MC100EP16VBDTR2 [ONSEMI]

3.3V / 5V ECL Differential Receiver/Driver with High and Low Gain; 3.3V / 5V ECL差分接收器/驱动器,具有高,低增益
MC100EP16VBDTR2
型号: MC100EP16VBDTR2
厂家: ONSEMI    ONSEMI
描述:

3.3V / 5V ECL Differential Receiver/Driver with High and Low Gain
3.3V / 5V ECL差分接收器/驱动器,具有高,低增益

驱动器
文件: 总10页 (文件大小:151K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC100EP16VB  
3.3Vꢀ/ꢀ5VꢁECL Differential  
Receiver/Driver with High  
and Low Gain  
Description  
http://onsemi.com  
MARKING DIAGRAMS*  
The EP16VB is a worldclass differential receiver/driver. The  
device is functionally equivalent to the EP16 and LVEP16 devices but  
with both high and low gain outputs. Q and Q outputs have a DC  
HG  
HG  
gain several times larger than the DC gain of an EP16. Q output is  
provided for feedback purposes.  
8
KEP65  
ALYW  
G
SOIC8  
D SUFFIX  
CASE 751  
The V pin, an internally generated voltage supply, is available to  
BB  
8
this device only. For single-ended input conditions, the unused  
1
1
differential input is connected to V as a switching reference voltage.  
1
BB  
V
BB  
may also rebias AC coupled inputs. When used, decouple V  
BB  
and V via a 0.01 mF capacitor and limit current sourcing or sinking  
CC  
8
1
to 0.5 mA. When not used, V should be left open.  
BB  
TSSOP8  
DT SUFFIX  
CASE 948R  
KP65  
8
Special considerations are required for differential inputs under No  
Signal conditions to prevent instability.  
The 100 Series contains temperature compensation.  
ALYWG  
G
Features  
Gain > 200  
Maximum Frequency > 3 GHz Typical  
DFN8  
MN SUFFIX  
CASE 506AA  
1
4
PECL Mode Operating Range: V = 3.0 V to 5.5 V  
CC  
with V = 0 V  
EE  
A
L
Y
W
M
G
= Assembly Location  
= Wafer Lot  
= Year  
= Work Week  
= Date Code  
= PbFree Package  
NECL Mode Operating Range: V = 0 V  
CC  
with V = 3.0 V to 5.5 V  
EE  
V Output  
BB  
PbFree Packages are Available  
(Note: Microdot may be in either location)  
*For additional marking information, refer to  
Application Note AND8002/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
December, 2006 Rev. 4  
MC100EP16VB/D  
MC100EP16VB  
Table 1. PIN DESCRIPTION  
Q
D
1
2
8
7
V
CC  
Pin  
Function  
ECL Data Inputs  
D*, D*  
Q
ECL Data Output  
Q
HG  
HG  
Q
, Q  
ECL High Gain Data Outputs  
Reference Voltage Output  
Positive Supply  
HG  
BB  
CC  
EE  
HG  
V
V
V
D
3
4
6
5
Q
Negative Supply  
EP  
Exposed pad must be connected to a  
sufficient thermal conduit. Electrically  
connect to the most negative supply or  
leave floating open.  
V
V
EE  
BB  
*Pins will default LOW when left open.  
Figure 1. 8Lead Pinout (Top View) and Logic  
Diagram  
Table 2. ATTRIBUTES  
Characteristics  
Value  
75 kW  
N/A  
Internal Input Pulldown Resistor  
Internal Input Pullup Resistor  
ESD Protection  
Human Body Model  
> 4 kV  
> 200 V  
> 2 kV  
Machine Model  
Charged Device Model  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
Pb Pkg  
PbFree Pkg  
SOIC8  
Level 1  
Level 1  
Level 1  
Level 1  
Level 3  
Level 1  
TSSOP8  
DFN8  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
167 Devices  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
http://onsemi.com  
2
 
