ISL9K1560G3 [ONSEMI]

30 A、600 V STEALTH™ 双二极管;
ISL9K1560G3
型号: ISL9K1560G3
厂家: ONSEMI    ONSEMI
描述:

30 A、600 V STEALTH™ 双二极管

软恢复二极管 快速软恢复二极管 局域网
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STEALTHt Dual Diode  
30 A, 600 V  
ISL9K1560G3  
Description  
The ISL9K1560G3 is a STEALTH dual diode optimized for low  
loss performance in high frequency hard switched applications.  
www.onsemi.com  
The STEALTH family exhibits low reverse recovery current (I  
)
RR  
and exceptionally soft recovery under typical operating conditions.  
This device is intended for use as a free wheeling or boost diode  
in power supplies and other power switching applications. The low  
CATHODE  
(BOTTOM SIDE METAL)  
ANODE 2  
CATHODE  
ANODE 1  
I
and short ta phase reduce loss in switching transistors. The soft  
RR  
recovery minimizes ringing, expanding the range of conditions under  
which the diode may be operated without the use of additional snubber  
circuitry. Consider using the STEALTH diode with an SMPS IGBT  
to provide the most efficient and highest power density design at lower  
cost.  
TO2473LD  
CASE 340CK  
Features  
Stealth Recovery t = 29.4 ns (@ I = 15 A)  
rr  
F
MARKING DIAGRAM  
Max Forward Voltage, V = 2.2 V (@ T = 25°C)  
F
C
600 V Reverse Voltage and High Reliability  
Avalanche Energy Rated  
This Device is PbFree and is RoHS Compliant  
$Y&Z&3&K  
K1560G3  
Applications  
Switch Mode Power Supplies  
Hard Switched PFC Boost Diode  
UPS Free Wheeling Diode  
Motor Drive FWD  
SMPS FWD  
Snubber Diode  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
K1560G3  
= Specific Device Code  
K
A
1
A
2
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
February, 2020 Rev. 3  
ISL9K1560G3/D  
ISL9K1560G3  
DEVICE MAXIMUM RATINGS (per leg) (T = 25°C unless otherwise noted)  
C
Parameter  
Repetitive Peak Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
Symbol  
Ratings  
600  
Unit  
V
V
RRM  
RWM  
V
600  
V
V
R
600  
V
I
F(AV)  
Average Rectified Forward Current (T = 145°C)  
15  
30  
A
A
C
Total Device Current (Both Legs)  
Repetitive Peak Surge Current (20 kHz Square Wave)  
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60 Hz)  
Power Dissipation  
I
30  
200  
A
A
FRM  
I
FSM  
P
D
150  
W
mJ  
°C  
Avalanche Energy (1 A, 40 mH)  
E
20  
AVL  
Operating and Storage Temperature Range  
T
T
55 to +175  
J, STG  
Maximum Temperature for Soldering  
T
PKG  
300  
260  
°C  
°C  
L
Leads at 0.063 in (1.6 mm) from Case for 10 s  
Package Body for 10 s, See Techbrief TB334  
T
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
PACKAGE MARKING AND ORDERING INFORMATION  
Device  
Device Marking  
Package  
Packing Method  
Tape Width  
Quantity  
ISL9K1560G3  
K1560G3  
TO2473L  
Tube  
N/A  
30  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
°C/W  
°C/W  
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
