MC74LCX16652DTR2 [ONSEMI]

LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56;
MC74LCX16652DTR2
型号: MC74LCX16652DTR2
厂家: ONSEMI    ONSEMI
描述:

LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56

输入元件 光电二极管 输出元件 逻辑集成电路
文件: 总21页 (文件大小:544K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
LOW–VOLTAGE CMOS  
16–BIT TRANSCEIVER/  
REGISTERED TRANSCEIVER  
WITH DUAL ENABLE  
The MC74LCX16652 is a high performance, non–inverting 16–bit  
transceiver/registered transceiver operating from a 2.7 to 3.6V supply.  
The device is byte controlled. Each byte has separate control inputs  
which can be tied together for full 16–bit operation. High impedance TTL  
compatible inputs significantly reduce current loading to input drivers  
while TTL compatible outputs offer improved switching noise  
performance. A V specification of 5.5V allows MC74LCX16652 inputs to  
I
be safely driven from 5V devices. The MC74LCX16652 is suitable for  
memory address driving and all TTL level bus oriented transceiver  
applications.  
Data on the A or B bus will be clocked into the registers as the  
appropriate clock pin goes from a LOW–to–HIGH logic level. Output  
Enable pins (OEBAn, OEABn) are provided to control the transceiver  
outputs. In the transceiver mode, data present at the high impedance port  
may be stored in either the A or the B register or in both. The select  
controls (SBAn, SABn) can multiplex stored and real–time (transparent  
mode) data. In the isolation mode (both outputs disabled), A data may be  
stored in the B register or B data may be stored in the A register. When in  
the real–time mode, it is possible to store data without using the internal  
registers by simultaneously enabling OEAB and OEBA. In this  
configuration, each output reinforces its input (data retention is not  
guaranteed in this mode).  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 1202–01  
Designed for 2.7 to 3.6V V  
CC  
Operation  
PIN NAMES  
5.7ns Maximum t  
pd  
Pins  
Function  
5V Tolerant — Interface Capability With 5V TTL Logic  
Supports Live Insertion and Withdrawal  
A0–A15  
B0–B15  
CABn, CBAn  
SABn, SBAn  
OEBAn, OEABn  
Side A Inputs/Outputs  
Side B Inputs/Outputs  
Clock Pulse Inputs  
Select Control Inputs  
Output Enable Inputs  
I  
OFF  
Specification Guarantees High Impedance When V  
= 0V  
CC  
LVTTL Compatible  
LVCMOS Compatible  
24mA Balanced Output Sink and Source Capability  
Near Zero Static Supply Current in All Three Logic States (20µA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 500mA  
ESD Performance: Human Body Model >2000V; Machine Model >200V  
This document contains information on a new product. Specifications and information herein are subject to  
change without notice.  
11/96  
REV 0.2  
215  
Motorola, Inc. 1996  
MC74LCX16652  
OEAB1  
CAB1  
SAB1  
GND  
A0  
OEBA1  
CBA1  
SBA1  
1
2
56  
55  
54  
3
4
53 GND  
B0  
B1  
V
5
52  
51  
50  
49  
48  
47  
A1  
6
V
CC  
7
CC  
A2  
A3  
A4  
B2  
B3  
B4  
8
9
10  
GND 11  
46 GND  
A5  
A6  
B5  
B6  
B7  
B8  
B9  
B10  
12  
13  
14  
15  
16  
17  
45  
44  
43  
42  
41  
40  
A7  
A8  
A9  
A10  
GND 18  
39 GND  
A11  
A12  
A13  
B11  
B12  
B13  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
V
CC  
V
CC  
A14  
B14  
A15  
GND  
B15  
GND  
SBA2  
CBA2  
OEBA2  
SAB2  
CAB2  
OEAB2  
MOTOROLA  
216  
LCX DATA  
BR1339 — REV 3  
MC74LCX16652  
LOGIC DIAGRAM  
55  
1
CBA1  
OEAB1  
56  
OEBA1  
SBA1  
54  
3
2
SAB1  
CAB1  
C
Q
A0:7  
D
C
Q
B0:7  
D
1 of 8 Channels  
To 7 Other Channels  
30  
28  
CBA2  
OEAB2  
29  
31  
OEBA2  
SBA2  
26  
27  
SAB2  
CAB2  
C
Q
A8:15  
D
C
Q
B8:15  
D
1 of 8 Channels  
To 7 Other Channels  
