GBU6B [ONSEMI]

6 A 桥式整流器;
GBU6B
型号: GBU6B
厂家: ONSEMI    ONSEMI
描述:

6 A 桥式整流器

局域网 二极管
文件: 总5页 (文件大小:174K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
Bridge Rectifiers  
GBU6A - GBU6M  
Features  
GlassPassivated Junction  
Surge Overload Rating: 175 A Peak  
Reliable LowCost Construction Utilizing Molded Plastic Technique  
Ideal for Printed Circuit Board  
UL Certified: UL #E258596  
SIP4  
CASE 127EL  
PACKAGE MARKING AND ORDERING INFORMATION  
Packing  
MARKING DIAGRAM  
Method  
Part Number  
Marking  
GBU6A  
GBU6B  
GBU6D  
GBU6G  
GBU6J  
GBU6K  
GBU6M  
Package  
GBU6A  
GBU 4L  
Rail  
RU$Y&Z&3  
GBU6B  
GBU  
6A  
GBU6D  
GBU6G  
GBU6J  
~
~
+
GBU6K  
GBU6M  
RU  
= UL Marking  
$Y  
&Z  
&3  
GBU6A  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Specific Device Code  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
June, 2022 Rev. 3  
GBU6M/D  
GBU6A GBU6M  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted) (Note 1)  
A
Value  
6G  
6A  
50  
35  
50  
6B  
100  
70  
6D  
6J  
6K  
6M  
1000  
700  
Symbol  
Parameter  
Units  
V
V
Maximum Repetitive Reverse Voltage  
Maximum RMS Bridge Input Voltage  
200  
140  
200  
400  
280  
400  
6.0  
600  
420  
600  
800  
560  
800  
V
V
V
A
RRM  
RMS  
V
R
DC Reverse Voltage (Rated V )  
100  
1000  
R
I
Average Rectified Forward  
Current  
T = 100°C  
A
F(AV)  
I
NonRepetitive Peak Forward Surge Current  
8.3 ms Single HalfSineWave  
175  
A
FSM  
T
Storage Temperature Range  
55 to +150  
55 to +150  
°C  
°C  
STG  
T
J
Operating Junction Temperature  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
THERMAL CHARECTERISTICS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
Value  
12  
Units  
W
P
D
Power Dissipation  
R
Thermal Resistance per Leg, Junction to Ambient (Note 2)  
Thermal Resistance per Leg, Junction to Lead (Note 3)  
18.6  
3.1  
°C/W  
°C/W  
q
JA  
R
q
JL  
2. Device mounted on PCB with 0.5 × 0.5 inch (12 × 12 mm)  
3. Device mounted on Al plate with 2.6 × 1.4 × 0.06 inch (6.5 × 3.5 × 0.15 cm)  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Value  
1.0  
Units  
V
V
I
Forward Voltage, per Element  
6.0 A  
F
Reverse Current, per Element at Rated V  
T = 25°C  
A
5.0  
mA  
R
R
T = 125°C  
500  
127  
mA  
A
2
2
2
I t  
I t Rating for Fusing  
t < 8.35 ms  
A s  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
 
GBU6A GBU6M  
TYPICAL PERFORMANCE CHARACTERISTICS  
5
4
3
100  
10  
1
HEATSINK  
MOUNTING, TC  
4x4x0.15”  
T
A
= 25°C  
COPPER PLATE  
2
1
Pulse Width = 300 ms  
1% Duty Cycle  
MOUNTED ON PC BOARD,  
TA 0.5” (12.7 mm) LEAD LENGTH  
60 Hz RESISTIVE OR INDUCTIVE LOAD  
0.1  
0.7  
0
0
50  
100  
150  
0.8  
0.9  
1.0  
1.1  
1.2  
1.3  
1.4  
Ambient Temperature (5C)  
V , Forward Voltage (V)  
F
Figure 1. Forward Current Derating Curve  
Figure 2. Forward Voltage Characteristics  
10  
175  
T
= 100°C  
C
140  
105  
70  
1
0.1  
T
= 105°C  
J
T
= 25°C  
C
35  
0
0.01  
0
20  
40  
60  
80  
100  
120  
140  
1
2
5
10  
20  
50  
100  
Number of Cycles at 60 Hz  
Percent of Rated Peak Reverse Voltage (%)  
Figure 3. Reverse Current vs. Reverse Voltage  
Figure 4. NonRepetitive Surge Current  
400  
T
A
= 25°C  
f = 1.0 MHz  
Visg = 50m Vpp  
100  
50  
10  
1
5
10  
50  
100  
V , Reverse Voltage (V)  
R
Figure 5. Total Capacitance  
www.onsemi.com  
3
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SIP4 22.05x18.55  
CASE 127EL  
ISSUE O  
DATE 31 DEC 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13717G  
SIP4 22.05x18.55  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
ADDITIONAL INFORMATION  
TECHNICAL PUBLICATIONS:  
Technical Library: www.onsemi.com/design/resources/technicaldocumentation  
onsemi Website: www.onsemi.com  
ONLINE SUPPORT: www.onsemi.com/support  
For additional information, please contact your local Sales Representative at  
www.onsemi.com/support/sales  

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