M74HCT4066ADTR2G [ONSEMI]

四路模拟开关/多工器/信号分离器/带 LSTTL 兼容输入;
M74HCT4066ADTR2G
型号: M74HCT4066ADTR2G
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四路模拟开关/多工器/信号分离器/带 LSTTL 兼容输入

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MC74HCT4066A  
Quad Analog Switch/  
Multiplexer/Demultiplexer  
with LSTTL Compatible  
Inputs  
http://onsemi.com  
MARKING  
HighPerformance SiliconGate CMOS  
The MC74HCT4066A utilizes silicongate CMOS technology to  
achieve fast propagation delays, low ON resistances, and low  
OFFchannel leakage current. This bilateral switch/  
multiplexer/demultiplexer controls analog and digital voltages that  
DIAGRAMS  
14  
SOIC14  
D SUFFIX  
CASE 751A  
HCT4066AG  
AWLYWW  
14  
14  
may vary across the full powersupply range (from V to GND).  
CC  
1
The HCT4066A is identical in pinout to the metalgate CMOS  
MC14016 and MC14066. Each device has four independent switches.  
1
The device has been designed so the ON resistances (R ) are more  
ON  
linear over input voltage than R  
switches.  
of metalgate CMOS analog  
ON  
14  
HCT40  
66A  
ALYWꢀ  
TSSOP14  
DT SUFFIX  
CASE 948G  
The ON/OFF control inputs are compatible with standard CMOS and  
LSTTL outputs. For analog switches with voltagelevel translators, see  
the HC4316A.  
1
1
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
Features  
Fast Switching and Propagation Speeds  
High ON/OFF Output Voltage Ratio  
Low Crosstalk Between Switches  
Diode Protection on All Inputs/Outputs  
W, WW = Work Week  
G or = PbFree Package  
(Note: Microdot may be in either location)  
Wide PowerSupply Voltage Range (V GND) = 4.5 to 5.5 V  
CC  
Analog Input Voltage Range (V GND) = 0 to 5.5 V  
CC  
Improved Linearity and Lower ON Resistance over Input Voltage  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
than the MC14016 or MC14066  
Low Noise  
Chip Complexity: 44 FETs or 11 Equivalent Gates  
These are PbFree Devices  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
November, 2010 Rev. 1  
MC74HCT4066A/D  
MC74HCT4066A  
1
2
3
X
Y
A
A
V
X
1
2
3
4
5
6
7
14  
13  
CC  
A
13  
4
A ON/OFF CONTROL  
Y
A
A ON/OFF CONTROL  
Y
B
X
B
12 D ON/OFF CONTROL  
X
B
Y
B
Y
C
Y
D
11  
10  
9
X
Y
Y
X
D
D
C
5
8
B ON/OFF CONTROL  
C ON/OFF CONTROL  
B ON/OFF CONTROL  
ANALOG  
OUTPUTS/INPUTS  
9
X
C
8
GND  
C
6
C ON/OFF CONTROL  
Figure 1. Pin Assignment  
FUNCTION TABLE  
11  
10  
X
D
12  
D ON/OFF CONTROL  
On/Off Control  
State of  
Analog Switch  
ANALOG INPUTS/OUTPUTS = X , X , X , X  
D
A
B
C
Input  
PIN 14 = V  
CC  
L
H
Off  
On  
PIN 7 = GND  
Figure 2. Logic Diagram  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74HCT4066ADG  
SOIC14  
(PbFree)  
55 Units / Rail  
MC74HCT4066ADR2G  
MC74HCT4066ADTR2G  
SOIC14  
(PbFree)  
2500 / Tape & Reel  
2500 / Tape & Reel  
TSSOP14*  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently PbFree.  
http://onsemi.com  
2
MC74HCT4066A  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
This device contains protection  
circuitry to guard against damage  
due to high static voltages or electric  
fields. However, precautions must  
be taken to avoid applications of any  
voltage higher than maximum rated  
voltages to this highimpedance cir-  
V
Positive DC Supply Voltage (Referenced to GND)  
Analog Input Voltage (Referenced to GND)  
Digital Input Voltage (Referenced to GND)  
DC Current Into or Out of Any Pin  
–0.5 to +14.0  
CC  
V
–0.5 to V + 0.5  
V
IS  
CC  
V
–0.5 to V + 0.5  
V
in  
CC  
I
25  
mA  
mW  
cuit. For proper operation, V and  
in  
P
D
Power Dissipation in Still Air,  
SOIC Package†  
TSSOP Package†  
500  
450  
V
out  
should be constrained to the  
range GND v (V or V ) v V  
.
in  
out  
CC  
Unused inputs must always be  
tied to an appropriate logic voltage  
T
stg  
Storage Temperature  
–65 to +150  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress  
ratings only. Functional operation above the Recommended Operating Conditions is not implied.  
