FXMA2104UMX [ONSEMI]
双电源、4位电源转换器/缓冲器/中继器/隔离器,用于开路漏极应用;型号: | FXMA2104UMX |
厂家: | ONSEMI |
描述: | 双电源、4位电源转换器/缓冲器/中继器/隔离器,用于开路漏极应用 中继器 接口集成电路 转换器 |
文件: | 总17页 (文件大小:1619K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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July 2012
FXMA2104
Dual-Supply, 4-Bit Voltage Translator / Buffer /
Repeater / Isolator for Open-Drain Applications
Features
Description
The FXMA2104 is
a
4-bit high-performance,
.
Bi-Directional Interface between Any Two Levels:
1.65V to 5.5V
configurable dual-voltage supply, open-drain translator
for bi-directional voltage translation over a wide range of
input and output voltages levels.
.
.
Direction Control not Needed
System GPIO Resources Not Required when OE
Tied to VCCA
I2C 400pF Buffer / Repeater
I2C-Bus® Isolation
Intended for use as a voltage translator in applications
using the I2C-Bus® interface, the input and output
voltage levels are compatible with I2C device
specification voltage levels. External pull-up resistors
are required.
.
.
.
A/B Port VOL = 175mV (Typical), VIL = 150mV,
IOL = 6mA
The device is designed so that the A port tracks the
VCCA level and the B port tracks the VCCB level. This
allows for bi-directional A/B port voltage translation
between any two levels from 1.65V to 5.5V. VCCA can
equal VCCB from 1.65V to 5.5V.
.
.
Open-Drain Inputs / Outputs
Accommodates Standard-Mode and Fast-Mode
I2C-Bus Devices
Non-preferential power-up means either VCC can be
powered-up first. Internal power-down control circuits
place the device in 3-state if either VCC is removed.
.
.
.
Supports I2C Clock Stretching & Multi-Master
Fully Configurable: Inputs and Outputs Track VCC
The two ports of the device have automatic direction-
sense capability. Either port may sense an input signal
and transfer it as an output signal to the other port.
Non-Preferential Power-Up; Either VCC May Be
Powered-Up First
.
.
.
Outputs Switch to 3-State if Either VCC is at GND
Tolerant Output Enable: 5V
Packaged in 12-Lead Ultrathin MLP
(1.8mm x 1.8mm)
.
ESD Protection Exceeds:
- 5kV HBM ESD (per JESD22-A114)
- 2kV CDM (per JESD22-C101)
Ordering Information
Operating
Temperature
Range
Top
Mark
Packing
Part Number
Package
Method
5000 Units on
Tape and Reel
FXMA2104UMX
-40 to +85°C
BX
12-Lead, Ultrathin, MLP, 1.8mm x 1.8mm
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
Block Diagram
OE
VCCB
Dynamic Driver
Internal Direction
Generator &
Control
(with Time Out)
VbiasB
VbiasA
B
A
VCCA
Internal Direction
Generator &
Control
Dynamic Driver
(with Time Out)
Figure 1. Block Diagram, 1 of 4 Channels
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
2
Pin Configuration
Figure 2. UMLP (Top-Through View)
Pin Definitions
Pin #
Name
Description
1
VCCB
VCCA
B-Side Power Supply
A-Side Power Supply
2
3, 4, 5, 6
A0, A1, A2, A3
GND
A-Side Inputs or 3-State Outputs
Ground
7
8
OE
Output Enable Input
9, 10, 11, 12
B3, B2, B1, B0,
B-Side Inputs or 3-State Outputs
Truth Table
Control
Outputs
OE
LOW Logic Level
HIGH Logic Level
3-State
Normal Operation
Note:
1. If the OE pin is driven LOW, the FXMA2104 is disabled and the A0, A1, A2, A3, B0, B1, B2 and B3 pins (including
dynamic drivers) are forced into 3-state.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
Max.
