FSL176MRTUDTU [ONSEMI]

具有异常 OCP 功能的 650 V 集成电源开关,用于 70 W 离线反激式转换器;
FSL176MRTUDTU
型号: FSL176MRTUDTU
厂家: ONSEMI    ONSEMI
描述:

具有异常 OCP 功能的 650 V 集成电源开关,用于 70 W 离线反激式转换器

开关 电源开关 转换器
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August 2012  
FSL176MRT  
Green-Mode Fairchild Power Switch (FPS™)  
Features  
Description  
The FSL176MRT is an integrated Pulse Width  
Modulation (PWM) controller and SenseFET specifically  
designed for offline Switched-Mode Power Supplies  
(SMPS) with minimal external components. The PWM  
controller includes an integrated fixed-frequency  
oscillator, Under-Voltage Lockout (UVLO), Leading-  
Edge Blanking (LEB), optimized gate driver, internal  
soft-start, temperature-compensated precise current  
sources for loop compensation, and self-protection  
circuitry. Compared with a discrete MOSFET and PWM  
controller solution, the FSL176MRT can reduce total  
cost, component count, size, and weight; while  
simultaneously increasing efficiency, productivity, and  
system reliability. This device provides a basic platform  
for cost-effective design of a flyback converter.  
. Advanced Soft Burst-Mode Operation for  
Low Standby Power and Low Audible Noise  
. Random Frequency Fluctuation for Low EMI  
. Pulse-by-Pulse Current Limit  
. Various Protection Functions: Overload Protection  
(OLP), Over-Voltage Protection (OVP), Abnormal  
Over-Current Protection (AOCP), Internal Thermal  
Shutdown (TSD) with Hysteresis, Output-Short  
Protection (OSP), and Under-Voltage Lockout (UVLO)  
with Hysteresis  
. Low Operating Current (0.4mA) in Burst Mode  
. Internal Startup Circuit  
. Internal High-Voltage SenseFET: 650V  
. Built-in Soft-Start: 15ms  
. Auto-Restart Mode  
Applications  
. Power Supply for LCD Monitor, STB, and  
DVD Combination  
Ordering Information  
Output Power Table(2)  
Operating  
Package Junction  
Temperature  
Current RDS(ON)  
Limit (Max.)  
230VAC ±15%(3)  
85~265VAC  
Replaces  
Device  
Part Number  
Open  
Adapter(4)  
Open  
Frame(5)  
Adapter(4)  
Frame(5)  
TO-220  
6-Lead(1)  
U-  
-40°C ~  
+125°C  
FSL176MRTUDTU  
3.50A 1.6  
80W  
90W  
48W  
70W FSGM0765R  
Forming  
Notes:  
1. Pb-free package per JEDEC J-STD-020B.  
2. The junction temperature can limit the maximum output power.  
3. 230VAC or 100/115VAC with voltage doubler.  
4. Typical continuous power in a non-ventilated enclosed adapter measured at 50C ambient temperature.  
5. Maximum practical continuous power in an open-frame design at 50C ambient temperature.  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
Application Circuit  
VO  
AC  
IN  
VSTR  
Drain  
GND  
VCC  
FB  
Figure 1. Typical Application Circuit  
Internal Block Diagram  
VSTR  
VCC  
Drain  
6
3
1
ICH  
VBURST  
0.30V / 0.45V  
Vref  
Soft Burst  
VCC Good  
7.5V / 12V  
Random  
OSC  
VCC  
Vref  
2.0µA  
IDELAY  
90µA  
IFB  
Soft-Start  
S
R
Q
Q
PWM  
Gate  
Driver  
FB  
4
5
3R  
R
LEB (300ns)  
N.C.  
tON<tOSP(1.0μs)  
LPF  
2
GND  
VAOCP  
VOSP  
S
R
Q
TSD  
VSD  
7.0V  
VCC Good  
Q
VCC  
VOVP  
24.5V  
Figure 2. Internal Block Diagram  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
2
Pin Configuration  
Figure 3. Pin Configuration (Top View)  
Pin Definitions  
Pin #  
Name  
Drain  
GND  
Description  
1
2
SenseFET Drain. High-voltage power SenseFET drain connection.  
