JANTXV2N3700 [ONSEMI]
MIL-PRF-19500/391: 80 V, 1 A NPN Small Signal Transistor;
| 型号： | JANTXV2N3700 |
| 厂家： | 
ONSEMI |
| 描述： | MIL-PRF-19500/391: 80 V, 1 A NPN Small Signal Transistor 开关 晶体管 |
| 文件： | 总8页 (文件大小：278K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2N3019, 2N3019S, 2N3700
80V, 1A NPN Small Signal
Transistor
Features
• MIL−PRF−19500/391Qualified
http://onsemi.com
• Available as JAN, JANTX, and JANTXV
COLLECTOR
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
2
BASE
Characteristic
Collector−Emitter Voltage
Collector−Base Voltage
Symbol
Value
80
Unit
Vdc
Vdc
Vdc
Adc
mW
V
CEO
V
CBO
V
EBO
1
140
7.0
EMITTER
Emitter−Base Voltage
Collector Current − Continuous
I
C
1.0
Total Device Dissipation @ T = 25°C
P
P
A
T
2N3019, 2N3019S
2N3700
800
500
Total Device Dissipation @ T = 25°C
W
C
T
2N3019, 2N3019S
5.0
1.0
2N3700
Operating and Storage Junction
Temperature Range
T , T
−65 to
+200
°C
J
stg
TO−5
CASE 205AA
STYLE 1
TO−39
CASE 205AB
STYLE 1
TO−18
CASE 206AA
STYLE 1
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
2N3019
2N3019S
2N3700
Thermal Resistance, Junction to Ambient
2N3019, 2N3019S
R
°C/W
q
JA
195
325
2N3700
ORDERING INFORMATION
Thermal Resistance, Junction to Case
2N3019, 2N3019S
R
°C/W
q
JC
Device
Package
Shipping
30
150
2N3700
JAN2N3019
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
JANTX2N3019
JANTXV2N3019
JAN2N3019S
TO−5
Bulk
JANTX2N3019S
JANTXV2N3019S
JAN2N3700
TO−39
TO−18
Bulk
Bulk
JANTX2N3700
JANTXV2N3700
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2012 − Rev. 2
2N3019/D
2N3019, 2N3019S, 2N3700
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
V
Vdc
(BR)CEO
(I = 30 mAdc)
80
−
C
Emitter−Base Cutoff Current
I
EBO
(V = 5.0 Vdc)
−
−
10
10
nAdc
mAdc
EB
(V = 7.0 Vdc)
EB
Collector−Emitter Cutoff Current
I
I
CEO
(V = 90 Vdc)
−
−
10
10
nAdc
CE
Collector−Base Cutoff Current
CBO
(V = 140 Vdc)
CB
mAdc
ON CHARACTERISTICS (Note 1)
DC Current Gain
h
FE
−
(I = 0.1 mAdc, V = 10 Vdc)
50
90
100
50
15
300
−
300
300
−
C
CE
(I = 10 mAdc, V = 10 Vdc)
C
CE
CE
CE
CE
(I = 150 mAdc, V = 10 Vdc)
C
(I = 500 mAdc, V = 10 Vdc)
C
(I = 1.0 Adc, V = 10 Vdc)
C
Collector−Emitter Saturation Voltage
(I = 150 mAdc, I = 15 mAdc)
V
V
Vdc
Vdc
CE(sat)
−
−
0.2
0.5
C
B
(I = 500 mAdc, I = 50 mAdc)
C
B
Base−Emitter Saturation Voltage
(I = 150 mAdc, I = 15 mAdc)
BE(sat)
−
1.1
C
B
SMALL−SIGNAL CHARACTERISTICS
Magnitude of Small−Signal Current Gain
|h |
−
fe
(I = 50 mAdc, V = 10 Vdc, f = 20 MHz)
5.0
80
−
20
400
12
C
CE
Small−Signal Current Gain
h
fe
−
(I = 1.0 mAdc, V = 5 Vdc, f = 1 kHz)
C
CE
Output Capacitance
C
pF
pF
dB
ps
obo
(V = 10 Vdc, I = 0, 100 kHz ≤ f ≤ 1.0 MHz)
CB
E
Input Capacitance
C
ibo
(V = 0.5 Vdc, I = 0, 100 kHz ≤ f ≤ 1.0 MHz)
−
60
EB
C
Noise Figure
NF
r’ ,C
(V = 10 Vdc, I = 100 mAdc, R = 1 kW, PBW = 200 Hz)
−
4.0
400
CE
C
g
Collector−Base Time Constant
(V = 10 Vdc, I = 10 mAdc, f = 79.8 MHz)
b
C
−
CB
C
SWITCHING CHARACTERISTICS
Pulse Response
t
on
+ t
off
ns
(Reference Figure in MIL−PRF−19500/391)
