MC33269DT [ONSEMI]
800 mA, Adjustable Output, Low Dropout Voltage Regulator; 800毫安，可调输出，低压差稳压器
| 型号： | MC33269DT |
| 厂家： | 
ONSEMI |
| 描述： | 800 mA, Adjustable Output, Low Dropout Voltage Regulator |
| 文件： | 总14页 (文件大小：137K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
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SO−8
D SUFFIX
8
CASE 751
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
1
• 3.3 V, 5.0 V, 12 V and Adjustable Versions.
2.85 V version available as MC34268.
Gnd/Adj
1
2
3
4
8
7
6
NC
V
V
out
• Space Saving DPAK, SOP−8 and SOT−223 Power Packages
• 1.0 V Dropout
• Output Current in Excess of 800 mA
• Thermal Protection
out
V
in
5
NC
(Top View)
• Short Circuit Protection
DPAK
• Output Trimmed to 1.0% Tolerance
• Pb−Free Package is Available
DT SUFFIX
CASE 369A
1
2 3
1
3
1. GND/Adj
(Top View)
2. V
3. V
out
in
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
SOT−223
ST SUFFIX
CASE 318E
MC33269D
Adj
Adj
MC33269D−5.0
MC33269DT−5.0
5.0 V
5.0 V
1
2
3
1
MC33269DT
3
NCV33269DTRK*
MC33269T
Adj
(Top View)
Adj
MC33269T−5.0
MC33269D−12
5.0 V
12 V
12 V
12 V
12 V
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MC33269DT−12
NCV33269DTRK−12*
MC33269T−12
TO−220AB
T SUFFIX
CASE 221A
*NCV prefix is for automotive and other applications requiring site and change
control.
1. GND/Adj
2. V
3. V
out
in
12 3
(Top View)
1
2
3
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 9 of this data sheet.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
March, 2004 − Rev. 16
MC33269/D
MC33269, NCV33269
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Input Voltage
V
in
20
V
Power Dissipation
Case 369A (DPAK)
T = 25°C
P
q
q
Internally Limited
W
°C/W
°C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 751 (SOP−8)
92
6.0
T = 25°C
P
q
q
Internally Limited
W
°C/W
°C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
160
25
Case 221A
T = 25°C
P
q
q
Internally Limited
W
°C/W
°C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
65
5.0
Case 318E
T = 25°C
P
q
q
Internally Limited
W
°C/W
°C/W
A
D
JA
JC
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
156
15
Operating Die Junction Temperature Range
Operating Ambient Temperature Range
T
−40 to +150
°C
°C
J
MC3326
NCV33269
T
A
−40 to +125
−40 to +125
Storage Temperature
T
stg
−55 to +150
°C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
V
4000
400
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2
MC33269, NCV33269
ELECTRICAL CHARACTERISTICS (C = 10 mF, T = 25°C, for min/max values T = −40°C to +125°C, unless otherwise noted.)
O
A
A
Characteristic
Symbol
Min
Typ
Max
Unit
Output Voltage (I = 10 mA, T = 25°C)
V
O
V
out
A
3.27
4.95
3.3
5.0
12
3.33
5.05
3.3 Suffix (V = 5.3 V)
CC
5.0 Suffix (V = 7.0 V)
CC
11.88
12.12
12 Suffix (V = 14 V)
CC
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V ≤ V − V ≤ 15 V, I = 500 mA)
V
O
V
in
out
out
(1.35 V ≤ V − V ≤ 10 V, I = 800 mA)
in
out
out
3.3 Suffix
5.0 Suffix
12 Suffix
3.23
4.9
3.3
5.0
12
3.37
5.1
11.76
12.24
Reference Voltage (I = 10 mA, V − V = 2.0 V, T = 25°C)
V
V
1.235
1.25
1.265
V
V
out
in
out
A
ref
for Adjustable Voltage
Reference Voltage (Line, Load and Temperature) (Note 1)
(1.25 V ≤ V − V ≤ 15 V, I = 500 mA)
1.225
1.25
1.275
ref
in
out
out
(1.35 V ≤ V − V ≤ 10 V, I = 800 mA)
in
out
out
for Adjustable Voltage
Line Regulation
Reg
−
−
−
−
0.3
0.5
%
line
(I = 10 mA, V = [V + 1.5 V] to V = 20 V, T = 25°C)
out
in
out
in
A
Load Regulation (V = V + 3.0 V, I = 10 mA to 800 mA, T = 25°C)
Reg
%
V
in
out
out
A
load
Dropout Voltage
(I = 500 mA)
V
in
− V
1.0
1.1
1.25
1.35
out
−
−
out
(I = 800 mA)
out
Ripple Rejection
RR
55
−
−
−
−
dB
(10 V , 120 Hz Sinewave; I = 500 mA)
pp
out
Current Limit (V − V = 10 V)
I
800
mA
mA
in
out
Limit
Quiescent Current (Fixed Output)
(1.5 V ≤ V ≤ 3.3 V)
I
Q
−
−
5.5
−
8.0
20
out
(5 V ≤ V ≤ 12 V)
out
Minimum Required Load Current
Fixed Output Voltage
I
mA
Load
−
−
−
0
−
Adjustable Voltage
8.0
Adjustment Pin Current
I
−
−
120
mA
Adj
1. The MC33269−12, V − V is limited to 8.0 V maximum, because of the 20 V maximum rating applied to V
in.
