MC100E141 [ONSEMI]

8-BIT SHIFT REGISTER; 8位移位寄存器
MC100E141
型号: MC100E141
厂家: ONSEMI    ONSEMI
描述:

8-BIT SHIFT REGISTER
8位移位寄存器

移位寄存器
文件: 总4页 (文件大小:115K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC10E/100E141 is an 8-bit full-function shift register. The E141  
performs serial/parallel in and serial/parallel out, shifting in either  
direction. The eight inputs D – D accept parallel input data, while  
0
7
DL/DR accept serial input data for left/right shifting. The Qn outputs do  
not need to be terminated for the shift operation to function. To minimize  
noise and power, any Q output not used should be left unterminated.  
700MHz Min. Shift Frequency  
8-Bit  
8-BIT SHIFT  
REGISTER  
Full-Function, Bi-Directional  
Asynchronous Master Reset  
Pin-Compatible with E241  
Extended 100E V  
EE  
Range of – 4.2V to – 5.46V  
75kInput Pulldown Resistors  
The select pins, SEL0 and SEL1, select one of four modes of  
operation: Load, Hold, Shift Left, Shift Right, according to the Function  
Table.  
Input data is accepted a set-up time before the positive clock edge. A  
HIGH on the Master Reset (MR) pin asynchronously resets all the  
registers to zero.  
FN SUFFIX  
PLASTIC PACKAGE  
CASE 776-02  
Pinout: 28-Lead PLCC (Top View)  
SEL0  
DL  
D
D
D
V
Q
7
7
6
5
CCO  
25  
24  
23  
22  
21  
20  
19  
SEL1  
Q
Q
26  
18  
17  
16  
15  
14  
13  
6
FUNCTION TABLE  
CLK  
MR  
27  
28  
5
SEL0  
SEL1  
Function  
V
CC  
L
L
H
H
L
H
L
Load  
Shift Right (D to D  
)
n+1  
n
V
1
2
NC  
EE  
Shift Left (D to D  
)
n –1  
n
H
Hold  
DR  
V
CCO  
PIN NAMES  
Pin  
D
0
3
Q
4
3
Function  
D
1
4
Q
12  
D
– D  
Parallel Data Inputs  
Serial Data Inputs  
Mode Select In Inputs  
Clock  
0
7
DL, DR  
SEL0, SEL1  
CLK  
5
6
7
8
9
10  
11  
D
D
D
V
Q
Q
Q
2
2
3
4
CCO  
0
1
Q
MR  
– Q  
Data Outputs  
Master Reset  
0
7
* All V  
and V pins are tied together on the die.  
CCO  
CC  
EXPANDED FUNCTION TABLE  
Function  
DL  
DR  
SEL0  
SEL1  
MR  
CLK  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Load  
X
X
X
L
X
L
L
L
L
H
H
L
L
L
L
L
L
L
Z
Z
Z
Z
Z
Z
D0  
L
D1  
Q0  
L
D2  
Q1  
Q0  
Q1  
Q2  
Q2  
D3  
Q2  
Q1  
Q2  
Q3  
Q3  
D4  
Q3  
Q2  
Q3  
Q4  
Q4  
D5  
Q4  
Q3  
Q4  
Q5  
Q5  
D6  
D7  
Q6  
Q5  
L
Shift Right  
Q5  
Q4  
Q5  
L
H
X
X
X
L
H
Shift Left  
Hold  
H
H
H
L
Q0  
Q1  
Q1  
H
X
L
Q0  
Q0  
H
H
L
H
X
X
X
X
H
X
H
X
L
Z
X
Q0  
L
Q1  
L
Q2  
L
Q3  
L
Q4  
L
Q5  
L
L
L
H
L
Reset  
H
7/96  
Motorola, Inc. 1996  
REV 3  
MC10E141 MC100E141  
LOGIC DIAGRAM  
DL  
BITS 1 – 6  
Q
D
Q
Q
D
D
DR  
R
R
R
D
Q
7
Q
Q
0
D
7
D
0
SEL1  
SEL0  
CLK  
MR  
DC CHARACTERISTICS (V  
= V (min) to V (max); V  
EE EE  
= V = GND)  
CCO  
EE  
CC  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Input HIGH Current  
min  
typ  
max  
min  
typ  
max  
min  
typ  
max Unit Condition  
I
I
150  
150  
150  
µA  
IH  
