MC74LCX06DTG [ONSEMI]
Low-Voltage CMOS Hex Inverter with Open Drain Outputs; 低电压CMOS六反相器具有漏极开路输出
| 型号： | MC74LCX06DTG |
| 厂家： | 
ONSEMI |
| 描述： | Low-Voltage CMOS Hex Inverter with Open Drain Outputs |
| 文件： | 总6页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74LCX06
Low-Voltage CMOS Hex
Inverter with Open Drain
Outputs
With 5 V − Tolerant Inputs
http://onsemi.com
The MC74LCX06 is a high performance hex inverter operating
from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs
significantly reduce current loading to input drivers. These LCX
devices have open drain outputs which provide the ability to set output
MARKING
DIAGRAMS
levels, or do active−HIGH AND or active−LOW OR functions. A V
specification of 5.5 V allows MC74LCX06 inputs to be safely driven
from 5.0 V devices.
I
14
SOIC−14
D SUFFIX
CASE 751A
LCX06G
AWLYWW
14
1
Features
1
• Designed for 2.3 V to 3.6 V V Operation
CC
14
• 5.0 V Tolerant Inputs/Outputs
• LVTTL Compatible
• LVCMOS Compatible
• 24 mA Output Sink Capability
LCX
06
TSSOP−14
DT SUFFIX
CASE 948G
14
ALYWG
• Near Zero Static Supply Current (10 mA) Substantially Reduces
1
G
System Power Requirements
• Latchup Performance Exceeds 500 mA
• Wired−OR, Wired−AND
1
A
= Assembly Location
WL, L = Wafer Lot
= Year
• Output Level Can Be Set Externally Without Affecting Speed of
Y
Device
WW, W = Work Week
• Functionally Compatible with LCX05
G or G = Pb−Free Package
• ESD Performance:
Human Body Model >1500 V;
Machine Model >200 V
(Note: Microdot may be in either location)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Compliant
V
A3
O3
12
A4
O4
A5
O5
CC
14
13
11
10
9
8
1
2
3
4
5
6
7
A0
O0
A1
O1
A2
O2 GND
Figure 1. Pinout: 14−Lead (Top View)
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
July, 2012 − Rev. 9
MC74LCX06/D
MC74LCX06
1
2
4
*
*
*
*
*
*
Table 1. PIN NAMES
A0
A1
A2
A3
A4
A5
O0
O1
O2
O3
O4
O5
Pins
Function
3
An
On
Data Inputs
Outputs
5
6
13
11
9
12
10
8
Table 2. TRUTH TABLE
An
On
L
H
Z
L
* OD
Figure 2. Logic Diagram
MAXIMUM RATINGS
Symbol
Parameter
Value
−0.5 to +7.0
−0.5 ≤ V ≤ +7.0
Condition
Unit
V
V
V
V
DC Supply Voltage
CC
I
DC Input Voltage
V
I
DC Output Voltage
−0.5 ≤ V ≤ +7.0
Output in HIGH or LOW State (Note 1)
V < GND
V
O
O
I
I
DC Input Diode Current
DC Output Diode Current
−50
−50
mA
mA
mA
mA
mA
mA
°C
IK
I
V
O
< GND
OK
+50
V > V
O CC
I
I
I
DC Output/Sink Current
+50
O
DC Supply Current Per Supply Pin
100
CC
GND
DC Ground Current Per Ground Pin
Storage Temperature Range
Moisture Sensitivity
100
T
−65 to +150
STG
MSL
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
ORDERING INFORMATION
Device
†
Package
Shipping
MC74LCX06DG
SOIC−14
(Pb−Free)
55 Units / Rail
2500 / Tape & Reel
96 Units / Rail
MC74LCX06DR2G
MC74LCX06DTG
MC74LCX06DTR2G
SOIC−14
(Pb−Free)
TSSOP−14
(Pb−Free)
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
MC74LCX06
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
V
CC
Supply Voltage
Operating
Data Retention Only
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
V
V
Input Voltage
0
0
5.5
V
V
I
Output Voltage
(HIGH or LOW State)
V
CC
O
I
OL
LOW Level Output Current
Sink
V
CC
V
CC
V
CC
= 3.0 V − 3.6 V
= 2.7 V − 3.0 V
= 2.3 V − 2.7 V
+24
+12
+8
mA
T
Operating Free−Air Temperature
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V
−40
+85
10
°C
A
Dt/DV
0
ns/V
IN
CC
DC ELECTRICAL CHARACTERISTICS (T = −40°C to +85°C)
