MBRB4030G [ONSEMI]

SWITCHMODE Power Rectifier; 开关模式电源整流器


型号：	MBRB4030G
厂家：	ONSEMI
描述：	SWITCHMODE Power Rectifier 开关模式电源整流器开关
文件：	总6页 (文件大小：64K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MBRB4030

Preferred Device

SWITCHMODEt

Power Rectifier

These state−of−the−art devices use the Schottky Barrier principle

with a proprietary barrier metal.

Features

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• Guardring for Stress Protection

• Maximum Die Size

• 175°C Operating Junction Temperature

• Short Heat Sink Tab Manufactured − Not Sheared

• Pb−Free Packages are Available

SCHOTTKY BARRIER

RECTIFIER

40 AMPERES, 30 VOLTS

Mechanical Characteristics:

• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0

• Weight: 1.7 Grams (Approximately)

• Finish: All External Surfaces Corrosion Resistant and Terminal

Leads Readily Solderable

• Device Meets MSL1 Requirements

• ESD Ratings: Machine Model, C (>400 V)

Human Body Model, 3B (>8000 V)

D PAK

CASE 418B

STYLE 3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

RRM

MARKING DIAGRAM

RWM

Average Rectified Forward Current

AY WW

F(AV)

(At Rated V ) T = +115°C (Note 1)

B4030G

AKA

Peak Repetitive Forward Current

(At Rated V , Square Wave, 20 kHz),

FRM

= +112°C

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions

Halfwave, Single Phase, 60 Hz)

300

2.0

FSM

= Assembly Location

= Year

= Work Week

Peak Repetitive Reverse Surge Current

(2.0 ms, 1.0 kHz)

RRM

B4030 = Device Code

AKA

= Pb−Free Package

= Diode Polarity

Storage Temperature Range

−65 to +175

°C

stg

Operating Junction Temperature Range

(Note 2)

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

Voltage Rate of Change (Rated V )

dv/dt

10,000

600

V/ms

Reverse Energy (Unclamped Inductive

Surge), (T = 25°C, L = 3.0 mH)

Preferred devices are recommended choices for future use

and best overall value.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Rating applies when pins 1 and 3 are connected.

2. The heat generated must be less than the thermal conductivity from

Junction−to−Ambient: dP /dT < 1/R .

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

September, 2006 − Rev. 6

MBRB4030/D

MBRB4030

THERMAL CHARACTERISTICS

Characteristic

Symbol

Value

1.0

Unit

°C/W

Thermal Resistance, Junction−to−Case

Thermal Resistance, Junction−to−Ambient (Note 4)

ELECTRICAL CHARACTERISTICS

Characteristic

Symbol

Value

Unit

Maximum Instantaneous Forward Voltage (Notes 3 and 5), per Device

(I = 20 A, T = + 25°C)

0.46

0.34

0.55

0.45

(I = 20 A, T = +150°C)

(I = 40 A, T = + 25°C)

(I = 40 A, T = +150°C)

Maximum Instantaneous Reverse Current (Note 5), per Device

(Rated DC Voltage, T = + 25°C)

0.35

150

(Rated DC Voltage, T = +125°C)

3. Rating applies when pins 1 and 3 are connected.

4. Rating applies when surface mounted on the miniumum pad size recommended.

5. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%

ORDERING INFORMATION

†

Device

Package

Shipping

MBRB4030

D PAK

50 Units / Rail

MBRB4030G

D PAK

(Pb−Free)

MBRB4030T4

D PAK

800 Units / Tape & Reel

MBRB4030T4G

D PAK

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

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MBRB4030

ELECTRICAL CHARACTERISTICS

100

T = 150°C

1.0

0.1

1.0

0.1

100°C

25°C

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.1

0.2

0.3

0.4

0.5

0.6

0.7

V , INSTANTANEOUS VOLTAGE (V)

Figure 1. Maximum Forward Voltage

Figure 2. Typical Forward Voltage

1.0

T = 150°C

0.1

100°C

0.01

−3

−4

25°C

−5

V , REVERSE VOLTAGE (V)

Figure 3. Maximum Reverse Current

Figure 4. Typical Reverse Current

T = 25°C

TYPICAL

MAXIMUM

1000

V , REVERSE VOLTAGE (V)

Figure 5. Maximum and Typical Capacitance

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MBRB4030

ELECTRICAL CHARACTERISTICS

= 25°C/W

SURFACE MOUNTED ON

MINIMUM RECOMMENDED

PAD SIZE

π (RESISTIVE LOAD)

SQUARE WAVE

(RESISTIVE LOAD)

SQUARE WAVE

= 5.0 (CAPACITIVE

LOAD)

= 5.0 (CAPACITIVE

LOAD)

100

150

100

110

120

130

140

150

T , AMBIENT TEMPERATURE (°C)

T , CASE TEMPERATURE (°C)

Figure 6. Current Derating, Infinite Heatsink

Figure 7. Current Derating

= 50°C/W

T = 150°C

π (RESISTIVE LOAD)

SQUARE WAVE

= 5.0 (CAPACITIVE

LOAD)

SQUARE WAVE

= 5.0 (CAPACITIVE

LOAD)

100

150

, AVERAGE FORWARD CURRENT (A)

T , AMBIENT TEMPERATURE (°C)

F(AV)

Figure 8. Current Derating, Free Air

Figure 9. Forward Power Dissipation

1.0

SINGLE PULSE

DUTY CYCLE, D = t /t

p 1

PEAK POWER, P , is peak of an

equivalent square power pulse.

0.1

TIME

DT = P • R [D + (1 − D) • r(t + t ) + r(t ) − r(t )]

where

DT = the increase in junction temperature above the lead temperature

r(t) = normalized value of transient thermal resistance at time, t, for example,

r(t) = r(t + t ) = normalized value of transient thermal resistance at time, t + t .

0.01

0.1

1.0

100

1000

t, TIME (ms)

Figure 10. Thermal Response

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MBRB4030

PACKAGE DIMENSIONS

D²PAK 3

CASE 418B−04

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 418B−01 THRU 418B−03 OBSOLETE,

NEW STANDARD 418B−04.

−B−

INCHES

DIM MIN MAX

MILLIMETERS

MIN

MAX

0.340 0.380

0.380 0.405

0.160 0.190

0.020 0.035

0.045 0.055

0.310 0.350

0.100 BSC

8.64

9.65 10.29

4.06

0.51

1.14

7.87

9.65

4.83

0.89

1.40

8.89

2.54 BSC

−T−

SEATING

PLANE

0.080

0.018 0.025

0.090 0.110

0.110

2.03

0.46

2.29

1.32

7.11

5.00 REF

2.00 REF

0.99 REF

2.79

0.64

2.79

1.83

8.13

0.052 0.072

0.280 0.320

0.197 REF

0.079 REF

0.039 REF

D 3 PL

0.13 (0.005)

0.575 0.625 14.60 15.88

0.045 0.055 1.14 1.40

STYLE 3:

VARIABLE

CONFIGURATION

ZONE

PIN 1. ANODE

2. CATHODE

3. ANODE

4. CATHODE

VIEW W−W

SOLDERING FOOTPRINT*

8.38

0.33

1.016

0.04

10.66

0.42

5.08

0.20

3.05

0.12

17.02

0.67

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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MBRB4030

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 61312, Phoenix, Arizona 85082−1312 USA

Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada

Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

MBRB4030/D

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