FTCO3V455A1 [ONSEMI]

汽车功率集成模块 (PIM),MOSFET,40 V,150 A;
FTCO3V455A1
型号: FTCO3V455A1
厂家: ONSEMI    ONSEMI
描述:

汽车功率集成模块 (PIM),MOSFET,40 V,150 A

文件: 总11页 (文件大小:326K)
中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
3-Phase Inverter  
Automotive Power Module  
FTCO3V455A1  
General Description  
The FTCO3V455A1 is a 40 V low R  
automotive qualified  
DS(ON)  
APMCB−A19  
power module featuring a 3−phase MOSFET inverter optimized for  
12 V battery systems. It includes a precision shunt resistor for current  
sensing an NTC for temperature sensing and an RC snubber circuit.  
The module utilizes onsemi’s trench MOSFET technology and it is  
designed to provide a very compact and high performance variable  
speed motor drive for applications like electric power steering,  
electro−hydraulic power steering, electric water pumps, electric oil  
pumps. The power module is 100% lead free, RoHS and UL  
compliant.  
CASE MODCG  
ELECTRICAL CONNECTION  
Features  
40 V − 150 A 3−phase Trench MOSFET Inverter Bridge  
1% Precision Shunt Current Sensing  
Temperature Sensing  
DBC Substrate  
100% Lead Free and RoHS Compliant with 2000/53/C Directive  
UL94V−0 Compliant  
Isolation Rating of 2500 V rms/min  
Mounting Through Screws  
Automotive Qualified  
MARKING DIAGRAM  
$Y  
Benefits  
FTCO3V455A1  
Low Junction−sink Thermal Resistance  
Low Inverter Electrical Resistance  
High Current Handling  
Compact Motor Design  
$Y  
FTCO3V455A1  
= ON Semiconductor  
= Specific Device Code  
Highly Integrated Compact Design  
Better EMC and Electrical Isolation  
Easy and Reliable Installation  
Improved Overall System Reliability  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 8 of  
this data sheet.  
Applications  
Electric and Electro−Hydraulic Power Steering  
Electric Water Pump  
Electric Oil Pump  
Electric Fan  
Flammability Information  
All Materials Present in the Power Module Meet UL Flammability  
Rating Class 94 V−0 or Higher  
Solder  
Solder Used is a Lead Free SnAgCu Alloy  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
November, 2021 − Rev. 2  
FTCO3V455A1/D  
FTCO3V455A1  
ABSOLUTE MAXIMUM RATINGS (T = 25_C, Unless Otherwise Specified)  
J
Symbol  
Parameter  
Rating  
40  
Unit  
V
V
V
(Q1~Q6)  
(Q1~Q6)  
Drain to Source Voltage  
DS  
Gate to Source Voltage  
20  
V
GS  
I (Q1~Q6)  
Drain Current Continuous (T = 25_C, V = 10 V)  
150  
947  
115  
175  
125  
A
D
C
GS  
E
P
T
(Q1~Q6)  
Single Pulse Avalanche Energy (Note 1)  
mJ  
W
AS  
D
Power Dissipation  
Maximum Junction Temperature  
Storage Temperature  
_C  
_C  
J
T
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE  
Symbol  
Parameter  
Q1 Thermal Resistance J −C  
Q2 Thermal Resistance J −C  
Q3 Thermal Resistance J −C  
Min.  
Typ.  
0.8  
Max.  
1.1  
Unit  
_C/W  
_C/W  
_C/W  
Rthjc  
Thermal Resistance  
Junction to case,  
Single Inverter FET,  
chip center  
0.8  
1.1  
0.8  
1.1  
Q4 Thermal Resistance J −C  
Q5 Thermal Resistance J −C  
Q6 Thermal Resistance J −C  
Maximum Junction Temperature  
Operating Sink Temperature  
Storage Temperature  
0.8  
0.8  
0.8  
1.1  
1.1  
_C/W  
_C/W  
_C/W  
_C  
_C  
_C  
(Note 2)  
1.1  
T
J
175  
120  
125  
T
S
−40  
−40  
T
STG  
1. Starting T = 25_C, V = 20 V, I = 64 A, L = 480 mH.  
J
DS  
AS  
2. These values are based on Thermal simulations and PV level measurements.  
These values assume a single MOSFET is on, and the test condition for referenced temperature is “Chip Center”.  
This means that the DT is measured between the T of each MOSFET and the temperature of the case located immediately under the center  
J
of the chip.  
www.onsemi.com  
2
 
