIN or VBUS <VUVLO  
HIGH  
X
X
LOW  
X
VBUS  
VOUT is selected by  
VIN_SEL  
HI-Z if VIN & VBUS >VUVLO  
LOW if VIN or VBUS <VUVLO  
Bidirectional channel  
HIGH  
LOW  
LOW  
LOW  
LOW  
X
X
HIGH  
HIGH  
LOW  
X
X
X
VIN  
VIN  
YES  
NO  
NO  
LOW  
LOW  
Automatic selection to  
valid input  
YES  
YES  
YES  
NO  
VBUS  
VBUS  
VIN  
VIN_SEL is output.  
YES  
YES  
NO  
LOW Floating  
HIGH-Z  
HIGH-Z  
Floating  
VOUT is selected by  
DF_IN  
HIGH  
NO  
LOW  
X
VIN_SEL is output.  
OFF  
LOW  
Floating  
Notes:  
1. Internal pull-down at EN.  
2. 1 µA pull-up current source at DF_IN.  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
5
Absolute Maximum Ratings  
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
Parameters  
Continuous  
Pulsed, 100 ms Maximum Non-Repetitive  
Min. Max.  
Unit  
-1.4  
18.0  
-2.0  
VIN, VBUS to GND  
VOUT to GND(3)  
VPIN  
V
-0.3  
-0.3  
16.0  
6.0  
EN, DF_IN, VIN_SEL, Other_VIN_AVA to GND  
TA=25°C  
TA=65°C  
TA=75°C  
TA=85°C  
2.70  
2.70  
2.50  
2.25  
2.25  
+150  
+150  
55(4)  
ISW  
Maximum Continuous Switch Current per Channel  
A
tPD  
TJ  
Total Power Dissipation at TA=25°C  
Operating Junction Temperature  
Storage Junction Temperature  
W
°C  
-40  
-65  
TSTG  
ϴJA  
°C  
Thermal Resistance, Junction-to-Ambient (1in. Square Pad of 2 oz. Copper)  
Human Body Model, ANSI/ESDA/JEDEC JS-001-2012  
Charged Device Model, JESD22-C101  
°C/W  
3.0  
1.5  
Electrostatic  
Discharge Capability  
Air Discharge  
(VIN, VBUS to GND)  
ESD  
kV  
15.0  
8.0  
IEC61000-4-2 System Level(5)  
Contact Discharge  
(VIN, VBUS to GND)  
Notes:  
3. If an external voltage of more than 13 V is applied to VOUT, the slew rate should be <1 V/ms from 13 V.  
4. Measured using 2S2P JEDEC standard PCB.  
5. System-level ESD can be guaranteed by design.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor  
does not recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
Parameters  
Min. Max. Unit  
VIN  
4.0  
4.0  
-40  
12.4  
12.4  
+85  
VPIN  
TA  
V
VBUS  
Ambient Operating Temperature  
°C  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
6
 
 
 
Electrical Characteristics  
VIN=4 to 12.4 V, VBUS=4 to 12.4 V, TA=-40 to 85°C unless otherwise noted. Typical values are at VIN=VBUS=5 V,  
EN=HIGH and TA=25°C unless otherwise noted.  
Symbol  
VIN  
Parameters  
Input Voltage from VIN  
Input Voltage from VBUS  
Condition  
Min. Typ. Max. Unit  
4.0  
4.0  
12.4  
12.4  
120  
70  
V
V
VBUS  
IOUT=0 mA, EN=HIGH, VIN or VBUS=5 V  
IOUT=0 mA, EN=5 V, VIN and VBUS=GND  
VIN=12 V, IOUT=200 mA, TA=25°C  
VIN=8 V, IOUT=200 mA, TA=25°C  
VIN=5 V, IOUT=200 mA, TA=25°C  
55  
33  
95  
95  
95  
μA  
μA  
IQ  
Quiescent Current  
On Resistance for VIN  
mΩ  
mΩ  
150  
200  
VIN=5 V, IOUT=200 mA,  
TA=25°C to 85°C(6)  
RON  
VBUS=12 V, IOUT=200 mA, TA=25°C  
VBUS=6 V, IOUT=200 mA, TA=25°C  
VBUS=5 V, IOUT=200 mA, TA=25°C  
70  
70  
70  
On Resistance for VBUS  
100  
140  
VBUS=5 V, IOUT=200 mA,  
TA=25°C to 85°C(6)  
VIH  
VIL  
Input Logic High Voltage  
Input Logic Low Voltage  
VIN, VBUS = 4.0 V~12.4 V  
1.15  
2.5  
V
V
VIN, VBUS =4.0 V~12.4 V  
0.52  
VEN(OTG) EN Voltage in OTG Mode(6)  
REN_PD Pull-Down Resistance at EN  
Protection  
VIN & VBUS=Float or VIN & VBUS <VUVLO  
V
1000  
