FQB19N20TM [ONSEMI]

功率 MOSFET,N 沟道,QFET®,200 V,19.4 A,150 mΩ,D2PAK;
FQB19N20TM
型号: FQB19N20TM
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,QFET®,200 V,19.4 A,150 mΩ,D2PAK

开关 脉冲 晶体管
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November 2013  
FQB19N20  
N-Channel QFET® MOSFET  
200 V, 19.4 A, 150 mΩ  
Description  
Features  
This N-Channel enhancement mode power MOSFET is  
produced using Fairchild Semiconductor’s proprietary planar  
stripe and DMOS technology. This advanced MOSFET  
technology has been especially tailored to reduce on-state  
resistance, and to provide superior switching performance  
and high avalanche energy strength. These devices are  
suitable for switched mode power supplies, active power  
factor correction (PFC), and electronic lamp ballasts.  
19.4 A, 200 V, RDS(on) = 150 m(Max.) @ VGS = 10 V,  
ID = 9.7 A  
Low Gate Charge (Typ. 31 nC)  
Low Crss (Typ. 30 pF)  
100% Avalanche Tested  
RoHS Compliant  
D
D
G
G
D2-PAK  
S
S
Absolute Maximum Ratings  
T = 25°C unless otherwise noted.  
C
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Maximum Lead Temperature for Soldering,  
1/8" from Case for 5 Seconds.  
ꢁꢈꢄ  
3++  
7ꢏ  
Thermal Characteristics  
Symbol  
Parameter  
Unit  
FQB19N20TM  
RJC  
RJA  
Thermal Resistance, Junction to Case, Max.  
0.89  
62.5  
40  
Thermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max.  
Thermal Resistance, Junction to Ambient (*1 in2 Pad of 2-oz Copper), Max.  
oC/W  
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