Units
VCCA, VCCB Supply Voltage
7.0
7.0
A Port
V
VIN
DC Input Voltage
Output Voltage(2)
B Port
7.0
Control Input (OE)
An Outputs 3-State
Bn Outputs 3-State
An Outputs Active
Bn Outputs Active
At VIN < 0V
7.0
7.0
7.0
VO
V
VCCA + 0.5V
VCCB + 0.5V
-50
IIK
DC Input Diode Current
DC Output Diode Current
mA
mA
At VO < 0V
-50
IOK
At VO > VCC
+50
IOH / IOL
ICC
DC Output Source/Sink Current
-50
-65
+50
mA
mA
mW
°C
DC VCC or Ground Current per Supply Pin
±100
0.129
+150
5
PD
Power Dissipation
At 400KHz
TSTG
Storage Temperature Range
Human Body Model, JESD22-A114
Charged Device Mode, JESD22-C101
Electrostatic Discharge
Capability
ESD
kV
2
Note:
2. IO absolute maximum rating must be observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
1.65
0
Max.
5.50
5.5
Units
VCCA, VCCB Power Supply Operating
V
A Port
VIN
Input Voltage
B Port
0
5.5
V
Control Input (OE)
0
VCCA
Thermal Resistance
301.5
+85
C°/W
°C
ΘJA
TA
Free Air Operating Temperature
-40
Note:
3. All unused inputs and I/O pins must be held at VCCI or GND, VCCI is the VCC associated with the input side.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
4
Functional Description
Power-Up/Power-Down Sequencing
FXM translators offer an advantage in that either VCC
may be powered up first. This benefit derives from the
chip design. When either VCC is at 0V, outputs are in a
high-impedance state. The control input (OE) is
designed to track the VCCA supply. A pull-down resistor
tying OE to GND should be used to ensure that bus
contention, excessive currents, or oscillations do not
occur during power-up/power-down. The size of the pull-
down resistor is based upon the current-sinking
capability of the device driving the OE pin.
The recommended power-up sequence is:
1. Apply power to the first VCC
2. Apply power to the second VCC
.
.
3. Drive the OE input HIGH to enable the device.
The recommended power-down sequence is:
1. Drive OE input LOW to disable the device.
2. Remove power from either VCC
.
3. Remove power from other VCC
.
Note:
4. Alternatively, the OE pin can be hardwired to VCCA
to save GPIO pins. If OE is hardwired to VCCA
either VCC can be powered up or down first.
,
Application Circuit
Figure 3. Application Circuit
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
5
Application Information
The FXMA2104 has open-drain I/Os and requires
external pull-up resistors on the eight data I/O pins, as
shown in Figure 3. If a pair of data I/O pins (An/Bn) is not
used, both pins should be tied to GND (or both to VCC).
In this case, pull-down or pull-up resistors are not
required. The recommended values for the pull-up
resistors (RPUs) are 1KΩ to 10K, depending on the total
bus capacitance, the user is free to vary the pull-up
resistor value to meet the maximum I2C edge rate per
the I2C specification (UM10204 rev. 03, June 19, 2007).
For example, the maximum edge rate (30% - 70%)
during Fast Mode (400kbit/s) is 300ns. If bus
capacitance is approaching the maximum 400pF, lower
the RPU value to keep the rise time below 300ns (Fast
Mode). Section 7.1 of the I2C specification provides an
excellent guideline for pull-up resistor sizing.
between the ports until either of the port’s VCC/2
thresholds are reached. After the RC time constant has
reached the VCC/2 threshold of either port, the port’s
edge detector triggers both dynamic drivers to drive
their respective ports in the LOW-to-HIGH (LH)
direction, accelerating the rising edge. The resulting rise
time resembles the scope shot in Figure 4. Effectively,
two distinct slew rates appear in rise time. The first slew
rate (slower) is the RC time constant of the bus. The
second slew rate (much faster) is the dynamic driver
accelerating the edge.
If both the A and B ports of the translator are HIGH, a
high-impedance path exists between the A and B ports
because both the Npassgates are turned off. If a master
or slave device decides to pull SCL or SDA LOW, that
device’s driver pulls down (Isink) SCL or SDA until the
edge reaches the A or B port VCC/2 threshold. When
either the A or B port threshold is reached, the port’s
edge detector triggers both dynamic drivers to drive
their respective ports in the HIGH-to-LOW (HL)
direction, accelerating the falling edge.
Theory of Operation
The FXMA2104 is designed for high-performance level
shifting and buffer / repeating in an I2C application.