Ground. This pin is the control ground and the SenseFET source.  
Power Supply. This pin is the positive supply input, which provides the internal operating  
current for both startup and steady-state operation.  
3
VCC  
Feedback. This pin is internally connected to the inverting input of the PWM comparator.  
The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor  
should be placed between this pin and GND. If the voltage of this pin reaches 7V, the overload  
protection triggers, which shuts down the FPS.  
4
5
6
FB  
NC  
No Connection  
Startup. This pin is connected directly, or through a resistor, to the high-voltage DC link.  
At startup, the internal high-voltage current source supplies internal bias and charges the  
external capacitor connected to the VCC pin. Once VCC reaches 12V, the internal current  
source (ICH) is disabled.  
VSTR  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VSTR  
VDS  
Parameter  
Min.  
Max.  
650  
650  
26  
Unit  
V
VSTR Pin Voltage  
Drain Pin Voltage  
VCC Pin Voltage  
V
VCC  
V
VFB  
Feedback Pin Voltage  
Drain Current Pulsed  
-0.3  
12.0  
12.8  
6.4  
V
IDM  
A
A
TC=25C  
IDS  
Continuous Switching Drain Current(6)  
4.0  
A
TC=100C  
EAS  
PD  
Single Pulsed Avalanche Energy(7)  
Total Power Dissipation (TC=25C)(8)  
Maximum Junction Temperature  
Operating Junction Temperature(9)  
Storage Temperature  
390  
50  
mJ  
W
C  
C  
150  
+125  
TJ  
-40  
-55  
TSTG  
ESD  
+150  
4.5  
C  
Human Body Model, JESD22-A114  
Charged Device Model, JESD22-C101  
Electrostatic  
Discharge Capability  
kV  
2.0  
Notes:  
6. Repetitive peak switching current when the inductive load is assumed: Limited by maximum duty (DMAX=0.74)  
and junction temperature (see Figure 4. ).  
7. L=45mH, starting TJ=25C.  
8. Infinite cooling condition (refer to the SEMI G30-88).  
9. Although this parameter guarantees IC operation, it does not guarantee all electrical characteristics.  
Figure 4. Repetitive Peak Switching Current  
Thermal Impedance  
TA=25°C unless otherwise specified.  
Symbol  
θJA  
Parameter  
Junction-to-Ambient Thermal Impedance(10)  
Junction-to-Case Thermal Impedance(11)  
Value  
63.5  
2.5  
Unit  
°C/W  
°C/W  
θJC  
Notes:  
10. Free standing without heat sink under natural convection condition, per JEDEC 51-2 and 1-10.  
11. Infinite cooling condition per Mil Std. 883C method 1012.1.  
© 2012 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FSL176MRT • Rev. 1.0.0  
4
Electrical Characteristics  
TJ = 25C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max.  