Extended exposure to stresses above the Recommended Operating Conditions may affect device  
reliability.  
level (e.g., either GND or V ).  
CC  
Unused outputs must be left open.  
I/O pins must be connected to a  
properly terminated line or bus.  
†Derating  
SOIC Package: – 7 mW/°C from 65°C to 125°C  
TSSOP Package: 6.1 mW/°C from 65°C to 125°C  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Positive DC Supply Voltage (Referenced to GND)  
Analog Input Voltage (Referenced to GND)  
Digital Input Voltage (Referenced to GND)  
Static or Dynamic Voltage Across Switch  
Operating Temperature, All Package Types  
Min  
4.5  
Max  
Unit  
V
V
CC  
5.5  
V
IS  
GND  
GND  
V
V
CC  
CC  
V
in  
V
V
V *  
IO  
1.2  
V
T
A
–55  
+125  
°C  
ns  
t , t  
Input Rise and Fall Time, ON/OFF Control Inputs  
(Figure 10)  
r
f
V
CC  
= 4.5 V  
0
500  
*For voltage drops across the switch greater than 1.2 V (switch on), excessive V current may be drawn; i.e., the current out of the switch may  
CC  
contain both V and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded.  
CC  
DC ELECTRICAL CHARACTERISTIC Digital Section (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
25°C  
v 85°C  
v 125°C  
V
Symbol  
Parameter  
Test Conditions  
Unit  
V
IH  
Minimum HighLevel Voltage  
ON/OFF Control Inputs  
R
R
= Per Spec  
4.5 to 5.5  
2.0  
0.8  
0.1  
2
2.0  
2.0  
V
on  
on  
V
IL  
Maximum LowLevel Voltage  
ON/OFF Control Inputs  
= Per Spec  
4.5 to 5.5  
5.5  
0.8  
1.0  
20  
0.8  
1.0  
40  
V
I
in  
Maximum Input Leakage Current  
ON/OFF Control Inputs  
V
in  
= V or GND  
A  
A  
A  
CC  
I
Maximum Quiescent Supply Current  
(per Package)  
V
V
= V or GND  
5.5  
CC  
in  
IO  
CC  
= 0 V  
I  
CC  
Additional Quiescent Supply Current  
(per Input)  
V
in  
= V 2.1 V  
4.5 to 5.5  
360  
450  
490  
CC  
Other control inputs at V  
or GND  
CC  
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3
MC74HCT4066A  
DC ELECTRICAL CHARACTERISTICS Analog Section (Voltages Referenced to GND)  
Guaranteed Limit  
– 55 to  
V
CC  
25°C  
v 85°C v 125°C  
V
Symbol  
Parameter  
Test Conditions  
= V  
Unit  
R
Maximum “ON” Resistance  
V
V
I
4.5  
120  
160  
200  
on  
in  
IH  
= V to GND  
IS  
CC  
v 2.0 mA (Figures 3, 4)  
S
V
V
= V  
4.5  
70  
85  
120  
in  
IH  
= V or GND  
IS  
CC  
(Endpoints)  
I
v 2.0 mA (Figures 3, 4)  
S
R  
Maximum Difference in “ON”  
Resistance Between Any Two  
Channels in the Same Package  
V
V
I
= V  
4.5  
5.5  
5.5  
20  
0.1  
0.1  
25  
0.5  
0.5  
30  
1.0  
1.0  
on  
in  
IH  
= 1/2 (V GND)  
IS  
CC  
v 2.0 mA  
S
I
off  
Maximum OffChannel Leakage  
Current, Any One Channel  
V
V
= V  
A  
A  
in  
IL  
= V or GND  
CC  
IO  
Switch Off (Figure 5)  
I
on  
Maximum OnChannel Leakage  
Current, Any One Channel  
V
V
= V  
IH  
in  
= V or GND  
IS  
CC  
(Figure 6)  
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, ON/OFF Control Inputs: t = t = 6 ns)  
L
r
f
Guaranteed Limit  
– 55 to  
V
CC  
25°C  
v 85°C v 125°C  
V
Symbol  
Parameter  
Unit  
t
t
t
,
Maximum Propagation Delay, Analog Input to Analog Output  
(Figures 10 and 11)  
4.5  
10  
30  
25  
10  
13  
38  
32  
10  
15  
45  
37  
10  
ns  
PLH  
t
PHL  
,
Maximum Propagation Delay, ON/OFF Control to Analog Output  
(Figures 12 and 13)  
4.5  
4.5  
ns  
ns  
pF  
PLZ  
t
PHZ  
,
Maximum Propagation Delay, ON/OFF Control to Analog Output  
(Figures 12 and 13)  
PZL  
t
PZH  
C
Maximum Capacitance  
ON/OFF Control Input  
Control Input = GND  
Analog I/O  
35  
1.0  
35  
1.0  
35  
1.0  
Feedthrough  
Typical @ 25°C, V = 5.0 V  
CC  
15  
C
Power Dissipation Capacitance (Per Switch) (Figure 15)*  
pF  
PD  
2
*Used to determine the noload dynamic power consumption: P = C  
V
f + I  
V
.