Figure 1 shows that each bi-directional channel contains
two series-Npassgates and two dynamic drivers. This
hybrid architecture is highly beneficial in an I2C
application where auto-direction is a necessity.
For example, during the following three I2C protocol
events:
.
.
Clock Stretching
Slave’s ACK Bit (9th bit = 0) following a Master’s
Write Bit (8th bit = 0)
.
Clock Synchronization and Multi Master
Arbitration
the bus direction needs to change from master-to-slave
to slave-to-master without the occurrence of an edge. If
there is an I2C translator between the master and slave
in these examples, the I2C translator must change
direction when both A and B ports are LOW. The
Npassgates can accomplish this task very efficiently
because, when both A and B ports are LOW, the
Npassgates act as a low resistive short between the two
(A and B) ports.
Due to I2C’s open-drain topology, I2C masters and
slaves are not push-pull drivers. Logic LOWs are “pulled
down” (Isink), while logic HIGHs are “let go” (3-state). For
example, when the master lets go of SCL (SCL always
comes from the master), the rise time of SCL is largely
determined by the RC time constant, where R = RPU and
C = the bus capacitance. If the FXMA2104 is attached
to the master [on the A port] and there is a slave on the
B port, the Npassgates act as a low resistive short
Figure 4. Waveform C: 600pF, Total RPU: 2.2KΩ
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
6
VOL vs. IOL
Buffer / Repeater Performance
The I2C specification mandates a maximum VIL (IOL of
3mA) of VCC • 0.3 and a maximum VOL of 0.4V. If there
is a master on the A port of an I2C translator with a VCC
of 1.65V and a slave on the I2C translator B port with a
VCC of 3.3V, the maximum VIL of the master is (1.65V x
0.3) 495mV. The slave could legally transmit a valid
logic LOW of 0.4V to the master.
If the I2C translator’s channel resistance is too high, the
voltage drop across the translator could present a VIL to
the master greater than 495mV. To complicate matters,
the I2C specification states that 6mA of IOL is
recommended for bus capacitances approaching
400pF. More IOL increases the voltage drop across the
I2C translator. The I2C application benefits when I2C
translators exhibit low VOL performance. Figure 5
depicts typical FXMA2104 VOL performance vs. a
competitor, given a 0.4V VIL.
The FXMA2104 dynamic drivers have enough current-
sourcing capability to drive a 400pF capacitive bus. This
is beneficial when an I2C buffer / repeater is required.
The I2C specification stipulates
a maximum bus
capacitance of 400pF. If an I2C segment exceeds
400pF, an I2C buffer / repeater is required to split the
segment into two segments, each of which is less than
400pF. Figure 4 is a scope shot of an FXMA2104
driving a lumped load of 600pF. Notice the (30% - 70%)
rise time is only 112ns (total RPU = 2.2K). This is well
below the maximum edge rate of 300ns. Not only does
the FXMA2104 drive 400Pf; it also provides excellent
headroom below the I2C specification maximum edge
rate of 300ns.
Figure 5. VOL vs. IOL
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
7
condition from slave #2 to slave #1 as well as the
master. However, if the OE pin is pulled LOW
(disabled), both ports (A and B) are 3-stated. This
results in the FXMA2104 isolating slave #2 from the
master and slave #1, allowing full communication
between the master and slave #1.
I2C Bus Isolation
The FXMA2104 supports I2C-Bus® isolation for the
following conditions:
. Bus isolation if bus clear
. Bus isolation if either VCC goes to ground
Bus Clear
Either VCC to GND
If slave #2 is a camera that is suddenly removed from
the I2C bus, resulting in VCCB transitioning from a valid
VCC (1.65V – 5.5V) to 0V; the FXMA2104 automatically
forces all I/Os on both its A and B ports into 3-state.
Once VCCB has reached 0V, full I2C communication
between the master and slave #1 remains undisturbed.
Because the I2C specification defines the minimum SCL
frequency of DC, the SCL signal can be held LOW
forever; however, this condition shuts down the I2C bus.
