HUFA75639S3ST [ONSEMI]

100 V、56 A、21 mΩ、D2PAKN 沟道 UltraFET®;
HUFA75639S3ST
型号: HUFA75639S3ST
厂家: ONSEMI    ONSEMI
描述:

100 V、56 A、21 mΩ、D2PAKN 沟道 UltraFET®

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Is Now  
To learn more about onsemi™, please visit our website at  
www.onsemi.com  
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or  
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi  
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regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/  
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application  
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized  
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for  
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,  
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associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative  
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.  
HUFA75639S3ST-F085A  
56A, 100V, 0.025 Ohm, N-Channel  
UltraFET Power MOSFETs  
Features  
• 56A, 100V  
These N-Channel power MOSFETs  
are manufactured using the  
innovative UltraFET® process. This  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
• Related Literature  
advanced process technology  
achieves the lowest possible on-resistance per silicon area,  
resulting in outstanding performance. This device is capable  
of withstanding high energy in the avalanche mode and the  
diode exhibits very low reverse recovery time and stored  
charge. It was designed for use in applications where power  
efficiency is important, such as switching regulators,  
switching converters, motor drivers, relay drivers, low-  
voltage bus switches, and power management in portable  
and battery-operated products.  
- TB334, “Guidelines for Soldering Surface Mount  
Components to PC Boards”  
Symbol  
D
Ordering Information  
PART NUMBER  
PACKAGE  
BRAND  
G
TO263AB  
HUFA75639S3ST-F085A  
75639S  
NOTE: When ordering, use the entire part number. Add the suffix T to  
obtain the TO-263AB variant in tape and reel, e.g., HUFA75639S3ST.  
S
Packaging  
DRAIN  
(FLANGE)  
GATE  
SOURCE  
JEDEC TO-263AB  
Publication Order Number:  
HUFA75639S3ST-F085A/D  
©2012 Semiconductor Components Industries, LLC.  
August-2017, Rev. 3  
HUFA75639S3ST-F085A  
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
100  
100  
±20  
V
V
V
DSS  
DGR  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Drain Current  
Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
56  
Figure 4  
Figures 6, 14, 15  
200  
A
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
DM  
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E  
AS  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.35  
W/ C  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
-55 to 175  
C
J
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
300  
260  
C
C
L
o
pkg  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
o
o
1. T = 25 C to 150 C.  
J
o
Electrical Specifications  
T = 25 C, Unless Otherwise Specified  
C
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
OFF STATE SPECIFICATIONS  
Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
BV  
I
= 250µA, V  
= 0V (Figure 11)  
100  
-
-
-
-
-
V
DSS  
D
GS  
GS  
GS  
I
V
V
V
= 95V, V  
= 90V, V  
= ±20V  
= 0V  
= 0V, T = 150 C  
-
-
-
1
µA  
µA  
nA  
DSS  
DS  
DS  
GS  
o
250  
±100  
C
Gate to Source Leakage Current  
ON STATE SPECIFICATIONS  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
THERMAL SPECIFICATIONS  