R
R
1.0  
30  
q
JC  
JA  
TO247  
q
www.onsemi.com  
2
ISL9K1560G3  
ELECTRICAL CHARACTERISTICS (per leg) (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF STATE CHARACTERISTICS  
Instantaneous Reverse Current  
I
R
V
R
= 600 V  
T
T
= 25°C  
100  
1.0  
mA  
C
= 125°C  
mA  
C
ON STATE CHARACTERISTICs  
Instantaneous Forward Voltage  
V
F
I = 15 A  
F
T
T
= 25°C  
1.8  
2.2  
2.0  
V
V
C
= 125°C  
1.65  
C
DYNAMIC CHARACTERISTICS  
Junction Capacitance  
C
t
V
= 10 V, I = 0 A  
62  
pF  
J
R
F
SWITCHING CHARACTERISTICS  
Reverse Recovery Time  
25  
35  
30  
40  
ns  
ns  
ns  
A
I = 1 A, dI/dt = 100 A/ms, V = 30 V  
F
rr  
R
I = 15 A, dI/dt = 100 A/ms, V = 30 V  
F
R
Reverse Recovery Time  
Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
t
I
I = 15 A,  
29.4  
3.5  
57  
rr  
F
dI /dt = 200 A/ms,  
F
rr  
V
= 390 V,  
= 25°C  
R
C
T
Q
nC  
ns  
rr  
t
rr  
I = 15 A,  
90  
F
dI /dt = 200 A/ms,  
F
Softness Factor (t / )  
S
2.0  
5.0  
275  
52  
b ta  
V
= 390 V,  
= 125°C  
R
C
T
Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
I
A
RR  
Q
nC  
ns  
RR  
t
rr  
I = 15 A,  
F
dI /dt = 800 A/ms,  
F
Softness Factor (t / )  
S
1.36  
13.5  
390  
800  
b ta  
V
= 390 V,  
= 125°C  
R
C
T
Reverse Recovery Current  
Reverse Recovered Charge  
I
A
RR  
Q
nC  
RR  
Maximum di/dt during t  
dI dt  
M/  
A/ms  
b
www.onsemi.com  
3
ISL9K1560G3  
TYPICAL PERFORMANCE CURVES  
30  
4000  
1000  
175°C  
25  
20  
15  
10  
150°C  
125°C  
100°C  
175°C  
150°C  
125°C  
100  
25°C  
10  
75°C  
100°C  
1
5
0
25°C  
0.1  
2.25  
1.75 2.0  
V , Forward Voltage (V)  
1.5  
0.75 1.0  
1.25  
300  
400  
500  
600  
0.5  
100  
200  
V , Reverse Voltage (V)  
R
F
Figure 2. Reverse Current vs. Reverse Voltage  
Figure 1. Forward Current vs. Forward Voltage  
100  
80  
100  
V
= 390 V, T = 125°C  
J
V
b
= 390 V, T = 125°C  
J
R
R
t AT dI /dt = 200 A/ms, 500 A/ms, 800 A/ms  
F
t AT I = 30 A, 15 A, 7.5 A  
b
F
80  
60  
40  
60  
40  
20  
0
20  
0
t AT I = 30 A, 15 A, 7.5 A  
a
F
t AT dI /dt = 200 A/ms, 500 A/ms, 800 A/ms  
a
F
1400 1600  
600 800 1000 1200  
200  
400  
30  
10  
15  
20  
25  
0
5
dI /dt, Current Rate of Change (A/ms)  
F
I , Forward Current (A)  
F
Figure 4. ta and tb Curves vs. dIF/dt  
Figure 3. ta and tb Curves vs. Forward Current  
25  
20  
15  
10  
16  
V
R
= 390 V, T = 125°C  
dI /dt = 800 A/ms  
V
R
= 390 V, T = 125°C  
J
F
J
I = 30 A  
14  
12  
10  
8
F
I = 15 A  
F
dI /dt = 500 A/ms  
F
I = 7.5 A  
F
6
dI /dt = 200 A/ms  
F
5
0
4
2
25  
30  
0
5
10  
15  
20  
200 400 600 800 1000 1200 1400 1600  
dI /dt, Current Rate of Change (A/ms)  
F
I , Forward Current (A)  
F
Figure 6. Maximum Reverse Recovery Current  
vs. dIF/dt  
Figure 5. Maximum Reverse Recovery Current  
vs. Forward Current  
www.onsemi.com  
4
ISL9K1560G3  
TYPICAL PERFORMANCE CURVES (continued)  
2.5  
700  
V
R
= 390 V, T = 125°C  
J
V
