MC74ACT240NG [ONSEMI]
Octal Buffer/Line Driver with 3−State Outputs; 八路缓冲器/ 3态输出的线路驱动器
| 型号： | MC74ACT240NG |
| 厂家： | 
ONSEMI |
| 描述： | Octal Buffer/Line Driver with 3−State Outputs |
| 文件： | 总10页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC240, MC74ACT240
Octal Buffer/Line Driver
with 3−State Outputs
The MC74AC240/74ACT240 is an octal buffer and line driver
designed to be employed as a memory address driver, clock driver and
bus oriented transmitter or receiver which provides improved PC
board density.
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Features
• 3−State Outputs Drive Bus Lines or Buffer Memory Address
Registers
• Outputs Source/Sink 24 mA
PDIP−20
N SUFFIX
CASE 738
• ′ACT240 Has TTL Compatible Inputs
• Pb−Free Packages are Available
1
SOIC−20W
DW SUFFIX
CASE 751D
TRUTH TABLE
Inputs
OE
Outputs
1
D
(Pins 12, 14, 16, 18)
1
L
L
H
L
H
X
H
L
Z
TSSOP−20
DT SUFFIX
CASE 948E
NOTE: H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
1
Z = High Impedance
SOEIAJ−20
M SUFFIX
CASE 967
TRUTH TABLE
Inputs
OE
Outputs
1
D
(Pins 3, 5, 7, 9)
2
L
L
H
L
H
X
H
L
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
NOTE: H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
Z = High Impedance
V
OE
2
CC
20
19
18
17
16
15
14
12
13
11
1
2
3
4
5
6
7
8
9
10
OE
GND
1
Figure 1. Pinout: 20−Lead Packages Conductors
(Top View)
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
November, 2006 − Rev. 8
MC74AC240/D
MC74AC240, MC74ACT240
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
CC
V
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
−0.5 to V +0.5
V
IN
CC
V
−0.5 to V +0.5
V
OUT
CC
I
20
50
mA
mA
mA
°C
IN
I
DC Output Sink/Source Current, per Pin
OUT
I
DC V or GND Current per Output Pin
50
CC
CC
T
stg
Storage Temperature
−65 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
4.5
0
Typ
5.0
5.0
−
Max
6.0
Unit
′AC
V
Supply Voltage
V
V
CC
′ACT
5.5
V
, V
IN
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
OUT
V
V
V
V
V
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
CC
CC
CC
CC
CC
Input Rise and Fall Time (Note 1)
−
−
−
−
−
ns/V
t , t
r
f
′AC Devices except Schmitt Inputs
−
−
Input Rise and Fall Time (Note 2)
t , t
r
ns/V
f
′ACT Devices except Schmitt Inputs
−
T
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
J
T
A
−40
−
25
−
I
−24
24
mA
mA
OH
I
Output Current − Low
−
−
OL
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
IN
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2
MC74AC240, MC74ACT240
DC CHARACTERISTICS
74AC
74AC
T =−40°C to +85°C
A
V
CC
T
A
= +25°C
Symbol
Parameter
Unit
Conditions
(V)
Typ
Guaranteed Limits
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
= 0.1 V
OUT
Minimum High Level
Input Voltage
IH
V
V
V
or V − 0.1 V
CC
V
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
V
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
I
OH
V
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
Maximum Input
Leakage Current
IN
5.5
5.5
−
−
0.1
0.5
1.0
5.0
mA
mA
V = V , GND
I CC
I
V (OE) = V , V
I IL IH
Maximum
3−State
Current
OZ
V = V , GND
I
CC
V
V
V
= V , GND
O
CC
I
5.5
5.5
−
−
−
−
75
mA
mA
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OLD
OHD
I
−75
= 3.85 V Min
OHD
I
Maximum Quiescent
Supply Current
CC
5.5
−
8.0
80
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
IN
CC
CC
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3
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
74AC
74AC
T
= −40°C
A
T
= +25°C
= 50 pF
V
*
Fig.
No.