in
out
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3
MC33269, NCV33269
V
in
V
out
Trim Links
V
Adj
Gnd
This device contains 38 active transistors.
Figure 1. Internal Schematic
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4
MC33269, NCV33269
1.5
1.3
1.1
0.9
0.7
0.5
T = −40°C
A
100
mV/Div
T = 25°C
A
C = 10 mF
in
C = 10 mF Tantalum
T = 125°C
A
O
V
in
= V + 3.0 V
O
Preload = 0.1 A
0.5 A
0 A
0
200
400
600
800
1000
20 ms/DIV
I , OUTPUT LOAD CURRENT (mA)
O
Figure 2. Dropout Voltage versus
Output Load Current
Figure 3. Transient Load Regulation
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1100
1060
1020
980
I
O
= 800 mA
T = 25°C
A
MC33269D−XX
L = 25 mm Copper
940
900
−55
0
2.0
4.0
6.0
8.0
10
12
14
16
−25
0
25
50
75
100
125
T , AMBIENT TEMPERATURE (°C)
A
INPUT−OUTPUT VOLTAGE DIFFERENTIAL (V)
Figure 4. Dropout Voltage
versus Temperature
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
70
70
V
O
= 3.3 V or 5.0 V
60
50
40
30
20
60
V
= 12 V
O
50
40
30
20
V
= 8.0 V
= 5.0 V
in
V
out
I = 800 mA
V
= V + 3.0 V
O
in
I = 800 mA
L
C
= 22 mF
L
Adj
T = 25°C
A
T = 25°C
A
0.1
1.0
10
f, FREQUENCY (kHz)
100
0.1
1.0
10
f, FREQUENCY (kHz)
100
Figure 6. MC33269 Ripple Rejection
versus Frequency
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
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5
MC33269, NCV33269
170
150
130
110
90
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
100
90
80
70
60
50
40
P
for T = 50°C
D(max)
A
Free Air
Mounted
Vertically
P
for T = 50°C
A
D(max)
2.0 oz. Copper
L
2.4
2.0
1.6
1.2
0.8
0.4
Minimum
Size Pad
Graph represents symmetrical layout
L
2.0 oz.
L
Copper
70
L
3.0 mm
50
R
q
JA
R
q
JA
30
0
5.0
10
15
20
25
30
0
10
20
30
40
50
L, LENGTH OF COPPER (mm)
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
280
2.50
P
for T = 50°C
D(max)
A
Free Air
Mounted
Vertically
240
200
160
120
80
1.25
2.0 oz. Copper
0.83
L
Minimum
Size Pad
0.63
L
0.50
0.42
0.35
R
q
JA
40
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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6
MC33269, NCV33269
APPLICATIONS INFORMATION
Figures 11 through 15 are typical application circuits. The
supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170°C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat−sinking.