LCX DATA  
BR1339 — REV 3  
217  
MOTOROLA  
MC74LCX16652  
BUS APPLICATIONS  
Real Time Transfer – Bus B to  
Real Time Transfer – Bus A to  
Bus B  
Bus A  
OEAB OEBA CAB CBA SAB  
SBA  
L
OEAB OEBA CAB CBA SAB  
SBA  
L
L
X
X
X
H
H
X
X
L
X
Store Data from Bus A, Bus B or  
Bus A and Bus B  
Transfer A Stored Data to Bus B  
or Stored Data Bus B to Bus A  
or Both at the Same Time  
OEAB OEBA CAB CBA SAB  
SBA  
OEAB OEBA CAB CBA SAB  
SBA  
X
L
L
H
X
H
X
X
X
X
X
X
X
X
H
L
H
H
L
L
H or L  
X
H or L H or L  
X
H or L  
H
X
H
X
H
H
Store Bus A in Both Registers or  
Store Bus B in Both Registers  
Isolation  
OEAB OEBA CAB CBA SAB  
SBA  
OEAB OEBA CAB CBA SAB  
H or L H or L  
SBA  
X
H
L
H
L
L
X
X
L
L
H
X
MOTOROLA  
218  
LCX DATA  
BR1339 — REV 3  
MC74LCX16652  
FUNCTION TABLE  
Inputs  
CBAn  
Data Ports  
Operating Mode  
OEABn  
OEBAn  
CABn  
SABn  
SBAn  
An  
Input  
X
Bn  
Input  
X
L
H
X
X
X
X
Isolation, Hold Storage  
Store A and/or B Data  
l
l
h
h
H
H
L
L
Input  
Output  
X*  
X*  
L
X
L
H
L
H
Real Time A Data to B Bus  
H
L
X
X
X
QA  
Stored A Data to B Bus  
l
h
L
H
Real TIme A Data to B Bus; Store A Data  
H
X
L
H
QA  
QA  
Clock A Data to B Bus; Store A Data  
L
Output  
Input  
X*  
X*  
X
L
L
H
L
H
Real Time B Data to A Bus  
X
X
H
L
QB  
X
Stored B Data to A Bus  
L
H
l
h
Real Time B Data to A Bus; Store B Data  
X
H
QB  
QB  
L
H
Clock B Data to A Bus; Store B Data  
H
Output  
Output  
H
H
QB  
QA  
Stored A Data to B Bus,  
Stored B Data to A Bus  
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Low–to–High Clock Transition; L = Low Voltage Level; l = Low Voltage Level One Setup  
TimePriortotheLow–to–HighClockTransition;X=Don’tCare;=Low–to–HighClockTransition;=NOTLow–to–HighClockTransition;QA=Ainputstorageregister;  
QB = B input storage register; * = The clocks are not internally gated with either the Output Enables or the Source Inputs. Therefore, data at the A or B ports may be  
clocked into the storage registers, at any time. For I  
reasons, Do Not Float Inputs.  
CC  
ABSOLUTE MAXIMUM RATINGS*  
Symbol  
CC  
Parameter  
DC Supply Voltage  
Value  
Condition  
Unit  
V
V
V
V
–0.5 to +7.0  
DC Input Voltage  
–0.5 V +7.0  
V
I
I
DC Output Voltage  
–0.5 V +7.0  
Output in 3–State  
Note 1.  
V
O
O
–0.5 V V  
+ 0.5  
V
O
CC  
I
I
DC Input Diode Current  
DC Output Diode Current  
–50  
–50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
V
O
< GND  
OK  
+50  
V > V  
O CC  
I
I
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
±50  
O
±100  
±100  
CC  
GND  
T
–65 to +150  
STG  
* Absolutemaximumcontinuousratingsarethosevaluesbeyondwhichdamagetothedevicemayoccur. Exposuretotheseconditionsorconditions  
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.  
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.  
O
LCX DATA  
219  
MOTOROLA  
BR1339 — REV 3  
MC74LCX16652  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
CC  
Parameter  
Min  
Typ  
Max  
Unit  
V
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
3.3  
3.3  
3.6  
3.6  
V
V
V
Input Voltage  
0
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
(3–State)  
0
0
V
CC  
O
5.5  
–24  
24  
I
I
I
I
HIGH Level Output Current, V  
= 3.0V – 3.6V  
mA  
mA  
mA  
mA  
°C  
OH  
OL  
OH  
OL  
CC  
LOW Level Output Current, V  
= 3.0V – 3.6V  
= 2.7V – 3.0V  
= 2.7V – 3.0V  
CC  
HIGH Level Output Current, V  
–12  
12  
CC  
LOW Level Output Current, V  
CC  
T
A
Operating Free–Air Temperature  
Input Transition Rise or Fall Rate, V from 0.8V to 2.0V,  
–40  
0
+85  
10  
t/V  
ns/V  
IN  
V
CC  
= 3.0V  
DC ELECTRICAL CHARACTERISTICS  
T
A
= –40°C to +85°C  
Symbol  
Characteristic  
HIGH Level Input Voltage (Note 2.)  
