MC10H116_06 [ONSEMI]
Triple Line Receiver; 三重线路接收器
| 型号： | MC10H116_06 |
| 厂家： | 
ONSEMI |
| 描述： | Triple Line Receiver |
| 文件： | 总6页 (文件大小：163K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10H116
Triple Line Receiver
Description
The MC10H116 is a triple differential amplifier designed for use in
sensing differential signals over long lines and is a functional/pinout
duplication of the MC10116, with 100% improvement in propagation
delay and no increase in power supply current. For termination
information see AND8020.
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MARKING DIAGRAMS*
Features
• Propagation Delay, 1.0 ns Typical
• Power Dissipation 85 mW Typ/Pkg (same as MECL 10K™)
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
16
1
16
MC10H116L
AWLYYWW
1
CDIP−16
L SUFFIX
• Voltage Compensated
CASE 620A
• MECL 10K Compatible
• Pb−Free Packages are Available*
16
1
MC10H116P
AWLYYWWG
4
5
2
3
*V to be used to supply bias to the MC10H116 only and bypassed
BB
16
(when used) with 0.01 mF to 0.1 mF capacitor to ground (0 V). V can
BB
source < 1.0 mA.
1
The MC10H116 is designed to be used in sensing differential signals
9
6
7
PDIP−16
P SUFFIX
CASE 648
over long lines. The bias supply (V ) is made available to make the
BB
10
device useful as a Schmitt trigger, or in other applications where a
stable reference voltage is necessary.
12
13
14
Active current sources provide these receivers with excellent
common−mode noise rejection. If any amplifier in a package is not
used, one input of that amplifier must be connected to V to prevent
15
11
1 20
BB
unbalancing the current−source bias network.
The MC10H116 does not have internal−input pull− down resistors.
This provides high impedance to the amplifier input and facilitates
differential connections.
V
*
BB
V
V
V
= Pin 1
= Pin 16
= Pin 8
CC1
20
1
CC2
10H116G
AWLYYWW
Applications:
EE
• Low Level Receiver
• Voltage Level
Interface
PLCC−20
FN SUFFIX
CASE 775
When input pin with
bubble goes positive
it’s respective output
pin with bubble goes
positive.
• Schmitt Trigger
16
Figure 1. Logic Diagram
16
10H116G
AWLYWW
1
SO−16
D SUFFIX
CASE 751B
1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
V
CC2
CC1
OUT
OUT
16
A
A
C
C
C
C
OUT
OUT
IN
16
10H116
ALYWG
1
A
A
IN
IN
SOEIAJ−16
M, MEL SUFFIX
CASE 966
IN
B
B
V
B
B
OUT
OUT
BB
IN
1
A
= Assembly Location
= Wafer Lot
V
IN
EE
WL
YY
WW
= Year
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see TND309, the Pin Conversion Tables,
page 9.
= Work Week
*For additional marking information, refer to
Application Note AND8002/D.
Figure 2. Dip Pin Assignment
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 10
MC10H116/D
MC10H116
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
Vdc
Vdc
mA
V
V
Power Supply (V = 0)
−8.0 to 0
EE
I
CC
Input Voltage (V = 0)
0 to V
CC
EE
I
Output Current
− Continuous
− Surge
50
100
out
T
A
Operating Temperature Range
0 to +75
°C
T
stg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (V = −5.2 V 5%) (Note 2)
EE
0°
25°
75°
Symbol
Characteristic
Power Supply Current
Min
−
Max
23
Min
−
Max
21
Min
−
Max
23
Unit
mA
mA
I
I
I
E
Input Current High
−
150
−
95
−
95
inH
CBO
Input Leakage Current
Reference Voltage
−
1.5
−
1.0
−
1.0
mA
V
V
V
V
V
V
V
−1.38
−1.02
−1.95
−1.17
−1.95
−
−1.27
−0.84
−1.63
−0.84
−1.48
−
−1.35
−0.98
−1.95
−1.13
−1.95
−1.25
−0.81
−1.63
−0.81
−1.48
−1.31
−0.92
−1.95
−1.07
−1.95
−
−1.19
−0.735
−1.60
−0.735
−1.45
−
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
BB
OH
OL
IH
High Output Voltage
Low Output Voltage
High Input Voltage (Note 1)
Low Input Voltage (Note 1)
IL
Common Mode
Range (Note 4)
−2.85 to −0.8
CMR
PP
Input Sensitivity (Note 3)
−
−
150 typ
−
−
mV
PP
1. When V is used as the reference voltage.
BB
2. Each MECL 10Hꢀ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50−ohm resistor to −2.0 V.
3. Differential input not to exceed 1.0 Vdc.
4. 150 mV
differential input required to obtain full logic swing on output.