Unit  
SenseFET Section  
BVDSS  
IDSS  
RDS(ON)  
CISS  
COSS  
tr  
Drain-Source Breakdown Voltage  
Zero-Gate-Voltage Drain Current  
Drain-Source On-State Resistance  
Input Capacitance(12)  
Output Capacitance(12)  
Rise Time  
650  
V
VCC = 0V, ID = 250A  
250  
VDS = 520V, TA = 125C  
VGS=10V, ID =1A  
A  
1.3  
674  
93  
1.6  
VDS = 25V, VGS = 0V, f=1MHz  
VDS = 25V, VGS = 0V, f=1MHz  
VDS = 325V, ID = 4A, RG=25Ω  
VDS = 325V, ID = 4A, RG=25Ω  
VDS = 325V, ID = 4A, RG=25Ω  
VDS = 325V, ID= 4A, RG=25Ω  
pF  
pF  
ns  
ns  
ns  
30  
tf  
Fall Time  
26  
td(on)  
td(off)  
Turn-On Delay  
16  
Turn-Off Delay  
39  
ns  
Control Section  
fS  
fS  
Switching Frequency(12)  
Switching Frequency Variation(12)  
VCC = 14V, VFB = 4V  
-25C < TJ < 125C  
VCC = 14V, VFB = 4V  
VCC = 14V, VFB = 0V  
VFB=0V  
61  
61  
67  
±5  
67  
73  
±10  
73  
kHz  
%
DMAX  
DMIN  
IFB  
Maximum Duty Ratio  
%
Minimum Duty Ratio  
%
Feedback Source Current  
65  
11  
90  
12  
7.5  
15  
115  
13  
A  
V
VSTART  
VSTOP  
tS/S  
VFB = 0V, VCC Sweep  
After Turn-On, VFB = 0V  
VSTR = 40V, VCC Sweep  
UVLO Threshold Voltage  
Internal Soft-Start Time  
7.0  
8.0  
V
ms  
Burst-Mode Section  
VBURH  
0.39  
0.26  
0.45  
0.30  
150  
0.51  
0.34  
V
V
VBURL  
Burst-Mode Voltage  
VCC = 14V, VFB Sweep  
VHys  
mV  
Protection Section  
ILIM  
VSD  
Peak Drain Current Limit  
3.15  
6.45  
1.2  
3.50  
7.00  
2.0  
3.85  
7.55  
2.8  
A
V
di/dt = 300mA/s  
Shutdown Feedback Voltage  
Shutdown Delay Current  
Leading-Edge Blanking Time(12)(14)  
Over-Voltage Protection  
Threshold Time  
VCC = 14V, VFB Sweep  
VCC = 14V, VFB = 4V  
IDELAY  
tLEB  
VOVP  
tOSP  
A  
ns  
V
300  
24.5  
1.0  
VCC Sweep  
23.0  
0.7  
26.0  
1.3  
s  
V
OSP Triggered when  
Output-Short  
Threshold VFB  
Protection(12)  
VOSP  
tOSP_FB  
TSD  
THys  
t
ON<tOSP & VFB>VOSP  
1.8  
2.0  
2.2  
(Lasts Longer than tOSP_FB  
)
VFB Blanking Time  
2.0  
2.5  
3.0  
s  
C  
C  
Shutdown Temperature  
Hysteresis  
130  
140  
60  
150  
Thermal Shutdown Temperature(12)  
Continued on the following page…  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
5
Electrical Characteristics (Continued)  
TJ = 25C unless otherwise specified.  
Symbol  
Parameter  
Conditions  
Min. Typ. Max.  
Unit  
Total Device Section  
Operating Supply Current,  
(Control Part in Burst Mode)  
IOP  
IOPS  
V
CC = 14V, VFB = 0V  
0.3  
1.1  
0.4  
1.5  
120  
0.5  
1.9  
mA  
mA  
A  
Operating Switching Current,  
(Control Part and SenseFET Part)  
VCC = 14V, VFB = 2V  
VCC=11V (Before VCC  
ISTART  
Start Current  
85  
155  
1.3  
Reaches VSTART  
)
ICH  
Startup Charging Current  
VCC = VFB = 0V, VSTR = 40V  
VCC = VFB = 0V, VSTR Sweep  
0.7  
1.0  
26  
mA  
V
VSTR  
Minimum VSTR Supply Voltage  
Notes:  
12. Although these parameters are guaranteed, they are not 100% tested in production.  
13. Average value.  
14. tLEB includes gate turn-on time.  
