MC10H125M [ONSEMI]

Quad MECL-to-TTL Translator; 四MECL至TTL转换器
MC10H125M
型号: MC10H125M
厂家: ONSEMI    ONSEMI
描述:

Quad MECL-to-TTL Translator
四MECL至TTL转换器

转换器
文件: 总8页 (文件大小:82K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10H125  
Quad MECL−to−TTL  
Translator  
The MC10H125 is a quad translator for interfacing data and control  
signals between the MECL section and saturated logic section of  
digital systems. The 10H part is a functional/pinout duplication of the  
standard MECL 10K family part, with 100% improvement in  
propagation delay, and no increase in power-supply current.  
Outputs of unused translators will go to low state when their inputs  
are left open.  
http://onsemi.com  
MARKING  
DIAGRAMS  
Propagation Delay, 2.5 ns Typical  
Voltage Compensated  
Improved Noise Margin 150 mV  
(Over Operating Voltage and Temperature Range)  
MECL 10K-Compatible  
16  
1
CDIP  
CASE 620A  
MC10H125L  
AWLYYWW  
16  
PDIP-16  
P SUFFIX  
CASE 648  
MC10H125P  
AWLYYWW  
1
1
PLCC-20  
FN SUFFIX  
CASE 775  
10H125  
AWLYYWW  
16  
EIAJ-16  
M SUFFIX  
CASE 966  
10H125  
ALYW  
1
A
= Assembly Location  
WL = Wafer Lot  
YY = Year  
WW = Work Week  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10H125L  
CDIP  
25 Units/Rail  
MC10H125P  
PDIP-16  
PLCC-20  
25 Units/Rail  
46 Units/Rail  
MC10H125FN  
MC10H125M  
EIAJ-16  
EIAJ-16  
50 Units/Rail  
MC10H125MEL  
2000 Units/Reel  
Semiconductor Components Industries, LLC, 2003  
1
Publication Order Number:  
May, 2003 - Rev. 11  
MC10H125/D  
MC10H125  
LOGIC DIAGRAM  
PIN ASSIGNMENT  
2
3
4
V
GND  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
BB  
6
7
D
A
in  
in  
5
D
A
in  
in  
10  
11  
12  
D
A
out  
out  
out  
C
B
14  
15  
out  
13  
1
C
B
in  
in  
in  
V
*
BB  
C
B
in  
GND = Pin 16  
V
CC  
V
EE  
( +5.0 Vdc) = Pin 9  
( -5.2 Vdc) = Pin 8  
V
V
CC  
EE  
Pin assignment is for Dual-in-Line Package.  
For PLCC pin assignment, see the Pin Conversion  
Tables.  
*V to be used to supply bias to the MC10H125  
only and bypassed (when used) with 0.01 mF to  
BB  
0.1 mF capacitor to ground (0 V). V can source <  
BB  
1.0 mA.  
DIP CONVERSION TABLES  
16-Pin DIL to 20-Pin PLCC  
16 PIN DIL  
1
2
2
3
3
4
4
5
5
7
6
8
7
9
8
9
10 11 12 13 14 15 16  
20 PIN PLCC  
10 12 13 14 15 17 18 19 20  
20-Pin DIL to 20-Pin PLCC  
20 PIN DIL  
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10 11 12 13 14 15 16 17 18 19 20  
10 11 12 13 14 15 16 17 18 19 20  
20 PIN PLCC  
http://onsemi.com  
2
MC10H125  
MAXIMUM RATINGS  
Symbol  
Characteristic  
Rating  
-8.0 to 0  
0 to +7.0  
Unit  
Vdc  
Vdc  
Vdc  
°C  
V
Power Supply (V = 5.0 V)  
CC  
EE  
CC  
V
Power Supply (V = -5.2 V)  
EE  
V
I
Input Voltage (V = 5.0 V)  
0 to V  
EE  
CC  
T
Operating Temperature Range  
Storage Temperature Range  
0 to +75  
A
T
stg  
- Plastic  
- Ceramic  
-55 to +150  
-55 to +165  
°C  
°C  
ELECTRICAL CHARACTERISTICS (V = -5.2 V +5%; V = 5.0 V + 5.0 %) (Note 2)  
EE  
CC  
0°  
25°  
75°  
Min  
Max  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Negative Power  
Unit  
I
E
-
44  
-
40  
-
44  
mA  
Supply Drain  
Current  
I
Positive Power Supply  
Drain Current  
-
63  
40  
225  
1.5  
-
-
63  
40  
145  
1.0  
-
-
63  
40  
145  
1.0  
-
mA  
mA  
mA  
CCH  
I
-
-
-
-
-
-
CCL  
I
Input Current  
inH  
I
Input Leakage Current  
High Output Voltage  
-
-
-
mA  
CBO  
V
2.5  
2.5  
2.5  
Vdc  
OH  
I
= -1.0 mA  
= +20 mA  
OH  
V
OL  
Low Output Voltage  
-
0.5  
-
0.5  
-
0.5  
Vdc  
I
OL  
V
High Input Voltage (Note 1)  
Low Input Voltage (Note 1)  
Short Circuit Current  
-1.17  
-1.95  