A
Symbol
Characteristic
Condition
2.3 V ≤ V ≤ 2.7 V
Min
1.7
2.0
Max
Unit
V
IH
HIGH Level Input Voltage (Note 2)
V
CC
2.7 V ≤ V ≤ 3.6 V
CC
V
LOW Level Input Voltage (Note 2)
LOW Level Output Voltage
V
V
2.3 V ≤ V ≤ 2.7 V
0.7
0.8
0.2
0.3
0.4
0.4
0.55
5
IL
CC
2.7 V ≤ V ≤ 3.6 V
CC
V
OL
2.3 V ≤ V ≤ 3.6 V; I = 100 mA
CC
OL
V
= 2.3 V; I = 8 mA
OL
CC
V
= 2.7 V; I = 12 mA
OL
CC
CC
CC
V
V
= 3.0 V; I = 16 mA
OL
= 3.0 V; I = 24 mA
OL
I
3−State Output Current
V
= 3.6 V, V = V or V ,
mA
OZ
CC
IN
IH
IL
V
OUT
= 0 to 3.6 V
I
I
I
Power Off Leakage Current
Input Leakage Current
V
V
= 0, V = 3.6 V or V = 3.6 V
OUT
10
5
mA
mA
mA
mA
OFF
CC
IN
= 0 to 3.6 V, V = 3.6 V or GND
IN
CC
IN
Quiescent Supply Current
V
= 3.6 V, V = 3.6 V or V = 3.6 V
OUT
10
500
CC
CC
IN
DI
Increase in I per Input
2.3 V ≤ V ≤ 3.6 V
CC
CC
CC
One Input at V = V − 0.6 V
IH
CC
2. These values of V are used to test DC electrical characteristics only.
I
AC ELECTRICAL CHARACTERISTICS (T = −40°C to +85°C)
A
V
CC
= 3.3 V 0.3 V
V
CC
= 2.7 V
V
CC
= 2.5 V 0.2 V
C = 50 pF
L
C = 50 pF
L
C = 30 pF
L
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Propagation Delay
Input to Output
Unit
t
0.8
0.8
3.7
3.7
1.0
1.0
4.1
4.1
0.8
0.8
3.5
3.5
ns
ns
PLZ
PZL
t
DYNAMIC SWITCHING CHARACTERISTICS (T = +25°C)
A
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
V
OLP
Dynamic LOW Peak Voltage (Note 3)
V
CC
V
CC
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
0.9
0.7
V
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
L
IH
IL
V
OLV
Dynamic LOW Valley Voltage (Note 3)
V
CC
V
CC
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
−0.8
−0.6
V
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
L
IH
IL
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
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3
MC74LCX06
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
= 3.3 V, V = 0 V or V
Typical
Unit
pF
C
C
C
Input Capacitance
V
V
7
8
IN
CC
I
CC
CC
Output Capacitance
= 3.3 V, V = 0 V or V
pF
OUT
PD
CC
I
Power Dissipation Capacitance
10 MHz, V = 3.3 V, V = 0 V or V
25
pF
CC
I
CC
V
CC
Vmi
Vmi
An
On
0 V
t
t
PLZ
PZL
Vmo
V
V
LZ
OL
PROPAGATION DELAYS
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
F W
Table 3. AC WAVEFORMS
V
CC
3.3 V $ 0.3 V
2.7 V
1.5 V
1.5 V
2.5 V $ 0.2 V
Symbol
V
V
V
1.5 V
V
/ 2
mi
CC
1.5 V
V
CC
/ 2
mo
LZ
V
OL
+ 0.3 V
V
+ 0.3 V
V
OL
+ 0.15 V
OL
V
CC
6 V or V × 2
CC
R
1
GND
PULSE
GENERATOR
DUT
R
T
C
R
L
L
Table 4. TEST CIRCUIT
TEST
SWITCH
6 V
t
, t
PZL PLZ
Open Collector/Drain t
and t
6 V
PLH
PHL
t
, t
GND
PZH PHZ
C
= 50 pF at V = 3.3 $ 0.3 V or equivalent (includes jig and
L
CC
probe capacitance)
C
= 30 pF at V = 2.5 $ 0.2 V or equivalent (includes jig and
L
CC
probe capacitance)
R
L
R
T
= R = 500 W or equivalent
1
OUT
= Z
of pulse generator (typically 50 W)
http://onsemi.com
4
MC74LCX06
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
K1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
J1
K
0.10 (0.004)
K1 0.19
SEATING
L
M
6.40 BSC
0.252 BSC
−T−
H
G
DETAIL E
D
PLANE
0
8
0
8
_
_
_
_
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
MC74LCX06
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
SEATING
PLANE
J
M
K
1.27 BSC
D 14 PL
0.19
0.10
0
M
S
S
0.25 (0.010)
T
B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MC74LCX06/D
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