The I2C specification refers to this condition as Bus
Clear. In Figure 6, if slave #2 holds down SCL forever,
the master and slave #1 are not able to communicate
because the FXMA2104 passes the SCL stuck-LOW
Slave#1
VCC = 3.3V
VCC = 1.8V
VCCA
VCCB
SCL1
SCL1
SDA
SCL1
SDA
SCL1
Slave#2
1
1
SDA1
1
SDA
VCC = 3.3V
FXMA2104
I2
VCC = 1.8V
C Buffer
Master
Translator
SCL2
SDA 2
SCL2
SCL2
SCL2
SDA2
Slave #3
OE
SDA2
SDA 2
OE: High Enable
Low Disable
GPIO3
VCCA
:
VCCB :
1.65V – 5.5V VCC
Domain
1.65V – 5.5V VCC
Domain
Figure 6. Bus Isolation
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
8
DC Electrical Characteristics
TA = –40°C to +85°C.
Symbol
Parameter
Condition
VCCA (V) VCCB (V)
Min.
Max.
Unit
Data Inputs An
1.65–5.50 1.65–5.50 VCCA – 0.4
1.65–5.50 1.65–5.50 0.7 x VCCA
High Level Input
Voltage A
VIHA
V
Control Input OE
High Level Input
Voltage B
VIHB
VILA
VILB
Data Inputs Bn
1.65–5.50 1.65–5.50 VCCB – 0.4
V
V
V
Data Inputs An
1.65–5.50 1.65–5.50
1.65–5.50 1.65–5.50
0.4
Low Level Input
Voltage A
Control Input OE
0.3 x VCCA
Low Level Input
Voltage B
Data Inputs Bn
VIL = 0.15V
1.65–5.50 1.65–5.50
1.65–5.50 1.65–5.50
1.65–5.50 1.65–5.50
0.4
0.4
Low Level Output
Voltage
VOL
V
IOL = 6mA
Input Leakage
Current
Control Input OE,
IL
±1
±2
±2
±2
±2
±2
5
µA
VIN = VCCA or GND
V
5.5V
IN or VO = 0V to
An
0
5.50
0
Power-Off Leakage
Current
IOFF
µA
µA
VIN or VO = 0V to
5.5V
Bn
5.50
5.50
5.50
0
An, VO = 0V to 5.5V,
Bn OE = VIL
5.50
0
3-State Output
Leakage(6)
VO = 0V to 5.5V,
An
IOZ
OE = Don’t Care
VO = 0V to 5.5V,
Bn
5.50
OE = Don’t Care
Quiescent Supply
Current(7,8)
VIN = VCCI or GND,
IO = 0
ICCA B
/
1.65–5.50 1.65–5.50
1.65–5.50 1.65–5.50
µA
µA
VIN = VCCI or GND,
Quiescent Supply
Current(7)
ICCZ
IO = 0,
OE = VIL
5
VIN = 5.5V or GND,
IO = 0,
OE = Don’t Care,
Bn to An
0
1.65–5.50
-2
2
Quiescent Supply
Current(6)
ICCA
µA
µA
1.65–5.50
1.65–5.50
0
0
0
VIN = 5.5V or GND,
IO = 0,
OE = Don’t Care,
An to Bn
-2
2
Quiescent Supply
Current(6)
ICCB
1.65–5.50
Notes:
5. This table contains the output voltage for static conditions. Dynamic drive specifications are given in Dynamic
Output Electrical Characteristics.
6. “Don’t Care” indicates any valid logic level.
7.
VCCI is the VCC associated with the input side.
8. Reflects current per supply, VCCA or VCCB
.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
9
Dynamic Output Electrical Characteristics
Output Rise / Fall Time
Output load: CL = 50pF, RPU = 2.2kΩ, push / pull driver, and TA = -40°C to +85°C.
(10)
VCCO
4.5 to 5.5V 3.0 to 3.6V 2.3 to 2.7V 1.65 to 1.95V
Symbol
Parameter
Unit
Typical
trise
tfall
Output Rise Time; A Port, B Port(11)
Output Fall Time; A Port, B Port(12)
3
4
8
5
6
7
4
ns
ns
11
Notes:
9. Output rise and fall times guaranteed by design simulation and characterization; not production tested.
10. CCO is the VCC associated with the output side.
V
11. See Figure 11.
12. See Figure 12.
)
Maximum Data Rate(13
Output load: CL = 50pF, RPU = 2.2kΩ, push-pull driver, and TA = -40°C to +85°C.
