FT10001L6X [ONSEMI]

重置计时器,带固定延迟和重置脉冲;
FT10001L6X
型号: FT10001L6X
厂家: ONSEMI    ONSEMI
描述:

重置计时器,带固定延迟和重置脉冲

脉冲
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January 2012  
FT10001  
Reset Timer with Fixed Delay and Reset Pulse  
Description  
Features  
The FT10001 is a timer for resetting a mobile device  
where long reset times are needed. The long delay  
helps avoid unintended resets caused by accidental key  
presses. It has a fixed delay of 10 ±20% seconds. The  
DSR pin enables Test Mode operation by immediately  
forcing /RST1 LOW for factory testing.  
.
.
.
.
.
.
.
.
.
Fixed Reset Delay: 10 Seconds  
One Input Reset Pin  
Open-Drain Output Pin with Fixed 530ms Pulse  
1.8V to 5.0V Operation (TA=-40°C to +85°C)  
1.7V to 5.0V Operation (TA=-25°C to +85°C)  
1.65V to 5.00V Operation (TA=0°C to +85°C)  
<1µA ICCQ Consumption  
The FT10001 has one input for single-button resetting  
capability. The device has a single open-drain output  
with 0.5mA pull-down drive.  
FT10001 draws minimal ICC current when inactive and  
functions over a power supply range of 1.65V to 5.00V.  
Zero-Second Test-Mode Enable  
Integrated Pull-Up Resistor on /SRO  
Applications  
.
.
.
.
.
Cell Phones  
Portable Media Players  
Tablets  
Mobile Devices  
Consumer Medical  
Ordering Information  
Operating  
Temperature Range  
Packing  
Part Number  
Package  
Method  
5000 Units on  
Tape and Reel  
FT10001L6X  
FT10001FHX  
6-Lead, MicroPak™ 1.0 x 1.45mm, JEDEC MO-252  
6-Lead, MicroPak2™ 1.0 x 1.0mm Body, .35mm Pitch  
-40C to +85C  
5000 Units on  
Tape and Reel  
-40C to +85C  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev. 1.0.1  
www.fairchildsemi.com  
Block Diagram  
Figure 1.  
Block Diagram  
Pin Configuration  
Figure 2.  
Pad Assignments (Top-Through View)  
Pin Definitions  
Description  
Pin # Name  
Normal Operation  
Zero-Second Factory-Test Mode  
Open-drain output, active LOW  
GND  
1
2
3
4
/RST1 Open-drain output, active LOW  
GND GND  
/SR0 Reset input with integrated pull-up, active LOW Reset input with integrated pull-up, active LOW  
VCC Power supply Power supply  
Delay selection input; tie to GND during normal Delay selection input. Pull HIGH to enable Zero-  
5
DSR  
operation.(1)  
second delay for factory test.  
Used for device testing; tie to GND during  
normal operation.  
Used for device testing; tie to GND during normal  
operation.  
6
TEST  
Note:  
1. This pin must always be tied to either GND or VCC. It must not float.  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FT10001 • Rev 1.0.1  
2
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.  
The absolute maximum ratings are stress ratings only.  
Symbol  
VCC  
VIN  
Parameter  
Condition  
Min.  
-0.5  
-0.5  
-0.5  
Max.  
7.0  
Unit  
V
Supply Voltage  
DC Input Voltage  
Output Voltage(2)  
/SR0, DSR  
/RST1  
7.0  
V
VOUT  
IIK  
7.0  
V
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
VIN < 0V  
VOUT < 0V  
-50  
mA  
mA  
mA  
mA  
C  
IOK  
-50  
IOL  
+50  
100  
+150  
+150  
+260  
5
ICC  
DC VCC or Ground Current per Supply Pin  
Storage Temperature Range  
TSTG  
TJ  
-65  
Junction Temperature Under Bias  
C  
TL  
Junction Lead Temperature, Soldering 10 Seconds  
Power Dissipation  
C  
PD  
mW  
Human Body Model, JESD22-A114  
4
ESD  
Electrostatic Discharge Capability  
kV  
Charged Device Model, JESD22-C101  
2
Note:  
2. All output current Absolute Maximum Ratings must be observed.  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended  
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not  
recommend exceeding them or designing to Absolute Maximum Ratings.  
