H11L3SR2M [ONSEMI]

6 引脚 DIP 施密特触发器输出光耦合器;
H11L3SR2M
型号: H11L3SR2M
厂家: ONSEMI    ONSEMI
描述:

6 引脚 DIP 施密特触发器输出光耦合器

输出元件 光电 触发器
文件: 总9页 (文件大小:338K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
6-Pin DIP Schmitt Trigger  
Output Optocoupler  
H11L1M, H11L2M, H11L3M  
Description  
The H11LXM series has a highspeed integrated circuit detector  
optically coupled to a galliumarsenide infrared emitting diode. The  
output incorporates a Schmitt trigger, which provides hysteresis for  
noise immunity and pulse shaping. The detector circuit is optimized  
for simplicity of operation and utilizes an opencollector output for  
maximum application flexibility.  
www.onsemi.com  
SCHEMATIC  
ANODE  
V
CC  
1
6
5
Features  
High Data Rate, 1 MHz Typical (NRZ)  
Free from Latchup and Oscillation Throughout Voltage and  
Temperature Ranges  
Microprocessor Compatible Drive  
Logic Compatible Output Sinks 16 mA at 0.4 V Maximum  
GND  
CATHODE  
2
3
V
O
4
Guaranteed On/Off Threshold Hysteresis  
Wide Supply Voltage Capability, Compatible with All Popular Logic  
Systems  
Truth Table  
Input  
Output  
H
L
L
Safety and Regulatory Approvals:  
H
UL1577, 4,170 VAC  
for 1 Minute  
RMS  
DINEN/IEC6074755, 850 V Peak Working Insulation Voltage  
Applications  
LogictoLogic Isolator  
Programmable Current Level Sensor  
Line Receiver Eliminate Noise and Transient Problems  
AC to TTL Conversion Square Wave Shaping  
Digital Programming of Power Supplies  
Interfaces Computers with Peripherals  
PDIP6  
CASE 646BX  
PDIP6  
CASE 646BY  
PDIP6  
CASE 646BZ  
MARKING DIAGRAM  
ON  
H11L1  
VYWWQ  
H11L1  
V
Y
= Specific Device Code  
= DIN EN/IEC4074755 Option  
= Year Code  
WW  
Q
= Work Week  
= Assembly Package Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5  
of this data sheet.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
June, 2020 Rev. 3  
H11L3M/D  
H11L1M, H11L2M, H11L3M  
SAFETY AND INSULATION RATINGS  
As per DIN EN/IEC 6074755, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with  
the safety ratings shall be ensured by means of protective circuits.  
Parameter  
Characteristics  
Installation Classifications per DIN VDE  
0110/1.89 Table 1, For For Rated Mains Voltage  
< 150 V  
< 300 V  
IIV  
IIV  
RMS  
RMS  
Climatic Classification  
55/100/21  
2
Pollution Degree (DIN VDE 0110/1.89)  
Comparative Tracking Index  
175  
Symbol  
Parameter  
InputtoOutput Test Voltage, Method A, V  
Value  
Units  
V
PR  
× 1.6 = V  
,
1360  
V
peak  
IORM  
PR  
Type and Sample Test with t = 10 s, Partial Discharge < 5 pC  
m
InputtoOutput Test Voltage, Method B, V  
× 1.875 = V  
,
1594  
V
peak  
IORM  
PR  
100% Production Test with t = 1 s, Partial Discharge < 5 pC  
m
V
Maximum Working Insulation Voltage  
Highest Allowable OverVoltage  
External Creepage  
850  
6000  
7  
V
V
IORM  
peak  
V
IOTM  
peak  
mm  
mm  
mm  
mm  
°C  
External Clearance  
7  
External Clearance (for Option TV, 0.4” Lead Spacing)  
Distance Through Insulation (Insulation Thickness)  
Case Temperature (Note 1)  
10  
0.5  
175  
350  
800  
DTI  
T
S
I
Input Current (Note 1)  
mA  
mW  
W
S,INPUT  
P
Output Power (Note 1)  
S,OUTPUT  
9
R
Insulation Resistance at T , V = 500 V (Note 1)  
>10  
IO  
S
IO  
1. Safety limit values maximum values allowed in the event of a failure.  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameters  
Value  
Units  
TOTAL DEVICE  
T
Storage Temperature  
Operating Temperature  
Junction Temperature  
Lead Solder Temperature  
40 to +125  
40 to +85  
40 to +125  
260 for 10 seconds  
250  
°C  
°C  
STG  
OPR  
T
T
J
°C  
T
°C  
SOL  
P
Total Device Power Dissipation at 25°C  
Derate Above 25°C  
mW  
mW/°C  
D
2.94  
EMITTER  
I
Continuous Forward Current  
Reverse Voltage  
30  
6
mA  
V
F
V
R
I (pk)  
Forward Current Peak (1 ms pulse, 300 pps)  
LED Power Dissipation  
100  
60  
mA  
mW  
F
P
D
DETECTOR  
P
V
Detector Power Dissipation  
150  
0 to 16  
3 to 16  
50  
mW  
V
D
O
V
Allowed Range  
Allowed Range  
45  
65  
V
CC  
V
V
I
O
I Output Current  
4
mA  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
www.onsemi.com  
2
 