Power Supply Current  
mA  
EE  
10E  
100E  
131  
131  
181  
181  
131  
131  
181  
181  
131  
151  
181  
181  
AC CHARACTERISTICS (V  
= V (min) to V (max); V  
EE EE  
= V  
= GND)  
CCO  
EE  
CC  
0°C  
25°C  
85°C  
typ  
Symbol  
Characteristic  
min  
typ  
max  
min  
typ  
max  
min  
max Unit Condition  
f
Max. Shift Frequency  
700  
900  
700  
900  
700  
900  
MH  
z
SHIFT  
t
t
Propagation Delay To Output  
ps  
PLH  
PHL  
Clk  
MR  
625  
600  
750  
725  
975  
975  
625  
600  
750  
725  
975  
975  
625  
600  
750  
725  
975  
975  
t
Setup Time  
ps  
ps  
s
D
175  
350  
300  
25  
175  
350  
300  
25  
175  
350  
300  
25  
200  
150  
SEL0  
SEL1  
200  
150  
200  
150  
t
h
Hold Time  
D
200  
100  
100  
– 25  
– 200  
–150  
200  
100  
100  
– 25  
– 200  
–150  
200  
100  
100  
– 25  
– 200  
–150  
SEL0  
SEL1  
t
t
Reset Recovery Time  
900  
700  
900  
700  
900  
700  
ps  
ps  
RR  
Minimum Pulse Width  
Clk, MR  
PW  
400  
400  
400  
t
Within-Device Skew  
60  
60  
60  
ps  
ps  
1
SKEW  
t
r
t
f
Rise/Fall Times  
20 - 80%  
300  
525  
800  
300  
525  
800  
300  
525  
800  
1. Within-device skew is defined as identical transitions on similar paths through a device.  
MOTOROLA  
2–2  
MC10E141 MC100E141  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 776–02  
ISSUE D  
M
S
S
0.007 (0.180)  
T
L –M  
N
B
Z
Y BRK  
D
-N-  
M
S
S
0.007 (0.180)  
T
L –M  
N
U
-L-  
-M-  
D
W
X
G1  
S
S
S
0.010 (0.250)  
0.007 (0.180)  
T
L –M  
L –M  
N
V
28  
1
VIEW D-D  
M
M
S
S
S
0.007 (0.180)  
0.007 (0.180)  
T
T
L –M  
L –M  
N
A
R
H
M
S
S
T
N
Z
S
N
K1  
C
E
0.004 (0.100)  
SEATING  
PLANE  
G
K
-T-  
VIEW S  
J
M
S
S
0.007 (0.180)  
T
L –M  
N
F
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L –M  
N
NOTES:  
1. DATUMS -L-, -M-, AND -N- DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIM G1, TRUE POSITION TO BE MEASURED  
AT DATUM -T-, SEATING PLANE.  
INCHES  
MAX  
MILLIMETERS  
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.  
ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
DIM  
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1  
K1  
MIN  
MIN  
12.32  
12.32  
4.20  
MAX  
12.57  
12.57  
4.57  
0.485  
0.495  
0.495  
0.180  
0.110  
0.019  
0.485  
0.165  
0.090  
0.013  
2.29  
2.79  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
0.33  
0.48  
0.050 BSC  
1.27 BSC  
0.026  
0.032  
0.456  
0.456  
0.048  
0.048  
0.056  
0.020  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
0.81  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
2
°
10°  
2°  
10°  
0.410  
0.040  
0.430  
10.42  
1.02  
10.92  
2–3  
MOTOROLA  
MC10E141 MC100E141  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315  
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC10E141/D  

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