1
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package  
D2-PAK  
Packing Method Reel Size Tape Width  
Tape and Reel  
330 mm  
24 mm  
Quantity  
FQB19N20  
800 units  
FQB19N20TM  
Electrical Characteristics  
T = 25°C unless otherwise noted.  
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Notes:  
1. Repetitive rating : pulse-width limited by maximum junction temperature.  
2. L = 1.0 mH, I = 19.4 A, V = 50 V, R = 25 Ω, starting T = 25°C.  
AS  
DD  
G
J
3. I 19.4 A, di/dt 300 A/µs , V BV  
starting T = 25°C.  
DSS, J  
SD  
DD  
Essentially independent of operating temperature.  
4.  
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
2
Typical Characteristics  
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ꢌꢋꢋ  
ꢃꢄꢈ  
ꢃꢄꢈ  
ꢁꢍꢇꢉꢊꢅꢁꢎ  
ꢁꢍꢇꢉꢊꢅꢁꢎ  
ꢁꢁꢁꢏꢐꢁꢑ ꢁꢂꢁꢘꢒꢑ  
ꢁꢁꢁꢏꢐꢁꢓꢙꢒ ꢅꢁꢚꢛꢜꢅꢊꢁꢝꢊꢅꢉ  
ꢈꢇ  
ꢁꢁꢁꢓꢐꢁꢓꢙꢒ ꢅꢁꢚꢛꢜꢅꢊꢁꢝꢊꢅꢉ  
ꢁꢁꢁꢓꢐꢁꢝ ꢁꢂꢁꢓꢙ  
ꢆꢇ  
ꢃꢄ  
ꢆꢇ  
ꢃꢄ  
ꢆꢇ  
ꢃꢄ  
ꢃꢄꢈ  
ꢃꢄꢇ  
ꢃꢄ  
 ꢂꢁꢂꢈꢆꢅꢉꢗꢘꢄꢙꢌꢒꢉꢂꢕꢄꢇꢅꢆꢍꢉꢂꢂꢎꢕꢐ  
ꢀꢂ  
ꢂꢁꢂꢖꢌꢆꢓꢏꢗꢘꢄꢙꢌꢒꢉꢂꢕꢄꢇꢅꢆꢍꢉꢂꢂꢎꢕꢐ  
ꢁꢂ  
ꢀꢁꢂꢃꢄꢅꢆ'ꢈꢆꢔꢎꢕꢖꢅꢂꢁꢘꢎꢆꢉꢏꢊꢄꢊꢌꢍꢅꢄꢁꢐꢍꢁꢌꢐ  
ꢀꢁꢂꢃꢄꢅꢆ%ꢈꢆ#ꢄꢊꢎꢐ&ꢅꢄꢆꢉꢏꢊꢄꢊꢌꢍꢅꢄꢁꢐꢍꢁꢌꢐ  
ꢀꢈꢉ  
ꢀꢈꢆ  
ꢀꢈꢃ  
ꢀꢈꢂ  
ꢀꢈꢀ  
ꢃꢄꢇ  
ꢋꢌꢋꢁꢀꢊ  
ꢉꢁ  
ꢋꢌꢋꢂꢀꢊ  
ꢉꢁ  
ꢃꢄꢈ  
ꢀꢁꢂꢃꢄꢍꢀꢅ  
ꢀꢀꢀꢈꢊꢀꢎ ꢀꢇꢀꢏꢎ  
ꢉꢋ  
ꢆꢇ  
ꢀꢀꢀꢐꢊꢀꢐꢑꢏ ꢍꢀꢒꢓꢔꢍꢄꢀꢕꢄꢍꢃ  
ꢀꢁꢂꢃꢄꢀꢅꢀꢇꢀꢐꢑ  
ꢆꢇ  
ꢃꢄ  
ꢄꢈꢉ  
ꢄꢈꢅ  
ꢄꢈꢆ  
ꢄꢈꢊ  
ꢃꢈꢄ  
ꢃꢈꢉ  
ꢃꢈꢅ  
ꢃꢈꢆ  
ꢃꢈꢊ  
ꢉꢈꢄ  
ꢁꢀ  
ꢂꢀ  
ꢄꢀ  
ꢃꢀ  
ꢅꢀ  
ꢆꢀ  
ꢇꢀ  
ꢂꢁꢂꢘꢄꢙꢌꢒꢉꢗꢖꢌꢆꢓꢏꢂꢕꢄꢇꢅꢆꢍꢉꢂꢂꢎꢕꢐ  
ꢗ ꢘꢙꢘꢀꢓꢚꢑꢐꢘꢂꢛꢓꢓꢜꢐꢌꢘꢘꢝꢅꢞ  
ꢂꢁ  
ꢀꢁꢂꢃꢄꢅꢆꢓꢈꢆꢔꢎꢕꢖꢅꢐꢁꢐꢍꢊꢎꢌꢅꢆꢗꢊꢄꢁꢊꢍꢁꢘꢎꢆꢆꢙꢐꢈ  
ꢚꢄꢊꢁꢎꢆꢉꢃꢄꢄꢅꢎꢍꢆꢊꢎꢛꢆꢒꢊꢍꢅꢆꢗꢘꢜꢍꢊꢂꢅ  
ꢀꢁꢂꢃꢄꢅꢆꢝꢈꢆꢞꢘꢛ ꢆꢚꢁꢘꢛꢅꢆꢀꢘꢄ!ꢊꢄꢛꢆꢗꢘꢜꢍꢊꢂꢅꢆ  
ꢗꢊꢄꢁꢊꢍꢁꢘꢎꢆꢙꢐꢈꢆ"ꢘꢃꢄꢌꢅꢆꢉꢃꢄꢄꢅꢎꢍꢆ  