D
PD CC  
CC CC  
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4
MC74HCT4066A  
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)  
Limit*  
25°C  
54/74HCT  
V
V
CC  
Symbol  
Parameter  
Test Conditions  
= 1 MHz Sine Wave  
Unit  
BW  
Maximum OnChannel Bandwidth or  
Minimum Frequency Response  
(Figure 7)  
f
in  
MHz  
Adjust f Voltage to Obtain 0 dBm at V  
in  
OS  
Increase f Frequency Until dB Meter Reads – 3 dB  
in  
R = 50 , C = 10 pF  
4.5  
150  
L
L
OffChannel Feedthrough Isolation  
(Figure 8)  
f
Sine Wave  
dB  
in  
Adjust f Voltage to Obtain 0 dBm at V  
in IS  
f
= 10 kHz, R = 600 , C = 50 pF  
4.5  
4.5  
50  
40  
in  
L
L
f
= 1.0 MHz, R = 50 , C = 10 pF  
L L  
in  
Feedthrough Noise, Control to  
Switch  
V
v 1 MHz Square Wave (t = t = 6 ns)  
mV  
in  
r
f
PP  
Adjust R at Setup so that I = 0 A  
L
S
(Figure 9)  
4.5  
4.5  
60  
30  
R = 600 , C = 50 pF  
L
L
R = 10 k, C = 10 pF  
L
L
Crosstalk Between Any Two  
Switches  
(Figure 14)  
f
Sine Wave  
dB  
%
in  
Adjust f Voltage to Obtain 0 dBm at V  
in  
IS  
f
= 10 kHz, R = 600 , C = 50 pF  
4.5  
4.5  
–70  
–80  
in  
L L  
f
= 1.0 MHz, R = 50 , C = 10 pF  
L L  
in  
THD  
Total Harmonic Distortion  
(Figure 16)  
f
in  
= 1 kHz, R = 10 k, C = 50 pF  
L
L
THD = THD  
THD  
Measured  
Source  
V
IS  
= 4.0 V sine wave  
4.5  
0.10  
PP  
*Guaranteed limits not tested. Determined by design and verified by qualification.  
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5
MC74HCT4066A  
200  
180  
160  
140  
120  
100  
80  
+25 °C  
+125°C  
55°C  
60  
40  
20  
0
0.00  
0.50  
1.00  
1.50  
2.00  
2.50  
3.00  
3.50  
4.00  
4.50  
V , INPUT VOLTAGE (VOLTS), REFERENCED TO GROUND  
is  
Figure 3. Typical On Resistance, VCC = 4.5 V  
PLOTTER  
PROGRAMMABLE  
MINI COMPUTER  
DC ANALYZER  
POWER  
SUPPLY  
-
+
V
CC  
DEVICE  
UNDER TEST  
ANALOG IN  
COMMON OUT  
GND  
Figure 4. On Resistance Test SetUp  
V
CC  
V
CC  
V
CC  
V
CC  
14  
14  
GND  
N/C  
A
ON  
A
OFF  
GND  
V
CC  
SELECTED  
CONTROL  
INPUT  
SELECTED  
CONTROL  
INPUT  
V
IL  
V
IH  
7
7
Figure 5. Maximum Off Channel Leakage Current,  
Figure 6. Maximum On Channel Leakage Current,  
Any One Channel, Test SetUp  
Test SetUp  
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6
MC74HCT4066A  
V
OS  
V
OS  
V
CC  
V
CC  
V
IS  
14  
14  
f
in  
f
in  
ON  
OFF  
dB  
dB  
0.1F  
0.1F  
C *  
L
C *  
L
R
METER  
L
METER  
SELECTED  
CONTROL  
INPUT  
SELECTED  
CONTROL  
INPUT  
V
CC  
7
7
*Includes all probe and jig capacitance.  