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 mF with an
equivalent series resistance (ESR) of less than 10 W but
greater than 0.2 W over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
V
in
V
out
V
in
V
out
MC33269
MC33269−XX
**
C
in
*
10 mF
C
**
o
C
in
R1
R2
*
C
Adj
o
10 mF
GND
An input capacitor is not necessary for stability, however
it will improve the overall performance.
C
Adj
***
Figure 11. Typical Fixed Output Application
R2
ꢀ + ꢀ1.25ꢀꢀǒ1 ) Ǔꢀ)ꢀ I
V
R2
Adjꢀ
out
R1
***C is optional, however it will improve the ripple rejection.
Adj
V
R
S
I
out
in
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
MC33269
*
10 mF
C
o
**
C
in
Adj
1.25
R
I
ꢀ +ꢀ
out
S
Figure 13. Current Regulator
Figure 12. Typical Adjustable Output Application
V
in
V
out
MC33269−XX
**
C
in
V
in
V
out
MC33269
GND
**
C
in
R1
R2
Adj
*
C
o
10 mF
MC33269−XX
*
C
o
10 mF
**
C
in
GND
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
R
sets the maximum output voltage. Each transistor
2
reduces the output voltage when turned on.
Figure 14. Battery Backed−Up Power Supply
Figure 15. Digitally Controlled Voltage Regulator
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7
MC33269, NCV33269
ORDERING INFORMATION
Device
†
Package
Shipping Information
MC33269D
SO−8
SO−8
98 Units / Rail
MC33269DR2
2500 Units / Tape & Reel
2500 Units / Tape & Reel
75 Units / Rail
MC33269DR2G
SO−8 (Pb−Free)
DPAK
MC33269DT
MC33269DTG
DPAK (Pb−Free)
DPAK
75 Units / Rail
MC33269DTRK
2500 Units / Tape & Reel
2500 Units / Tape & Reel
50 Units / Rail
MC33269DTRKG
MC33269T
DPAK (Pb−Free)
TO−220
MC33269D−3.3
SO−8
98 Units / Rail
MC33269DR2−3.3
MC33269DR2−3.3G
MC33269DT−3.3
MC33269DT−3.3G
MC33269DTRK−3.3
MC33269DTRK−3.3G
MC33269ST−3.3T3
MC33269ST−3.3T3G
MC33269T−3.3
SO−8
2500 Units / Tape & Reel
2500 Units / Tape & Reel
75 Units / Rail
SO−8 (Pb−Free)
DPAK
DPAK (Pb−Free)
DPAK
75 Units / Rail
2500 Units / Tape & Reel
2500 Units / Tape & Reel
4000 Units / Tape & Reel
4000 Units / Tape & Reel
50 Units / Rail
DPAK (Pb−Free)
SOT−223
SOT−223 (Pb−Free)
TO−220
MC33269D−5.0
SO−8
98 Units / Rail
MC33269DR2−5.0
MC33269DT−5.0
MC33269DTRK−5.0
MC33269DTRK−5.0G
MC33269T−5.0
SO−8
2500 Units / Tape & Reel
75 Units / Rail
DPAK
DPAK
2500 Units / Tape & Reel
2500 Units / Tape & Reel
50 Units / Rail
DPAK (Pb−Free)
TO−220
MC33269D−12
SO−8
98 Units / Rail
MC33269DR2−12
MC33269DT−12
MC33269DTRK−12
MC33269DTRK−12G
MC33269T−12
SO−8
2500 Units / Tape & Reel
75 Units / Rail
DPAK
DPAK
2500 Units / Tape & Reel
2500 Units / Tape & Reel
50 Units / Rail
DPAK (Pb−Free)
TO−220
NCV33269DTRK*
NCV33269DTRK−3.3*
NCV33269DTRK−12*
DPAK
2500 Units / Tape & Reel
2500 Units / Tape & Reel
250 Units / Tape & Reel
DPAK
DPAK
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV prefix is for automotive and other applications requiring site and control changes.