ꢊꢎꢛꢆ#ꢅ$ꢋꢅꢄꢊꢍꢃꢄꢅ  
ꢂꢃ  
ꢂꢀ  
ꢃꢁꢀꢀ  
ꢃꢀꢀꢀ  
ꢂꢁꢀꢀ  
ꢂꢀꢀꢀ  
ꢁꢀꢀ  
ꢁꢂꢁꢀ ꢁꢃꢁꢀ ꢁꢄꢀ ꢁꢂꢁꢅꢆꢇꢈꢉꢊꢋꢌ  
ꢂꢁ ꢂꢃ ꢃꢁ  
ꢀꢁꢁ  
ꢁꢂꢁꢀ ꢁꢃꢁꢀ  
ꢃꢁ ꢂꢃ  
ꢁꢂꢁꢅꢄꢀ  
ꢄꢁꢁ  
ꢀꢁ  
ꢁꢂꢁꢀ  
ꢂꢃ  
ꢅꢁꢁ  
ꢁꢂꢁꢃꢄꢄꢀ  
ꢀꢁ  
ꢁꢂꢁꢃꢆꢄꢀ  
ꢀꢁ  
ꢅꢃꢃ  
ꢄꢃꢃ  
ꢁꢍꢇꢉꢊꢅꢁꢎ  
ꢁꢁꢁꢏꢐꢁꢑ ꢁꢂꢁꢒꢁꢑ  
ꢆꢇ  
ꢁꢁꢁꢓꢐꢁꢔꢁꢂꢁꢏꢁꢕꢖꢗ  
ꢂꢃꢃ  
ꢀꢁꢂꢃꢄꢀꢅꢀꢆ ꢀꢇꢀꢈꢉꢊꢋꢀꢌ  
ꢂꢀꢀꢁ  
ꢂꢀꢂ  
ꢂꢀꢁ  
ꢂꢀ  
ꢂꢁ  
ꢃꢀ  
ꢃꢁ  
ꢄꢀ  
ꢄꢁ  
ꢁꢂꢖꢌꢆꢓꢏꢗꢘꢄꢙꢌꢒꢉꢂꢕꢄꢇꢅꢆꢍꢉꢂꢎꢕꢐ  
 ꢁꢂꢃꢄꢅꢆꢇꢂꢈꢆꢅꢉꢂꢊꢋꢆꢌꢍꢉꢂꢎꢏꢊꢐ  
ꢁꢂ  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢆꢉꢊꢋꢊꢌꢁꢍꢊꢎꢌꢅꢆꢉꢏꢊꢄꢊꢌꢍꢅꢄꢁꢐꢍꢁꢌꢐ  
ꢀꢁꢂꢃꢄꢅꢆꢑꢈꢆꢒꢊꢍꢅꢆꢉꢏꢊꢄꢂꢅꢆꢉꢏꢊꢄꢊꢌꢍꢅꢄꢁꢐꢍꢁꢌꢐ  
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
3
(Continued)  
Typical Characteristics  
ꢄꢋꢀ  
ꢃꢋꢁ  
ꢃꢋꢀ  
ꢂꢋꢁ  
ꢂꢋꢀ  
ꢀꢋꢁ  
ꢀꢋꢀ  
ꢁꢅꢄ  
ꢁꢅꢁ  
ꢁꢅꢂ  
ꢂꢅꢇ  
ꢂꢅꢆ  
ꢀꢁꢂꢃꢄꢅꢀꢆ  
ꢀꢀꢀꢇꢈꢀꢉ ꢀꢊꢀꢋꢀꢉ  
ꢁꢍꢇꢉꢊꢅꢁꢎ  
ꢀꢁ  
ꢀꢀꢀꢌꢈꢀꢍ ꢀꢊꢀꢌꢎꢋꢀꢏ  
ꢁꢁꢁꢏꢐꢁꢑ ꢁꢂꢁꢏꢒꢁꢑ  
ꢆꢇ  
ꢁꢁꢁꢓꢐꢁ1 ꢁꢂꢁ2ꢐ!ꢁ)  
ꢀꢁꢂꢂ  
ꢀꢃꢂ  
ꢃꢂ  
ꢁꢂꢂ  
ꢁꢃꢂ  
ꢄꢂꢂ  
ꢊꢂꢀꢀ  
ꢊꢁꢀ  
ꢁꢀ  
ꢂꢀꢀ  
ꢂꢁꢀ  
ꢃꢀꢀ  
 ꢁꢂ#ꢙꢏꢒꢅꢓꢄꢏꢂꢃꢉ"ꢑꢉꢌꢆꢅꢙꢌꢉꢂꢎ  
ꢀ ꢁꢂꢃꢄꢅꢆꢇꢈꢉꢅꢂꢀꢊꢋꢌꢊꢍꢎꢇꢄꢍꢊꢂꢏꢑ  
ꢀꢁꢂꢃꢄꢅꢆ-ꢈꢆꢞꢄꢅꢊ.ꢛꢘ!ꢎꢆꢗꢘꢜꢍꢊꢂꢅꢆꢗꢊꢄꢁꢊꢍꢁꢘꢎ  
ꢙꢐꢈꢆ#ꢅ$ꢋꢅꢄꢊꢍꢃꢄꢅ  
ꢀꢁꢂꢃꢄꢅꢆ/ꢈꢆꢔꢎꢕꢖꢅꢐꢁꢐꢍꢊꢎꢌꢅꢆꢗꢊꢄꢁꢊꢍꢁꢘꢎ  
ꢙꢐꢈꢆ#ꢅ$ꢋꢅꢄꢊꢍꢃꢄꢅ  
ꢃꢅ  
ꢃꢀ  
ꢂꢆ  
ꢂꢃ  
%ꢞꢊꢈ&ꢉ'ꢇ(ꢁ'(ꢁꢝꢆ'ꢅꢁ)ꢈꢊ&ꢁ  
'ꢅꢁ*'$'ꢉꢊꢋꢁ+,ꢁ-ꢁꢈꢇꢎꢄꢏꢐ  
ꢂꢀꢆ  
ꢃꢄꢄꢁµꢍ  
ꢃꢁꢖꢍ  
ꢃꢄꢁꢖꢍ  
ꢂꢀ  
ꢕꢇ  
ꢂꢀꢂ  
ꢁꢍꢇꢉꢊꢅꢁꢎ  
ꢁꢁꢁꢏꢐꢁꢝꢁꢂꢁꢓꢙꢁ  
ꢁꢁꢁꢓꢐꢁꢝꢁꢂꢁꢏꢙꢒꢁ  
ꢁꢁꢁ.ꢐꢁ/'(0ꢜꢊꢁꢚꢛꢜꢅꢊ  
ꢀꢁ  
ꢂꢀ  
ꢃꢁ  
ꢁꢀ  
ꢉꢁ  
ꢂꢀꢀ  
ꢂꢃꢁ  
ꢂꢁꢀ  
ꢂꢀ  
ꢂꢀ  
ꢂꢀ  
 ꢁꢂꢊꢆ!ꢉꢂꢃꢉ"ꢑꢉꢌꢆꢅꢙꢌꢉꢂꢎ  
ꢁꢂꢖꢌꢆꢓꢏꢗꢘꢄꢙꢌꢒꢉꢂꢕꢄꢇꢅꢆꢍꢉꢂꢎꢕꢐ  
ꢁꢂ  
ꢀꢁꢂꢃꢄꢅꢆ(ꢈꢆ)ꢊ*ꢁ$ꢃ$ꢆ"ꢊ&ꢅꢆꢔꢋꢅꢄꢊꢍꢁꢎꢂꢆ+ꢄꢅꢊ  
ꢀꢁꢂꢃꢄꢅꢆ',ꢈꢆ)ꢊ*ꢁ$ꢃ$ꢆꢚꢄꢊꢁꢎꢆꢉꢃꢄꢄꢅꢎꢍ  
ꢙꢐꢈꢆꢉꢊꢐꢅꢆ#ꢅ$ꢋꢅꢄꢊꢍꢃꢄꢅ  
ꢂ ꢀ ꢂ  
ꢕ ꢂ ꢄ ꢋ  
ꢀꢁ  ꢃꢄ  ꢀꢅ  
ꢉ  
ꢀꢀꢀꢈ ꢊꢀꢖ ꢃꢘ ꢀꢇ ꢀꢏ ꢊꢙ   ꢚꢛ ꢀꢜ     
ꢂ ꢀ ꢁ  
ꢀꢀꢀꢐ ꢊꢀ   ꢃ! ꢀ"  # ꢃꢂ $%ꢀ   ꢌ  
