MC100EL12DTG [ONSEMI]
5.0 V ECL Low Impedance Driver; 5.0 V ECL低阻抗驱动器型号: | MC100EL12DTG |
厂家: | ONSEMI |
描述: | 5.0 V ECL Low Impedance Driver |
文件: | 总8页 (文件大小:144K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MC10EL12, MC100EL12
5.0 VꢀECL Low Impedance
Driver
The MC10EL/100EL12 is a low impedance drive buffer. With two
pairs of OR/NOR outputs the device is ideally suited for high drive
applications such as memory addressing. The device is a function
equivalent to the E112 device with higher performance capabilities.
With propagation delays significantly faster than the E112, the EL12 is
ideally suited for those applications which require the ultimate in
AC performance.
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MARKING
DIAGRAMS*
8
The 100 Series contains temperature compensation.
8
1
8
1
Features
• 290 ps Propagation Delay
• Dual Outputs for 25 W Drive Applications
HEL12
KEL12
ALYW
G
SOIC−8
D SUFFIX
CASE 751
ALYW
G
1
• ESD Protection: Human Body Model; > 1.0 kV
Machine Model; > 100 V
8
8
8
• PECL Mode Operating Range: V = 4.2 V to 5.7 V with V = 0 V
CC
EE
1
HL12
ALYWG
G
KL12
ALYWG
G
• NECL Mode Operating Range: V = 0 V with V = −4.2 V to −5.7 V
CC
EE
TSSOP−8
DT SUFFIX
CASE 948R
• Internal Input Pulldown Resistors
• Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1
1
• Moisture Sensitivity Level 1
For Additional Information, see Application Note AND8003/D
• Flammability Rating: UL 94 V−0 @ 0.125 in,
Oxygen Index: 28 to 34
• Transistor Count = 44 devices
• Pb−Free Packages are Available
DFN8
MN SUFFIX
CASE 506AA
1
4
1
4
H
K
MC10
MC100
L
= Wafer Lot
= Year
= Work Week
= Date Code
= Pb−Free Package
Q
Q
Q
1
2
3
8
7
6
V
CC
a
b
a
Y
W
M
G
4R MC10
2F MC100
A
= Assembly Location
D
D
0
1
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Q
4
5
V
EE
b
Figure 1. Logic Diagram and Pinout Assignment
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 6
MC10EL12/D
MC10EL12, MC100EL12
Table 1. PIN DESCRIPTION
PIN
FUNCTION
D0, D1
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
Qa,Qa; Qb, Qb
V
CC
V
EE
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
Table 2. MAXIMUM RATINGS
Symbol
Parameter
PECL Mode Power Supply
NECL Mode Power Supply
Condition 1
Condition 2
Rating
Unit
V
V
V
EE
V
CC
= 0 V
= 0 V
8
CC
EE
I
V
V
−8
V
PECL Mode Input Voltage
NECL Mode Input Voltage
V
V
= 0 V
= 0 V
V ꢀ V
6
−6
V
V
EE
I
CC
V ꢁ V
CC
I
EE
I
Output Current
Continuous
Surge
50
100
mA
mA
out
T
Operating Temperature Range
−40 to +85
°C
°C
A
T
Storage Temperature Range
−65 to +150
stg
JA
q
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
q
q
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Standard Board
SOIC−8
41 to 44
°C/W
JC
JA
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
q
q
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
JC
JA
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
T
sol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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2
MC10EL12, MC100EL12
Table 3. 10EL SERIES PECL DC CHARACTERISTICS V = 5.0 V; V = 0.0 V (Note 1)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
Typ
14
Max
17
Min
Max
17
Min
Max
17
Unit
mA
mV
mV
mV
mV
mA
I
EE
14
14
V
V
V
V
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 2)
Input HIGH Voltage
3920
3050
3770
3050
4010
3200
4110
3350
4110
3500
150
4020
3050
3870
3050
4105
3210
4190
3370
4190
3520
150
4090
3050
3940
3050
4185
3227
4280
3405
4280
3555
150
OH
OL
IH
Input LOW Voltage
IL
I
Input HIGH Current
IH
IL
I
Input LOW Current
0.5
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with V . V can vary +0.06 V / −0.5 V.