60  
-0.84  
-1.48  
150  
-1.27  
-
-1.13  
-1.95  
60  
-0.81  
-1.48  
150  
-1.07  
-1.95  
50  
-0.735  
-1.45  
150  
Vdc  
Vdc  
mA  
Vdc  
V
IH  
V
IL  
I
OS  
V
BB  
Reference Voltage  
-1.38  
-
-1.35  
-1.25  
-1.31  
-1.19  
V
CMR  
Common Mode  
Range (Note 3)  
-2.85 to +0.3  
Typical  
V
PP  
Input Sensitivity (Note 4)  
150  
mV  
AC PARAMETERS  
Symbol  
0°  
25°  
75°  
Min  
0.8  
0.3  
0.3  
Max  
3.3  
1.2  
1.2  
Min  
Max  
3.35  
1.2  
Min  
0.9  
0.3  
0.3  
Max  
3.4  
1.2  
1.2  
Characteristic  
Unit  
ns  
t
pd  
Propagation Delay  
0.85  
0.3  
t
Rise Time (Note 5)  
Fall Time (Note 5)  
ns  
r
t
0.3  
1.2  
ns  
f
1. When V is used as the reference voltage.  
BB  
2. Each MECL 10H series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been  
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is  
maintained.  
3. Differential input not to exceed 1.0 Vdc.  
4. 150 mV  
differential input required to obtain full logic swing on output.  
p- p  
5. Output Voltage = 1.0 V to 2.0 V. R = 500 W to GND and C = 25 pF to GND. Refer to Figure 1.  
L
L
http://onsemi.com  
3
MC10H125  
APPLICATION  
TTL RECEIVER  
CHARACTERISTIC TEST  
C *  
L
R
L
*C includes  
L
fixture  
capacitance  
AC TEST LOAD  
GND  
Figure 1. TTL Output Loading Used for Device Evaluation  
APPLICATION INFORMATION  
The MC10H125 incorporates differential inputs and  
Schottky TTL “totem pole” outputs. Differential inputs  
allow for use as an inverting/non-inverting translator or as  
An advantage of this device is that MECL-level  
information can be received, via balanced twisted pair lines,  
in the TTL equipment. This isolates the MECL-logic from  
the noisy TTL environment. Power supply requirements are  
ground, +5.0 volts and -5.2 volts.  
a differential line receiver. The V reference voltage is  
BB  
available on Pin 1 for use in single-ended input biasing. The  
outputs of the MC10H125 go to a low-logic level whenever  
the inputs are left floating, and a high-logic output level is  
achieved with a minimum input level of 150 mV  
.
p- p  
http://onsemi.com  
4
MC10H125  
PACKAGE DIMENSIONS  
PLCC-20  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 775-02  
ISSUE D  
M
S
S
N
0.007 (0.180)  
T L−M  
B
Y BRK  
-M-  
-N-  
M
S
S
N
0.007 (0.180)  
T L−M  
U
D
D
-L-  
Z
W
20  
1
S
S
S
0.010 (0.250)  
T L−M  
N
G1  
X
V
VIEW D-D  
M
M
S
S
S
S
A
R
0.007 (0.180)  
0.007 (0.180)  
T L−M  
N
N
Z
T L−M  
M
S
S
N
0.007 (0.180)  
T L−M  
H
C
K1  
E
K
0.004 (0.100)  
G
-T-  
SEATING  
PLANE  
J
M
S
S
N
0.007 (0.180)  
T L−M  
F
VIEW S  
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T L−M  
N
NOTES:  
INCHES  
MILLIMETERS  
1. DATUMS −L−, −M−, AND −N− DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC  
BODY AT MOLD PARTING LINE.  
2. DIMENSION G1, TRUE POSITION TO BE  
MEASURED AT DATUM −T−, SEATING PLANE.  
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD  
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
DIM MIN  
MAX  
0.395  
0.395  
0.180  
0.110  
0.019  
MIN  
9.78  
9.78  
4.20  
2.29  
0.33  
MAX  
10.03  
10.03  
4.57  
A
B
C
E
F
0.385  
0.385  
0.165  
0.090  
0.013  
2.79  
0.48  
G
H
J
0.050 BSC  
1.27 BSC  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
5. CONTROLLING DIMENSION: INCH.  
0.026  
0.020  
0.025  
0.350  
0.350  
0.042  
0.042  
0.042  
−−−  
0.032  
−−−  
−−−  
0.66  
0.51  
0.64  
8.89  
8.89  
1.07  
1.07  
1.07  
−−−  
2
0.81  
−−−  
−−−  
9.04  
9.04  
1.21  
1.21  
1.42  
0.50  
10  
K
R
U
V
W
X
Y
Z
6. THE PACKAGE TOP MAY BE SMALLER THAN THE  
PACKAGE BOTTOM BY UP TO 0.012 (0.300).  