LOW Level Input Voltage (Note 2.)  
HIGH Level Output Voltage  
Condition  
Min  
2.0  
Max  
Unit  
V
V
V
V
2.7V V  
3.6V  
IH  
CC  
2.7V V  
2.7V V  
3.6V  
= –100µA  
0.8  
V
IL  
CC  
3.6V; I  
V
– 0.2  
V
OH  
CC  
OH  
CC  
V
CC  
V
CC  
V
CC  
= 2.7V; I  
= 3.0V; I  
= 3.0V; I  
= –12mA  
= –18mA  
= –24mA  
2.2  
OH  
OH  
OH  
2.4  
2.2  
V
LOW Level Output Voltage  
2.7V V  
CC  
3.6V; I  
= 100µA  
OL  
0.2  
0.4  
V
OL  
V
= 2.7V; I = 12mA  
OL  
CC  
CC  
CC  
V
V
= 3.0V; I  
= 3.0V; I  
= 16mA  
= 24mA  
0.4  
OL  
OL  
0.55  
±5.0  
±5.0  
I
I
Input Leakage Current  
3–State Output Current  
2.7V V  
CC  
3.6V; 0V V 5.5V  
µA  
µA  
I
I
2.7 V  
CC  
3.6V; 0V V 5.5V;  
O
I
OZ  
V = V or V  
IH  
IL  
I
I
Power–Off Leakage Current  
Quiescent Supply Current  
V
= 0V; V or V = 5.5V  
10  
20  
µA  
µA  
µA  
µA  
OFF  
CC  
I
O
2.7 V  
3.6V; V = GND or V  
CC  
CC  
I
CC  
2.7 V  
CC  
3.6V; 3.6 V or V 5.5V  
±20  
500  
I
O
I  
CC  
Increase in I  
CC  
per Input  
2.7 V  
CC  
3.6V; V = V  
IH  
– 0.6V  
CC  
2. These values of V are used to test DC electrical characteristics only. Functional test should use V 2.4V, V 0.5V.  
IH IL  
I
MOTOROLA  
220  
LCX DATA  
BR1339 — REV 3  
MC74LCX16652  
AC CHARACTERISTICS (Note 3.; t = t = 2.5ns; C = 50pF; R = 500)  
R
F
L
L
Limits  
T
A
= –40°C to +85°C  
V
= 3.0V to 3.6V  
Max  
V
= 2.7V  
CC  
CC  
Symbol  
Parameter  
Waveform  
Min  
Min  
Max  
Unit  
MHz  
ns  
f
Clock Pulse Frequency  
3
1
170  
max  
t
t
Propagation Delay  
Input to Output  
1.5  
1.5  
5.7  
5.7  
1.5  
1.5  
6.2  
6.2  
PLH  
PHL  
t
t
Propagation Delay  
Clock to Output  
3
1
2
2
1.5  
1.5  
6.2  
6.2  
1.5  
1.5  
7.0  
7.0  
ns  
ns  
ns  
ns  
PLH  
PHL  
t
t
Propagation Delay  
Select to Output  
1.5  
1.5  
6.5  
6.5  
1.5  
1.5  
7.0  
7.0  
PLH  
PHL  
t
t
Output Enable Time to  
High and Low Level  
1.5  
1.5  
7.0  
7.0  
1.5  
1.5  
8.0  
8.0  
PZH  
PZL  
t
t
Output Disable Time From  
High and Low Level  
1.5  
1.5  
6.5  
6.5  
1.5  
1.5  
7.0  
7.0  
PHZ  
PLZ  
t
t
t
Setup Time, HIGH or LOW Data to Clock  
Hold Time, HIGH or LOW Data to Clock  
Clock Pulse Width, HIGH or LOW  
3
3
3
2.5  
1.5  
3.0  
2.5  
1.5  
3.0  
ns  
ns  
ns  
ns  
s
h
w
t
t
Output–to–Output Skew  
(Note 4.)  
1.0  
1.0  
OSHL  
OSLH  
3. These AC parameters are preliminary and may be modified prior to release.  
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t  
guaranteed by design.  
) or LOW–to–HIGH (t  
OSHL  
); parameter  
OSLH  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Symbol  
Characteristic  
Condition  
Min  
Typ  
0.8  
0.8  
Max  
Unit  
V
V
V
Dynamic LOW Peak Voltage (Note 5.)  