p−p
Table 3. AC CHARACTERISTICS
0°
25°
75°
Symbol
Characteristic
Min
0.4
0.5
0.5
Max
1.3
1.5
1.5
Min
0.4
0.5
0.5
Max
1.3
1.6
1.6
Min
0.45
0.5
Max
1.45
1.7
Unit
ns
t
t
t
Propagation Delay
Rise Time
pd
ns
r
f
Fall Time
0.5
1.7
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H116
ORDERING INFORMATION
†
Device
Package
Shipping
MC10H116D
SO−16
48 Units / Rail
48 Units / Rail
MC10H116DG
SO−16
(Pb−Free)
MC10H116DR2
SO−16
2500 / Tape & Reel
2500 / Tape & Reel
MC10H116DR2G
SO−16
(Pb−Free)
MC10H116FN
PLCC−20
46 Units / Rail
46 Units/Rail
MC10H116FNG
PLCC−20
(Pb−Free)
MC10H116FNR2
PLCC−20
500 / Tape & Reel
500 / Tape & Reel
MC10H116FNR2G
PLCC−20
(Pb−Free)
MC10H116L
MC10H116M
MC10H116MG
CD1P−16
25 Units / Rail
50 Units / Rail
50 Units / Rail
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
MC10H116MEL
SOEIAJ−16
2000 / Tape & Reel
2000 / Tape & Reel
MC10H116MELG
SOEIAJ−16
(Pb−Free)
MC10H116P
PD1P−16
25 Units / Rail
25 Units / Rail
MC10H116PG
PD1P−16
(Pb−Free)
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H116
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
S
S
0.007 (0.180) M
T
L−M
N
B
Y BRK
−N−
M
S
S
N
0.007 (0.180)
T
L−M
U
D
D
−L−
−M−
Z
W
20
1
S
S
S
N
0.010 (0.250)
T
L−M
G1
X
V
VIEW D−D
S
S
S
S
0.007 (0.180) M
0.007 (0.180) M
T
L−M
L−M
N
N
A
R
Z
T
S
S
N
0.007 (0.180) M
T
L−M
H
C
K1
E
K
0.004 (0.100)
G
−T− SEATING
PLANE
J
M
S
S
N
0.007 (0.180)
T
L−M
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L−M
N
NOTES:
INCHES
MIN MAX
MILLIMETERS
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
DIM
A
B
C
E
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.019
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.032
−−−
−−−
0.356
0.356
0.048
0.048
0.056
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
−−−
2
0.81
−−−
−−−
9.04
9.04
1.21
1.21
1.42
0.50
10
−−− 0.020
Z
2
10
0.330
−−−
_
_
_
_
G1 0.310
K1 0.040
7.88
1.02
8.38
−−−
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4
MC10H116
PACKAGE DIMENSIONS
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
B
B
A
A
M
16
9
8
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
L
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
19.05
6.10
−−−
MAX
19.93
7.49
5.08
0.50
A
B
C
D
E
F
0.750
0.240
0.785
0.295
16X J
−−− 0.200
0.015 0.020
0.050 BSC
0.39
M
0.25 (0.010)
T
B
1.27 BSC
E
0.055
0.065
1.40
1.65
G
H
K
L
0.100 BSC
2.54 BSC
F
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
0.300 BSC
7.62 BSC
M
N
0
0.020
15
_
0.040
0
_
0.51
15
_
1.01
_
C
K
SEATING
PLANE
T
N
G
16X D
M
0.25 (0.010)
T A
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
−A−
ISSUE R
16
9
8
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
0.770
0.270
0.175
0.021
0.70
C
L
S
SEATING
PLANE
−T−
G
H
J
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
K
L
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
M
S
_
_
_
_
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
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5
MC10H116
PACKAGE DIMENSIONS
SO−16
D SUFFIX
PLASTIC DIP PACKAGE
CASE 751B−05
ISSUE J
−A−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
16
9
8
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−B−
P 8 PL
M
S
B
0.25 (0.010)
1
G
MILLIMETERS
INCHES
DIM MIN
MAX
10.00
4.00
1.75
0.49
1.25
MIN
MAX
0.393
0.157
0.068
0.019
0.049
F
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
0.386
0.150
0.054
0.014
0.016
R X 45
K
_
C
G
J
1.27 BSC
0.050 BSC
−T−
SEATING
PLANE
0.19
0.10
0
0.25
0.25
7
0.008
0.004
0
0.009
0.009
7
J
M
K
M
P
R
D
16 PL
_
_
_
_
5.80
0.25
6.20
0.50
0.229
0.010
0.244
0.019
M
S
S
A
0.25 (0.010)
T
B
SOEIAJ−16
CASE 966−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
16
9
E
Q
1
H
E
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
1
8
L
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
A
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
c
A
−−−
0.05
0.35
0.10
9.90
5.10
A
1
0.002
0.008
0.020
0.011
0.413
0.215
b
c
0.014
0.007
0.390
0.201
D
E
A
1
b
e
1.27 BSC
0.050 BSC
0.10 (0.004)
M
H
0.13 (0.005)
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
0
10
10
0.035
M
Q
0
0.028
_
_
_
_
0.70
−−−
0.90
0.78
1
Z
−−− 0.031
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MC10H116/D
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