ISL9R1560P2 [ONSEMI]

15A,600V,STEALTH™ 二极管;
ISL9R1560P2
型号: ISL9R1560P2
厂家: ONSEMI    ONSEMI
描述:

15A,600V,STEALTH™ 二极管

二极管
文件: 总10页 (文件大小:488K)
中文:  中文翻译
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STEALTHt Diode  
15 A, 600 V  
ISL9R1560G2, ISL9R1560P2,  
ISL9R1560S3S  
Description  
The ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S is a STEALTH  
diode optimized for low loss performance in high frequency hard  
switched applications. The STEALTH family exhibits low reverse  
www.onsemi.com  
ANODE  
recovery current (I ) and exceptionally soft recovery under typical  
CATHODE  
(BOTTOM SIDE  
METAL)  
rr  
CATHODE  
operating conditions. This device is intended for use as a free wheeling  
or boost diode in power supplies and other power switching  
$Y&Z&3&K  
R1560G2  
applications. The low I and short ta phase reduce loss in switching  
rr  
transistors. The soft recovery minimizes ringing, expanding the range  
of conditions under which the diode may be operated without the use  
of additional snubber circuitry. Consider using the STEALTH diode  
with an SMPS IGBT to provide the most efficient and highest power  
density design at lower cost.  
TO2472LD  
CASE 340CL  
ANODE  
CATHODE  
Features  
$Y&Z&3&K  
R1560P2  
Stealth Recovery t = 29.4 ns (@ I = 15 A)  
rr  
F
CATHODE  
(FLANGE)  
Max Forward Voltage, V = 2.2 V (@ T = 25°C)  
F
C
600 V Reverse Voltage and High Reliability  
Avalanche Energy Rated  
TO2202LD  
CASE 340BA  
CATHODE  
(FLANGE)  
These Devices are PbFree and are RoHS Compliant  
Applications  
SMPS  
$Y&Z&3&K  
R1560S3S  
N/C  
Hard Switched PFC Boost Diode  
UPS Free Wheeling Diode  
Motor Drive FWD  
SMPS FWD  
ANODE  
2
D PAK3 (TO263, 3LEAD)  
CASE 418AJ  
Snubber Diode  
MARKING DIAGRAM  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
R1560G2, R1560P2,  
R1560S3S  
= Specific Device Code  
SYMBOL  
K
A
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
March, 2020 Rev. 4  
ISL9R1560S3S/D  
ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S  
DEVICE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Ratings  
Unit  
V
Repetitive Peak Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
RRM  
RWM  
600  
600  
V
V
V
R
600  
V
Average Rectified Forward Current (T = 145°C)  
I
15  
A
C
F(AV)  
Repetitive Peak Surge Current (20 kHz Square Wave)  
Nonrepetitive Peak Surge Current (Halfwave 1 Phase 60 Hz)  
Power Dissipation  
I
30  
A
FRM  
I
200  
A
FSM  
P
D
150  
W
mJ  
°C  
Avalanche Energy (1 A, 40 mH)  
E
20  
AVL  
Operating and Storage Temperature Range  
T
T
55 to +175  
J, STG  
Maximum Temperature for Soldering  
T
PKG  
300  
260  
°C  
°C  
L
Leads at 0.063 in (1.6 mm) from Case for 10 s  
Package Body for 10 s, See Techbrief TB334  
T
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
PACKAGE MARKING AND ORDERING INFORMATION  
Device  
Device Marking  
R1560G2  
Package  
Packing Method  
Reel Size  
N/A  
Tape Width  
N/A  
Quantity  
30  
ISL9R1560G2  
ISL9R1560P2  
ISL9R1560S3ST  
TO2472LD  
TO2202LD  
Tube  
Tube  
Reel  
R1560P2  
N/A  
N/A  
50  
2
R1560S3S  
TO263(D PAK)  
13dia  
24 mm  
800  
THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
Thermal Resistance Junction to Ambient  
Thermal Resistance Junction to Ambient  
R
1.0  
30  
62  
62  
q
JC  
R
R
R
TO247  
TO220  
TO263  
q
q
q
JA  
JA  
JA  
www.onsemi.com  