Dynamic LOW Valley Voltage (Note 5.)  
V
V
= 3.3V, C = 50pF, V = 3.3V, V = 0V  
L IH IL  
OLP  
CC  
= 3.3V, C = 50pF, V = 3.3V, V = 0V  
IH IL  
V
OLV  
CC  
L
5. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is  
measured in the LOW state. The LCX16652 is characterized with 15 outputs switching with 1 output held LOW.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3V, V = 0V or V  
Typical  
Unit  
pF  
C
C
C
V
V
7
8
IN  
CC  
I
CC  
CC  
Input/Output Capacitance  
= 3.3V, V = 0V or V  
pF  
I/O  
PD  
CC  
I
Power Dissipation Capacitance  
10MHz, V  
CC  
= 3.3V, V = 0V or V  
CC  
20  
pF  
I
LCX DATA  
BR1339 — REV 3  
221  
MOTOROLA  
MC74LCX16652  
2.7V  
0V  
An, Bn,  
SBAn, SABn  
1.5V  
t
, t  
PLH PHL  
V
OH  
Bn, An  
1.5V  
V
OL  
WAVEFORM 1 – SAB to B and SBA to A, An to Bn PROPAGATION DELAYS  
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns  
F
W
2.7V  
0V  
OEBAn  
OEABn  
1.5V  
1.5V  
t
t
PHZ  
PZH  
V
OH  
– 0.3V  
1.5V  
1.5V  
An, Bn  
0V  
t
t
PLZ  
PZL  
3.0V  
An, Bn  
V
OL  
+ 0.3V  
WAVEFORM 2 – OEBA/OEAB to An/Bn OUTPUT ENABLE AND DISABLE TIMES  
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns  
F
W
Figure 1. AC Waveforms  
MOTOROLA  
222  
LCX DATA  
BR1339 — REV 3  
MC74LCX16652  
2.7V  
An, Bn  
1.5V  
0V  
t
s
t
h
2.7V  
CABn,  
CBAn  
t
w
1.5V  
1.5V  
0V  
f
max  
t
, t  
PLH PHL  
V
OH  
Bn, An  
1.5V  
V
OL  
WAVEFORM 3 – CLOCK to Bn/An PROPAGATION DELAYS, CLOCK MINIMUM PULSE WIDTH,  
An/Bn to CLOCK SETUP AND HOLD TIMES  
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns except when noted  
F W  
t
w
NEGATIVE  
PULSE  
1.5V  
1.5V  
1.5V  
1.5V  
POSITIVE  
PULSE  
t
w
WAVEFORM 4 – INPUT PULSE DEFINITION  
= t = 2.5ns, 10% to 90% of 0V to 2.7V  
t
R
F
Figure 1. AC Waveforms (continued)  
V
CC  
6V  
OPEN  
GND  
R
1
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
TEST  
SWITCH  
Open  
6V  
t , t  
PLH PHL  
t , t  
PZL PLZ  
Open Collector/Drain t  
PLH  
and t  
PHL  
6V  
t
, t  
GND  
PZH PHZ  
C
R
R
= 50pF or equivalent (Includes jig and probe capacitance)  
L
L
T
= R = 500or equivalent  
1
OUT  
= Z  
of pulse generator (typically 50)  
Figure 2. Test Circuit  
LCX DATA  
223  
MOTOROLA  
BR1339 — REV 3  
SEMICONDUCTOR TECHNICAL DATA  
Device Nomenclature  
MC 74 XXXX YYYYYY ZZ  
Motorola  
Package Type  
Circuit Identifier  
D  
= Plastic Narrow JECDEC SOIC  
DW = Plastic Wide JEDEC SOIC  
M = Plastic EIAJ SOIC  
SD = Plastic SSOP  
DT = Plastic TSSOP  
Temperature Range  
74 = –40 to +85°C  
Family Identifier  
LCX = 5V–Tolerant Low–Voltage CMOS  
LVX = Low–Voltage CMOS  
LVXC = Configurable Low–Voltage CMOS  
Function Type  
A = Modified LCX Spec  
251  
MOTOROLA  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751A–03  
ISSUE F  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
14  
1
8
7
P 7 PL  
–B–  
M
M
0.25 (0.010)  
B
MILLIMETERS  
INCHES  
MIN MAX  
G
F
R X 45°  
DIM MIN  
MAX  
8.75  
4.00  
1.75  
0.49  
1.25  
C
A
B
C
D
F
G
J
K
M
P
8.55  
3.80  
1.35  
0.35  
0.40  
0.337 0.344  
0.150 0.157  
0.054 0.068  
0.014 0.019  
0.016 0.049  
0.050 BSC  
J
M
SEATING  
PLANE  
K
D 14 PL  
1.27 BSC  
0.19  
0.10  
0°  
0.25  
0.25  
7°  
0.008 0.009  
0.004 0.009  
M
S
S
0.25 (0.010)  
T
B
A
0°  
7°  
5.80  
0.25  
6.20  
0.50  
0.228 0.244  
0.010 0.019  
R
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 965–01  
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
14  
8
7
Q
1
E H  
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
A
DIM MIN  
MAX  
MIN  
---  
MAX  
0.081  
c
A
---  
2.05  
A
0.05  
0.35  
0.18  
0.20 0.002 0.008  
0.50 0.014 0.020  
0.27 0.007  
1
b
c
0.011  
D
E
e
9.90 10.50 0.390 0.413  
b
A
1
5.10  
5.45 0.201 0.215  
M
1.27 BSC  
0.050 BSC  
8.20 0.291 0.323  
0.85 0.020 0.033  
1.50 0.043 0.059  
0.13 (0.005)  
0.10 (0.004)  
H
7.40  
0.50  
1.10  
0
0.70  
---  
E
L
L
E
M
Q
10  
0.90 0.028 0.035  
1.42 --- 0.056  
0
10  
1
Z
MOTOROLA  
252  
Case Outlines  