−
30
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
http://onsemi.com
2
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−5 3−Lead
CASE 205AA
ISSUE B
DATE 06 JUL 2012
SCALE 1:1
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
A
DETAIL X
B
3. DIMENSION J MEASURED FROM DIAMETER A TO EDGE.
4. LEAD TRUE POSITION TO BE DETERMINED AT THE GUAGE
PLANE DEFINED BY DIMENSION R.
5. DIMENSION F APPLIES BETWEEN DIMENSION P AND L.
6. DIMENSION D APPLIES BETWEEN DIMENSION L AND K.
7. BODY CONTOUR OPTIONAL WITHIN ZONE DEFINED BY DIMEN
SIONS A, B, AND T.
U
P
C
K
U
SEATING
PLANE
L
A
R
8. DIMENSION B SHALL NOT VARY MORE THAN 0.010 IN ZONE P.
F
MILLIMETERS
DIM MIN MAX
INCHES
MIN
NOTE 5
MAX
0.370
0.335
0.260
0.021
0.125
0.019
0.034
0.040
1.750
---
E
A
B
C
D
E
F
8.89
8.00
6.10
0.41
0.23
0.41
0.71
0.73
38.10
6.35
9.40 0.350
8.51 0.315
6.60 0.240
0.53 0.016
3.18 0.009
0.48 0.016
0.86 0.028
1.02 0.029
44.45 1.500
--- 0.250
T
NOTE 7
DETAIL X
NOTES 4 & 6
3X
D
S
M
0.007 (0.18MM) A B
C
H
J
K
L
N
2
H
M
N
P
R
T
45 BSC
_
45 BSC
_
1
3
5.08 BSC
0.200 BSC
---
---
1.27
0.050
J
1.37 BSC
--- 0.76
2.54 --- 0.100
0.054 BSC
M
---
0.030
---
LEAD IDENTIFICATION
DETAIL
U
C
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
98AON49138E
ON SEMICONDUCTOR STANDARD
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
DESCRIPTION: TO−5 3−LEAD
PAGE 1 OF2
DOCUMENT NUMBER:
98AON49138E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
A
B
RELEASED FOR PRODUCTION. REQ. BY B. JENSEN.
CHANGED DIMENSION “D” MAX TO 0.53 MM (0.021 IN). REQ. BY B. JENSEN.
18 MAR 2010
10 AUG 2010
06 JUL 2012
MADE ISOMETRIC IMAGE LARGER TO REFLECT ACTUAL SIZE. REQ. BY J.
FULTON.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
©
Semiconductor Components Industries, LLC, 2012
Case Outline Number:
July, 2012 − Rev. B
205AA
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−39 3−Lead
CASE 205AB
ISSUE A
DATE 25 JUN 2012
SCALE 1:1
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
A
DETAIL X
B
3. DIMENSION J MEASURED FROM DIAMETER A TO EDGE.
4. LEAD TRUE POSITION TO BE DETERMINED AT THE GUAGE
PLANE DEFINED BY DIMENSION R.
5. DIMENSION F APPLIES BETWEEN DIMENSION P AND L.
6. DIMENSION D APPLIES BETWEEN DIMENSION L AND K.
7. BODY CONTOUR OPTIONAL WITHIN ZONE DEFINED BY DIMEN
SIONS A, B, AND T.