kΩ  
VIN or VBUS Rising  
VIN or VBUS Falling  
3.05 3.50 4.00  
V
V
VUVLO Under-Voltage Lockout Threshold  
VUVHYS Under-Voltage Lockout Hysteresis  
2.55 3.00 3.55  
0.5  
V
VIN Rising Threshold  
VIN Falling Threshold  
VBUS Rising Threshold  
VBUS Falling Threshold  
VIN  
12.9 14.0 15.0  
V
12.4 13.5 14.5  
V
VOVLO Over-Voltage Lockout Threshold  
VOVHYS Over-Voltage Lockout Hysteresis  
12.9 14.0 15.0  
V
12.4 13.5 14.5  
V
0.5  
0.5  
150  
20  
V
VBUS  
V
TSDN  
Thermal Shutdown Threshold  
°C  
°C  
TSDNHYS Thermal Shutdown Hysteresis  
Reverse Current Blocking (RCB)  
IRCB  
VIN or VBUS Current During RCB  
VOUT=8 V, VIN or VBUS=GND  
30  
μA  
Dynamic Characteristics  
VOUT Rise Time, VBUS(6,7)  
90  
50  
tR  
μs  
VOUT Rise Time, VIN(6,7)  
VOUT Fall Time(6,7)  
VIN=VBUS=5 V, RL=150 Ω, CL=4.7 μF,  
TA=25°C  
tF  
tTRAN  
tSD  
1.4  
ms  
ms  
μs  
Transition Delay(6,7)  
Selection Delay(6,7)  
50  
100  
50  
Notes:  
6. This parameter is guaranteed by characterization and/or design; not production tested.  
7. tSD/tTRAN/tR/tF are defined in Figure 6.  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
7
 
 
Timing Diagram  
Figure 6. Transition Delay (VIN=VBUS=5 V)  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
8
Typical Characteristics  
Figure 7. VIN Quiescent Current (Iq) vs. Temperature Figure 8. VBUS Quiescent Current (Iq) vs. Temperature  
Figure 9. VIN Quiescent Current vs. Supply Voltage Figure 10.VBUS Quiescent Current vs. Supply Voltage  
Figure 11.VIN On Resistance (mΩ) vs. Temperature  
Figure 12.VBUS On Resistance (mΩ) vs. Temperature  
Figure 13.VIN On Resistance (mΩ) vs. Supply Voltage Figure 14.VBUS On Resistance (mΩ) vs. Supply Voltage  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
9
Typical Characteristics (Continued)  
Figure 15.VIN_SEL Input Logic HIGH & Low Voltage  
vs. Temperature  
Figure 16.EN Input Logic HIGH & Low Voltage  
vs. Temperature  
Figure 17.DF_IN Logic HIGH & Low Voltage  
vs. Temperature  
Figure 18.VIN_VULVO vs. Temperature  
Figure 19.VBUS  
_
VULVO vs. Temperature  
Figure 20.VIN_VOVLO vs. Temperature  
Figure 21.VBUS  
_
VOVLO vs. Temperature  
Figure 22.VOUT tR vs. Temperature  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
10  
Typical Characteristics (Continued)  
Figure 23.VOUT tF vs. Temperature  
Figure 24.tTRAN vs. Temperature  
Figure 25.Power Source Transition (VIN=VBUS=5 V,  
EN=HIGH, VIN_SEL=LOWHIGHLOW,  
COUT=4.7 µF, RL=150 )  
Figure 26.VIN On Response (VIN=GND5 V,  
VBUS=EN=GND, COUT=4.7 µF, RL=150 )  
Figure 27.VBUS On Response (VBUS=GND5 V,  
VIN=EN=GND, COUT=4.7 µF, RL=150 Ω)  
Figure 28.Off Response (VIN=VBUS=5 V, EN=HIGH,  
VIN_SEL=LOHIGH or HIGHLOW, COUT=4.7 µF,  
RL=150 Ω)  
Figure 29.VIN Over-Voltage Protection Response  
(VIN=5 V15 V, VBUS=5 V, EN=VIN_SEL=HIGH,  
COUT=4.7 µF, RL=150 )  
Figure 30.VBUS Over-Voltage Protection Response  
(VBUS=5 V15 V, VIN=5 V, EN=HIGH,  
VIN_SEL=LOW, COUT=4.7 µF, RL=150 )  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
11  
Operation and Application Information  
The FPF3042 is an 18 V, 2.7 A-rated, Dual-Input Single-  
Output (DISO) N-channel MOSFET load switch with  
slew-rate-controlled and low on resistance. The input  
operating range is from 4 V to 12.4 V at VBUS and at VIN.  