MC100EP16VB  
Table 3. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
Condition 2  
Rating  
Unit  
V
V
CC  
V
EE  
V
I
PECL Mode Power Supply  
NECL Mode Power Supply  
V
V
= 0 V  
= 0 V  
6
EE  
6  
V
CC  
PECL Mode Input Voltage  
NECL Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V v V  
6
6  
V
V
EE  
I
CC  
V w V  
CC  
I
EE  
I
I
Output Current  
Continuous  
Surge  
50  
100  
mA  
mA  
out  
V
BB  
Sink/Source  
± 0.5  
mA  
°C  
BB  
T
Operating Temperature Range  
40 to +85  
65 to +150  
A
T
Storage Temperature Range  
°C  
stg  
q
Thermal Resistance (JunctiontoAmbient)  
0 lfpm  
500 lfpm  
8 SOIC  
8 SOIC  
190  
130  
°C/W  
°C/W  
JA  
q
q
Thermal Resistance (JunctiontoCase)  
Thermal Resistance (JunctiontoAmbient)  
Standard Board  
8 SOIC  
41 to 44  
°C/W  
JC  
JA  
0 lfpm  
500 lfpm  
8 TSSOP  
8 TSSOP  
185  
140  
°C/W  
°C/W  
q
q
Thermal Resistance (JunctiontoCase)  
Thermal Resistance (JunctiontoAmbient)  
Standard Board  
8 TSSOP  
41 to 44  
°C/W  
JC  
JA  
0 lfpm  
500 lfpm  
DFN8  
DFN8  
129  
84  
°C/W  
°C/W  
T
sol  
Wave Solder  
Pb  
PbFree  
265  
265  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
Table 4. 100EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 2)  
CC  
EE  
40°C  
25°C  
Typ  
36  
85°C  
Typ  
38  
Symbol  
Characteristic  
Power Supply Current  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
52  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
25  
34  
45  
30  
50  
32  
V
V
V
V
V
V
Output HIGH Voltage (Note 3)  
Output LOW Voltage (Note 3)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
2125 2250  
1305 1430  
2075  
2375 2125 2250 2375 2125 2250  
1555 1305 1400 1555 1305 1380  
2375  
1555  
2420  
1675  
1960  
3.3  
OH  
OL  
2420 2075  
1675 1355  
2420 2075  
1675 1355  
IH  
1355  
IL  
1730 1845  
2.0  
1960 1730 1845 1960 1730 1845  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 4)  
3.3  
2.0  
3.3  
2.0  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. Input and output parameters vary 1:1 with V . V can vary +0.3 V to 2.2 V.  
CC  
EE  
3. All loading with 50 W to V 2.0 V.  
CC  
4. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
3
 
MC100EP16VB  
Table 5. 100EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 5)  
CC  
EE  
40°C  
25°C  
Typ  
36  
85°C  
Typ  
38  
Symbol  
Characteristic  
Power Supply Current  
Min  
25  
Typ  
Max  
Min  
Max  
Min  
Max  
Unit  
I
EE  
34  
45  
30  
50  
32  
52  
mA  
V
V
V
V
V
V
Output HIGH Voltage (Note 6)  
Output LOW Voltage (Note 6)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
3825 3950 4075 3825 3950 4075 3825 3950 4075  
3005 3130 3255 3005 3100 3255 3005 3080 3255  
mV  
mV  
mV  
mV  
mV  
V
OH  
OL  
3775  
3055  
4120 3775  
3375 3055  
4120 3775  
3375 3055  
4120  
3375  
IH  
IL  
3430 3445 3660 3430 3445 3660 3430 3445 3660  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 7)  
2.0  
5.0  
2.0  
5.0  
2.0  
5.0  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
5. Input and output parameters vary 1:1 with V . V can vary +2.0 V to 0.5 V.  
CC  
EE  
6. All loading with 50 W to V 2.0 V.  
CC  
7. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 6. 100EP DC CHARACTERISTICS, NECL V = 0 V; V = 5.5 V to 3.0 V (Note 8)  
CC  
EE  
40°C  
Typ  
34  
25°C  
Typ  
36  
85°C  
Typ  
38  
Symbol  
Characteristic  
Power Supply Current  
Min  
Max  
45  
Min  
Max  
Min  
Max  
Unit  
I
EE  
25  
30  
50  
32  
52  
mA  
V
V
V
V
V
V
Output HIGH Voltage (Note 9)  
Output LOW Voltage (Note 9)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
Output Voltage Reference  
1175 1050 925 1175 1050 925 1175 1050 925  
1995 1870 1745 1995 1900 1745 1995 1920 1745  
mV  
mV  
mV  
mV  
mV  
V
OH  
OL  
1225  
1945  
880 1225  
1625 1945  
880 1225  
1625 1945  
880  
IH  
1625  
IL  
1570 1455 1340 1570 1455 1340 1570 1455 1340  
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 10)  
V
EE  
+ 2.0  
0.0  
V
EE  
+ 2.0  
0.0  
V + 2.0  
EE  
0.0  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
8. Input and output parameters vary 1:1 with V  
.
CC  
9. All loading with 50 W to V 2.0 V.  
CC  
10.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
4
 
