FSUSB31K8X [ONSEMI]
低功耗双 SPST 高速 USB 2.0 (480 Mbps) 开关;
| 型号： | FSUSB31K8X |
| 厂家： | 
ONSEMI |
| 描述： | 低功耗双 SPST 高速 USB 2.0 (480 Mbps) 开关 开关 光电二极管 输出元件 |
| 文件： | 总16页 (文件大小：924K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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February 2009
FSUSB31
Low-Power, Single-Port, High-Speed USB 2.0 (480Mbps)
Switch
Features
Description
■ Low On Capacitance: 3.7pF (Typical)
■ Low On Resistance: 6.5Ω (Typical)
■ Low Power Consumption: 1µA (Maximum)
The FSUSB31 is a low-power, single-port, high-speed
USB 2.0 switch. This part is configured as a double-pole,
single-throw switch and is optimized for switching or iso-
lating a high-speed (480Mbps) source or a high-speed
and full-speed (12Mbps) source. The FSUSB31 is com-
patible with the requirements of USB2.0 and features an
extremely low on capacitance (CON) of 3.7pF. The wide
bandwidth of this device (>720MHz) exceeds the band-
width needed to pass the third harmonic, resulting in sig-
nals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
– 10µA Maximum ICCT Over an Expanded Control
Voltage Range: VIN =2.6V, VCC =4.3V
■ Wide -3dB Bandwidth: > 720MHz
■ 8kV I/O to GND ESD Protection
■ Power-off Protection When VCC = 0V, D+/D- Pins Can
Tolerate up to 5.5V
■ Packaged in:
– 8-lead MicroPak™ (1.6 x 1.6mm)
– 8-lead US8
The FSUSB31 contains special circuitry on the D+ / D-
pins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize cur-
rent consumption even when the control voltage applied
to the OE pin is lower than the supply voltage (VCC). This
feature is especially valuable for mobile applications,
such as cell phones, allowing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include port isolation and switching in porta-
ble cell phones, PDAs, digital cameras, printers, and
notebook computers.
– 8-lead Ultrathin MLP (1.2 x 1.4mm)
Applications
■ Cell Phone, PDA, Digital Camera, and Notebook
■ LCD Monitor, TV, and Set-top Box
Related Resources
■ AN-6022 Using the FSUSB30/31 to Comply with
USB 2.0 Fault Condition Requirements
Ordering Information
Part Number Package
Eco Status
Green
Package Description
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
8-Lead MicroPak, 1.6mm Wide
FSUSB31K8X
FSUSB31L8X
FSUSB31UMX
MAB08A
MAC08A
UMLP08A
RoHS
Green
8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Application Diagram
FSUSB31
V
CC
D+
D–
USB
Connector
Base Band
Processor
or FS USB
Controller
OE
HS USB
Controller
Figure 1. Typical Application Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
Analog Symbol
Pin Descriptions
Pin Name
Description
Bus Switch Enable
Data Ports
HSD+
OE
D+, D−, HSD+, HSD−
NC
D+
D–
No Connect
HSD–
OE
Truth Table
Function
OE
Control
HIGH
LOW
Disconnect
D+, D− = HSD+, HSD-
Figure 2. Analog Symbol
Connection Diagrams
7
6
2
5
VCC
8
4
3
GND
1
Figure 3. Pin Assignments for MicroPak
1
8
NC
HSD–
D–
VCC
2
3
4
7
6
5
OE
HSD+
D+
GND
Figure 4. Pin Assignments for US8
Figure 5. Pin Assignments for UMLP
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol
Parameter
Minimum
-0.5
Maximum
Unit
V
V
Supply Voltage
5.5
CC
(1)
V
DC Input Voltage
-0.5
V
V
V
V
S
IN
IK
CC
CC
CC
HSD
-0.5
V
(1)
V
DC Switch Voltage
D+, D−
-0.5
V
I
DC Input Diode Current
DC Output Current
-50
mA
mA
°C
kV
kV
I
50
OUT
T
Storage Temperature
-65
+150
7.5
8
STG
All Pins
Human Body Model:
JESD22-A114
ESD
I/O to GND
Note:
1.The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Minimum
Maximum
Unit
V
V
Supply Voltage
3.0
0
4.3
CC
(2)
V
Control Input Voltage
Switch Input Voltage
V
V
V
IN
CC
CC
0
V
T
Operating Temperature
-40
+85
°C
A
Note:
2. Control input must be held HIGH or LOW and it must not float.
© 2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSUSB31 Rev. 1.1.0
3
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
T = −40°C to +85°C
A
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min.