U
P
C
K
U
SEATING
PLANE
L
A
R
8. DIMENSION B SHALL NOT VARY MORE THAN 0.010 IN ZONE P.
F
MILLIMETERS
DIM MIN MAX
INCHES
MIN
NOTE 5
MAX
0.370
0.335
0.260
0.019
0.125
0.019
0.034
0.040
0.580
---
E
A
B
C
D
E
F
8.89
8.00
6.10
0.41
0.23
0.41
0.71
0.73
12.70
6.35
9.40 0.350
8.51 0.315
6.60 0.240
0.48 0.016
3.18 0.009
0.48 0.016
0.86 0.028
1.02 0.029
14.73 0.500
--- 0.250
T
NOTE 7
DETAIL X
NOTES 4 & 6
3X
D
0.007 (0.18MM) A B
S
M
C
H
J
K
L
N
2
H
M
N
P
R
T
45 BSC
_
45 BSC
_
1
3
5.08 BSC
0.200 BSC
---
---
1.27
0.050
J
1.37 BSC
--- 0.76
2.54 --- 0.100
0.054 BSC
M
---
0.030
---
LEAD IDENTIFICATION
DETAIL
U
C
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
98AON49134E
ON SEMICONDUCTOR STANDARD
DOCUMENT NUMBER:
STATUS:
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
DESCRIPTION: TO−39 3−LEAD
PAGE 1 OF2
DOCUMENT NUMBER:
98AON49134E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
A
RELEASED FOR PRODUCTION. REQ. BY B. JENSEN.
18 MAR 2010
25 JUN 2012
MADE ISOMETRIC IMAGE LARGER TO REFLECT ACTUAL SIZE. REQ. BY J.
FULTON.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2012
Case Outline Number:
June, 2012 − Rev. A
205AB
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−18
CASE 206AA
ISSUE A
DATE 21 AUG 2012
SCALE 1:1
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
A
DETAIL X
B
3. DIMENSION J MEASURED FROM DIAMETER A TO EDGE.
4. LEAD TRUE POSITION TO BE DETERMINED AT THE GUAGE
PLANE DEFINED BY DIMENSION R.
5. DIMENSION F APPLIES BETWEEN DIMENSION P AND L.
6. DIMENSION D APPLIES BETWEEN DIMENSION L AND K.
7. BODY CONTOUR OPTIONAL WITHIN ZONE DEFINED BY DIMEN
SIONS A, B, AND T.
U
P
C
K
U
SEATING
PLANE
L
A
R
MILLIMETERS
DIM MIN MAX
INCHES
MIN
F
MAX
0.230
0.195
0.210
0.021
0.030
0.019
0.046
0.048
0.750
---
NOTE 5
A
B
C
D
E
F
5.31
4.52
4.32
0.41
---
5.84 0.209
4.95 0.178
5.33 0.170
0.53 0.016
E
T
NOTE 7
DETAIL X
0.76
---
NOTES 4 & 6
3X
D
0.41
0.91
0.71
12.70
6.35
0.48 0.016
1.17 0.036
1.22 0.028
19.05 0.500
--- 0.250
S
M
H
J
0.007 (0.18MM) A B
C
K
L
N
M
N
P
R
T
45 BSC
_
45 BSC
_
2
H
2.54 BSC
0.100 BSC
---
1
3
---
1.27
0.050
1.37 BSC
--- 0.76
2.54 --- 0.100
0.054 BSC
J
---
0.030
---
M
U
LEAD IDENTIFICATION
DETAIL
C
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
PIN 1. SOURCE, SUBSTRATE
PIN 1. SOURCE
2. DRAIN
3. GATE
& CASE
2. GATE
3. DRAIN
STYLE 4:
STYLE 6:
PIN 1. SOURCE
2. DRAIN
3. GATE & CASE
STYLE 5:
PIN 1. CATHODE
2. GATE
3. ANODE
PIN 1. EMITTER
2. BASE 1
3. BASE 2
STYLE 7:
STYLE 9:
PIN 1. ANODE
2. BASE
3. CATHODE
STYLE 8:
PIN 1. ANODE 2
2. ANODE 1
3. GATE
PIN 1. GATE
2. ANODE 1
3. ANODE 2
(CONNECTED TO CASE)
STYLE 10:
PIN 1. BASE
2. EMITTER
3. BASE
STYLE 11:
PIN 1. DRAIN
2. GATE
STYLE 12:
PIN 1. SOURCE
2. GATE
3. SOURCE, SUBSTRATE
3. DRAIN (CASE)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON45207E
TO−18 3−LEAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
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