MC100LVEL05DR2 [ONSEMI]

3.3V ECL 2-Input Differential AND/NAND; 3.3V ECL 2输入差分AND / NAND
MC100LVEL05DR2
型号: MC100LVEL05DR2
厂家: ONSEMI    ONSEMI
描述:

3.3V ECL 2-Input Differential AND/NAND
3.3V ECL 2输入差分AND / NAND

栅极 触发器 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:140K)
中文:  中文翻译
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MC100LVEL05  
3.3VꢀECL 2-Input Differential  
AND/NAND  
Description  
The MC100LVEL05 is a 2-input differential AND/NAND gate. The  
device is functionally equivalent to the MC100EL05 device and  
operates from a 3.3 V supply voltage. With propagation delays and  
output transition times equivalent to the EL05, the LVEL05 is ideally  
suited for those applications which require the ultimate in AC  
performance at low voltage power supplies.  
http://onsemi.com  
MARKING  
DIAGRAMS*  
Because a negative 2-input NAND is equivalent to a 2-input OR  
function, the differential inputs and outputs of the device allows the  
LVEL05 to also be used as a 2-input differential OR/NOR gate.  
8
8
1
KVL05  
ALYW  
G
SOIC8  
D SUFFIX  
CASE 751  
Features  
1
8
340 ps Propagation Delay  
High Bandwidth Output Transitions  
ESD Protection: >4 kV Human Body Model,  
>200 V Machine Model  
8
1
KV05  
ALYWG  
The 100 Series Contains Temperature Compensation  
TSSOP8  
DT SUFFIX  
CASE 948R  
G
1
PECL Mode Operating Range: V = 3.0 V to 3.8 V  
CC  
with V = 0 V  
EE  
NECL Mode Operating Range: V = 0 V  
CC  
with V = 3.0 V to 3.8 V  
EE  
Internal Input Pulldown Resistors  
Q Output will Default LOW with All Inputs Open or at V  
1
4
EE  
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
Moisture Sensitivity Level 1  
For Additional Information, see Application Note AND8003/D  
Flammability Rating: UL 94 V0 @ 0.125 in,  
Oxygen Index: 28 to 34  
DFN8  
MN SUFFIX  
CASE 506AA  
A
L
= Assembly Location  
= Wafer Lot  
= Year  
W = Work Week  
M = Date Code  
Transistor Count = 69 devices  
PbFree Packages are Available  
Y
G
= PbFree Package  
(Note: Microdot may be in either location)  
*For additional marking information, refer to  
Application Note AND8002/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
December, 2006 Rev. 3  
MC100LVEL05/D  
MC100LVEL05  
Table 1. PIN DESCRIPTION  
PIN  
FUNCTION  
D
D
1
2
8
7
V
CC  
0
0
D0, D0; D1, D1  
Q, Q  
ECL Data Inputs  
ECL Data Outputs  
Positive Supply  
Negative Supply  
Q
Q
V
CC  
V
EE  
EP  
Exposed pad must be con-  
nected to a sufficient thermal  
conduit. Electrically connect  
to the most negative supply or  
leave floating open.  
D
D
3
4
6
5
1
1
V
EE  
Figure 1. Logic Diagram and Pinout Assignment  
Table 2. MAXIMUM RATINGS  
Symbol  
Parameter  
PECL Mode Power Supply  
NECL Mode Power Supply  
Condition 1  
= 0 V  
Condition 2  
Rating  
8 to 0  
Unit  
V
V
CC  
V
EE  
V
I
V
V
EE  
= 0 V  
8 to 0  
V
CC  
PECL Mode Input Voltage  
NECL Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V V  
6 to 0  
6 to 0  
V
V
EE  
I
CC  
V V  
CC  
I
EE  
I
Output Current  
Continuous  
Surge  
50  
100  
mA  
mA  
out  
T
Operating Temperature Range  
Storage Temperature Range  
40 to +85  
°C  
°C  
A
T
65 to +150  
