FSV360FP [ONSEMI]
表面贴装肖特基势垒整流器;
| 型号： | FSV360FP |
| 厂家： | 
ONSEMI |
| 描述： | 表面贴装肖特基势垒整流器 |
| 文件： | 总5页 (文件大小：156K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Schottky Barrier Rectifier,
Surface Mount
FSV340FP, FSV360FP
Features
• Low Forward Voltage Drop:
www.onsemi.com
♦ FSV340FP: 0.52 V Maximum at 3 A, T = 25°C
A
♦ FSV360FP: 0.65 V Maximum at 3 A, T = 25°C
A
• Larger Cathode Pad for Improved Power Dissipation
• Ultra Thin Profile − Maximum Height of 1.0 mm
• High Surge Capacity
1
2
Cathode
Anode
• UL Flammability 94V−0 Classification
• MSL 1
Schottky Barrier Rectifier
• Green Mold Compound
• These Devices are Pb−Free, Halogen Free Free and are RoHS
Compliant
Specifications
SOD−123EP
CASE 425AC
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Value
FSV340FP FSV360FP
Symbol
Parameter
Unit
MARKING DIAGRAM
V
RRM
Recurrent Peak Reverse
Voltage
40
60
V
&Y
&Z**&G
V
RMS Reverse Voltage
DC Blocking Voltage
28
40
42
60
V
V
A
RMS
V
R
Band Indicates Cathode
I
Average Forward Current at
3
F(AV)
T = 75°C
L
&Y
&Z
**
= Binary Calendar Year Coding Scheme
= Assembly Plant Code
= Specific Device Code − (FC, FD)
= Single Digit Weekly Data Code
I
Peak Forward Surge Current:
8.3 ms Single Half Sine−Wave
Superimposed on Rated Load
(JEDEC Method)
80
A
FSM
&G
T
Operating Junction
Temperature Range
−55 to +150
−55 to +150
°C
°C
J
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
T
Storage Temperature Range
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
June, 2020 − Rev. 6
FSV360FP/D
FSV340FP, FSV360FP
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Note 1)
A
Symbol
Characteristic
Typical Thermal Characteristics, Junction−to−Lead (Note 2)
Typical Thermal Resistance, Junction−to−Ambient
Value
10
Unit
°C/W
°C/W
Ψ
JL
R
140
q
JA
1. Per JESD51−3 recommended thermal test board. Device mounted on FR−4 PCB, board size = 76.2 mm x 114.3 mm.
2. Thermocouple soldered at cathode lead.
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Symbol
Parameter
Forward Voltage
Conditions
Min
−
Typ
Max
0.52
0.65
160
100
−
Unit
V
F
I = 3 A
FSV340FP
FSV360FP
FSV340FP
FSV360FP
FSV340FP
FSV360FP
−
−
V
F
−
I
R
Reverse Current
V
V
= 40 V
= 60 V
−
−
mA
ns
R
−
−
R
T
rr
Reverse Recovery Time
I = 0.5 A, I = 1 A,
−
12.37
10.62
F
rr
R
I
= 0.25 A
−
−
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ORDERING INFORMATION
†
Part Number
Top Mark
Package
Shipping
FSV340FP
FC
SOD−123EP
(Pb−Free/Halogen Free)
3000 / Tape & Reel
FSV360FP
FD
SOD−123EP
(Pb−Free/Halogen Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
FSV340FP, FSV360FP
TYPICAL PERFORMANCE CHARACTERISTICS
10000
10000
1000
100
100°C
100°C
1000
100
10
75°C
25°C
75°C
25°C
10
1
1
FSV340FP
40
FSV360FP
0.1
0.1
0
10
20
30
0
10 20 30 40
50 60 70 80 90
Reverse Voltage (V)
Reverse Voltage (V)
Figure 1. Typical Reverse Characteristics
Figure 2. Typical Reverse Characteristics
100
10
100
10
125°C
100°C
125°C
100°C
1.0
0.1
1.0
0.1
75°C
75°C
25°C
25°C
FSV340FP
FSV360FP
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Forward Voltage (V)
Forward Voltage (V)
Figure 3. Typical Forward Characteristics
Figure 4. Typical Forward Characteristics
400
350
300
250
200
150
100
50
0
0
12
24
36
48
60
V , Reverse Bias Voltage (V)
R
Figure 5. Typical Junction Capacitance
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3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123EP
CASE 425AC
ISSUE O
DATE 31 AUG 2016
3.00
2.60
0.55
1.95
1.65
1.15
0.85
1.40
2.30
1.25
LAND PATTERN RECOMMENDATION
LONG PAD IS CATHODE
0.30
0.10
1.00
0.75
3.90
3.50
2.05
1.65
2.05
1.65
NOTES:
A. NO INDUSTRY STANDARD APPLIES TO THIS
PACKAGE.
B. ALL DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH AND TIE BAR PROTRUSIONS.
1.25
0.85
0.40
0.25
2.30
1.90
1.20
0.55
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON13723G
SOD−123EP
PAGE 1 OF 1
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