Symbol  
Parameter  
Condition  
Min. Max. Unit  
1.8  
1.7  
5.0  
5.0  
-40C to +85C  
VCC  
Supply Voltage  
V
-25C to +85C  
0C to +85C  
1.65  
5.00  
VCC=0V After Power Down,  
Rising to 0.5V  
tRFC  
VCC Recovery Time After Power Down  
5
ms  
VIN  
VOUT  
IOL  
Input Voltage  
/SR0  
0
0
5
V
V
Output Voltage  
/RST1  
5
DC Output Sink Current  
Free-Air Operating Temperature  
Thermal Resistance  
/RST1, VCC=2.0V to 5.0V  
+0.5  
+85  
350  
mA  
C  
TA  
-40  
°C/W  
JA  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
3
DC Electrical Characteristics  
Conditions of TA=-40°C to 80°C with VCC=1.8V - 5.0V OR TA=-25°C to 85°C with VCC=1.7V – 5.0V OR TA=0°C to  
85°C with VCC=1.65V – 5.00V produce the performance characteristics below.  
Symbol  
Parameter  
Condition  
Min.  
Typ. Max. Unit  
VIH  
Input High Voltage  
DSR, /SR0  
0.65 x VCC  
V
0.25 x  
V
VIL  
Input Low Voltage  
DSR, /SR0  
VCC  
VOL  
RPU  
Low Level Output Voltage  
RST, IOL=500µA  
0.3  
V
Integrated Pull-Up Resistor on /SR0  
Input Leakage Current /SR0  
Input Leakage Current DSR  
50  
k  
VIN= VCC  
1  
1  
IIN  
µA  
µA  
0V VIN 5.0V  
Quiescent Supply Current  
(Timer Inactive)  
/SR0=VCC  
1
ICC  
Dynamic Supply Current (Timer Active) /SR0=0V  
200  
AC Electrical Characteristics  
Conditions of TA=-40°C to 80°C with VCC=1.8V - 5.0V OR TA=-25°C to 85°C with VCC=1.7V – 5.0V OR TA=0°C to  
85°C with VCC=1.65V – 5.00V produce the performance characteristics below.  
Symbol  
Parameter  
Condition  
Min.  
Typ. Max. Unit  
tPHL1  
Timer Delay, /SR0 to RST (DSR=0)  
8
10  
12  
s
CL=5pF, RL=5K,  
See Figure 4  
tREC  
Reset Timeout Delay  
420  
530  
635  
ms  
Capacitance Specifications  
TA=+25C.  
Symbol  
CIN  
Parameter  
Condition  
Typ. Unit  
Input Capacitance  
Output Capacitance  
VCC=GND  
4
5
pF  
pF  
COUT  
VCC=5.0V  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
4
Functional Description  
Default operation time N is 10s. If the DSR pin is pulled  
HIGH prior to VCC ramp, the FT10001 enters Test Mode  
and the reset output, /RST1, is immediately pulled LOW  
for factory testing. The DSR pin MUST be forced to  
GND during normal operation. The DSR pin should  
never be driven HIGH or left to FLOAT during normal  
operation. The DSR PIN state should never be changed  
during device operation; it must be biased prior to  
supplying the VCC supply. If there is a need to use the  
DSR=VCC Test Mode, the /SR0 must be HIGH when  
the DSR pin is moved from LOW to HIGH to enter Zero-  
Second Factory-Test Mode. To return to the standard  
10-second reset time, the same procedure must be  
followed with DSR=GND. The DSR pin should never be  
allowed to change state while the /SR0 pin is LOW.  
state 530ms after time tREC has expired, regardless of  
the state of /SR0. The /RST1 output is an open-drain  
driver. When the count time exceeds time 10s, the  
/RST1 output pulls LOW.  
Short Duration (tW < 10s)  
When the /SR0 input goes LOW, the internal timer starts  
counting. If the /SR0 input goes HIGH before 10s has  
elapsed, the timer stops counting and resets and no  
changes occur on the outputs.  
Long Duration (tW > 10s)  
When the /SR0 input goes LOW, the internal timer starts  
counting. If the /SR0 input stays LOW for at least 10s, the  
RST output is enabled and pulled LOW. The output RST  
is held LOW for tREC, 530ms, as soon as the reset time  
of 10s is met, regardless of the state of the /SR0 pin.  
When the /SR0 input has returned HIGH and tREC has  
expired, the internal timer resets and awaits the next  
RESET event.  
Operation Modes  
A low input signal on /SR0 starts the oscillator. There  
are two scenarios for counting: short duration and long  
duration. In the short-duration scenario, output /RST1 is  
not affected. In the long-duration scenario, the output  
/RST1 goes LOW after /SR0 has been held LOW for  
10s. The /RST1 output returns to its original HIGH  
Zero-Second Test Mode  
/RST1 goes LOW immediately after /SR0 goes LOW.  