Typ. Max.
V
Clamp Diode Voltage
Input Voltage HIGH
I
= −18mA
IN
3.0
-1.2
V
V
IK
3.0 to 3.6
4.3
1.3
1.7
V
IH
3.0 to 3.6
4.3
0.5
0.7
1.0
2.0
V
V
I
Input Voltage LOW
IL
Control Input Leakage
OFF State Leakage
V
= 0V to V
0 to V
-1.0
-2.0
μA
μA
IN
IN
CC
CC
I
0 ≤ HSD ≤ V
4.3
OZ
CC
Power OFF Leakage
Current (D+, D–)
V
V
= 0.0V to 4.3V,
IN
I
0
-2.0
2.0
μA
OFF
= 0V
CC
(3)
R
Switch On Resistance
V
V
= 0.4V, I = −8mA
3.0
3.0
6.5
10.0
Ω
Ω
ON
IN
IN
IN
ON
(4)
ΔR
Delta R
= 0.4V, I = −8mA
0.35
ON
ON
ON
V
I
= 0.0V −1.0V,
= −8mA
(3)
R
Flatness R Flatness
3.0
4.3
2.0
Ω
ON
ON
ON
V
= 0.0V or V
,
CC
IN
I
Quiescent Supply Current
1.0
μA
CC
I
= 0
OUT
Increase in I Current
CC
I
per Control Voltage and
V
= 2.6V, V = 4.3V
4.3
10.0
μA
CCT
IN
CC
V
Levels
CC
Notes:
3. Measured by the voltage drop between Dn, HSD, and Dn pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V are at 25°C unless otherwise specified.
T = −40°C to +85°C
A
Figure
Number
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min. Typ. Max.
Turn-On Time,
OE to Output
V
= 0.8V, R = 50Ω,
IN
L
t
3.0 to 3.6
3.0 to 3.6
3.3
15.0
12.0
0.25
30.0
25.0
ns
ns
ns
ns
dB
dB
Figure 13
Figure 13
ON
C = 5pF
L
Turn-Off Time,
OE to Output
V
= 0.8V, R = 50Ω,
IN L
t
OFF
C = 5pF
L
Figure 11
Figure 12
(5)
t
Propagation Delay
R = 50Ω, C = 5pF
L L
PD
R = 50Ω, C = 5pF,
V
L
L
t
Break-Before-Make
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
2.0
6.5
Figure 14
Figure 17
Figure 18
BBM
= 0.8V
IN
Off Isolation
(Non-Adjacent)
O
R = 50Ω, f = 240MHz
-35.0
-55.0
IRR
T
Non-Adjacent Channel
Crosstalk
Xtalk
BW
R = 50Ω, f = 240MHz
T
R = 50Ω, C = 0pF
720
550
T
L
-3dB Bandwidth
3.0 to 3.6
MHz Figure 16
R = 50Ω, C = 5pF
T
L
Note:
5. Guaranteed by characterization.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
4
USB Hi-Speed Related AC Electrical Characteristics
T = −40°C to
A
Figure
Number
+85°C
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min. Typ. Max.
Channel-to-Chan-
nel Skew
Figure 11
Figure 15
t
C = 5pF
3.0 to 3.6
3.0 to 3.6
50.0
ps
ps
(6)
SK(O)
L
Skew of Opposite
Transitions of the
Figure 11
Figure 15
t
C = 5pF
20.0
SK(P)
L
(6)
Same Output
R = 50Ω, C = 5pF,
L
L
(6)
t
Total Jitter
t = t = 500ps at 480 Mbps 3.0 to 3.6
200
ps
J
R
F
15
(PRBS = 2 − 1)
Note:
6. Guaranteed by design.
Capacitance
T = −40°C to +85°C
A
Figure
Number
Symbol
Parameter
Conditions
Unit
Min.