Comparison of FSGM0765R and FSL176MRT  
Function  
FSGM0765R  
FSL176MRT  
Built-in  
Advantages of FSL176MRT  
Random Frequency Fluctuation  
Operating Current  
Low EMI  
Very low standby power  
1.6mA  
0.4mA  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
6
Typical Performance Characteristics  
Characteristic graphs are normalized at TA=25°C.  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 5. Operating Supply Current (IOP) vs. TA  
Figure 6. Operating Switching Current (IOPS) vs. TA  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 7. Startup Charging Current (ICH) vs. TA  
Figure 8. Peak Drain Current Limit (ILIM) vs. TA  
1.40  
1.30  
1.20  
1.10  
1.00  
0.90  
0.80  
0.70  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.60  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 9. Feedback Source Current (IFB) vs. TA  
Figure 10. Shutdown Delay Current (IDELAY) vs. TA  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
7
Typical Performance Characteristics  
Characteristic graphs are normalized at TA=25°C.  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 11. UVLO Threshold Voltage (VSTART) vs. TA  
Figure 12. UVLO Threshold Voltage (VSTOP) vs. TA  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 13. Shutdown Feedback Voltage (VSD) vs. TA  
Figure 14. Over-Voltage Protection (VOVP) vs. TA  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.80  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
40'C 20'C 0'C 25'C 50'C 75'C 90'C 110'C 120'C 125'C  
Temperature [ °C]  
Temperature [ °C]  
Figure 15. Switching Frequency (fS) vs. TA  
Figure 16. Maximum Duty Ratio (DMAX) vs. TA  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
8
Functional Description  
1. Startup: At startup, an internal high-voltage current  
source supplies the internal bias and charges the  
external capacitor (CVcc) connected to the VCC pin, as  
illustrated in Figure 17. When VCC reaches 12V, the  
FSL176MRT begins switching and the internal high-  
voltage current source is disabled. The FSL176MRT  
continues normal switching operation and the power is  
supplied from the auxiliary transformer winding unless  
3. Feedback Control: This device employs current-  
mode control, as shown in Figure 18. An opto-coupler  
(such as the FOD817) and shunt regulator (such as the  
KA431) are typically used to implement the feedback  
network. Comparing the feedback voltage with the  
voltage across the RSENSE resistor makes it possible to  
control the switching duty cycle. When the reference pin  
voltage of the shunt regulator exceeds the internal  
reference voltage of 2.5V, the opto-coupler LED current  
increases, pulling down the feedback voltage and  
reducing drain current. This typically occurs when the  
input voltage is increased or the output load is decreased.  
VCC goes below the stop voltage of 7.5V.  
3.1 Pulse-by-Pulse Current Limit: Because current-  
mode control is employed, the peak current through  
the SenseFET is limited by the inverting input of the  
PWM comparator (VFB*), as shown in Figure 18.  
Assuming that the 90μA current source flows only  
through the internal resistor (3R + R = 27k), the  
cathode voltage of diode D2 is about 2.5V. Since D1 is  
blocked when the feedback voltage (VFB) exceeds  
2.5V, the maximum voltage of the cathode of D2 is  
clamped at this voltage. Therefore, the peak value of  
the current through the SenseFET is limited.  
Figure 17. Startup Block  
3.2 Leading-Edge Blanking (LEB): At the instant the  
internal SenseFET is turned on, a high-current spike  
usually occurs through the SenseFET, caused by  
primary-side capacitance and secondary-side rectifier  
reverse recovery. Excessive voltage across the RSENSE  
resistor leads to incorrect feedback operation in the  
current-mode PWM control. To counter this effect, the  
FSL176MRT employs a leading-edge blanking (LEB)  
circuit. This circuit inhibits the PWM comparator for  
2. Soft-Start: The internal soft-start circuit increases the  
PWM comparator inverting input voltage, together with  
the SenseFET current, slowly after startup. The typical  
soft-start time is 15ms. The pulse width to the power  
switching device is progressively increased to establish  
the correct working conditions for transformers,  
inductors, and capacitors. The voltage on the output  
capacitors is progressively increased to smoothly  
establish the required output voltage. This helps prevent  
transformer saturation and reduces stress on the  
secondary diode during startup.  
t
LEB (300ns) after the SenseFET is turned on.  
Figure 18. Pulse Width Modulation Circuit  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
9
7.0V, when the switching operation is terminated, as  
shown in Figure 20. The delay for shutdown is the  
time required to charge CFB from 2.5V to 7.0V with  
2.0µA. A 25 ~ 50ms delay is typical. This protection is  
implemented in auto-restart mode.  