MC100EP16VB  
Table 7. AC CHARACTERISTICS V = 0 V; V = 3.0 V to 5.5 V or V = 3.0 V to 5.5 V; V = 0 V (Note 11)  
CC  
EE  
CC  
EE  
40°C  
Typ  
25°C  
Typ  
> 3  
85°C  
Typ  
> 3  
Symbol  
Characteristic  
Maximum Frequency (Figure 2)  
Propagation Delay (Differential) Q  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
GHz  
ps  
f
> 3  
max  
t
t
,
200  
200  
250  
250  
275  
280  
325  
330  
350  
350  
400  
400  
250  
250  
300  
300  
300  
300  
350  
350  
400  
400  
450  
450  
275  
275  
325  
325  
310  
320  
360  
370  
425  
425  
475  
475  
PLH  
PHL  
(Differential) QHG, QHG  
(SingleEnded) Q  
(SingleEnded) QHG, QHG  
t
t
Duty Cycle Skew (Note 12)  
CycletoCycle Jitter (Figure 3)  
5.0  
0.2  
20  
5.0  
0.2  
20  
5.0  
0.2  
20  
ps  
ps  
SKEW  
< 1  
< 1  
< 1  
JITTER  
V
PP  
Input Voltage Swing  
(Differential) HG  
(Differential) Q  
25  
150  
800  
800  
1200  
1200  
25  
150  
800  
800  
1200  
1200  
25  
150  
800  
800  
1200  
1200  
mV  
t
r
t
f
Output Rise/Fall Times  
Q
200  
70  
270  
130  
400  
220  
220  
80  
300  
150  
420  
240  
250  
100  
310  
170  
450  
270  
ps  
(20% 80%)  
QHG, QHG  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
11. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V 2.0 V.  
CC  
12.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays  
are measured from the cross point of the inputs to the cross point of the outputs.  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
9
8
7
6
5
4
3
2
1
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
FREQUENCY (MHz)  
Figure 2. Fmax/Jitter for QHG, QHG Output  
http://onsemi.com  
5
 
MC100EP16VB  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
9
8
7
6
5
4
3
2
1
0
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
FREQUENCY (MHz)  
Figure 3. Fmax/Jitter for Q Output  
Z = 50 W  
Q
Q
D
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
50 W  
50 W  
V
TT  
V
TT  
= V 2.0 V  
CC  
Figure 4. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D Termination of ECL Logic Devices.)  
http://onsemi.com  
6
MC100EP16VB  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC100EP16VBD  
MC100EP16VBDG  
SOIC8  
98 Units / Rail  
98 Units / Rail  
SOIC8  
(PbFree)  
MC100EP16VBDR2  
MC100EP16VBDR2G  
SOIC8  
2500 / Tape & Reel  
2500 / Tape & Reel  
SOIC8  
(PbFree)  
MC100EP16VBDT  
MC100EP16VBDTG  
TSSOP8  
100 Units / Rail  
100 Units / Rail  
TSSOP8  
(PbFree)  
MC100EP16VBDTR2  
MC100EP16VBDTR2G  
TSSOP8  
2500 / Tape & Reel  
2500 / Tape & Reel  
TSSOP8  
(PbFree)  
MC100EP16VBMNR4  
MC100EP16VBMNR4G  
DFN8  
1000 / Tape & Reel  
1000 / Tape & Reel  
DFN8  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
7
MC100EP16VB  
PACKAGE DIMENSIONS  
SOIC8 NB  
CASE 75107  
ISSUE AH  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
X−  
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. 75101 THRU 75106 ARE OBSOLETE. NEW  
STANDARD IS 75107.  
S
M
M
B
0.25 (0.010)  
Y
1
K
Y−  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
Z−  
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
0.020  
0.244  
M
J
H
D
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
1.52  
0.060  
7.0  
4.0  
0.275  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
8
MC100EP16VB  
PACKAGE DIMENSIONS  
TSSOP8  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948R02  
ISSUE A  
8x K REF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T U  
S
0.15 (0.006) T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
2X L/2  
8
5
4
0.25 (0.010)  
B
U−  
L
1
M
PIN 1  
IDENT  
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
6. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE −W−.  
S
0.15 (0.006) T U  
A
V−  
F
DETAIL E  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
3.10  
3.10  
MAX  
0.122  
0.122  
0.043  
0.006  
0.028  
A
B
C
D
F
2.90  
2.90  
0.80  
0.05  
0.40  
0.114  
0.114  
C
1.10 0.031  
0.15 0.002  
0.70 0.016  
0.10 (0.004)  
W−  
SEATING  
PLANE  
D
T−  
G
G
K
L
0.65 BSC  
0.026 BSC  
0.25  
0.40 0.010  
0.016  
4.90 BSC  
0.193 BSC  
0
DETAIL E  
M
0
6
6
_
_
_
_
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9
MC100EP16VB  
PACKAGE DIMENSIONS  
DFN8  
CASE 506AA01  
ISSUE D  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994 .  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.25 AND 0.30 MM FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE  
REFERENCE  
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
E
A
A1  
A3  
b
0.80  
0.00  
0.20 REF  
0.20  
0.30  
2 X  
D
D2  
E
E2  
e
K
2.00 BSC  
0.10  
C
1.10  
1.30  
2.00 BSC  
2 X  
0.70  
0.90  
0.50 BSC  
0.10  
C
TOP VIEW  
0.20  
0.25  
−−−  
0.35  
L
A
0.10  
0.08  
C
C
8 X  
(A3)  
SIDE VIEW  
D2  
A1  
SEATING  
PLANE  
C
e
e/2  
4
1
8 X L  
E2  
K
8
5
0.10 C A B  
0.05  
8 X b  
C
NOTE 3  
BOTTOM VIEW  
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC100EP16VB/D  

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