Typ.
1.0
Max.
C
Control Pin Input Capacitance
On Capacitance
V
V
V
= 0V
pF
pF
pF
Figure 20
Figure 19
Figure 20
IN
CC
CC
CC
C
= 3.3V, OE = 0V
and OE = 3.3V
3.7
ON
C
Off Capacitance
1.7
OFF
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
5
Typical Characteristics
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
VCC = 3.3V
-1
CL = 0pF
VCC = 3.3V
-2
-3
-4
-5
-6
-7
-8
1
10
100
1000
10000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
Figure 6. Gain vs. Frequency
Figure 7. Off Isolation
0
-10
-20
VCC = 3.3V
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
1000
Frequency (MHz)
Figure 8. Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
6
Test Diagrams
VON
FSUSB31
FSUSB31
IDn(OFF)
NC
HSD
VIN
Dn
A
VIN
ION
OE
VS = 0 or VCC
OE
VS = 0 to VCC
GND
GND
GND
RON = VON / ION
Each switch port is tested separately.
Figure 9. On Resistance
Figure 10. Off Leakage
FSUSB31
tFALL = 500ps
tRISE = 500ps
400mV
HSD
VIN
D+, D–
CL*
90%
50%
90%
50%
VOUT
RL
Input: HSD+,
HSD–
RS
GND
10%
10%
0V
GND
VOE
VOH
GND
Output: D+, D–
50%
50%
RL, RS, and CL are functions of the application environment
(see AC Electrical tables for specific values).
VOL
tPLH
tPHL
*CL includes test fixture and stray capacitance.
Figure 11. AC Test Circuit Load
Figure 12. Switch Propagation Delay Waveforms
(tPD
)
tFALL = 2.5ns
tRISE = 2.5ns
VCC
90%
/2
90%
Input – OE
V
V
/2
CC
CC
10%
10%
GND
VOH
Output – VOUT
VOL
90%
90%
tON
tOFF
Figure 13. Turn On / Turn Off Waveform (tON / tOFF
)
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
7
Test Diagrams (Continued)
VCC
VCC
HSDn
VO
VOUT
CL*
VCC
0V
D+, D–
Control
Input
HSDn
50%
RL
tR = tF = 2.5ns (10–90%)
S
VOUT
Control
Input
GND
0.9 x VOUT
tD
*CL includes test fixture and stray capacitance.
Figure 14. Break-Before-Make (tBBM
)
tFALL = 500ps
tRISE = 500ps
400mV
90%
50%
90%
50%
Input: D+, D–
10%
10%
0V
t
FALL = 500ps
tRISE = 500ps
400mV
VOH
Output1: HSD1+
HSD1–
VOL
90%
50%
90%
50%
50%
50%
Input: HSDn+
HSDn–
10%
10%
tPLH1
tPHL1
0V
VOH
VOH
50%
50%
50%
50%
Output1: D2+, D2–
VOL
Output: D+, D–
VOL
tPLH
tPHL
tPLH2
tPHL2
TSK(P) = | tPHL – tPLH
Pulse Skew, TSK(P)
|
TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2
Output Skew, TSK(OUT)
|
Figure 15. Switch Skew Tests
Network Analyzer
FSUSB31
RS
VIN
VS
GND
GND
V
OE
GND
VOUT
RT
GND
RS and RT are functions of the application environment
(see AC Electrical Tables for specific values).
GND
Figure 16. Bandwidth
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
8
Test Diagrams (Continued)
Network Analyzer
FSUSB31
RS
VIN
VS
GND
GND
RT
V
OE
GND
GND
GND
VOUT
RT
GND
OFF-Isolation = 20 Log (VOUT /VIN
)
Figure 17. Channel Off Isolation
NC
Network Analyzer
FSUSB31
RS
VIN
VS
GND
V
GND
OE
GND
RT
GND
RT
VOUT
GND
R
S and RT are functions of the application environment
GND
(50, 75 or 100Ω).