FTCO3V455A1  
Figure 1. Pin Configuration  
PIN DESCRIPTION  
Pin Number  
Pin Name  
Pin Descriptions  
1
TEMP 1  
NTC Thermistor Terminal 1  
2
TEMP 2  
NTC Thermistor Terminal 2  
3
4
PHASE W SENSE  
GATE HS W  
Source of HS W and Drain of LS W  
Gate of HS phase W MOSFET  
Gate of LS phase W MOSFET  
Source of HS V and Drain of LS V  
Gate of HS phase V MOSFET  
Gate of LS phase V MOSFET  
Source of HS U and Drain of LS U  
Gate of HS phase U MOSFET  
Drain of HS U, V and W MOSFET  
Gate of LS phase U MOSFET  
5
GATE LS W  
6
PHASE V SENSE  
GATE HS V  
7
8
GATE LS V  
9
PHASE U SENSE  
GATE HS U  
10  
11  
12  
VBAT SENSE  
GATE LS U  
13  
14  
15  
SHUNT P  
SHUNT N  
VBAT  
Source of LS U, V W MOSFETS / Shunt +  
Negative shunt terminal (shunt −)  
Positive battery terminal  
16  
GND  
Negative battery terminal  
Motor phase U  
17  
18  
19  
PHASE U  
PHASE V  
PHASE W  
Motor phase V  
Motor phase W  
www.onsemi.com  
3
FTCO3V455A1  
VBAT  
VBAT SENSE  
GATE HS U  
GATE HS V  
GATE HS W  
PHASE 1 SENSE  
PHASE U  
PHASE V  
PHASE W  
PHASE 2 SENSE  
PHASE 3 SENSE  
GATE LS U  
GATE LS V  
GATE LS W  
SHUNT P  
CSR  
SHUNT N  
TEMP 1  
TEMP 2  
GND  
Figure 2. Internal Equivalent Circuit  
www.onsemi.com  
4
FTCO3V455A1  
ELECTRICAL CHARACTERISTICS (T = 25_C, Unless Otherwise Specified)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
D−S Breakdown Voltage  
(Inverter MOSFETs)  
BVDSS  
VGS = 0, ID = 250 mA  
40  
V
Gate to Source Voltage  
(Inverter MOSFETs)  
VGS  
−20  
2.0  
20  
V
Threshold Voltage  
(Inverter MOSFETs)  
VTH  
VSD  
VGS = VDS, ID = 250 mA, Tj = 25_C  
VGS = 0 V, IS = 80 A, Tj = 25_C  
VGS = 10 V, ID = 80 A, Tj = 25_C  
2.8  
0.8  
4.0  
V
V
1.28  
MOSFET Body Diode Forward Voltage  
Inverter High Side MOSFETs Q1  
(See Note 3)  
mW  
1.15  
1.22  
1.31  
1.36  
1.57  
1.86  
1.66  
1.73  
1.82  
1.87  
2.08  
2.32  
1.0  
RDS(ON)Q1  
RDS(ON)Q2  
RDS(ON)Q3  
RDS(ON)Q4  
RDS(ON)Q5  
Inverter High Side MOSFETs Q2  
(See Note 3)  
VGS = 10 V, ID = 80 A, Tj = 25_C  
VGS = 10 V, ID = 80 A, Tj = 25_C  
VGS = 10 V, ID = 80 A, Tj =25_C  
VGS = 10 V, ID = 80 A, Tj = 25_C  
VGS = 10 V, ID = 80 A, Tj = 25_C  
VGS = 0 V, VDS = 32 V, Tj = 25_C  
mW  
mW  
mW  
mW  
mW  
mA  
Inverter High Side MOSFETs Q3  
(See Note 3)  
Inverter Low Side MOSFETs Q4  
(See Note 3)  
Inverter Low Side MOSFETs Q5  
(See Note 3)  
Inverter Low Side MOSFETs Q6  
(See Note 3)  
RDS(ON)Q6  
IDSS  
Inverter MOSFETs  
(UH,UL,VH,VL,WH,WL)  
Inverter MOSFETs  
Gate to Source Leakage Current  
IGSS  
VGS = 20 V  
100  
5.5  
nA  
VGS = 10 V, ID = 80 A, Tj = 25_C  
mW  
4.69  
Total loop resistance VLINK(+) − V0 (−)  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
3. All MOSFETs have same die size and R  
. The different R  
values listed in the datasheet are due to the different access points  
DS(ON)  
DS(ON)  
available inside the module for R  
measurement. While the high side MOSFETs (Q1, Q2, Q3) have source sense wire bonds, the low  
DS(ON)  
side MOSFETs (Q4, Q5, Q6) do not have source sense wire bonds, thus resulting in higher R  
values.  
DS(ON)  
TEMPERATURE SENSE (NTC Thermistor)  
Symbol  
Test Conditions  
Test Time  
Min  
Typ  
Max  
Unit  
Voltage  
Current = 1 mA, Temperature = 25_C  
T = 0.5 ms  
T = 0.5 ms  
7.5  
12  
V
CURRENT SENSE RESISTOR  
Symbol  
Test Conditions  
Current Sense resistor current = 80 A  
Test Time  
Min  
Typ  
Max  
Unit  
Resistance  
0.46  
0.53  
mW  
www.onsemi.com  
5
 