(continued)  
SD SUFFIX  
PLASTIC SSOP PACKAGE  
CASE 940A–03  
NOTES:  
ISSUE B  
6
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
14X K REF  
7
8
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
M
S
S
0.12 (0.005)  
T U  
V
0.25 (0.010)  
N
9
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
14  
8
L/2  
M
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF K DIMENSION AT MAXIMUM  
MATERIAL CONDITION. DAMBAR INTRUSION  
SHALL NOT REDUCE DIMENSION K BY MORE  
THAN 0.07 (0.002) AT LEAST MATERIAL  
CONDITION.  
B
L
F
PIN 1  
IDENT  
1
7
DETAIL E  
–U–  
11 TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
12 DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
A
–V–  
K
J
J1  
M
S
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
0.20 (0.008)  
T U  
A
B
C
D
F
6.07  
5.20  
1.73  
0.05  
0.63  
6.33 0.238 0.249  
5.38 0.205 0.212  
1.99 0.068 0.078  
0.21 0.002 0.008  
0.95 0.024 0.037  
K1  
SECTION N–N  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
1.22 0.042 0.048  
0.20 0.003 0.008  
0.16 0.003 0.006  
0.38 0.010 0.015  
0.33 0.010 0.013  
1.08  
0.09  
0.09  
0.25  
0.25  
7.65  
0
–W–  
C
0.076 (0.003)  
SEATING  
PLANE  
–T–  
7.90 0.301  
0.311  
8
D
G
M
8
0
DETAIL E  
H
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948G–01  
ISSUE O  
NOTES:  
1
14X K REF  
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.10 (0.004)  
T U  
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
4
5
8
7
2X L/2  
M
B
L
N
–U–  
PIN 1  
IDENT.  
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
DETAIL E  
K
S
0.15 (0.006) T U  
A
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
K1  
–V–  
A
B
4.90  
4.30  
–––  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
C
1.20  
––– 0.047  
D
F
G
H
J
J1  
K
K1  
L
0.05  
0.50  
0.65 BSC  
0.50  
0.09  
0.09  
0.19  
0.19  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N–N  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
–W–  
C
0.10 (0.004)  
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
–T–  
H
G
M
0
8
0
8
DETAIL E  
D
253  
MOTOROLA  
Case Outlines  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751B–05  
ISSUE J  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
16  
1
9
8
–B–  
P 8 PL  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
M
M
0.25 (0.010)  
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
G
MILLIMETERS  
INCHES  
MIN MAX  
DIM MIN  
MAX  
A
B
C
D
F
G
J
K
M
P
9.80 10.00  
0.386 0.393  
0.150 0.157  
0.054 0.068  
0.014 0.019  
0.016 0.049  
0.050 BSC  
F
K
R X 45°  
3.80  
1.35  
0.35  
0.40  
4.00  
1.75  
0.49  
1.25  
C
1.27 BSC  
–T–  
SEATING  
0.19  
0.10  
0°  
0.25  
0.25  
7°  
0.008 0.009  
0.004 0.009  
J
M
PLANE  
D 16 PL  
0°  
7°  
5.80  
0.25  
6.20  
0.50  
0.229 0.244  
0.010 0.019  
M
S
S
0.25 (0.010)  
T
B
A
R
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 966–01  
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
16  
9
8
Q
1
E H  
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
A
DIM MIN  
MAX  
MIN  
---  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
A
---  
2.05  
A
0.05  
0.35  
0.18  
9.90  
5.10  
0.20 0.002  
0.50 0.014  
0.27 0.007  
10.50 0.390  
5.45 0.201  
1
b
c
D
E
e
A
1
b
0.13 (0.005)  
1.27 BSC  
0.050 BSC  
M
0.10 (0.004)  
H
7.40  
0.50  
1.10  
0
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
10  
E
L
L
E
M
Q
10  
0
0.70  
---  
0.90 0.028  
0.78  
0.035  
0.031  
1
Z
---  
MOTOROLA  
254  
Case Outlines  
(continued)  
SD SUFFIX  
PLASTIC SSOP PACKAGE  
CASE 940B–03  
NOTES:  
6
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
7
8
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
ISSUE B  
16X K REF  
M
S
S
0.12 (0.005)  
T U  
V
0.25 (0.010)  
9
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF K DIMENSION AT MAXIMUM  
MATERIAL CONDITION. DAMBAR INTRUSION  
SHALL NOT REDUCE DIMENSION K BY MORE  
THAN 0.07 (0.002) AT LEAST MATERIAL  
CONDITION.  
