FS8J [ONSEMI]

8 A 标准恢复表面贴装整流器;


型号：	FS8J
厂家：	ONSEMI
描述：	8 A 标准恢复表面贴装整流器
文件：	总6页 (文件大小：216K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DATA SHEET

www.onsemi.com

8 A Standard Recovery

Surface Mount Rectifiers

Anode 1

Anode 2

Cathode

Rectifier

FS8G - FS8M

Description

The FS8G to FS8M series offers breakthrough size and

performance. It sinks 8 A DC forward current and provides up to

230 A surge current capability with only 0.37 mA reverse leakage

current. All this capability is packed into a small, flat−lead, TO−277

package, optimized for space−constrained applications.

TO−277−3LD

CASE 340BQ

Features

• Very High forward Surge Capability: I

= 230 A

FSM

• Low Leakage Current: 0.37 mA at T = 25°C

MARKING DIAGRAM

• Very Low Profile: Typical Height of 1.1 mm

• Glass Passivated Junction

$Y&Z&3

• HBM (JEDEC A114) > 8 KV; CDM (JEDEC C101C) > 2 KV

• Green Molding Compound as per IEC61249 Standard

• With DAP Option Only

= onsemi Logo

= Assembly Plant Code

= Date Code (Year & Week)

= Specific Device Code

FS8G, FS8J, FS8K, FS8M

• These Devices are Pb−Free, Halogen Free Free and are RoHS

Compliant

Applications

• General−Purpose Applications

• Reverse Polarity Protection

• Rectifications

ORDERING INFORMATION

See detailed ordering and shipping information on page 3 of

this data sheet.

Publication Order Number:

May, 2023 − Rev. 6

FS8M/D

FS8G − FS8M

ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)

Value

FS8G

400

FS8J

600

FS8K

800

FS8M

1000

700

Symbol

Rating

Unit

Maximum Repetitive Peak Reverse Voltage

Maximum RMS Reverse Voltage

DC Blocking Voltage

RRM

RMS

280

420

560

400

600

800

1000

Maximum Average Rectified Forward Current

F(AV)

Peak Forward Surge Current: 8.3 ms Single Half

Sine−Wave Superimposed on Rated Load

230

FSM

Operating Junction Temperature Range

Storage Temperature Range

−55 to +150

°C

STG

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Note 1)

Symbol

Characteristic

Minimum

Maximum

Unit

Land Pattern Land Pattern

Junction−to−Ambient Thermal Resistance

100

°C/W

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode

Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode

1. The thermal resistances (R

& Ψ_JL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1

and Figure 2. PCB size: 76^J.^A2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2).

Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils.

Figure 1. Minimum Land Pattern of 2 oz Copper

Figure 2. Maximum Land Pattern of 2 oz Copper

ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)

Symbol

Parameter

Forward Voltage

Conditions

Min

Typ

0.951

0.845

0.37

Max

Unit

I = 8 A

−

1.1

I = 8 A, T = 125°C

DC Reverse Current

= V

−

= V

T = 125°C

DC,

Reverse Recovery Time

Junction Capacitance

I = 0.5 A, I = 1 A, I = 0.25 A

3.37

118

= 0 V, f = 1 MHz

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

www.onsemi.com

FS8G − FS8M

ORDERING INFORMATION

Part Number

†

Top Mark

Package

Shipping

FS8G

TO−277 3L

(DAP Option)

5000 / Tape & Reel

(Pb−Free/Halogen Free)

FS8J

FS8K

FS8M

FS8J

FS8K

FS8M

TO−277 3L

(DAP Option)

(Pb−Free/Halogen Free)

TO−277 3L

(DAP Option)

(Pb−Free/Halogen Free)

TO−277 3L

(DAP Option)

(Pb−Free/Halogen Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

www.onsemi.com

FS8G − FS8M

TYPICAL PERFORMANCE CHARACTERISTICS

1000

T (Cathode, Min. Pad)

100

T (3 cm x 3 cm Pad)

T (Min. Pad)

100

125

150 175

0.1

100

V , Reverse Voltage (V)

Ambient / Lead Temperature (5C)

Figure 3. Forward Current Derating Curve

Figure 4. Typical Junction Capacitance

1000

T = 150°C

T = 75°C

100

T = 125°C

T = 75°C

T = 150°C

0.1

T = 25°C

0.01

1E−3

T = −55°C

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

100 200 300 400 500 600 700 800 900 1000

V , Reverse Voltage (V)

V , Forward Voltage (V)

Figure 5. Typical Reverse Characteristics

Figure 6. Typical Forward Characteristics

300

250

200

150

100

10000

1000

100

1000

10000

Number of Cycles

T , Square Waveform Pulse Duration (ms)

NOTE: Typical performance bases on a limited sample

size, not guarantee rating.

Figure 7. Maximum Non−Repetitive Peak

Figure 8. Typical Non−Repetitive Forward Surge

Forward Surge Current

Current

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MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

TO−277−3LD

CASE 340BQ

ISSUE O

DATE 30 SEP 2016

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DOCUMENT NUMBER:

DESCRIPTION:

98AON13861G

TO−277−3LD

PAGE 1 OF 1

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