CC
EE
2. Outputs are terminated through a 50 W resistor to V − 2 volts.
CC
Table 4. 10EL SERIES NECL DC CHARACTERISTICS V = 0.0 V; V = −5.0 V (Note 3)
CC
EE
−40°C
25°C
Typ
14
85°C
Typ
14
Symbol
Characteristic
Power Supply Current
Min
Typ
Max
17
Min
Max
17
Min
Max
17
Unit
mA
mV
mV
mV
mV
mA
I
EE
14
V
V
V
V
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Input HIGH Voltage
−1080 −990
−890
−980
−895
−810
−910
−815
−720
OH
OL
IH
−1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595
−1230
−1950
−890 −1130
−1500 −1950
150
−810 −1060
−1480 −1950
150
−720
−1445
150
Input LOW Voltage
IL
I
IH
I
IL
Input HIGH Current
Input LOW Current
0.5
0.5
0.3
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Input and output parameters vary 1:1 with V . V can vary +0.06 V / −0.5 V.
CC
EE
4. Outputs are terminated through a 50 W resistor to V − 2 volts.
CC
Table 5. 100EL SERIES PECL DC CHARACTERISTICS V = 5.0 V; V = 0.0 V (Note 5)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
Typ
14
Max
17
Min
Max
17
Min
Max
20
Unit
mA
mV
mV
mV
mV
mA
I
EE
14
16
V
V
V
V
Output HIGH Voltage (Note 6)
Output LOW Voltage (Note 6)
Input HIGH Voltage
3915
3170
3835
3190
3995
3305
4120
3445
4120
3525
150
3975
3190
3835
3190
4045
3295
4120
3380
4120
3525
150
3975
3190
3835
3190
4050
3295
4120
3380
4120
3525
150
OH
OL
IH
Input LOW Voltage
IL
I
Input HIGH Current
IH
IL
I
Input LOW Current
0.5
0.5
0.5
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with V . V can vary +0.8 V / −0.5 V.
CC
EE
6. Outputs are terminated through a 50 W resistor to V − 2 volts.
CC
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3
MC10EL12, MC100EL12
Table 6. 100EL SERIES NECL DC CHARACTERISTICS V = 0.0 V; V = −5.0 V (Note 7)
CC
EE
−40°C
Typ
14
25°C
Typ
14
85°C
Typ
16
Symbol
Characteristic
Power Supply Current
Min
Max
Min
Max
Min
Max
20
Unit
mA
mV
I
EE
17
17
V
V
V
V
Output HIGH Voltage (Note 8)
Output LOW Voltage (Note 8)
Input HIGH Voltage
−1085 −1005 −880 −1025 −955
−880 −1025 −955
−880
OH
OL
IH
−1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV
−1165
−1810
−880 −1165
−1475 −1810
150
−880 −1165
−1475 −1810
150
−880
mV
Input LOW Voltage
−1475 mV
IL
I
Input HIGH Current
150
mA
mA
IH
IL
I
Input LOW Current
0.5
0.5
0.5
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with V . V can vary +0.8 V / −0.5 V.
CC
EE
8. Outputs are terminated through a 50 W resistor to V − 2 volts.
CC
Table 7. AC CHARACTERISTICS V = 5.0 V; V = 0.0 V or V = 0.0 V; V = −5.0 V (Note 9)
CC
EE
CC
EE
−40°C
25°C
Typ
85°C
Typ
Min
Typ
Max
Min
Max
Min
Max
Symbol
Characteristic
Unit
f
Maximum Toggle Frequency
TBD
TBD
TBD
GHz
max
t
t
Propagation Delay to
Output
PLH
PHL
120
280
TBD
350
500
180
290
TBD
350
450
210
320
TBD
350
480
ps
ps
ps
t
Cycle−to−Cycle Jitter
JITTER
t
r
t
f
Output Rise/Fall Times Q
(20% − 80%)
150
550
150
550
150
550
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: V can vary +0.06 V / −0.5 V.