stg  
JA  
q
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
500 lfpm  
8 SOIC  
8 SOIC  
190  
130  
°C/W  
°C/W  
q
q
Thermal Resistance (JunctiontoCase)  
Standard Board  
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
500 lfpm  
Standard Board  
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
8 SOIC  
41 to 44 ± 5%  
°C/W  
JC  
JA  
8 TSSOP  
8 TSSOP  
185  
140  
°C/W  
°C/W  
q
q
Thermal Resistance (JunctiontoCase)  
8 TSSOP  
41 to 44 ± 5%  
°C/W  
JC  
JA  
DFN8  
DFN8  
129  
84  
°C/W  
°C/W  
500 lfpm  
T
sol  
Wave Solder  
Pb <2 to 3 sec @ 248°C  
PbFree <2 to 3 sec @ 260°C  
265  
265  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
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2
MC100LVEL05  
Table 3. LVPECL DC CHARACTERISTICS V = 3.3 V; V = 0.0 V (Note 1)  
CC  
EE  
40°C  
25°C  
Typ  
18  
85°C  
Typ  
19  
Symbol  
Characteristic  
Power Supply Current  
Min  
Typ  
18  
Max  
25  
Min  
Max  
25  
Min  
Max  
26  
Unit  
mA  
mV  
mV  
mV  
mV  
I
EE  
V
V
V
V
V
Output HIGH Voltage (Note 2)  
Output LOW Voltage (Note 2)  
2215  
1470  
2135  
1490  
2295  
1605  
2420  
1745  
2420  
1825  
2275  
1490  
2135  
1490  
2345  
1595  
2420  
1680  
2420  
1825  
2275  
1490  
2135  
1490  
2345  
1595  
2420  
1680  
2420  
1825  
OH  
OL  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential) (Note 6)  
IHCMR  
Vpp < 500 mV  
Vpp y 500 mV  
1.2  
1.5  
2.9  
2.9  
1.1  
1.4  
2.9  
2.9  
1.1  
1.4  
2.9  
2.9  
V
V
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
1. Input and output parameters vary 1:1 with V . V can vary ±0.3 V.  
CC  
EE  
2. Outputs are terminated through a 50 ohm resistor to V 2.0 V.  
CC  
3. V  
min varies 1:1 with V , max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential input signal.  
IHCMR  
EE  
CC  
IHCMR  
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V min and 1V.  
PP  
Table 4. LVNECL DC CHARACTERISTICS V = 0.0 V; V = 3.3 V (Note 4)  
CC  
EE  
40°C  
25°C  
Typ  
18  
85°C  
Typ  
19  
Symbol  
Characteristic  
Power Supply Current  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
26  
Unit  
mA  
mV  
mV  
mV  
mV  
I
EE  
18  
25  
25  
V
V
V
V
V
Output HIGH Voltage (Note 5)  
Output LOW Voltage (Note 5)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
1085 1005 880 1025 955  
880 1025 955  
880  
OH  
OL  
1830 1695 1555 1810 1705 1620 1810 1705 1620  
1165  
1810  
880 1165  
1475 1810  
880 1165  
1475 1810  
880  
IH  
1475  
IL  
Input HIGH Voltage Common Mode  
Range (Differential) (Note 6)  
IHCMR  
Vpp < 500 mV 2.1  
Vpp y 500 mV 1.8  
0.4  
0.4  
2.2  
1.9  
0.4  
0.4  
2.2  
1.9  
0.4  
0.4  
V
V
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
4. Input and output parameters vary 1:1 with V . V can vary ±0.3 V.  
CC  
EE  
5. Outputs are terminated through a 50 ohm resistor to V 2.0 V.  
CC  
6. V  
min varies 1:1 with V , max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential input signal.  
IHCMR  
EE  
CC  
IHCMR  
Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between V min and 1V.  
PP  
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3
 