VCCB
VCCA
Direction
4.5 to 5.5V
3.0 to 3.6V
2.3 to 2.7V
1.65 to 1.95V Unit
Minimum
A to B
B to A
A to B
B to A
A to B
B to A
A to B
B to A
26
26
26
26
26
26
26
26
20
20
20
20
20
20
20
20
16
16
16
16
16
16
16
16
9
4.5V to 5.5V
3.0V to 3.6V
2.3V to 2.7V
MHz
9
9
MHz
9
9
MHz
9
9
1.65V to 1.95V
MHz
9
Note:
13. F-toggle guaranteed by design simulation; not production tested.
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FXMA2104 • Rev. 1.0.1
10
AC Characteristics(17)
Output Load: CL = 50pF, RPU = 2.2kΩ, and TA = -40°C to +85°C.
VCCB
3.0 to 3.6V 2.3 to 2.7V 1.65 to 1.95V Units
Typ. Max. Typ. Max. Typ. Max. Typ. Max.
Symbol
Parameter
4.5 to 5.5V
VCCA = 4.5 to 5.5V
A to B
tPLH
1
1
3
3
1
2
3
4
1
3
3
5
1
4
3
7
ns
ns
ns
B to A
A to B
tPHL
2
4
3
5
4
6
6
7
B to A
2
4
2
5
2
6
5
7
OE to A
tPZL
4
5
6
10
7
5
9
7
15
15
105
16
1.0
OE to B
3
5
4
5
8
10
65
9
OE to A
tPLZ
65
5
100
9
65
6
105
10
1.0
65
7
105
12
1.0
ns
ns
OE to B
tskew
A Port, B Port(14)
0.5
1.5
0.5
0.5
0.5
VCCA = 3.0 to 3.6V
A to B
tPLH
2.0
1.5
2
5.0
3.0
4
1.5
1.5
2
3.0
4.0
4
1.5
2.0
2
3.0
6.0
5
1.5
3.0
6
3.0
9.0
7
ns
ns
ns
B to A
A to B
tPHL
B to A
2
4
2
4
2
5
3
5
OE to A
tPZL
4
8
5
9
6
11
11
115
10
1.0
7
15
14
115
15
1.0
OE to B
4
8
6
9
8
10
100
9
OE to A
tPLZ
100
5
115
10
1.5
100
4
115
8
100
5
ns
ns
OE to B
tskew
A Port, B Port(14)
0.5
0.5
1.0
0.5
0.5
VCCA = 2.3 to 2.7V
A to B
tPLH
2.5
1.5
2
5.0
3.0
5
2.5
2.0
2
5.0
4.0
5
2.0
3.0
2
4.0
6.0
5
1.0
5.0
5
3.0
10.0
6
ns
ns
ns
B to A
A to B
tPHL
B to A
2
5
2
5
2
5
3
6
OE to A
tPZL
5
10
5
10
6
12
9.0
9.0
100
12
0.5
18.0
18.0
115
25
OE to B
4.0
100
65
0.5
8.0
115
110
1.5
4.5
100
65
0.5
9.0
115
110
1.0
5.0
100
65
0.5
10.0
115
115
1.0
OE to A
tPLZ
ns
ns
OE to B
tskew
A Port, B Port(14)
1.0
VCCA = 1.65 to 1.95V
A to B
tPLH
4.0
1.0
5
7.0
2.0
8
40.
1.0
3
7.0
2.0
7
5.0
1.5
3
8.0
3.0
7
5.0
5.0
8
10.0
10.0
9
ns
ns
ns
B to A
A to B
tPHL
B to A
4
8
3
7
3
7
3
7
OE to A
tPZL
11
6
15
14
115
115
1.5
11
6
14
14
115
115
1.0
14
6
28
14
115
115
1.0
14
9
23
OE to B
19
OE to A
tPLZ
75
75
0.5
75
75
0.5
75
75
0.5
75
75
0.5
115
115
1.0
ns
ns
OE to B
tskew
A Port, B Port(14)
Note:
14. Skew is the variation of propagation delay between output signals and applies only to output signals on the same
port (An or Bn) and switching with the same polarity (LOW-to-HIGH or HIGH-to-LOW) (see Figure 14). Skew is
guaranteed, but not tested.
15. AC Characteristic is guaranteed by Design and Characterization.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
11
Capacitance
TA = +25°C.