A
CC
to +85°C
= 50 pF
Symbol
Parameter
Unit
C
(V)
L
C
L
Min
Typ
Max
Min
Max
Propagation Delay
Data to Output
3.3
5.0
1.5
1.5
6.0
4.5
8.0
6.5
1.0
1.0
9.0
7.0
t
t
t
ns
ns
ns
ns
ns
ns
3−5
3−5
3−7
3−8
3−7
3−8
PLH
PHL
PZH
Propagation Delay
Data to Output
3.3
5.0
1.5
1.5
5.5
4.5
8.0
6.0
1.0
1.0
8.5
6.5
3.3
5.0
1.5
1.5
6.0
5.0
10.5
7.0
1.0
1.0
11.0
8.0
Output Enable Time
Output Enable Time
Output Disable Time
Output Disable Time
3.3
5.0
1.5
1.5
7.0
5.5
10.0
8.0
1.0
1.0
11.0
8.5
t
PZL
3.3
5.0
1.5
1.5
7.0
6.5
10.0
9.0
1.0
1.0
10.5
9.5
t
PHZ
3.3
5.0
1.5
1.5
7.5
6.5
10.5
9.0
1.0
1.0
11.5
9.5
t
PLZ
* Voltage Range 3.3 V is 3.3 V 0.3 V.
Voltage Range 5.0 V is 5.0 V 0.5 V.
DC CHARACTERISTICS
74ACT
74ACT
V
CC
T
A
= +25°C
T = −40°C to +85°C
A
Symbol
Parameter
Unit
Conditions
(V)
Typ
Guaranteed Limits
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
OUT
Minimum High Level
Input Voltage
IH
V
V
V
or V − 0.1 V
CC
V
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
= 0.1 V
OUT
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
V
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
OUT
Minimum High Level
Output Voltage
OH
*V = V or V
IN
IL
IH
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
V
−24 mA
−24 mA
I
OH
V
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
Maximum Low Level
Output Voltage
OL
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
Maximum Input
Leakage Current
IN
5.5
5.5
−
0.1
−
1.0
1.5
mA
V = V , GND
I CC
DI
Additional Max. I /Input
0.6
mA
V = V − 2.1 V
I CC
CCT
CC
I
V (OE) = V , V
I IL IH
Maximum
3−State
Current
OZ
5.5
−
0.5
5.0
mA
V = V , GND
I
CC
V
V
V
= V , GND
O
CC
I
5.5
5.5
−
−
−
−
75
mA
mA
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
OLD
OHD
I
−75
= 3.85 V Min
OHD
I
Maximum Quiescent
Supply Current
CC
5.5
−
8.0
80
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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4
MC74AC240, MC74ACT240
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT
74ACT
T
= −40°C
A
V
*
T
C
= +25°C
= 50 pF
Fig.
No.
CC
A
to +85°C
C
Symbol
Parameter
Unit
(V)
L
= 50 pF
L
Min
Typ
Max
Min
Max
t
t
t
Propagation Delay Data to Output
Propagation Delay Data to Output
Output Enable Time
5.0
5.0
5.0
5.0
5.0
5.0
1.5
1.5
1.5
2.0
2.0
2.5
6.0
5.5
7.0
7.0
8.0
6.5
8.5
7.5
1.5
1.5
1.0
1.5
2.0
2.0
9.5
8.5
ns
ns
ns
ns
ns
ns
3−5
3−5
3−7
3−8
3−7
3−8
PLH
PHL
PZH
8.5
9.5
t
Output Enable Time
9.5
10.5
10.5
10.5
PZL
PHZ
t
Output Disable Time
9.5
t
Output Disable Time
10.0
PLZ
*Voltage Range 5.0 V is 5.0 V 0.5 V.