4. Protection Circuits: The FSL176MRT has several  
self-protective functions, such as Overload Protection  
(OLP), Abnormal Over-Current Protection (AOCP),  
Output-Short Protection (OSP), Over-Voltage Protection  
(OVP), and Thermal Shutdown (TSD). All the  
protections are implemented as auto-restart. Once a  
fault condition is detected, switching is terminated and  
the SenseFET remains off. This causes VCC to fall.  
When VCC falls to the Under-Voltage Lockout (UVLO)  
stop voltage of 7.5V, the protection is reset and the  
startup circuit charges the VCC capacitor. When VCC  
reaches the start voltage of 12.0V, the FSL176MRT  
resumes normal operation. If the fault condition is not  
removed, the SenseFET remains off and VCC drops to  
stop voltage again. In this manner, the auto-restart can  
alternately enable and disable the switching of the  
power SenseFET until the fault condition is eliminated.  
Because these protection circuits are fully integrated  
into the IC without external components, the reliability is  
improved without increasing cost.  
Figure 20. Overload Protection  
4.2 Abnormal Over-Current Protection (AOCP):  
When the secondary rectifier diodes or the  
transformer pins are shorted, a steep current with  
extremely high di/dt can flow through the SenseFET  
during the minimum turn-on time. Overload protection  
is not enough to protect the FSL176MRT in that  
abnormal case; since severe current stress is  
imposed on the SenseFET until OLP is triggered. The  
FSL176MRT internal AOCP circuit is shown in Figure  
21. When the gate turn-on signal is applied to the  
power SenseFET, the AOCP block is enabled and  
monitors the current through the sensing resistor. The  
voltage across the resistor is compared with a preset  
AOCP level. If the sensing resistor voltage is greater  
than the AOCP level, the set signal is applied to the  
S-R latch, resulting in the shutdown of the SMPS.  
Figure 19. Auto-Restart Protection Waveforms  
4.1 Overload Protection (OLP): Overload is defined  
as the load current exceeding its normal level due to  
an unexpected abnormal event. In this situation, the  
protection circuit should trigger to protect the SMPS.  
However, when the SMPS is in normal operation, the  
overload protection circuit can be triggered during  
load transition. To avoid this undesired operation, the  
overload protection circuit is designed to trigger only  
after a specified time to determine whether it is a  
transient situation or  
a true overload situation.  
Because of the pulse-by-pulse current-limit capability,  
the maximum peak current through the SenseFET is  
limited and, therefore, the maximum input power is  
restricted with a given input voltage. If the output  
consumes more than this maximum power, the output  
voltage (VOUT) decreases below the set voltage. This  
reduces the current through the opto-coupler LED,  
which also reduces the opto-coupler transistor  
current, thus increasing the feedback voltage (VFB). If  
VFB exceeds 2.5V, D1 is blocked and the 2.0µA  
current source starts to charge CFB slowly up. In this  
condition, VFB continues increasing until it reaches  
Figure 21. Abnormal Over-Current Protection  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
10  
4.3. Output-Short Protection (OSP): If the output is  
shorted, steep current with extremely high di/dt can  
flow through the SenseFET during the minimum turn-  
on time. Such a steep current brings high-voltage  
stress on the drain of the SenseFET when turned off.  
To protect the device from this abnormal condition,  
OSP is included. It is comprised of detecting VFB and  
SenseFET turn-on time. When the VFB is higher than  
2.0V and the SenseFET turn-on time is lower than  
1.0μs, the FSL176MRT recognizes this condition as  
an abnormal error and shuts down PWM switching  
until VCC reaches VSTART again. An abnormal condition  
output short is shown in Figure 22.  