11 TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
12 DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
16  
9
L/2  
M
N
B
L
F
PIN 1  
IDENT  
1
8
DETAIL E  
K
–U–  
A
–V–  
MILLIMETERS  
DIM MIN MAX  
INCHES  
J
J1  
MIN  
MAX  
0.249  
0.212  
0.078  
0.008  
0.037  
A
B
6.07  
5.20  
1.73  
0.05  
0.63  
6.33 0.238  
5.38 0.205  
1.99 0.068  
0.21 0.002  
0.95 0.024  
M
S
0.20 (0.008)  
T U  
K1  
C
D
F
SECTION N–N  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.73  
0.09  
0.09  
0.25  
0.25  
7.65  
0
0.90 0.028  
0.20 0.003  
0.16 0.003  
0.38 0.010  
0.33 0.010  
7.90 0.301  
0.035  
0.008  
0.006  
0.015  
0.013  
0.311  
8
–W–  
C
0.076 (0.003)  
SEATING  
PLANE  
–T–  
D
G
M
8
0
DETAIL E  
H
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948F–01  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
ISSUE O  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
16X KREF  
M
S
S
0.10 (0.004)  
T U  
V
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
S
0.15 (0.006) T U  
K
K1  
16  
9
2X L/2  
J1  
B
–U–  
SECTION N–N  
6
7
L
J
PIN 1  
IDENT.  
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
8
1
0.25 (0.010)  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
A
B
C
4.90  
4.30  
–––  
5.10 0.193  
4.50 0.169  
1.20  
M
–––  
S
0.15 (0.006) T U  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
A
N
–V–  
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
F
DETAIL E  
6.40 BSC  
0.252 BSC  
0
–W–  
M
0
8
8
C
0.10 (0.004)  
DETAIL E  
H
SEATING  
PLANE  
–T–  
D
G
255  
MOTOROLA  
Case Outlines  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751D–04  
ISSUE E  
-A-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
20  
11  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
-B-  
P 10 PL  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
M
M
0.010 (0.25)  
B
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
1
10  
D 20 PL  
J
MILLIMETERS  
DIM MIN MAX  
12.65 12.95 0.499 0.510  
INCHES  
M
S
S
0.010 (0.25)  
T
A
B
MIN MAX  
A
B
C
D
F
7.40  
2.35  
0.35  
0.50  
7.60 0.292 0.299  
2.65 0.093 0.104  
0.49 0.014 0.019  
0.90 0.020 0.035  
F
R X 45°  
G
J
K
M
P
1.27 BSC  
0.050 BSC  
0.32 0.010 0.012  
0.25 0.004 0.009  
0.25  
0.10  
0°  
C
7°  
0°  
7°  
10.05 10.55 0.395 0.415  
0.25 0.75 0.010 0.029  
-T-  
R
M
SEATING  
PLANE  
K
G 18 PL  
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 967–01  
NOTES:  
ISSUE O  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
20  
11  
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E H  
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
10  
1
DETAIL P  
Z
D
VIEW P  
MILLIMETERS  
INCHES  
e
A
DIM MIN  
MAX  
MIN  
---  
MAX  
0.081  
0.008  
0.020  
0.011  
0.504  
0.215  
c
A
---  
0.05  
0.35  
0.18  
12.35  
5.10  
2.05  
A
0.20 0.002  
0.50 0.014  
0.27 0.007  
12.80 0.486  
5.45 0.201  
1
b
c
D
E
e
A
b
1
1.27 BSC  
0.050 BSC  
M
0.10 (0.004)  
0.13 (0.005)  
H
7.40  
0.50  
1.10  
0
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
10  
E
L
L
E
M
Q
10  
0
0.70  
---  
0.90 0.028  
0.81  
0.035  
0.032  
1
Z
---  
MOTOROLA  
256  
Case Outlines  
(continued)  
SD SUFFIX  
PLASTIC SSOP PACKAGE  
CASE 940C–03  
ISSUE B  
20X K REF  
NOTES:  
6
M
S
S
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
0.12 (0.005)  
T U  
V
0.25 (0.010)  
7
8
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
N
20  
11  
10  
L/2  
M
9
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
B
N
L
F
10 DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF K DIMENSION AT MAXIMUM  
MATERIAL CONDITION. DAMBAR INTRUSION  
SHALL NOT REDUCE DIMENSION K BY MORE  
THAN 0.07 (0.002) AT LEAST MATERIAL  
CONDITION.  