FTCO3V455A1  
TYPICAL CHARACTERISTICS  
(Generated using MOSFETs assembled in a TO263 package, for reference purposes only.)  
4000  
1000  
500  
If R = 0  
t
= (L)(I )/(1.3*RATED BV  
− V )  
AV  
AS  
DSS DD  
00  
10us  
If R  
AV  
t
= (L/R)ln[(I *R)/(1.3*RATED BV  
− V ) +1]  
AS  
DSS DD  
100  
10  
1
100us  
100  
10  
1
STARTING TJ = 25oC  
LIMITED  
BY PACKAGE  
STARTING TJ = 150oC  
1ms  
10ms  
DC  
OPERATION IN THIS SINGLE PULSE  
AREA MAY BE  
LIMITED BY r  
T
= MAX RATED  
J
o
DS(on)  
T
C
= 25 C  
0.1  
0.01  
0.1  
1
10  
100  
1000 5000  
11  
0
100  
tAV, TIME INAVALANCHE (ms)  
V
DS, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to Application Notes AN7514 and AN7515  
Figure 3. Forward Bias Safe Operating Area  
Figure 4. Unclamped Inductive Switching Capability  
160  
160  
PULSE DURATION = 80ms  
VGS = 10V  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
DUTY CYCLE = 0.5% MAX  
VGS = 5V  
V
DD = 5V  
120  
80  
40  
0
120  
80  
40  
0
VGS = 4.5V  
TJ = 175oC  
TJ = 25oC  
VGS = 4V  
TJ = −55oC  
VGS = 3.5V  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
0
1
2
3
4
V
TO SOURCE VOLTAGE (V)  
V
GS, GATE TO SOURCE VOLTAGE (V)  
DS , DRAIN  
Figure 5. Transfer Characteristics  
Figure 6. Saturation Characteristics  
50  
40  
30  
20  
10  
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80ms  
DUTYCYCLE = 0.5% MAX  
TJ = 25oC  
TJ = 175oC  
I
D = 80A  
VGS = 10V  
3
4
5
6
7
8
9
10  
−80 −40  
0
40  
80 120 160 200  
o
TJ, JUNCTION TEMPERATURE( C)  
VGS, GATETO SOURCE VOLTAGE(V)  
Figure 7. Drain to Source On−Resistance Variation Figure 8. Normalized Drain to Source On Resistance  
vs Gate to Source Voltage vs Junction Temperature  
www.onsemi.com  
6
FTCO3V455A1  
TYPICAL CHARACTERISTICS  
(Generated using MOSFETs assembled in a TO263 package, for reference purposes only.)  
1.15  
1.2  
1.0  
0.8  
0.6  
0.4  
ID = 250mA  
VGS = VDS  
ID = 250mA  
1.10  
1.05  
1.00  
0.95  
0.90  
-80ꢀꢁ-40  
0
40  
80 120 160 200  
-80ꢀꢁ-40  
0
40  
80 120 160 200  
TJ, JUNCTION TEMPERATURE(oC)  
TJ, JUNCTION TEMPERATURE(oC)  
Figure 9. Normalized Gate Threshold Voltage  
vs Junction Temperature  
Figure 10. Normalized Drain to Source Breakdown  
Voltage vs Junction Temperature  
10  
40000  
ID = 80A  
Ciss  
V
DD = 15V  
8
6
4
2
0
10000  
VDD = 25V  
Coss  
VDD = 20V  
1000  
Crss  
f = 1MHz  
VGS = 0V  
100  
0
50  
1 00  
150  
200  
250  
0.1  
1
10  
50  
VDS, DRAIN TO SOURCE VOLTAGE(V)  
Qg, GATECHARGE(nC)  
Figure 11. Capacitance vs Drain to Source  
Voltage  
Figure 12. Gate Charge vs Gate to Source Voltage  
www.onsemi.com  
7
FTCO3V455A1  
MECHANICAL CHARACTERISTICS AND RATINGS  
Limits  
Typ  
Min  
0
Max  
+200  
0.8  
Parameter  
Device Flatness  
Condition  
Unit  
mm  
N.m  
g
Note Figure 13.  
Mounting Torque  
Weight  
Mounting Screw: − M3, Recommended 0.7 N.m  
0.6  
0.7  
20  
1
Figure 13. Flatness Measurement Position  
ORDERING INFORMATION  
Device Marking  
MOSFET  
Packing Type  
Quantity  
FTCO3V455A1  
PCF33478  
Tube  
11  
www.onsemi.com  
8
 
FTCO3V455A1  
VBAT  
GND PHASE U PHASE V PHASE W  
Figure 14.  
www.onsemi.com  
9
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
APMCBA19 / 19LD, APM, PDD STD DBC, DIP TYPE  
CASE MODCG  
ISSUE O  
DATE 31 DEC 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13507G  
APMCBA19 / 19LD, APM, PDD STD DBC, DIP TYPE  
PAGE 1 OF 1  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
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© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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