*Includes all probe and jig capacitance.  
Figure 7. Maximum OnChannel Bandwidth  
Test SetUp  
Figure 8. OffChannel Feedthrough Isolation,  
Test SetUp  
V
CC  
V
CC/2  
V
CC/2  
14  
R
R
L
L
V
OS  
I
S
OFF/ON  
V
CC  
C *  
L
50%  
ANALOG IN  
(V )  
SELECTED  
CONTROL  
INPUT  
GND  
I
7
V
1 MHz  
f
t
t
PHL  
in  
t = t = 6 ns  
PLH  
r
3.0 V  
GND  
CONTROL  
50%  
ANALOG OUT  
*Includes all probe and jig capacitance.  
Figure 9. Feedthrough Noise, ON/OFF Control to  
Figure 10. Propagation Delays, Analog In to  
Analog Out  
Analog Out, Test SetUp  
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7
MC74HCT4066A  
V
CC  
t
r
t
f
14  
V
CC  
90%  
m
10%  
CONTROL  
ANALOG IN  
ANALOG OUT  
C *  
V
TEST  
ON  
(V )  
I
POINT  
GND  
L
t
t
t
PLZ  
PZL  
HIGH  
IMPEDANCE  
50%  
50%  
SELECTED  
CONTROL  
INPUT  
V
CC  
10%  
90%  
V
OL  
ANALOG  
OUT  
7
t
PZH  
PHZ  
V
OH  
HIGH  
*Includes all probe and jig capacitance.  
IMPEDANCE  
V = GND to 3.0 V  
I
V
m
= 1.3 V  
Figure 11. Propagation Delay Test SetUp  
Figure 12. Propagation Delay, ON/OFF Control  
to Analog Out  
V
IS  
1
POSITIONꢀꢀꢁWHEN TESTING t  
AND t  
PHZ  
PZH  
V
CC  
2
POSITIONꢀꢀWHEN TESTING t AND t  
PLZ  
PZL  
1
2
14  
R
V
OS  
L
V
CC  
f
in  
ON  
V
CC  
0.1 F  
1 kꢂ  
14  
1
2
TEST  
POINT  
OFF  
ON/OFF  
V
CC  
OR GND  
R
C *  
L
R
C *  
L
L
L
C *  
L
R
L
SELECTED  
CONTROL  
INPUT  
SELECTED  
CONTROL  
INPUT  
V
CC/2  
V
CC/2  
7
7
V
CC/2  
*Includes all probe and jig capacitance.  
*Includes all probe and jig capacitance.  
Figure 13. Propagation Delay Test SetUp  
Figure 14. Crosstalk Between Any Two Switches,  
Test SetUp  
V
CC  
A
V
IS  
V
CC  
V
OS  
14  
0.1 F  
TO  
N/C  
N/C  
OFF/ON  
f
in  
ON  
DISTORTION  
METER  
C *  
L
R
L
V
SELECTED  
CONTROL  
INPUT  
CC/2  
7
SELECTED  
CONTROL  
INPUT  
V
CC  
7
ON/OFF CONTROL  
*Includes all probe and jig capacitance.  
Figure 15. Power Dissipation Capacitance  
Figure 16. Total Harmonic Distortion, Test SetUp  
Test SetUp  
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8
MC74HCT4066A  
0
-ꢂ10  
-ꢂ20  
-ꢂ30  
-ꢂ40  
FUNDAMENTAL FREQUENCY  
-ꢂ50  
-ꢂ60  
-ꢂ70  
-ꢂ80  
-ꢂ90  
DEVICE  
SOURCE  
1.0  
2.0  
FREQUENCY (kHz)  
3.0  
Figure 17. Plot, Harmonic Distortion  
APPLICATION INFORMATION  
analog signal of twelve volts peaktopeak can be  
controlled.  