I
GSS  
V
V
= V , I = 250µA (Figure 10)  
2
-
-
4
V
GS(TH)  
GS  
DS  
D
r
I
= 56A, V  
= 10V (Figure 9)  
0.021  
0.025  
DS(ON)  
D
GS  
o
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
R
R
(Figure 3)  
TO-247  
-
-
-
-
-
-
0.74  
30  
C/W  
θJC  
o
C/W  
θJA  
o
TO-220, TO-263  
62  
C/W  
SWITCHING SPECIFICATIONS (V  
Turn-On Time  
= 10V)  
GS  
t
V
R
R
= 50V, I  
D
56A,  
= 10V,  
-
-
-
-
-
-
-
110  
ns  
ns  
ns  
ns  
ns  
ns  
ON  
DD  
= 0.89, V  
L
GS  
Turn-On Delay Time  
Rise Time  
t
15  
60  
20  
25  
-
-
-
d(ON)  
= 5.1Ω  
GS  
t
r
Turn-Off Delay Time  
Fall Time  
t
-
d(OFF)  
t
-
f
Turn-Off Time  
t
70  
OFF  
GATE CHARGE SPECIFICATIONS  
Total Gate Charge  
Q
V
V
V
= 0V to 20V  
= 0V to 10V  
= 0V to 2V  
V
DD  
= 50V,  
56A,  
-
-
-
-
-
110  
57  
130  
75  
4.5  
-
nC  
nC  
nC  
nC  
nC  
g(TOT)  
GS  
GS  
GS  
I
D
Gate Charge at 10V  
Q
g(10)  
R
= 0.89Ω  
L
I
= 1.0mA  
g(REF)  
(Figure 13)  
Threshold Gate Charge  
Q
3.7  
9.8  
24  
g(TH)  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Q
gs  
gd  
Q
-
www.onsemi.com  
2
HUFA75639S3ST-F085A  
o
Electrical Specifications  
T = 25 C, Unless Otherwise Specified  
C
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
CAPACITANCE SPECIFICATIONS  
Input Capacitance  
C
V
= 25V, V = 0V,  
GS  
-
-
-
2000  
500  
65  
-
-
-
pF  
pF  
pF  
ISS  
DS  
f = 1MHz  
(Figure 12)  
Output Capacitance  
C
C
OSS  
Reverse Transfer Capacitance  
RSS  
Source to Drain Diode Specifications  
PARAMETER  
Source to Drain Diode Voltage  
Reverse Recovery Time  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
1.25  
110  
UNITS  
V
V
I
I
I
= 56A  
-
-
-
-
-
-
SD  
SD  
SD  
SD  
t
= 56A, dI /dt = 100A/µs  
SD  
ns  
rr  
Reverse Recovered Charge  
Q
= 56A, dI /dt = 100A/µs  
320  
nC  
RR  
SD  
Typical Performance Curves  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
60  
50  
40  
30  
20  
10  
0
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
o
150  
175  
o
T
, CASE TEMPERATURE ( C)  
T , CASE TEMPERATURE ( C)  
C
C
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE  
TEMPERATURE  
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs  
CASE TEMPERATURE  
2
DUTY CYCLE - DESCENDING ORDER  
0.5  
0.2  
1
0.1  
0.05  
0.02  
0.01  
P
DM  
0.1  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
10  
1
2
PEAK T = P  
x Z  
x R + T  
θJC C  
J
DM  
θJC  
0.01  
-4  
10  
-3  
-2  
-1  
0
1
-5  
10  
t, RECTANGULAR PULSE DURATION (s)  
10  
10  
10  
10  
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE  
www.onsemi.com  
3
HUFA75639S3ST-F085A  
Typical Performance Curves (Continued)  
1000  
100  
10  
o
T
= 25 C  
FOR TEMPERATURES  
ABOVE 25 C DERATE PEAK  
C
o
CURRENT AS FOLLOWS:  
175 - T  
150  
C
I = I  
25  
V
= 10V  
GS  
TRANSCONDUCTANCE  
MAY LIMIT CURRENT  
IN THIS REGION  
-5  
10  
-4  
-3  
-2  
10  
-1  
0
1
10  
10  
10  
10  
10  
t, PULSE WIDTH (s)  
FIGURE 4. PEAK CURRENT CAPABILITY  
300  
If R = 0  
1000  
100  
t
= (L)(I )/(1.3*RATED BV  
- V  
)
AV  
AS  
DSS  
DD  
T
T
= MAX RATED  
= 25 C  
J
C
If R 0  
o
t
AV  
= (L/R)ln[(I *R)/(1.3*RATED BV  
AS  
- V ) +1]  
DD  
DSS  
100  
o
STARTING T = 25 C  
J
100µs  
o
STARTING T = 150 C  
J
10  
1
1ms  
OPERATION IN THIS  
AREA MAY BE  
10ms  
V
= 100V  
LIMITED BY r  
DS(ON)  
DSS(MAX)  
10  
0.001  
0.01  
0.1  
1
1
10  
, DRAIN TO SOURCE VOLTAGE (V)  
100  
200  
t
, TIME IN AVALANCHE (ms)  
AV  
V
DS  
NOTE: Refer to ON Semiconductor Application Notes AN9321 and AN9322.  
