MC10H160MEL [ONSEMI]
12−Bit Parity Generator−Checker; 12位奇偶校验发生器，检查
| 型号： | MC10H160MEL |
| 厂家： | 
ONSEMI |
| 描述： | 12−Bit Parity Generator−Checker |
| 文件： | 总6页 (文件大小：152K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10H160
12−Bit Parity
Generator−Checker
Description
The MC10H160 is a 12−bit parity generator−checker. The output
goes high when an odd number of inputs are high providing the odd
parity function. Unconnected inputs are pulled to a logic low allowing
parity detection and generation for less than 12−bits. The MC10H160
is a functional pin duplication of the standard 10K family part with
100% improvement in propagation delay and no increase in
power−supply current.
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MARKING DIAGRAMS*
16
MC10H160L
AWLYYWW
Features
• Propagation Delay, 2.5 ns Typical
1
• Power Dissipation, 320 mW Typical
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• Voltage Compensated
CDIP−16
L SUFFIX
CASE 620A
• MECL 10K™ Compatible
16
1
• Pb−Free Packages are Available*
MC10H160P
AWLYYWWG
16
1
LOGIC DIAGRAM
3
PDIP−16
P SUFFIX
CASE 648
4
5
V
V
V
= PIN 1
= PIN 16
CC1
CC2
TRUTH TABLE
INPUT
= PIN 8
6
7
EE
OUTPUT
10H160
ALYWG
Sum of
High Level
Inputs
Pin 2
9
10
2
Even
Odd
Low
11
12
High
SOEIAJ−16
CASE 966
13
14
1 20
DIP
PIN ASSIGNMENT
15
10H160G
AWLYYWW
20
1
V
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
CC1
OUT
IN1
IN2
IN3
IN4
IN5
IN12
IN11
IN10
IN9
PLLC−20
FN SUFFIX
CASE 775
A
= Assembly Location
= Year
WL, L = Wafer Lot
YY, Y
WW, W = Work Week
G
IN8
IN7
= Pb−Free Package
IN6
V
EE
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 8
MC10H160/D
MC10H160
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
Vdc
Vdc
mA
V
Power Supply (V = 0)
−8.0 to 0
EE
CC
V
Input Voltage (V = 0)
0 to V
I
CC
EE
I
Output Current
− Continuous
− Surge
50
100
out
T
A
Operating Temperature Range
0 to +75
°C
T
stg
Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 2. ELECTRICAL CHARACTERISTICS (V = −5.2 V 5%) (Note 1)
EE
0°
25°
75°
Symbol
Characteristic
Power Supply Current
Input Current High
Pins 3,5,7,10,12,14
Pins 4,6,9,11,13,15
Input Current Low
Min
Max
Min
Max
Min
Max
Unit
mA
mA
I
−
88
−
78
−
88
E
I
inH
−
−
391
457
−
−
246
285
−
−
246
285
I
0.5
−
0.5
−
0.3
−
mA
inL
V
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
−1.02
−1.95
−1.17
−1.95
−0.84
−1.63
−0.84
−1.48
−0.98
−1.95
−1.13
−1.95
−0.81
−1.63
−0.81
−1.48
−0.92
−1.95
−1.07
−1.95
−0.735
−1.60
−0.735
−1.45
Vdc
Vdc
Vdc
Vdc
OH
V
OL
V
IH
V
IL
1. Each MECL 10Hꢀ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 3. AC PARAMETERS
0°
25°
75°
Symbol
Characteristic
Propagation Delay
Min
1.1
Max
3.1
1.5
1.5
Min
1.1
Max
3.3
1.6
1.6
Min
1.2
Max
3.5
1.7
1.7
Unit
ns
t
pd
t
t
Rise Time
Fall Time
0.55
0.55
0.55
0.55
0.75
0.75
ns
r
ns
f
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC10H160
ORDERING INFORMATION
Device
†
Package
Shipping
MC10H160FN
PLLC−20
46 Units / Rail
46 Units / Rail
MC10H160FNG
PLLC−20
(Pb−Free)
MC10H160L
MC10H160M
MC10H160MG
CDIP−16
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
MC10H160MEL
SOEIAJ−16
2000 / Tape & Reel
2000 / Tape & Reel
MC10H160MELG
SOEIAJ−16
(Pb−Free)
MC10H160P
PDIP−16
25 Unit / Rail
25 Unit / Rail
MC10H160PG
PDIP−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC10H160
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
M
S
S
0.007 (0.180)
T
L−M
N
B
Y BRK
−N−
S
S
N
0.007 (0.180) M
T
L−M
U
D
D
−L−
−M−
Z
W
20
1
S
S
S
N
0.010 (0.250)
T
L−M
G1
X
V
VIEW D−D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L−M
L−M
N
N
Z
T
M
S
S
N
0.007 (0.180)
T
L−M
H
C
K1
E
K
0.004 (0.100)
G
−T− SEATING
PLANE
J
M
S
S
N
0.007 (0.180)
T
L−M
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L−M
N
NOTES:
INCHES
MILLIMETERS
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
DIM
A
B
C
E
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
0.385
0.385
0.165
0.090
0.013
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.032
−−−
−−−
0.356
0.356
0.048
0.048
0.056
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
−−−
2
0.81
−−−
−−−
9.04
9.04
1.21
1.21
1.42
0.50
10
−−− 0.020
Z
2
10
0.330
−−−
_
_
_
_
G1 0.310
K1 0.040
7.88
1.02
8.38
−−−
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4
MC10H160
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
16
9
E
Q
1
H
E
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
1
8
L
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
A
DIM MIN
MAX
2.05
0.20
0.50
0.20
10.50
5.45
c
A
−−−
0.05
0.35
0.10
9.90
5.10
A
1
0.002
0.008
0.020
0.011
0.413
0.215
b
c
0.014
0.007
0.390
0.201
D
E
A
1
b
e
1.27 BSC
0.050 BSC
0.10 (0.004)
M
H
0.13 (0.005)
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
0
10
10
0.035
M
Q
0
0.028
_
_
_
_
0.70
−−−
0.90
0.78
1
Z
−−− 0.031
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
B
B
A
A
M
16
9
8
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
L
INCHES
DIM MIN MAX
MILLIMETERS
1
MIN
19.05
6.10
−−−
MAX
19.93
7.49
5.08
0.50
A
B
C
D
E
F
0.750
0.240
0.785
0.295
16X J
−−− 0.200
0.015 0.020
0.050 BSC
0.39
M
0.25 (0.010)
T
B
1.27 BSC
E
0.055
0.065
1.40
1.65
G
H
K
L
0.100 BSC
2.54 BSC
F
0.008
0.125
0.015
0.170
0.21
3.18
0.38
4.31
0.300 BSC
7.62 BSC
M
N
0
0.020
15
_
0.040
0
_
0.51
15
_
1.01
_
C
K
N
SEATING
PLANE
T
G
16X D
M
0.25 (0.010)
T A
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5
MC10H160
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
−A−
16
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
MILLIMETERS
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
F
A
B
C
D
F
0.740
0.250
0.145
0.015
0.040
0.770
0.270
0.175
0.021
0.70
C
L
SEATING
PLANE
−T−
G
H
J
0.100 BSC
0.050 BSC
2.54 BSC
1.27 BSC
K
M
0.008
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
H
J
K
L
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
M
S
_
_
_
_
0.020
0.040
0.51
1.01
M
M
0.25 (0.010)
T A
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Order Literature: http://www.onsemi.com/litorder
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Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
MC10H160/D
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