H11L1M, H11L2M, H11L3M  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Conditions  
Device  
Min  
0.75  
3
Typ  
Max  
Units  
INDIVIDUAL COMPONENT CHARACTERISTICS  
Emitter  
V
F
Input Forward Voltage  
I = 10 mA  
All  
1.2  
1.0  
1.5  
V
F
I = 0.3 mA  
F
I
R
Reverse Current  
Capacitance  
V
R
= 3 V  
All  
All  
10  
mA  
C
V = 0, f = 1.0 MHz  
100  
pF  
J
Detector  
V
CC  
Operating Voltage Range  
Supply Current  
All  
All  
All  
15  
5.0  
100  
V
I
I = 0, V = 5 V  
1.6  
mA  
mA  
CC(off)  
F
CC  
I
Output Current, High  
I = 0, V = V = 15 V  
F CC O  
OH  
TRANSFER CHARACTERISTICS  
DC Characteristics  
I
Supply Current  
I = 10 mA, V = 5 V  
All  
All  
1.6  
0.2  
5.0  
0.4  
mA  
V
CC(on)  
F
CC  
V
OL  
Output Voltage, Low  
R = 270 W, V = 5 V,  
L CC  
I = I  
max.  
F
F(on)  
I
TurnOn Threshold Current  
R = 270 W, V = 5 V  
H11L1M  
H11L2M  
H11L3M  
All  
1.6  
10.0  
5.0  
mA  
F(on)  
L
CC  
(Note 2)  
I
TurnOff Threshold Current  
R = 270 W, V = 5 V  
0.3  
1.0  
mA  
F(off)  
L
CC  
I
/I  
Hysteresis Ratio  
R = 270 W, V = 5 V  
All  
0.50  
0.75  
0.90  
4.0  
F(off) F(on)  
L
CC  
AC Characteristics, Switching Speed  
t
TurnOn Time  
Fall Time  
R = 270 W, V = 5 V,  
All  
All  
All  
All  
All  
1.0  
0.1  
1.2  
0.1  
1.0  
ms  
on  
L
F
CC  
I = I  
, T = 25°C  
F(on)  
A
t
f
t
TurnOff Time  
Rise Time  
4.0  
off  
t
r
Data Rate  
MHz  
ISOLATION CHARACTERISTICS  
V
ISO  
C
ISO  
R
ISO  
InputOutput Isolation Voltage  
Isolation Capacitance  
t = 1 Minute  
4170  
VAC  
RMS  
V
IO  
= 0 V, f = 1 MHz  
0.4  
0.6  
pF  
11  
Isolation Resistance  
V
=
500 VDC, T =  
10  
W
IO  
A
25°C  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 1.6 mA maximum trigger current would require the  
LED to be driven at a current greater than 1.6 mA to guarantee the device turns on. A 10% guard band is recommended to account for  
degradation of the LED over its lifetime. The maximum allowable LED drive current is 30 mA.  
www.onsemi.com  
3
 