The internal circuitry is powered from the highest  
voltage source among VIN, VBUS, and EN.  
is highest voltage among VIN, VBUS, and EN if none of  
them is higher than 5.3 V.  
EN Voltage for Control Logic Power Supply  
Internal control logic is powered from the highest  
voltage among VIN, VBUS, and VEN. If valid VIN or VBUS  
higher than UVLO is applied, ON/OFF control by EN  
should be accomplished with VIH/VIL. If EN powers the  
internal control block without valid VIN and VBUS, more  
than 2.5 V is required on the EN pin to operate properly.  
Input Power-Source Selection  
The input power source can be selected by VIN_SEL and  
DF_IN, respectively, depending on the EN state. When  
EN is HIGH, the input source is selected by VIN_SEL  
regardless of DF_IN. If VIN_SEL is LOW, VBUS is selected.  
If VIN_SEL is HIGH, VIN is selected.  
Over-Voltage Protection (OVP)  
The FPF3042 includes over-voltage protection at both VIN  
and VBUS. If VIN or VBUS is higher than 14 V (typical), the  
power switch is off until input voltage is lower than the  
over-voltage trip level by a hysteresis voltage of 0.5 V.  
Table 2. Input Power Selection by VIN_SEL  
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN VOUT  
Reverse Power Supply for OTG  
HIGH  
HIGH  
X
X
X
X
LOW  
X
X
VBUS  
VIN  
HIGH  
The bidirectional switch allows reverse power for On-The-  
Go (OTG) operation. Even if both VIN and VBUS are  
unavailable, reverse power can be supported if internal  
control circuitry is powered by EN.  
When EN is LOW, the input source is selected by  
DF_IN and the number of valid input sources. If only  
one input source is valid (greater than VUVLO(MAX)), the  
source is selected automatically, regardless of DF_IN,  
to make charging path in case the battery is depleted. If  
both VBUS and VIN have valid input sources, the input  
source is selected by DF_IN. If DF_IN is LOW, VIN is  
selected. If DF_IN is HIGH or floating, VBUS is selected.  
DF_IN is biased HIGH with an internal 1 µA pull-up  
current source.  
Reverse-Current Blocking (RCB)  
FPF3042 supports reverse-current blocking during EN  
LOW and an unselected channel.  
Thermal Shutdown  
During thermal shutdown, the power switch is turned off  
if junction temperature exceeds 150°C to avoid damage.  
Table 3. Input Power Selection by DF_IN  
EN VIN>VUVLO VBUS>VUVLO VIN_SEL DF_IN VOUT  
Wireless Charging System  
FPF3042 can be used as an input power selector  
supporting Travel Adaptor (TA) and Wireless Charging  
(WC) with a single-input-based battery charger or Power  
Management IC (PMIC), including a charging block as  
shown in Figure 31. The system can recognize an input  
power source change between 5 V TA and 5 V WC  
without detection circuitry because FPF3042 has a  
100 ms transition delay. OTG Mode can be supported  
without an additional power path, such as a MOSFET.  
LOW  
LOW  
LOW  
LOW  
LOW  
YES  
NO  
NO  
YES  
YES  
YES  
NO  
HIGH  
LOW  
X
X
VIN  
VBUS  
YES  
YES  
NO  
LOW Floating VBUS  
HIGH LOW  
VIN  
X
X
Floating  
VIN_SEL can be the status output to indicate which input  
power source is used during EN is LOW. If VIN is used,  
VIN_SEL shows HIGH. If VBUS is used, VIN_SEL shows  
LOW. The voltage level of HIGH signal is 5.3 V if any  
one of VIN, VBUS, or EN is higher than 5.3 V. The signal  
FPF3042  
VBUS  
PMIC  
with  
Travel Adaptor  
System  
VOUT  
BAT Charger &  
OTG Boost &  
VIN  
Wireless Charging  
Power Path  
Li-Pol  
BAT  
VIN_SEL, Other_VIN_Ava  
EN, VIN_SEL, DF_IN  
Figure 31.Input Power Selector for Wireless Charging System  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
12  
 
Product Specific Package Information  
D
E
X
Y
1.96 mm 0.03 mm  
1.76 mm 0.03 mm  
0.28 mm  
0.38 mm  
© 2013 Semiconductor Components Industries, LLC.  
FPF3042 • Rev. 1.0.1  
www.fairchildsemi.com  
www.onsemi.com  
13  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
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