ꢃ  
ꢀꢀꢀ& ꢊꢀꢕ ꢊ ꢍ 'ꢀꢕ  ꢀꢒ ( ꢀꢖ ꢃꢘ  
ꢄ ꢋ  
"
ꢀꢅ  
ꢄ ꢉ  
ꢄ ꢃ  
ꢄ  
ꢏ ꢐ ꢑꢒ ꢁꢓ ꢔ ꢑꢍ ꢒ  
ꢆ  
ꢂ ꢀ ꢆ  
ꢂ ꢀ ꢃ  
ꢂ ꢀ ꢄ  
ꢂ ꢀ ꢅ  
ꢂ ꢀ ꢆ  
ꢂ ꢀ ꢁ  
ꢂ ꢀ ꢂ  
ꢂ ꢀ ꢁ  
ꢁꢂꢘ    ꢌꢉ ꢂꢝ      ꢇ!  ꢂꢖ  ꢌꢆ ꢅꢓꢄ  ꢂꢎ!     
ꢀꢁꢂꢃꢄꢅꢆ''ꢈꢆ#ꢄꢊꢎꢐꢁꢅꢎꢍꢆ#ꢏꢅꢄ$ꢊꢜꢆꢖꢅꢐꢋꢘꢎꢐꢅꢆꢉꢃꢄꢙꢅ  
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
4
VGS  
Same Type  
as DUT  
50KΩ  
Qg  
12V  
200nF  
300nF  
VDS  
VGS  
Qgs  
Qgd  
DUT  
I
= const.  
G
Charge  
Figure 12. Gate Charge Test Circuit & Waveform  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
Figure 13. Resistive Switching Test Circuit & Waveforms  
BVDSS  
--------------------  
BVDSS - VDD  
L
1
2
2
----  
EAS  
=
L IAS  
VDS  
I D  
BVDSS  
IAS  
RG  
VDD  
ID (t)  
V
VDS (t)  
VDD  
DUT  
GS  
t p  
t p  
Time  
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
www.fairchildsemi.com  
5
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
6
Mechanical Dimensions  
2
Figure 16. TO263 (D PAK), Molded, 2-Lead, Surface Mount  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-  
ically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT263-002  
7
www.fairchildsemi.com  
©2008 Fairchild Semiconductor Corporation  
FQB19N20 Rev. C1  
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intended to be an exhaustive list of all such trademarks.  
AccuPower™  
AX-CAP *  
BitSiC™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
F-PFS™  
FRFET  
Sync-Lock™  
®*  
®
®
®
tm  
®
Global Power ResourceSM  
GreenBridge™  
Green FPS™  
PowerTrench  
PowerXS™  
Programmable Active Droop™  
QFET  
QS™  
Quiet Series™  
RapidConfigure™  
®
TinyBoost  
TinyBuck  
®
®
Green FPS™ e-Series™  
Gmax™  
GTO™  
TinyCalc™  
®
TinyLogic  
TINYOPTO™  
TinyPower™  
TinyPWM™  
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TranSiC™  
TriFault Detect™  
Current Transfer Logic™  
IntelliMAX™  
®
DEUXPEED  
ISOPLANAR™  
Marking Small Speakers Sound Louder  
and Better™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
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®
EcoSPARK  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
EfficentMax™  
ESBC™  
®
TRUECURRENT *  
SerDes™  
SMART START™  
®
Solutions for Your Success™  
®
®
SPM  
Fairchild  
®
STEALTH™  
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SuperSOT™-8  
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FACT Quiet Series™  
®
®
UHC  
®
Ultra FRFET™  
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®
mWSaver  
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FACT  
FAST  
®
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®
®
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SyncFET™  
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Datasheet contains the design specifications for product development. Specifications  
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Datasheet contains preliminary data; supplementary data will be published at a later  
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Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
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