概述
数据手册
替代型号M1MA174T1 概述
Silicon Switching Diode 硅开关二极管 TVS二极管
M1MA174T1 数据手册
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Preferred Device
Silicon Switching Diode
MAXIMUM RATINGS
Rating
Symbol
Value
100
Unit
V
Continuous Reverse Voltage
Recurrent Peak Forward Current
V
R
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I
F
200
mA
mA
Peak Forward Surge Current
Pulse Width = 10 µs
I
500
FM(surge)
3
CATHODE
1
ANODE
Total Power Dissipation,
One Diode Loaded
P
D
200
1.6
mW
T
A
= 25°C
Derate above 25°C
mW/°C
3
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
Operating and Storage Junction
Temperature Range
T , T
–55 to
+150
°C
J
stg
1
2
SC–70/SOT–323
CASE 419
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
STYLE 2
Thermal Resistance,
Junction to Ambient
One Diode Loaded
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
R
0.625
°C/mW
θJA
MARKING DIAGRAM
J6 M
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Max
Unit
Reverse Breakdown Voltage
(I = 100 µAdc)
R
V
(BR)
100
–
Vdc
J6 = Device Code
M
= Date Code
Reverse Voltage Leakage Current
I
R
(V = 20 Vdc)
–
–
25
5.0
nAdc
µAdc
R
(V = 75 Vdc)
R
ORDERING INFORMATION
Diode Capacitance
(V = 0, f = 1.0 MHz)
R
C
V
–
–
–
4.0
1.0
4.0
pF
Vdc
ns
T
Device
M1MA174T1
Package
Shipping
3000/Tape & Reel
Forward Voltage
(I = 10 mAdc)
F
F
SC–70
Reverse Recovery Time
t
rr
(I = I = 10 mAdc) (Figure 1)
Preferred devices are recommended choices for future use
and best overall value.
F
R
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
November, 2001 – Rev. 1
M1MA174T1/D
M1MA174T1
820 Ω
I
F
+10 V
t
r
t
p
t
2.0 k
0.1 µF
I
F
t
rr
t
100 µH
10%
0.1 µF
90%
DUT
i
= 1.0 mA
R(REC)
50 Ω OUTPUT
PULSE
GENERATOR
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
I
R
V
R
OUTPUT PULSE
(I = I = 10 mA; MEASURED
INPUT SIGNAL
F
R
at i
= 1.0 mA)
R(REC)
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (I ) of 10 mA.
F
Notes: 2. Input pulse is adjusted so I
is equal to 10 mA.
R(peak)
Notes: 3. t » t
p
rr
Figure 1. Recovery Time Equivalent Test Circuit
100
10
T
= 150°C
= 125°C
A
T
A
= 85°C
T
A
T
A
= -40°C
1.0
0.1
10
1.0
0.1
T
= 85°C
= 55°C
A
T
A
= 25°C
T
A
0.01
0.001
T
A
= 25°C
0.2
0.4
0.6
0.8
1.0
1.2
0
10
20
30
40
50
V , FORWARD VOLTAGE (VOLTS)
F
V , REVERSE VOLTAGE (VOLTS)
R
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
0.64
0.60
0.56
0.52
0
2.0
4.0
6.0
8.0
V , REVERSE VOLTAGE (VOLTS)
R
Figure 4. Capacitance
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2
M1MA174T1
INFORMATION FOR USING THE SC–70/SOT–323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.025
0.65
0.025
0.65
0.075
1.9
0.035
0.9
0.028
0.7
inches
mm
SC–70/SOT–323 POWER DISSIPATION
The power dissipation of the SC–70/SOT–323 is a func-
tion of the pad size. This can vary from the minimum pad
size for soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device
the equation for an ambient temperature T of 25°C, one
can calculate the power dissipation of the device which in
this case is 200 milliwatts.