EE
100 Series: V can vary +0.8 V / −0.5 V.
EE
Z = 50 W
Q
D
D
o
Receiver
Device
Driver
Device
Q
Z = 50 W
o
50 W
50 W
V
TT
V
TT
= V − 3.0 V
CC
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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4
MC10EL12, MC100EL12
ORDERING INFORMATION
Device
†
Package
Shipping
MC10EL12D
SOIC−8
98 Units / Rail
98 Units / Rail
MC10EL12DG
SOIC−8
(Pb−Free)
MC10EL12DR2
SOIC−8
2500 / Tape & Reel
2500 / Tape & Reel
MC10EL12DR2G
SOIC−8
(Pb−Free)
MC10EL12DT
TSSOP−8
100 Units / Rail
100 Units / Rail
MC10EL12DTG
TSSOP−8
(Pb−Free)
MC10EL12DTR2
TSSOP−8
2500 / Tape & Reel
2500 / Tape & Reel
MC10EL12DTR2G
TSSOP−8
(Pb−Free)
MC10EL12MNR4
MC10EL12MNR4G
DFN8
1000 / Tape & Reel
1000 / Tape & Reel
DFN8
(Pb−Free)
MC100EL12D
SOIC−8
98 Units / Rail
98 Units / Rail
MC100EL12DG
SOIC−8
(Pb−Free)
MC100EL12DR2
SOIC−8
2500 / Tape & Reel
2500 / Tape & Reel
MC100EL12DR2G
SOIC−8
(Pb−Free)
MC100EL12DT
TSSOP−8
100 Units / Rail
100 Units / Rail
MC100EL12DTG
TSSOP−8
(Pb−Free)
MC100EL12DTR2
MC100EL12DTR2G
TSSOP−8
2500 / Tape & Reel
2500 / Tape & Reel
TSSOP−8
(Pb−Free)
MC100EL12MNR4
MC100EL12MNR4G
DFN8
1000 / Tape & Reel
1000 / Tape & Reel
DFN8
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
−
−
−
−
−
−
−
−
−
−
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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5
MC10EL12, MC100EL12
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MC10EL12, MC100EL12
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x K REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
S
0.15 (0.006) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
2X L/2
8
5
4
0.25 (0.010)
B
−U−
L
1
M
PIN 1
IDENT
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
0.15 (0.006) T U
A
−V−
F
DETAIL E
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
3.10
3.10
MAX
0.122
0.122
0.043
0.006
0.028
A
B
C
D
F
2.90
2.90
0.80
0.05
0.40
0.114
0.114
C
1.10 0.031
0.15 0.002
0.70 0.016
0.10 (0.004)
−W−
SEATING
PLANE
D
−T−
G
G
K
L
0.65 BSC
0.026 BSC
0.25
0.40 0.010
0.016
4.90 BSC
0.193 BSC
0
DETAIL E
M
0
6
6
_
_
_
_
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7
MC10EL12, MC100EL12
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
MILLIMETERS
DIM MIN
MAX
1.00
0.05
E
A
A1
A3
b
0.80
0.00
0.20 REF
0.20
0.30
2 X
D
D2
E
E2
e
K
2.00 BSC
0.10
C
1.10
1.30
2.00 BSC
2 X
0.70
0.90
0.50 BSC
0.10
C
TOP VIEW
0.20
0.25
−−−
0.35
L
A
0.10
0.08
C
C
8 X
(A3)
SIDE VIEW
D2
A1
SEATING
PLANE
C
e
e/2
4
1
8 X L
E2
K
8
5
0.10 C A B
8 X b
0.05
C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Phone: 421 33 790 2910
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MC10EL12/D
相关型号:
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