2
ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Off State Characteristics  
Instantaneous Reverse Current  
I
R
V
R
= 600 V  
T
T
= 25°C  
100  
1.0  
mA  
C
= 125°C  
mA  
C
On State Characteristics  
Instantaneous Forward Voltage  
V
F
I = 15 A  
F
T
T
= 25°C  
1.8  
2.2  
2.0  
V
V
C
= 125°C  
1.65  
C
Dynamic Characteristics  
Junction Capacitance  
C
t
V
= 10 V, I = 0 A  
62  
pF  
J
R
F
Switching Characteristics  
Reverse Recovery Time  
25  
35  
30  
40  
ns  
ns  
ns  
A
I = 1 A, dI /dt = 100 A/ms, V = 30 V  
F
rr  
F
R
I = 15 A, dI /dt = 100 A/ms, V = 30 V  
F
F
R
Reverse Recovery Time  
Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
t
I
I = 15 A,  
29.4  
3.5  
57  
rr  
F
dI /dt = 200 A/ms,  
F
rr  
V
= 390 V,  
= 25°C  
R
C
T
Q
nC  
ns  
rr  
t
rr  
I = 15 A,  
90  
F
dI /dt = 200 A/ms,  
F
Softness Factor (t / )  
S
2.0  
5.0  
275  
52  
b ta  
V
= 390 V,  
= 125°C  
R
C
T
Reverse Recovery Current  
Reverse Recovered Charge  
Reverse Recovery Time  
I
rr  
A
Q
nC  
ns  
rr  
t
rr  
I = 15 A,  
F
dI /dt = 800 A/ms,  
F
Softness Factor (t / )  
S
1.36  
13.5  
390  
800  
b ta  
V
= 390 V,  
= 125°C  
R
C
T
Reverse Recovery Current  
Reverse Recovered Charge  
I
rr  
A
Q
nC  
rr  
Maximum di/dt During t  
dI dt  
M/  
A/ms  
b
www.onsemi.com  
3
ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S  
TYPICAL PERFORMANCE CURVES  
30  
4000  
175°C  
1000  
25  
20  
15  
10  
150°C  
175°C  
125°C  
150°C  
125°C  
100  
25°C  
100°C  
10  
75°C  
25°C  
100°C  
1
5
0
0.1  
2.25  
1.75 2.0  
1.5  
0.75 1.0  
1.25  
300  
400  
500  
600  
0.5  
100  
200  
V , Reverse Voltage (V)  
R
V , Forward Voltage (V)  
F
Figure 2. Reverse Current vs. Reverse Voltage  
Figure 1. Forward Current vs. Forward Voltage  
100  
80  
100  
V
= 390 V, T = 125°C  
J
V
b
= 390 V, T = 125°C  
J
R
R
t AT dI /dt = 200 A/ms, 500 A/ms, 800 A/ms  
F
t AT I = 30 A, 15 A, 7.5 A  
b
F
80  
60  
40  
60  
40  
20  
0
20  
0
t AT I = 30 A, 15 A, 7.5 A  
a
F
t AT dI /dt = 200 A/ms, 500 A/ms, 800 A/ms  
a
F
1400 1600  
600 800 1000 1200  
200  
400  
30  
10  
15  
20  
25  
0
5
dI /dt, Current Rate of Change (A/ms)  
F
I , Forward Current (A)  
F
Figure 4. ta and tb Curves vs. dIF/dt  
Figure 3. ta and tb Curves vs. Forward Current  
25  
20  
15  
10  
16  
V
R
= 390 V, T = 125°C  
dI /dt = 800 A/ms  
V
R
= 390 V, T = 125°C  
J
F
J
I = 30 A  
14  
12  
10  
F
I = 15 A  
F
dI /dt = 500 A/ms  
F
I = 7.5 A  
F
8
6
4
2
dI /dt = 200 A/ms  
F
5
0
25  
30  
0
5
10  
15  
20  
200 400 600 800 1000 1200 1400 1600  
dI /dt, Current Rate of Change (A/ms)  
F
I , Forward Current (A)  
F
Figure 6. Maximum Reverse Recovery Current  
vs. dIF/dt  
Figure 5. Maximum Reverse Recovery Current  
vs. Forward Current  
www.onsemi.com  
4
ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S  
TYPICAL PERFORMANCE CURVES (continued)  
2.5  
700  
V
R
= 390 V, T = 125°C  
J
V
R
= 390 V, T = 125°C  
J
I = 30 A  
F
I = 30 A  
F
600  
500  
400  
300  
200  
2.0  
1.5  
I = 15 A  
F
I = 15 A  
F
I = 7.5 A  
F
1.0  
0.5  
I = 7.5 A  
F
1200 1400 1600  
200 400 600 800 1000  
1400 1600  
1000 1200  
200 400 600  
800  
dI /dt, Current Rate of Change (A/ms)  
F
dI /dt Current Rate of Change (A/ms)  
F
Figure 7. Reverse Recovery Softness Factor  
vs. dIF/dt  
Figure 8. Reverse Recovered Charge vs. dIF/dt  
1200  
16  
14  
12  