H11L1M, H11L2M, H11L3M  
TYPICAL PERFORMANCE CURVES  
6
5
1.6  
V
= 5 V  
= 270 W  
= 25°C  
CC  
I
I
NORMALIZED TO:  
at V = 5 V  
F
R
T
L
V
F(ON)  
CC  
OH  
1.4  
1.2  
T = 25°C  
A
A
4
I
I
TURN ON THRESHOLD  
TURN OFF THRESHOLD  
F(OFF)  
F(ON)  
3
2
1
1.0  
0.8  
0.6  
V
OL  
0.4  
0
0
1
2
3
0
2
4
6
8
10  
12  
14  
16  
I , INPUT CURRENT (mA)  
F
V
CC  
, SUPPLY VOLTAGE (V)  
Figure 1. Transfer Characteristics  
Figure 2. Threshold Current vs. Supply Voltage  
1.6  
1.4  
1.2  
2
1
0.8  
0.6  
0.5  
0.4  
1.0  
NORMALIZED TO:  
V
T
= 5 V  
= 25°C  
CC  
0.8  
0.6  
0.3  
A
0.2  
I
V
R
= I  
F(ON)  
F
0.4  
0.2  
= 5 V  
CC  
= 270 W  
L
0.1  
50  
25  
0
25  
50  
75  
100  
1
10  
100  
T , TEMPERATURE (5C)  
A
I , LOAD CURRENT (mA)  
O
Figure 3. Threshold Current vs. Supply Temperature  
Figure 4. Output Voltage, Low vs. Load Current  
1.7  
1.6  
1.5  
1.4  
1.3  
6
5
4
T
= 0°C  
A
T
= 25°C  
I
F
= 5 mA  
A
T
= 70°C  
A
3
2
1
T
= 55°C  
A
1.2  
T
A
= 0°C  
T
= 25°C  
T = 70°C  
A
A
T
= 25°C  
1.1  
1.0  
A
T
A
= 100°C  
I
F
= 0 mA  
0
0
2
4
6
8
10  
12  
14  
16  
1
10  
100  
I , LED FORWARD CURRENT (mA)  
F
V
CC  
, SUPPLY VOLTAGE (V)  
Figure 5. Supply Current vs. Supply Voltage  
Figure 6. LED Forward Voltage  
vs. Forward Current  
www.onsemi.com  
4
H11L1M, H11L2M, H11L3M  
TYPICAL PERFORMANCE CURVES (continued)  
C
R
V
IN  
50%  
I
6
5 V  
0
I
F
H11L1  
1
2
6
E
R
L
270 W  
4
V
IN  
V
O
t
on  
t
off  
0.1 mF  
5
t = t 0.01 mS  
r
f
Z = 50 W  
10%  
90%  
V
O
t
f
t
r
Figure 7. Switching Test Circuit and Waveforms  
REFLOW PROFILE  
300  
280  
260  
260°C  
>245°C = 42  
Sec  
240  
220  
200  
180  
160  
Time above  
183°C = 90 Sec  
140  
120  
100  
80  
1.822°C/Sec Ramp up  
rate  
60  
40  
20  
33 Sec  
0
0
60  
120  
180  
TIME (s)  
270  
360  
Figure 8. Reflow Profile  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
H11L1M  
Package  
Shipping  
DIP 6Pin  
50 Units/Tube  
50 Units/Tube  
H11L1SM  
SMT 6Pin (Lead Bend)  
H11L1SR2M  
H11L1VM  
SMT 6Pin (Lead Bend)  
1000 Units/Tape & Reel  
50 Units/Tube  
DIP 6Pin, DIN EN/IEC6074755 Option  
SMT 6Pin (Lead Bend), DIN EN/IEC6074755 Option  
SMT 6Pin (Lead Bend), DIN EN/IEC6074755 Option  
DIP 6Pin, 0.4” Lead Spacing, DIN EN/IEC6074755 Option  
H11L1SVM  
H11L1SR2VM  
H11L1TVM  
50 Units/Tube  
1000 Units/Tape & Reel  
50 Units/Tube  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
3. The product orderable part number system listed in this table also applies to the H11L2M and H11L3M product families.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PDIP6 8.51x6.35, 2.54P  
CASE 646BX  
ISSUE O  
DATE 31 JUL 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13449G  
PDIP6 8.51X6.35, 2.54P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PDIP6 8.51x6.35, 2.54P  
CASE 646BY  
ISSUE A  
DATE 15 JUL 2019  
A
B
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13450G  
PDIP6 8.51x6.35, 2.54P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PDIP6 8.51x6.35, 2.54P  
CASE 646BZ  
ISSUE O  
DATE 31 JUL 2016  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13451G  
PDIP6 8.51X6.35, 2.54P  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
products or information herein, without notice. The information herein is provided “asis” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the  
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
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