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8
MC33269, NCV33269
MARKING DIAGRAMS
SO−8
D SUFFIX
CASE 751
8
1
8
1
8
1
8
1
269AJ
ALYW
69−12
ALYW
269−3
ALYW
269−5
ALYW
DPAK
DT SUFFIX
CASE 369A
SOT−223
ST SUFFIX
CASE 318E
269AJ
ALYWW
69−12
ALYWW
269−3
ALYWW
269−5
ALYWW
ALYW
2693
2
2
2
2
1
2
3
1
3
1
3
1
3
1
3
TO−220AB
T SUFFIX
CASE 221A
MC
33269T
AWLYWW
MC
33269T−12
AWLYWW
MC
33269T−3.3
AWLYWW
MC
33269T−5.0
AWLYWW
1
2
3
1
2
3
1
2
3
1
2
3
A
= Assembly Location
WL, L = Wafer Lot
= Year
Y
WW, W = Work Week
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9
MC33269, NCV33269
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−X−
A
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
G
MILLIMETERS
INCHES
DIM MIN
MAX
5.00
4.00
1.75
0.51
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
4.80
3.80
1.35
0.33
0.189
0.150
0.053
0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25
0.25
1.27
8
0.004
0.010
0.010
0.050
8
0.007
0.016
0
0.010
0.228
M
J
H
D
K
M
N
S
_
_
_
_
0.25
5.80
0.50
6.20
0.020
0.244
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
Figure 16. SO−8
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
MC33269, NCV33269
DPAK
DT SUFFIX
CASE 369A−13
ISSUE AB
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
−T−
2. CONTROLLING DIMENSION: INCH.
C
B
R
INCHES
DIM MIN MAX
MILLIMETERS
E
V
MIN
5.97
6.35
2.19
0.69
0.84
0.94
MAX
6.35
6.73
2.38
0.88
1.01
1.19
A
B
C
D
E
F
0.235
0.250
0.086
0.027
0.033
0.037
0.250
0.265
0.094
0.035
0.040
0.047
4
2
Z
A
K
S
1
3
G
H
J
0.180 BSC
4.58 BSC
U
0.034
0.018
0.102
0.040
0.023
0.114
0.87
0.46
2.60
1.01
0.58
2.89
K
L
0.090 BSC
2.29 BSC
F
J
R
S
U
V
Z
0.175
0.020
0.020
0.030
0.138
0.215
0.050
−−−
0.050
−−−
4.45
0.51
0.51
0.77
3.51
5.46
1.27
−−−
1.27
−−−
L
H
D 2 PL
M
G
0.13 (0.005)
T
SOLDERING FOOTPRINT*
6.20
3.0
0.244
0.118
2.58
0.101
5.80
0.228
1.6
0.063
6.172
0.243
mm
inches
ǒ
Ǔ
SCALE 3:1
Figure 17. DPAK
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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11
MC33269, NCV33269
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE K
A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
2
INCHES
DIM MIN MAX
MILLIMETERS
S
B
MIN
6.30
3.30
1.50
0.60
2.90
2.20
MAX
6.70
3.70
1.75
0.89
3.20
2.40
0.100
0.35
2.00
1.05
10
1
3
A
B
C
D
F
0.249
0.130
0.060
0.024
0.115
0.087
0.263
0.145
0.068
0.035
0.126
0.094
D
G
H
J
L
0.0008 0.0040 0.020
G
0.009
0.060
0.033
0
0.014
0.078
0.041
10
0.24
1.50
0.85
0
J
K
L
C
M
S
_
_
_
_
0.08 (0003)
0.264
0.287
6.70
7.30
M
H
K
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
6.3
0.248
2.3
0.091
2.3
0.091
2.0
0.079
mm
inches
ǒ
Ǔ
1.5
0.059
SCALE 6:1
Figure 18. SOT−223
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
MC33269, NCV33269
TO−220AB
T SUFFIX
CASE 221A−09
ISSUE AA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
SEATING
PLANE
−T−
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
C
B
F
T
S
4
1
INCHES
DIM MIN MAX
MILLIMETERS
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.46
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
−−−
MAX
15.75
10.28
4.82
0.88
3.73
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
−−−
A
K
Q
Z
A
B
C
D
F
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.018
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
−−−
0.620
0.405
0.190
0.035
0.147
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
−−−
2
3
U
H
G
H
J
K
L
L
R
N
Q
R
S
T
V
J
G
D
U
V
Z
N
0.080
2.04
http://onsemi.com
13
MC33269, NCV33269
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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MC33269/D
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