10  
8
1000  
800  
600  
400  
6
4
200  
0
2
0
140 145 150 155  
160  
165 170 175  
0.1  
1
10  
V , Reverse Voltage (V)  
100  
T , Case Temperature (°C)  
C
R
Figure 10. DC Current Derating Curve  
Figure 9. Junction Capacitance vs. Reverse  
Voltage  
Duty Cycle Descending Order  
0.5  
1.0  
0.2  
0.1  
0.05  
0.02  
0.01  
P
DM  
0.1  
t
1
t
2
Notes:  
Duty Factor: D = t /t  
1
2
Single Pulse  
Peak T = P  
x Z  
x R  
+ T  
JA A  
q
q
J
DM  
JA  
0.01  
3  
2  
1  
0
1
5  
4  
10  
10  
10  
10  
10  
10  
10  
t, Rectangular Pulse Duration (s)  
Figure 11. Normalized Maximum Transient Thermal Impedance  
www.onsemi.com  
5
ISL9R1560G2, ISL9R1560P2, ISL9R1560S3S  
TEST CIRCUIT AND WAVEFORMS  
V
AMPLITUDE AND  
GE  
G
R
CONTROL dI /dt  
F
L
t AND t Control I  
1
2
F
dI  
dt  
DUT CURRENT  
SENSE  
t
rr  
F
I
F
R
t
a
t
b
G
+
0
V
DD  
V
GE  
MOSFET  
t
1
0.25 I  
RM  
t
2
I
RM  
Figure 13. trr Waveforms and Definitions  
Figure 12. trr Test Circuit  
I = 1 A  
L = 40 mH  
R < 0.1 W  
V
E
= 50 V  
AVL  
Q = IGBT (BV  
DD  
2
= 1/2LI [V  
/(V  
V )]  
R(AVL  
R(AVL)  
R(AVL) DD  
> DUT V  
)
1
CES  
V
AVL  
R
L
+
V
CURRENT  
SENSE  
I
L
I
L
DD  
Q
I V  
1
V
DD  
DUT  
t
t
1
t
2
t
0
Figure 14. Avalanche Energy Test Circuit  
Figure 15. Avalanche Current and Voltage  
Waveforms  
STEALTH is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2202LD  
CASE 340BA  
ISSUE O  
DATE 31 AUG 2016  
4.036  
3.636  
10.360  
10.109  
A
C
M
0.36  
B A  
1.400  
8.89  
6.86  
B
2.860  
2.660  
6.477  
6.121  
1.146  
7°  
3°  
3
15.215  
14.757  
8.787  
5°  
3°  
5°  
3°  
8.587  
1
2
0.60 MAX  
2.755  
2.555  
13.894  
12.941  
3.962  
3.720  
1.65  
1.25  
1.91  
0.889  
0.787  
M
0.36  
C A B  
0.457  
0.357  
2.640  
2.440  
5.180  
4.980  
NOTES:  
5°  
3°  
5°  
3°  
A. PACKAGE REFERENCE: JEDEC TO220  
VARIATION AC.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSION AND TOLERANCE AS PER ASME  
Y14.52009.  
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
4.672  
4.472  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13831G  
TO2202LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2019  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2472LD  
CASE 340CL  
ISSUE A  
DATE 03 DEC 2019  
GENERIC  
MARKING DIAGRAM*  
AYWWZZ  
XXXXXXX  
XXXXXXX  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ  
= Assembly Lot Code  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13850G  
TO2472LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
D2PAK3 (TO263, 3LEAD)  
CASE 418AJ  
ISSUE F  
DATE 11 MAR 2021  
SCALE 1:1  
XXXXXX = Specific Device Code  
A
= Assembly Location  
WL  
Y
= Wafer Lot  
= Year  
GENERIC MARKING DIAGRAMS*  
WW  
W
M
G
AKA  
= Work Week  
= Week Code (SSG)  
= Month Code (SSG)  
= PbFree Package  
= Polarity Indicator  
XX  
AYWW  
XXXXXXXXG  
AKA  
XXXXXXXXG  
AYWW  
XXXXXX  
XXYMW  
XXXXXXXXX  
AWLYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”,  
may or may not be present. Some products  
may not follow the Generic Marking.  
IC  
Standard  
Rectifier  
SSG  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
98AON56370E  
D2PAK3 (TO263, 3LEAD)  
PAGE 1 OF 1  
DESCRIPTION:  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
rights of others.  
© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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