Symbol
Parameter
Condition
Typical Unit
CIN
CI/O
Cpd
Input Capacitance Control Pin (OE) VCCA = VCCB = GND
2.2
pF
pF
pF
Input / Output Capacitance, An, Bn
Power Dissipation Capacitance
VCCA = VCCB = 5.0V, OE = GND
13.0
13.5
VCCA = VCCB = 5.0V, VIN = 0V or VCC, f = 400KHz
Figure 7. AC Test Circuit
Table 1. Propagation Delay Table(17)
Test
Input Signal
Output Enable Control
VCCA
tPLH, tPHL
Data Pulses
tPZL (OE to An, Bn)
tPLZ (OE to An, Bn)
0V
0V
LOW to HIGH Switch
HIGH to LOW Switch
Table 2. AC Load Table
VCCO
CL
RL
1.8 ± 0.15V
2.5 ± 0.2V
3.3 ± 0.3V
5.0 ± 0.5V
50pF
50pF
50pF
50pF
2.2kΩ
2.2kΩ
2.2kΩ
2.2kΩ
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
12
Timing Diagrams
V
CCI
DATA
IN
V
CCA
V
mi
OUTPUT
CONTROL
V
mi
GND
GND
t
t
t
pxx
pxx
PZL
DATA
OUT
V
CCO
V
DATA
OUT
Y
V
V
OL
mo
Figure 8. Waveform for Inverting and Non-Inverting
Functions(16)
Figure 9. 3-STATE Output Low Enable Time(16)
V
CCA
Symbol
Vmi
VCC
OUTPUT
V
mi
CONTROL
GND
VCCI / 2
t
PLZ
Vmo
VCCO / 2
0.5 x VCCO
0.1 x VCCO
DATA
OUT
V
VX
x
V
OL
VY
Figure 10. 3-STATE Output High Enable Time(16)
Figure 11. Active Output Rise Time
Figure 12. Active Output Fall Time
V
CCO
DATA
OUTPUT
V
V
mo
mo
GND
t
period
t
t
skew
skew
V
CCI
DATA
IN
V
/ 2
V
/ 2
CCI
CCI
V
CCO
GND
DATA
OUTPUT
V
V
mo
mo
F-toggle rate, f = 1 / t
period
GND
t
= (t
– t
)
(t
– t
)
skew
pHLmax pHLmin or pLHmax pLHmin
Figure 13. F-Toggle Rate
Figure 14. Output Skew Time
Notes:
16. Input tR = tF = 2.0ns, 10% to 90% at VIN = 1.65V to 1.95V;
Input tR = tF = 2.0ns, 10% to 90% at VIN = 2.3 to 2.7V;
Input tR = tF = 2.5ns, 10% to 90%, at VIN = 3.0V to 3.6V only;
Input tR = tF = 2.5ns, 10% to 90%, at VIN = 4.5V to 5.5 only.
17. VCCI = VCCA for control pin OE or Vmi = (VCCA / 2).
© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FXMA2104 • Rev. 1.0.1
13
Physical Dimensions
(11X)
0.563
2.10
1.80
A
B
0.10
C
0.588
0.40
2X
1
1.80
2.10
PIN#1 IDENT
0.10 C
(12X)
0.20
TOP VIEW
2X
RECOMMENDED
LAND PATTERN
0.55 MAX.
0.152
0.10 C
0.08
0.45
0.35
C
0.10
0.05
0.00
SEATING
PLANE
C
0.10
0.10
SIDE VIEW
DETAIL A
SCALE : 2X
0.35
(11X)
NOTES:
0.45
3
6
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
0.40
B. DIMENSIONS ARE IN MILLIMETERS.
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
12
9
0.25
0.15
(12X)
BOTTOM VIEW
0.10
C A B
E. DRAWING FILENAME: MKT-UMLP12Arev4.
0.05
C
PACKAGE
EDGE
LEAD
LEAD
OPTION 2
SCALE : 2X
OPTION 1
SCALE : 2X
Figure 15. 12-Lead Ultrathin MLP, 1.8mm x 1.8mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
14
© 2011 Fairchild Semiconductor Corporation
FXMA2104 • Rev. 1.0.1
www.fairchildsemi.com
15
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