Unused analog inputs/outputs may be left floating (not  
connected). However, it is advisable to tie unused analog  
When voltage transients above V and/or below GND  
CC  
are anticipated on the analog channels, external diodes (Dx)  
are recommended as shown in Figure 17. These diodes  
should be small signal, fast turnon types able to absorb the  
maximum anticipated current surges during clipping. An  
alternate method would be to replace the Dx diodes with  
MOSORB® (MOSORB is an acronym for high current  
surge protectors). MOSORBs are fast turnon devices  
ideally suited for precise DC protection with no inherent  
wear out mechanism.  
inputs and outputs to V or GND through a low value  
CC  
resistor. This minimizes crosstalk and feedthrough noise  
that may be pickedup by the unused I/O pins.  
The maximum analog voltage swings are determined by  
the supply voltages V and GND. The positive peak analog  
CC  
voltage should not exceed V . Similarly, the negative peak  
CC  
analog voltage should not go below GND. In the example  
below, the difference between V and GND is twelve volts.  
CC  
Therefore, using the configuration in Figure 16, a maximum  
V
CC  
V
CC  
V
CC  
= 5 V  
D
D
D
D
14  
x
x
x
x
16  
+ 5 V  
0 V  
+ 5 V  
0 V  
ANALOG I/O  
ANALOG O/I  
ON  
ON  
SELECTED  
CONTROL  
INPUT  
SELECTED  
CONTROL  
INPUT  
V
CC  
OTHER CONTROL  
INPUTS  
OTHER CONTROL  
INPUTS  
7
7
Figure 18. 5 V Application  
Figure 19. Transient Suppressor Application  
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9
MC74HCT4066A  
+ꢂ5 V  
+ꢂ5 V  
14  
14  
ANALOG  
SIGNALS  
ANALOG  
SIGNALS  
ANALOG  
SIGNALS  
ANALOG  
SIGNALS  
R* R* R* R*  
HC4066A  
HCT4066A  
LSTTL/  
NMOS  
LSTTL/  
NMOS  
5
6
5
6
CONTROL  
INPUTS  
CONTROL  
INPUTS  
14  
15  
14  
15  
7
7
R* = 2 TO 10 kꢂ  
a. Using Pull-Up Resistors with HC Device  
b. Using HCT Buffer  
Figure 20. LSTTL/NMOS to HCTMOS Interface  
1 OF 4  
CHANNEL 4  
CHANNEL 3  
CHANNEL 2  
CHANNEL 1  
SWITCHES  
1 OF 4  
SWITCHES  
COMMON I/O  
1 OF 4  
SWITCHES  
-
+
1 OF 4  
OUTPUT  
1 OF 4  
INPUT  
SWITCHES  
LF356 OR  
SWITCHES  
EQUIVALENT  
0.01 F  
1
2
3
4
CONTROL INPUTS  
Figure 21. 4Input Multiplexer  
Figure 22. Sample/Hold Amplifier  
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10  
MC74HCT4066A  
PACKAGE DIMENSIONS  
SOIC14  
CASE 751A03  
ISSUE J  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
A−  
14  
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
B−  
P 7 PL  
M
M
B
0.25 (0.010)  
7
1
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
F
R X 45ꢁ  
C
A
B
C
D
F
G
J
K
M
P
R
8.55  
3.80  
1.35  
0.35  
0.40  
1.27 BSC  
0.19  
0.10  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
T−  
J
M
K
SEATING  
D 14 PL  
PLANE  
M
S
S
0.25 (0.010)  
T
B
A
0 ꢁ  
5.80  
0.25  
7ꢁ  
0 ꢁ  
7ꢁ  
6.20 0.228 0.244  
0.50 0.010 0.019  
SOLDERING FOOTPRINT*  
7X  
7.04  
14X  
1.52  
1
14X  
0.58  
1.27  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
11  
MC74HCT4066A  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G01  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DETAIL E  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T  
U
A
V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
J1  
K
W−  
C
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
0 ꢁ  
8 ꢁ  
0 ꢁ  
8 ꢁ  
SEATING  
PLANE  
T−  
H
G
DETAIL E  
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
12  
MC74HCT4066A  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC74HCT4066A/D  

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