N=7.5s  
Short-Duration,  
Normal Operation  
/SR0  
/RST1 never goes LOW because  
/SR0 LOW duration does not meet  
requirement: Reset Time N=10s  
RST1  
Long-Duration,  
Normal Operation  
/SR0  
/RST1 goes LOW because  
/SR0 LOW duration exceeds  
requirement: Reset Time N=10s  
RST1  
tREC=530ms  
/SR0  
Zero-Second Factory-Test Mode  
/RST1 goes LOW immediately  
after /SR0 goes LOW  
RST1  
tREC=530ms  
Figure 3.  
Reset Timing Waveforms  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
5
AC Test Circuit and Waveforms  
Figure 4.  
AC Test Circuit and Waveforms for /RST1 Output ST Output  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
6
Physical Dimensions  
2X  
0.05 C  
1.45  
B
(1)  
2X  
0.05 C  
(0.49)  
5X  
(0.254)  
1.00  
(0.75)  
(0.52)  
1X  
A
TOP VIEW  
PIN 1 IDENTIFIER  
5
0.55MAX  
(0.30)  
6X  
PIN 1  
0.05 C  
0.05  
0.00  
RECOMMENED  
LAND PATTERN  
0.05 C  
C
0.45  
0.35  
0.10  
6X  
0.00  
0.25  
6X  
0.15  
1.0  
DETAIL A  
0.10  
C B A  
0.40  
0.30  
0.05  
C
0.35  
0.25  
5X  
5X  
0.40  
0.30  
DETAIL A  
PIN 1 TERMINAL  
0.075 X 45  
CHAMFER  
0.5  
BOTTOM VIEW  
(0.05)  
6X  
(0.13)  
4X  
Notes:  
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD  
2. DIMENSIONS ARE IN MILLIMETERS  
3. DRAWING CONFORMS TO ASME Y14.5M-1994  
4. FILENAME AND REVISION: MAC06AREV4  
5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY  
OTHER LINE IN THE MARK CODE LAYOUT.  
Figure 5.  
6-Lead MicroPak™ 1.0 x 1.45mm, JEDEC MO-252  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
7
Physical Dimensions  
0.35  
0.05 C  
1.00  
B
A
2X  
5X 0.40  
1X 0.45  
PIN 1  
0.66  
MIN 250uM  
1.00  
6X 0.19  
0.05 C  
TOP VIEW  
RECOMMENDED LAND PATTERN  
FOR SPACE CONSTRAINED PCB  
2X  
0.90  
0.35  
0.05 C  
0.55MAX  
C
5X 0.52  
SIDE VIEW  
0.73  
0.57  
1X  
(0.08) 4X  
DETAIL A  
0.09  
0.19  
6X  
1
2
3
0.20 6X  
ALTERNATIVE LAND PATTERN  
FOR UNIVERSAL APPLICATION  
(0.05) 6X  
0.35  
5X  
0.25  
0.60  
6
5
4
0.10  
.05 C  
C B A  
0.40  
0.30  
0.35  
(0.08)  
4X  
BOTTOM VIEW  
NOTES:  
A. COMPLIES TO JEDEC MO-252 STANDARD  
B. DIMENSIONS ARE IN MILLIMETERS.  
0.075X45°  
CHAMFER  
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994  
D. LANDPATTERN RECOMMENDATION IS BASED ON FSC  
DESIGN.  
DETAIL A  
PIN 1 LEAD SCALE: 2X  
E. DRAWING FILENAME AND REVISION: MGF06AREV3  
Figure 6.  
6-Lead MicroPak2™ 1.0 x 1.0mm, .35mm Pitch  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or  
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the  
warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
8
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
9
Revisions  
Rev 0.0  
Rev 0.1  
8/1/11  
Sean Ryan  
Sean Ryan  
Initial Rev – created from FT7521 datasheet  
Updated the t to align with reset time of 10sec.  
8/11/11  
REC  
Rev 0.2  
Rev 0.3  
Rev 0.4  
Alvan Lam  
Alvan Lam  
Alvan Lam  
Added micropak2 information and marketing drawing  
8/24/11  
8/25/11  
9/6/11  
Updated the NMOS symbol in block diagram  
Created revision table instead of using Hidden Text  
Changed ABS Max to 7V, initial datasheet released by  
Techdoc  
Rev 1.0.0  
Rev 1.0.1  
12/6/11  
Alvan Lam  
Alvan Lam  
Added 1.7/-25C condition to align FT7521 datasheet  
12/14/11  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
10  
© 2011 Fairchild Semiconductor Corporation  
FT10001 • Rev 1.0.1  
www.fairchildsemi.com  
11  
ON Semiconductor and  
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
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designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
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application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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