PIN 1  
IDENT  
1
DETAIL E  
–U–  
A
K
–V–  
11 TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
12 DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
M
S
J
0.20 (0.008)  
T U  
J1  
MILLIMETERS  
DIM MIN MAX  
INCHES  
K1  
MIN  
MAX  
0.288  
0.212  
0.078  
0.008  
0.037  
A
B
C
D
F
7.07  
5.20  
1.73  
0.05  
0.63  
7.33 0.278  
5.38 0.205  
1.99 0.068  
0.21 0.002  
0.95 0.024  
SECTION N–N  
–W–  
C
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.076 (0.003)  
0.59  
0.09  
0.09  
0.25  
0.25  
7.65  
0
0.75 0.023  
0.20 0.003  
0.16 0.003  
0.38 0.010  
0.33 0.010  
7.90 0.301  
0.030  
0.008  
0.006  
0.015  
0.013  
0.311  
8
SEATING  
PLANE  
–T–  
D
G
DETAIL E  
H
M
8
0
257  
MOTOROLA  
Case Outlines  
(continued)  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948E–02  
ISSUE A  
20X K REF  
NOTES:  
13 DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.10 (0.004)  
T U  
V
S
0.15 (0.006) T U  
14 CONTROLLING DIMENSION: MILLIMETER.  
15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
16 DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
17 DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
K
K1  
20  
11  
2X L/2  
J J1  
B
L
–U–  
PIN 1  
IDENT  
SECTION N–N  
1
10  
0.25 (0.010)  
18 TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
N
S
19 DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
0.15 (0.006) T U  
M
A
–V–  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
A
B
C
6.40  
4.30  
–––  
6.60 0.252  
4.50 0.169  
1.20  
N
–––  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
F
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
DETAIL E  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
–W–  
C
6.40 BSC  
0.252 BSC  
G
D
M
0
8
0
8
H
DETAIL E  
0.100 (0.004)  
–T– SEATING  
PLANE  
MOTOROLA  
258  
Case Outlines  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751E–04  
ISSUE E  
-A-  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
13  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
-B-  
P 12 PL  
M
M
0.010 (0.25)  
B
1
12  
D 24 PL  
MILLIMETERS  
INCHES  
MIN MAX  
J
F
DIM MIN  
MAX  
M
S
S
0.010 (0.25)  
T
A
B
A
B
C
D
F
G
J
K
M
P
15.25 15.54  
0.601 0.612  
0.292 0.299  
0.093 0.104  
0.014 0.019  
0.016 0.035  
0.050 BSC  
7.40  
2.35  
0.35  
0.41  
7.60  
2.65  
0.49  
0.90  
R X 45°  
1.27 BSC  
0.23  
0.13  
0°  
0.32  
0.29  
8°  
0.009 0.013  
0.005 0.011  
C
0°  
8°  
10.05 10.55  
0.25 0.75  
0.395 0.415  
0.010 0.029  
-T-  
SEATING  
PLANE  
R
M
K
G 22 PL  
SD SUFFIX  
PLASTIC SSOP PACKAGE  
CASE 940D–03  
ISSUE B  
NOTES:  
24X K REF  
20 DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
0.12 (0.005)  
T U  
V
21 CONTROLLING DIMENSION: MILLIMETER.  
22 DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
23 DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
K
J
J1  
L/2  
24  
13  
K1  
B
L
24 DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN  
EXCESS OF K DIMENSION AT MAXIMUM  
MATERIAL CONDITION. DAMBAR INTRUSION  
SHALL NOT REDUCE DIMENSION K BY MORE  
THAN 0.07 (0.002) AT LEAST MATERIAL  
CONDITION.  