DIMENSIONS R AND U ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,  
GATE BURRS AND INTERLEAD FLASH, BUT  
INCLUDING ANY MISMATCH BETWEEN THE TOP  
AND BOTTOM OF THE PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037 (0.940).  
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE  
THE H DIMENSION TO BE SMALLER THAN 0.025  
(0.635).  
0.356  
0.356  
0.048  
0.048  
0.056  
0.020  
10  
2
_
_
_
_
G1 0.310  
K1 0.040  
0.330  
−−−  
7.88  
1.02  
8.38  
−−−  
http://onsemi.com  
5
MC10H125  
CDIP  
CASE 620A-01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
4. DIMENSION F MAY NARROW TO 0.76 (0.030)  
WHERE THE LEAD ENTERS THE CERAMIC  
BODY.  
B
B
A
A
M
16  
9
8
5
THIS DRAWING REPLACES OBSOLETE  
CASE OUTLINE 620−10.  
L
INCHES  
DIM MIN MAX  
MILLIMETERS  
1
MIN  
19.05  
6.10  
−−−  
MAX  
19.93  
7.49  
5.08  
0.50  
A
B
C
D
E
F
0.750  
0.240  
−−−  
0.785  
0.295  
0.200  
0.020  
16X J  
0.015  
0.39  
M
0.25 (0.010)  
T
B
0.050 BSC  
1.27 BSC  
E
0.055  
0.065  
1.40  
1.65  
G
H
K
L
0.100 BSC  
2.54 BSC  
F
0.008  
0.125  
0.015  
0.170  
0.21  
3.18  
0.38  
4.31  
0.300 BSC  
7.62 BSC  
M
N
0
0.020  
15  
_
0.040  
0
_
0.51  
15  
_
1.01  
_
C
K
SEATING  
PLANE  
T
N
G
16X D  
M
0.25 (0.010)  
T A  
http://onsemi.com  
6
MC10H125  
PDIP-16  
P SUFFIX  
PLASTIC DIP PACKAGE  
CASE 648-08  
ISSUE R  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
-A-  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS WHEN  
FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.  
5. ROUNDED CORNERS OPTIONAL.  
16  
1
9
8
B
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
18.80  
6.35  
3.69  
0.39  
1.02  
MAX  
19.55  
6.85  
4.44  
0.53  
1.77  
F
A
B
C
D
F
0.740  
0.250  
0.145  
0.015  
0.040  
0.770  
0.270  
0.175  
0.021  
0.70  
C
L
SEATING  
PLANE  
-T-  
G
H
J
0.100 BSC  
0.050 BSC  
2.54 BSC  
1.27 BSC  
K
M
0.008  
0.015  
0.130  
0.305  
10  
0.21  
0.38  
3.30  
7.74  
10  
H
J
K
L
0.110  
0.295  
0
2.80  
7.50  
0
G
D 16 PL  
M
S
_
_
_
_
0.020  
0.040  
0.51  
1.01  
M
M
0.25 (0.010)  
T
A
STYLE 1:  
PIN 1. CATHODE  
2. CATHODE  
3. CATHODE  
4. CATHODE  
5. CATHODE  
6. CATHODE  
7. CATHODE  
8. CATHODE  
9. ANODE  
10. ANODE  
11. ANODE  
12. ANODE  
13. ANODE  
14. ANODE  
15. ANODE  
16. ANODE  
EIAJ-16  
M SUFFIX  
16 PIN PLASTIC EIAJ PACKAGE  
CASE966-01  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
ISSUE O  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
16  
9
L
E
Q
1
H
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
1
8
L
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
MIN  
−−−  
A
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
A
1
0.20 0.002  
0.50 0.014  
0.27 0.007  
b
c
D
E
10.50 0.390  
5.45 0.201  
A
1
b
0.13 (0.005)  
e
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
M
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
Q
0
10  
0.90 0.028  
10  
_
0.035  
0.031  
0
_
_
_
0.70  
−−−  
1
Z
0.78  
−−−  
http://onsemi.com  
7
MC10H125  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make  
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all  
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death  
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
PUBLICATION ORDERING INFORMATION  
Literature Fulfillment:  
JAPAN: ON Semiconductor, Japan Customer Focus Center  
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051  
Phone: 81-3-5773-3850  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  
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For additional information, please contact your local  
Sales Representative.  
N. American Technical Support: 800-282-9855 Toll Free USA/Canada  
MC10H125/D  

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