R
= 390 V, T = 125°C  
J
I = 30 A  
F
I = 30 A  
F
600  
500  
400  
300  
200  
2.0  
1.5  
I = 15 A  
F
I = 15 A  
F
I = 7.5 A  
F
1.0  
0.5  
I = 7.5 A  
F
1200 1400 1600  
200 400 600 800 1000  
1400 1600  
1000 1200  
200 400 600  
800  
dI /dt, Current Rate of Change (A/ms)  
F
dI /dt Current Rate of Change (A/ms)  
F
Figure 7. Reverse Recovery Softness Factor  
vs. dIF/dt  
Figure 8. Reverse Recovered Charge vs. dIF/dt  
1200  
16  
14  
12  
10  
8
1000  
800  
600  
400  
6
4
200  
0
2
0
140 145 150 155  
160  
165 170 175  
10  
V , Reverse Voltage (V)  
100  
0.1  
1
T , Case Temperature (°C)  
C
R
Figure 10. DC Current Derating Curve  
Figure 9. Junction Capacitance vs. Reverse  
Voltage  
Duty Cycle Descending Order  
0.5  
1.0  
0.2  
0.1  
0.05  
0.02  
0.01  
P
DM  
0.1  
t
1
t
2
Notes:  
Duty Factor: D = t /t  
1
2
Single Pulse  
Peak T = P  
x Z  
x R  
+ T  
JA A  
q
q
J
DM  
JA  
0.01  
3  
2  
1  
0
1
5  
4  
10  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
Figure 11. Normalized Maximum Transient Thermal Impedance  
www.onsemi.com  
5
ISL9K1560G3  
TEST CIRCUIT AND WAVEFORMS  
V
AMPLITUDE AND  
GE  
G
R
CONTROL dI /dt  
F
L
t AND t Control I  
1
2
F
DUT CURRENT  
SENSE  
dI  
dt  
t
rr  
F
I
F
R
G
t
a
t
b
+
V
DD  
V
GE  
MOSFET  
t
1
0.25 I  
RM  
t
2
I
RM  
Figure 12. trr Test Circuit  
Figure 13. trr Waveforms and Definitions  
I = 1 A  
L = 40 mH  
R < 0.1 W  
V
E
= 50 V  
AVL  
Q = IGBT (BV  
DD  
2
= 1/2LI [V  
/(V  
V )]  
R(AVL  
R(AVL)  
R(AVL)  
DD  
V
> DUT V  
)
AVL  
1
CES  
R
L
+
V
CURRENT  
SENSE  
I
L
I
L
DD  
I V  
Q
1
V
DD  
DUT  
t
t
1
t
2
t
0
Figure 14. Avalanche Energy Test Circuit  
Figure 15. Avalanche Current and Voltage  
Waveforms  
STEALTH is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD SHORT LEAD  
CASE 340CK  
ISSUE A  
DATE 31 JAN 2019  
P1  
D2  
A
E
P
A
A2  
Q
E2  
S
D1  
D
E1  
B
2
2
1
3
L1  
A1  
b4  
L
c
(3X) b  
(2X) b2  
M
M
B A  
0.25  
MILLIMETERS  
MIN NOM MAX  
4.58 4.70 4.82  
2.20 2.40 2.60  
1.40 1.50 1.60  
1.17 1.26 1.35  
1.53 1.65 1.77  
2.42 2.54 2.66  
0.51 0.61 0.71  
20.32 20.57 20.82  
(2X) e  
DIM  
A
A1  
A2  
b
b2  
b4  
c
GENERIC  
D
MARKING DIAGRAM*  
D1 13.08  
~
~
D2  
E
0.51 0.93 1.35  
15.37 15.62 15.87  
AYWWZZ  
XXXXXXX  
XXXXXXX  
E1 12.81  
~
~
E2  
e
L
4.96 5.08 5.20  
5.56  
15.75 16.00 16.25  
3.69 3.81 3.93  
3.51 3.58 3.65  
XXXX = Specific Device Code  
~
~
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ = Assembly Lot Code  
L1  
P
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
P1 6.60 6.80 7.00  
Q
S
5.34 5.46 5.58  
5.34 5.46 5.58  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13851G  
TO2473LD SHORT LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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© Semiconductor Components Industries, LLC, 2018  
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