SECTION N–N  
PIN 1  
IDENT  
1
12  
0.25 (0.010)  
–U–  
A
–V–  
N
25 TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
26 DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
M
S
0.20 (0.008)  
T U  
M
N
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.328  
0.212  
0.078  
0.008  
0.037  
F
A
B
8.07  
5.20  
1.73  
0.05  
0.63  
8.33 0.317  
5.38 0.205  
1.99 0.068  
0.21 0.002  
0.95 0.024  
DETAIL E  
C
D
F
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.44  
0.09  
0.09  
0.25  
0.25  
7.65  
0
0.60 0.017  
0.20 0.003  
0.16 0.003  
0.38 0.010  
0.33 0.010  
7.90 0.301  
0.024  
0.008  
0.006  
0.015  
0.013  
0.311  
8
–W–  
C
0.076 (0.003)  
SEATING  
PLANE  
–T–  
G
D
DETAIL E  
H
M
8
0
259  
MOTOROLA  
Case Outlines  
(continued)  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948H–01  
ISSUE O  
24X KREF  
M
S
S
0.10 (0.004)  
T U  
V
S
0.15 (0.006) T U  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
24  
13  
2X L/2  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
B
–U–  
L
4
5
PIN 1  
IDENT.  
12  
1
S
0.15 (0.006) T U  
A
–V–  
6
7
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE W.  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.311  
0.177  
0.047  
0.006  
0.030  
C
A
B
C
7.70  
4.30  
–––  
7.90 0.303  
4.50 0.169  
1.20  
–––  
0.10 (0.004)  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
SEATING  
PLANE  
–T–  
G
H
D
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.011  
0.015  
0.008  
0.006  
0.012  
0.010  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
–W–  
6.40 BSC  
0.252 BSC  
M
0
8
0
8
DETAIL E  
N
0.25 (0.010)  
K
K1  
M
N
J1  
F
SECTION N–N  
DETAIL E  
J
MOTOROLA  
260  
Case Outlines  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 1201–01  
ISSUE A  
48X K REF  
K
K1  
NOTES:  
M
S
S
0.12 (0.005)  
T U  
V
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
J
J1  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
48  
25  
SECTION N–N  
B
–U–  
L
N
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
1
24  
6. DIMENSIONS A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
MILLIMETERS  
DIM MIN MAX  
12.40 12.60 0.488 0.496  
INCHES  
MIN MAX  
A
–V–  
PIN 1  
IDENT.  
A
B
N
6.00  
–––  
6.20 0.236 0.244  
1.10 ––– 0.043  
C
M
F
D
F
0.05  
0.50  
0.15 0.002 0.006  
0.75 0.020 0.030  
0.25 (0.010)  
DETAIL E  
G
H
J
J1  
K
K1  
L
0.50 BSC  
0.0197 BSC  
0.37  
0.09  
0.09  
0.17  
0.17  
7.95  
0
––– 0.015 –––  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.27 0.007  
0.23 0.007 0.009  
8.25 0.313 0.325  
D
0.011  
C
–W–  
0.076 (0.003)  
M
8
0
8
DETAIL E  
–T–  
SEATING  
PLANE  
H
G
261  
MOTOROLA  
Case Outlines  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 1202–01  
ISSUE A  
56X K REF  
K
K1  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
M
S
S
0.12 (0.005)  
T U  
V
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS OR GATE  
BURRS. MOLD FLASH OR GATE BURRS  
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL  
IN EXCESS OF THE K DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
J
J1  
56  
29  
28  
SECTION N–N  
B
L
–U–  
N
1
6. DIMENSIONS A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.555  
0.244  
0.043  
0.006  
0.030  
A
–V–  
PIN 1  
A
B
C
13.90  
6.00  
–––  
14.10 0.547  
6.20 0.236  
1.10  
IDENT.  
N
–––  
D
F
0.05  
0.50  
0.15 0.002  
0.75 0.020  
F
M
G
H
J
J1  
K
K1  
L
0.50 BSC  
0.0197 BSC  
0.12  
0.09  
0.09  
0.17  
0.17  
7.95  
0
––– 0.005  
0.20 0.004  
0.16 0.004  
0.27 0.007  
0.23 0.007  
8.25 0.313  
–––  
0.008  
0.006  
0.011  
0.009  
0.325  
8
0.25 (0.010)  
DETAIL E  
D
C
–W–  
M
8
0
0.076 (0.003)  
DETAIL E  
–T–  
SEATING  
PLANE  
H
G
MOTOROLA  
262  

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