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA  
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY  
100  
100  
V
= 6V  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
o
GS  
175 C  
V
= 15V  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
DD  
V
= 20V  
= 10V  
= 7V  
GS  
V
GS  
V
GS  
V
= 5V  
GS  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
o
o
25 C  
-55 C  
o
T
= 25 C  
C
0
1.5  
3.0  
4.5  
6.0  
7.5  
0
1
2
3
4
5
6
7
V
, DRAIN TO SOURCE VOLTAGE (V)  
V
GS  
, GATE TO SOURCE VOLTAGE (V)  
DS  
FIGURE 7. SATURATION CHARACTERISTICS  
FIGURE 8. TRANSFER CHARACTERISTICS  
www.onsemi.com  
4
HUFA75639S3ST-F085A  
Typical Performance Curves (Continued)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
1.2  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
V
= V , I = 250µA  
DS  
GS  
D
V
= 10V, I = 56A  
D
GS  
1.0  
0.8  
0.6  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
o
o
T , JUNCTION TEMPERATURE ( C)  
T , JUNCTION TEMPERATURE ( C)  
J
J
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON  
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs  
JUNCTION TEMPERATURE  
RESISTANCE vs JUNCTION TEMPERATURE  
1.2  
3000  
V
= 0V, f = 1MHz  
GS  
ISS  
I
= 250µA  
D
C
C
C
= C  
+ C  
GS  
GD  
2500  
2000  
1500  
1000  
500  
= C  
C + C  
RSS  
OSS  
GD  
DS  
GD  
1.1  
1.0  
0.9  
C
ISS  
C
C
OSS  
RSS  
0
-80  
-40  
0
40  
80  
120  
160  
200  
0
10  
20  
30  
40  
50  
60  
o
V
, DRAIN TO SOURCE VOLTAGE (V)  
T , JUNCTION TEMPERATURE ( C)  
DS  
J
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN  
VOLTAGE vs JUNCTION TEMPERATURE  
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE  
10  
8
6
4
WAVEFORMS IN  
DESCENDING ORDER:  
I
I
I
= 56A  
= 37A  
= 18A  
D
D
D
2
V
= 50V  
DD  
0
0
10  
20  
30  
40  
50  
60  
Qg, GATE CHARGE (nC)  
NOTE: Refer to ON Semiconductor Application Notes AN7254 and AN7260.  
FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT  
www.onsemi.com  
5
HUFA75639S3ST-F085A  
Test Circuits and Waveforms  
V
DS  
BV  
DSS  
L
t
P
V
DS  
I
VARY t TO OBTAIN  
P
AS  
+
V
DD  
R
REQUIRED PEAK I  
G
AS  
V
DD  
-
V
GS  
DUT  
t
P
I
AS  
0V  
0
0.01Ω  
t
AV  
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT  
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS  
V
DS  
V
Q
g(TOT)  
R
DD  
L
V
DS  
V
= 20V  
GS  
V
Q
GS  
g(10)  
+
-
V
DD  
V
= 10V  
V
GS  
GS  
DUT  
V
= 2V  
GS  
I
0
G(REF)  
Q
g(TH)  
Q
Q
gd  
gs  
I
g(REF)  
0
FIGURE 16. GATE CHARGE TEST CIRCUIT  
FIGURE 17. GATE CHARGE WAVEFORM  
V
t
t
DS  
ON  
OFF  
t
d(OFF)  
t
d(ON)  
t
t
f
R
L
r
V
DS  
90%  
90%  
+
V
GS  
V
DD  
10%  
10%  
0
-
DUT  
90%  
50%  
R
GS  
V
GS  
50%  
PULSE WIDTH  
10%  
V
GS  
0
FIGURE 18. SWITCHING TIME TEST CIRCUIT  
FIGURE 19. RESISTIVE SWITCHING WAVEFORMS  
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6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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For additional information, please contact your local  
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www.onsemi.com  
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7

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