5. Soft Burst-Mode Operation: To minimize power  
dissipation in Standby Mode, the FSL176MRT enters  
Burst-Mode operation. As the load decreases, the  
feedback voltage decreases. The device automatically  
enters Burst Mode when the feedback voltage drops  
below VBURL (300mV), as shown in Figure 23. At this  
point, switching stops and the output voltages start to  
drop at a rate dependent on standby current load. This  
causes the feedback voltage to rise. Once it passes  
VBURH (450mV), switching resumes. The feedback  
voltage then falls and the process repeats. Burst Mode  
alternately enables and disables switching of the  
SenseFET, reducing switching loss in Standby Mode.  
Figure 22. Output-Short Protection  
4.4 Over-Voltage Protection (OVP): If the  
secondary-side feedback circuit malfunctions or a  
solder defect causes an opening in the feedback path,  
the current through the opto-coupler transistor  
becomes almost zero. Then VFB climbs up in a similar  
manner to the overload situation, forcing the preset  
maximum current to be supplied to the SMPS until the  
overload protection is triggered. Because more energy  
than required is provided to the output, the output  
voltage may exceed the rated voltage before the  
overload protection is triggered, resulting in the  
breakdown of the devices in the secondary side. To  
prevent this situation, an OVP circuit is employed. In  
general, the VCC is proportional to the output voltage  
and the FSL176MRT uses VCC instead of directly  
monitoring the output voltage. If VCC exceeds 24.5V,  
an OVP circuit is triggered, resulting in the termination  
of the switching operation. To avoid undesired  
activation of OVP during normal operation, VCC should  
be designed to be below 24.5V.  
Figure 23. Burst-Mode Operation  
6. Random Frequency Fluctuation (RFF): Fluctuating  
switching frequency of an SMPS can reduce EMI by  
spreading the energy over a wide frequency range. The  
amount of EMI reduction is directly related to the  
switching frequency variation, which is limited internally.  
The switching frequency is determined randomly by the  
external feedback voltage and an internal free-running  
oscillator at every switching instant. This random  
frequency fluctuation scatters the EMI noise around  
typical switching frequency (67kHz) effectively and can  
reduce the cost of the input filter included to meet the  
EMI requirements (e.g. EN55022).  
4.5 Thermal Shutdown (TSD): The SenseFET and  
the control IC on a die in one package makes it easier  
for the control IC to detect high temperature of the  
SenseFET. If the temperature exceeds ~140C, the  
thermal shutdown is triggered and stops operation.  
The FSL176MRT operates in auto-restart mode until  
the temperature decreases to around 75C, when  
normal operation resumes.  
Figure 24. Random Frequency Fluctuation  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
11  
Typical Application Circuit  
Application  
LCD Monitor  
Power Supply  
Input Voltage  
Rated Output  
5.0V (3A)  
Rated Power  
85 ~ 265VAC  
64W  
14.0V (3.5A)  
Key Design Notes:  
1. The delay for overload protection (OLP) is designed to be about 30ms with C105 (8.2nF). OLP time between  
39ms (12nF) and 46ms (15nF) is recommended.  
2. The SMD-type capacitor (C106) must be placed as close as possible to the VCC pin to avoid malfunction by  
abrupt pulsating noises and to improve ESD and surge immunity. Capacitance between 100nF and 220nF  
is recommended.  
Figure 25. Schematic  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
12  
Transformer Specification  
.
Core: EER3019 (Ae=134 mm2)  
.