MC100LVEL05  
Table 5. AC CHARACTERISTICS V = 3.3 V; V = 0.0 V or V = 0.0 V; V = 3.3 V (Note 7)  
CC  
EE  
CC  
EE  
405C  
Typ  
TBD  
260  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Min  
Max  
Min  
240  
Max  
Min  
Max  
Unit  
GHz  
ps  
f
Maximum Toggle Frequency  
Propagation Delay to Output  
TBD  
340  
TBD  
max  
t
t
240  
440  
440  
250  
450  
PLH  
PHL  
t
CycletoCycle Jitter  
TBD  
TBD  
TBD  
ps  
mV  
ps  
JITTER  
V
Input Swing (Note 8)  
150  
100  
1000  
320  
150  
100  
1000  
320  
150  
100  
1000  
320  
PP  
t
r
t
f
Output Rise/Fall Times Q  
(20% 80%)  
210  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
7.  
V
can vary ±0.3 V.  
EE  
PP  
8. V (min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of 40.  
Z = 50 W  
Q
Q
D
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
50 W  
50 W  
V
TT  
V
TT  
= V 3.0 V  
CC  
Figure 2. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D Termination of ECL Logic Devices.)  
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4
 
MC100LVEL05  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC100LVEL05D  
SOIC8  
98 Units / Rail  
98 Units / Rail  
MC100LVEL05DG  
SOIC8  
(PbFree)  
MC100LVEL05DR2  
MC100LVEL05DR2G  
SOIC8  
2500 / Tape & Reel  
2500 / Tape & Reel  
SOIC8  
(PbFree)  
MC100LVEL05DT  
MC100LVEL05DTG  
TSSOP8  
100 Units / Rail  
100 Units / Rail  
TSSOP8  
(PbFree)  
MC100LVEL05DTR2  
MC100LVEL05DTR2G  
TSSOP8  
2500 / Tape & Reel  
2500 / Tape & Reel  
TSSOP8  
(PbFree)  
MC100LVEL05MNR4  
MC100LVEL05MNR4G  
DFN8  
1000 / Tape & Reel  
1000 / Tape & Reel  
DFN8  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
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5
MC100LVEL05  
PACKAGE DIMENSIONS  
SOIC8 NB  
CASE 75107  
ISSUE AH  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
X−  
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. 75101 THRU 75106 ARE OBSOLETE. NEW  
STANDARD IS 75107.  
S
M
M
B
0.25 (0.010)  
Y
1
K
Y−  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
Z−  
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
0.020  
0.244  
M
J
H
D
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
1.52  
0.060  
7.0  
4.0  
0.275  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
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6
MC100LVEL05  
PACKAGE DIMENSIONS  
TSSOP8  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948R02  
ISSUE A  
8x K REF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T U  
S
0.15 (0.006) T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
2X L/2  
8
5
4
0.25 (0.010)  
B
U−  
L
1
M
PIN 1  
IDENT  
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
6. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE −W−.  
S
0.15 (0.006) T U  
A
V−  
F
DETAIL E  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
3.10  
3.10  
MAX  
0.122  
0.122  
0.043  
0.006  
0.028  
A
B
C
D
F
2.90  
2.90  
0.80  
0.05  
0.40  
0.114  
0.114  
C
1.10 0.031  
0.15 0.002  
0.70 0.016  
0.10 (0.004)  
W−  
SEATING  
PLANE  
D
T−  
G
G
K
L
0.65 BSC  
0.026 BSC  
0.25  
0.40 0.010  
0.016  
4.90 BSC  
0.193 BSC  
0
DETAIL E  
M
0
6
6
_
_
_
_
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7
MC100LVEL05  
PACKAGE DIMENSIONS  
DFN8  
CASE 506AA01  
ISSUE D  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994 .  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.25 AND 0.30 MM FROM TERMINAL.  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE  
REFERENCE  
MILLIMETERS  
DIM MIN  
MAX  
1.00  
0.05  
E
A
A1  
A3  
b
0.80  
0.00  
0.20 REF  
0.20  
0.30  
2 X  
D
D2  
E
E2  
e
K
2.00 BSC  
0.10  
C
1.10  
1.30  
2.00 BSC  
2 X  
0.70  
0.90  
0.50 BSC  
0.10  
C
TOP VIEW  
0.20  
0.25  
−−−  
0.35  
L
A
0.10  
0.08  
C
C
8 X  
(A3)  
SIDE VIEW  
D2  
A1  
SEATING  
PLANE  
C
e
e/2  
4
1
8 X L  
E2  
K
8
5
0.10 C A B  
8 X b  
0.05  
C
NOTE 3  
BOTTOM VIEW  
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
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Europe, Middle East and Africa Technical Support:  
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Order Literature: http://www.onsemi.com/orderlit  
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Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC100LVEL05/D  

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