CAPACITANCE
Symbol
Value
Typ
Parameter
Unit
Test Conditions
C
Input Capacitance
Power Dissipation Capacitance
4.5
45
pF
pF
V
V
= 5.0 V
= 5.0 V
IN
CC
CC
C
PD
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5
MC74AC240, MC74ACT240
ORDERING INFORMATION
Device
†
Package
Shipping
MC74AC240N
PDIP−20
MC74AC240NG
PDIP−20
(Pb−Free)
18 Units / Rail
MC74ACT240N
PDIP−20
MC74ACT240NG
PDIP−20
(Pb−Free)
MC74AC240DW
SOIC−20
38 Units / Rail
1000 / Tape & Reel
38 Units / Rail
MC74AC240DWG
SOIC−20
(Pb−Free)
MC74AC240DWR2
MC74AC240DWR2G
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT240DW
MC74ACT240DWG
SOIC−20
SOIC−20
(Pb−Free)
MC74ACT240DWR2
MC74ACT240DWR2G
SOIC−20
1000 / Tape & Reel
SOIC−20
(Pb−Free)
MC74AC240DTR2
MC74AC240DTR2G
MC74ACT240DTR2
MC74ACT240DTR2G
MC74AC240MEL
TSSOP−20*
TSSOP−20*
TSSOP−20*
TSSOP−20*
SOEIAJ−20
2500 / Tape & Reel
2000 / Tape & Reel
2000 / Tape & Reel
MC74AC240MELG
SOEIAJ−20
(Pb−Free)
MC74ACT240MEL
MC74ACT240MELG
SOEIAJ−20
SOEIAJ−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
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6
MC74AC240, MC74ACT240
MARKING DIAGRAMS
PDIP−20
SOIC−20W
TSSOP−20
SOEIAJ−20
20
20
20
1
20
1
AC
240
AC240
AWLYYWWG
MC74AC240N
AWLYYWWG
74AC240
AWLYWWG
ALYWG
G
1
1
20
20
20
1
20
1
ACT
240
ACT240
AWLYYWWG
74ACT240
AWLYWWG
MC74ACT240N
AWLYYWWG
ALYWG
G
1
1
A
WL, L
YY, Y
= Assembly Location
= Wafer Lot
= Year
WW, W = Work Week
G or G
= Pb−Free Package
(Note: Microdot may be in either location)
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7
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
10
B
INCHES
DIM MIN MAX
MILLIMETERS
L
C
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
A
B
C
D
E
F
1.010
0.240
0.150
0.015
1.070
0.260
0.180
0.022
0.050 BSC
1.27 BSC
−T−
SEATING
PLANE
K
0.050
0.070
1.27
1.77
G
J
0.100 BSC
2.54 BSC
M
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
N
E
K
L
0.300 BSC
7.62 BSC
G
F
M
N
0
0.020
15
0.040
0
_
0.51
15
1.01
J 20 PL
_
_
_
D 20 PL
M
M
B
0.25 (0.010)
T
M
M
A
0.25 (0.010)
T
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
D
A
q
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
E
B
MILLIMETERS
1
10
DIM MIN
MAX
2.65
0.25
0.49
0.32
12.95
7.60
A
A1
B
C
D
E
2.35
0.10
0.35
0.23
12.65
7.40
20X B
M
S
S
B
0.25
T A
e
1.27 BSC
H
h
10.05
0.25
0.50
0
10.55
0.75
0.90
7
A
L
q
_
_
SEATING
PLANE
18X e
A1
C
T
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8
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
20X K REF
K
M
S
S
V
0.10 (0.004)
T
U
S
U
K1
0.15 (0.006) T
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
J J1
20
11
2X L/2
B
SECTION N−N
L
−U−
PIN 1
IDENT
0.25 (0.010)
N
1
10
M
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
0.15 (0.006) T
U
A
−V−
N
MILLIMETERS
INCHES
DIM MIN
MAX
6.60
4.50
1.20
0.15
0.75
MIN
MAX
0.260
0.177
F
A
B
6.40
4.30
−−−
0.252
0.169
DETAIL E
C
−−− 0.047
0.006
0.030
D
0.05
0.50
0.002
0.020
F
G
H
0.65 BSC
0.026 BSC
−W−
0.27
0.09
0.09
0.19
0.19
0.37
0.20
0.16
0.30
0.25
0.011
0.004
0.004
0.007
0.007
0.015
0.008
0.006
0.012
0.010
C
J
J1
K
G
D
H
K1
L
DETAIL E
6.40 BSC
0.252 BSC
0
0.100 (0.004)
−T− SEATING
M
0
8
8
_
_
_
_
PLANE
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MC74AC240, MC74ACT240
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
NOTES:
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
L
20
11
E
Q
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
1
H
E
E
_
M
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
L
1
10
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DETAIL P
Z
D
VIEW P
e
A
c
MILLIMETERS
INCHES
MIN MAX
−−− 0.081
DIM MIN
MAX
2.05
0.20
0.50
0.25
12.80
5.45
A
−−−
0.05
A
1
A
b
1
0.002
0.008
0.020
0.010
0.504
0.215
b
c
0.35
0.15
0.014
0.006
0.486
0.201
M
0.10 (0.004)
0.13 (0.005)
D
E
e
12.35
5.10
1.27 BSC
0.050 BSC
H
7.40
0.50
1.10
8.20
0.85
1.50
0.291
0.020
0.043
0.323
0.033
0.059
E
L
L
E
M
Q
0
10
10
0.035
0
0.028
_
_
_
_
0.70
−−−
0.90
0.81
1
Z
−−− 0.032
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MC74AC240/D
相关型号：
MC74ACT241DWCR2
Bus Driver, ACT Series, 2-Func, 4-Bit, True Output, CMOS, PDSO20, PLASTIC, SOIC-20
MOTOROLA
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