Bobbin: EER3019  
Figure 26. Transformer Specification  
Table 1. Winding Specification  
Barrier Tape  
Pin (S F)  
Wire  
Turns Winding Method  
TOP  
BOT  
Ts  
Np /2(BOT)  
3 2  
0.4φ×1  
18  
3
Solenoid Winding  
Solenoid Winding  
Solenoid Winding  
Solenoid Winding  
Solenoid Winding  
Solenoid Winding  
2.0mm  
1
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
N5V 7 6 0.4φ×3 (TIW)  
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
Na 4 5 0.20φ×1  
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
N5V 8 6 0.4φ×3 (TIW)  
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
N14V 10 8 0.4φ×3 (TIW)  
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
Np/2(TOP) 2 1 0.4φ×1  
3.0mm  
1
1
1
1
1
8
4.0mm  
3.0mm  
3.0mm  
3
5
18  
2.0mm  
Insulation: Polyester Tape t = 0.025mm, 2 Layers  
Table 2. Electrical Characteristics  
Pin  
Specification  
465H ±6%  
Remark  
Inductance  
Leakage  
13  
13  
67kHz, 1V  
Short all other pins  
10H Maximum  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
13  
Table 3. Bill of Materials  
Part #  
Value  
250V 3.15A  
5D-11  
Note  
Part #  
Value  
Capacitor  
Note  
Fuse  
NTC  
F101  
C101  
C102  
C103  
C104  
C105  
C106  
C107  
C201  
C202  
C203  
C204  
C205  
C206  
C207  
C208  
C301  
220nF / 275V  
150nF/275V  
Box (Pilkor)  
Box (Pilkor)  
NTC101  
DSC  
120µF / 400V Electrolytic (SamYoung)  
3.3nF/630V  
12nF / 100V  
220nF  
Film (Sehwa)  
Film (Sehwa)  
Resistor  
R101  
R103  
R201  
R202  
R203  
R204  
R205  
1.5M, J  
43k, J  
1k, F  
1W  
1W  
SMD (2012)  
1/4W, 1%  
1/4W, 1%  
1/4W, 1%  
1/4W, 1%  
1/4W, 1%  
47µF / 50V  
Electrolytic (SamYoung)  
1.2k, F  
18k, F  
8k, F  
1000µF / 25V Electrolytic (SamYoung)  
1000µF / 25V Electrolytic (SamYoung)  
1000µF / 25V Electrolytic (SamYoung)  
2200µF / 10V Electrolytic (SamYoung)  
1000µF / 16V Electrolytic (SamYoung)  
1000µF / 16V Electrolytic (SamYoung)  
8k, F  
100nF  
100nF  
SMD (2012)  
SMD (2012)  
IC  
SMPS  
IC201  
IC301  
FSL176MRT  
KA431LZ  
Fairchild Semiconductor  
Fairchild Semiconductor  
Fairchild Semiconductor  
4.7nF / Y2  
Y-cap (Samhwa)  
Inductor  
FOD817B  
LF101  
L201  
L202  
20mH  
5µH  
Line Filter 0.5Ø  
5A Rating  
Diode  
D101  
D102  
1N4007  
UF4004  
Vishay  
Vishay  
5µH  
5A Rating  
Transformer  
ZD101  
D201  
1N4750  
Vishay  
T101  
465µH  
MBR20150CT  
FYPF2006DN  
G3SBA60  
Fairchild Semiconductor  
Fairchild Semiconductor  
Vishay  
D202  
BD101  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
14  
Physical Dimensions  
10.36  
9.96  
B
2.74  
2.34  
(7.00)  
(0.70)  
A
3.28  
Ø
5.18  
4.98  
3.40  
3.20  
3.08  
(5.40)  
6.88  
6.48  
16.07  
15.67  
19.97 18.94  
18.97 17.94  
13.05  
(0.48)  
24.00  
23.00  
R0.55  
R0.55  
R0.55  
(0.88)  
8.13  
1.40  
0.80  
0.70  
7.15  
5PLCS  
3.06  
2.46  
7.13  
1.20  
#1  
#6  
#1,6  
#2,4  
#3,5  
0.70  
0.50  
5PLCS  
0.20  
0.60  
0.45  
2.19  
1.75  
3.48  
2.88  
1.27  
A B  
(3.81)  
3.81  
7.29  
6.69  
NOTES:  
A) NO PACKAGE STANDARD APPLIES.  
B) DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSIONS.  
C) DIMENSIONS ARE IN MILLIMETERS.  
4.80  
4.40  
5°  
5°  
D) DRAWING FILENAME : MKT-TO220F06REV2  
Figure 28. 6-Lead, TO220, Fullpack, U-Forming, 2 DAP  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
15  
© 2012 Fairchild Semiconductor Corporation  
FSL176MRT • Rev. 1.0.0  
www.fairchildsemi.com  
16  
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