A
150°C – 25°C
0.625°C/W
is determined by T
perature of the die, Rθ , the thermal resistance from the
device junction to ambient; and the operating temperature,
, the maximum rated junction tem-
J(max)
P
=
= 200 milliwatts
D
JA
The 0.625°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve
a power dissipation of 200 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, a higher power dissipation of 300 milli-
watts can be achieved using the same footprint.
T . Using the values provided on the data sheet, P can be
calculated as follows.
A
D
T
– T
A
J(max)
P
=
D
R
θJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied dur-
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
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3
M1MA174T1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6 STEP 7
VENT COOLING
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6
SOAK"
SOAK" ZONES 2 & 5
RAMP"
205° TO 219°C
PEAK AT
SOLDER JOINT
200°C
150°C
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°C
MASS OF ASSEMBLY)
100°C
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 5. Typical Solder Heating Profile
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4
M1MA174T1
PACKAGE DIMENSIONS
SC–70 (SOT–323)
CASE 419–04
ISSUE L
NOTES:
A
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
L
INCHES
DIM MIN MAX
MILLIMETERS
3
MIN
1.80
1.15
0.80
0.30
1.20
0.00
0.10
MAX
2.20
1.35
1.00
0.40
1.40
0.10
0.25
A
B
C
D
G
H
J
0.071
0.045
0.032
0.012
0.047
0.000
0.004
0.087
0.053
0.040
0.016
0.055
0.004
0.010
B
S
1
2
D
G
K
L
0.017 REF
0.026 BSC
0.028 REF
0.425 REF
0.650 BSC
0.700 REF
N
S
0.079
0.095
2.00
2.40
J
N
STYLE 2:
C
PIN 1. ANODE
2. N.C.
3. CATHODE
0.05 (0.002)
K
H
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5
M1MA174T1
Notes
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6
M1MA174T1
Notes
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7
M1MA174T1
Thermal Clad is a trademark of the Bergquist Company.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold
SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable
attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031
Phone: 81–3–5740–2700
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
Email: r14525@onsemi.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800–282–9855 Toll Free USA/Canada
M1MA174T1/D
M1MA174T1 替代型号
| 型号 | 制造商 | 描述 | 替代类型 | 文档 |
| M1MA174T1G | ONSEMI | Switching Diode 80V, SC-70 (SOT-323) 3 LEAD, 3000-REEL | 完全替代 |
|
| M1MA142KT1 | ONSEMI | SC-70/SOT-323 PACKAGE SINGLE SILICON SWITCHING DIODE 40/80 V-100 mA SURFACE MOUNT | 功能相似 |
|
| M1MA142WAT1G | ONSEMI | Common Anode Silicon Dual Switching Diode | 功能相似 |
|
M1MA174T1 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| M1MA174T1D | ONSEMI | Silicon Switching Diode | 获取价格 |
|
| M1MA174T1G | ONSEMI | Switching Diode 80V, SC-70 (SOT-323) 3 LEAD, 3000-REEL | 获取价格 |
|
| M1MAWAT1 | LRC | Common Anode Silicon Dual Switching diodes | 获取价格 |
|
| M1N1 | ETC | MEDIUM CURRENT SILICON RECTIFIERS | 获取价格 |
|
| M1N5 | ETC | MEDIUM CURRENT SILICON RECTIFIERS | 获取价格 |
|
| M1N5711 | MICROSEMI | Rectifier Diode, Schottky, 1 Element, Silicon, DO-35, HERMETIC SEALED, GLASS PACKAGE-2 | 获取价格 |
|
| M1N643 | MICROSEMI | 0.04A, 175V, SILICON, SIGNAL DIODE, DO-35, | 获取价格 |
|
| M1N9 | ETC | MEDIUM CURRENT SILICON RECTIFIERS | 获取价格 |
|
| M1P-L67201L-55/883 | TEMIC | FIFO, 512X9, 55ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 获取价格 |
|
| M1P-L67201L-60/883 | TEMIC | FIFO, 512X9, 60ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 | 获取价格 |
|
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