Crosstalk = 20 Log (VOUT / VIN
)
Figure 18. Non-Adjacent Channel-to-Channel Crosstalk
FSUSB31
FSUSB31
Dn
Dn
Capacitance
Meter
OE
OE
Capacitance
VOE = 0 or VCC
Meter
VOE = 0 or VCC
F = 240MHz
F = 240MHz
HSDn
HSDn
Figure 19. Channel On Capacitance
Figure 20. Channel Off Capacitance
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
9
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
In section 7.1.1 of the USB 2.0 specification, it notes that
USB devices must be able to withstand a Vbus short to
D+ or D- when the USB devices is either powered off or
powered on. The FSUSB31 can be successfully config-
ured to meet both these requirements.
Power-On Protection
The USB 2.0 specification also notes that the USB
device should be capable of withstanding a Vbus short
during transmission of data. Fairchild recommends add-
ing a 100Ω series resister between the switch VCC pin
and supply rail to protect against this case. This modifi-
cation works by limiting current flow back into the VCC
rail during the over-voltage event so current remains
within the safe operating range. In this application, the
switch passes the full 5.25V input signal through to the
selected output, while maintaining specified off isolation
on the un-selected pins.
Power-Off Protection
For a Vbus short circuit, the switch is expected to with-
stand such a condition for at least 24 hours. The
FSUSB31 has specially designed circuitry which pre-
vents unintended signal bleed through as well as guar-
anteed system reliability during a power-down, over-
voltage condition. The protection has been added to the
common pins (D+, D-).
VCC= 3.6 V
100 Ohms
D+ = 5.25V
HSD+
HSD-
FSUSB31
D- = 5.25V
Figure 21. A 100Ω resistor in series with the VCC supply allows the FSUSB31 to withstand a Vbus
short when powered up
For more information, see Applications Note AN-6022 — Using the FSUSB30/FSUSB31 to Comply with
USB 2.0 Fault Condition Requirements at www.fairchildsemi.com.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
10
Physical Dimensions
Figure 22. 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
For MicroPak™ tape and reel specifications, please visit Fairchild’s website: http://www.fairchildsemi.com/ms/MS/MS-522.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
11
Physical Dimensions (Continued)
2X
C
0.10
A
1.6
B
1.6
INDEX AREA
C
2X
0.10
TOP VIEW
0.55 MAX
0.05 C
Recommended Landpattern
(0.20)
C
0.05
0.05
0.00
C
DETAIL A
8X(0.09)
1.0
0.35
0.25
0.5
1
2
3
(0.1)
4
8
4
(0.15)
0.35
0.25
7
6
5
0.35
0.15
0.25
8X
8X
DETAIL A
0.25
(0.2)
0.10
0.05
C A B
C
PIN #1 TERMINAL
SCALE: 2X
3X
BOTTOM VIEW
Notes:
1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y.14M-1994
4. PIN 1 FLAG, END OF PACKAGE OFFSET
5. DRAWING FILE NAME: MKT-MAC08AREV4
MAC08AREV4
Figure 23. 8-Lead MicroPak, 1.6mm Wide
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
12
Physical Dimensions (Continued)
1.450
C
2X
0.10
0.725
0.450
B
1.4
A
0.400
1.20
1.250
0.350 7X
0.250 8X
0.625
C
0.10
2X
TOP VIEW
0.55 MAX
0.05 C
SEATING
PLANE
0.025
0.00
C
0.05
C
0.40
0.35
7X
0.25
2
4
DETAIL A
0.10
0.30
5
1
45°
8
6
0.20
0.15
PIN#1 IDENT
8X
0.25
0.10
(0.2)
0.10
0.05
C A B
C
BOTTOM VIEW
DETAIL: A
SCALE : 2x
NOTES:
A. DOES NOT CONFORMS TO JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES CONFORMS TO ASME Y14.5M, 1994.
D. DRAWING FILE NAME : UMLP08Arev1
Figure 24. 8-Lead, Ultrathin Molded Leadless Package (UMLP), 1.2 x 1.4mm
For MicroPak™ tape and reel specifications, please visit Fairchild’s website:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
www.fairchildsemi.com
13
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.1.0
14
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