MC74LCX257DTR [ONSEMI]

IC LVC/LCX/Z SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, TSSOP-16, Multiplexer/Demultiplexer;
MC74LCX257DTR
型号: MC74LCX257DTR
厂家: ONSEMI    ONSEMI
描述:

IC LVC/LCX/Z SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, TSSOP-16, Multiplexer/Demultiplexer

光电二极管 输出元件 逻辑集成电路
文件: 总8页 (文件大小:82K)
中文:  中文翻译
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MC74LCX257  
Low-Voltage CMOS Quad  
2-Input Multiplexer  
With 5.0 V–Tolerant Inputs and Outputs  
(3–State, Non–Inverting)  
http://onsemi.com  
MARKING DIAGRAMS  
The MC74LCX257 is a high performance, quad 2–input  
multiplexer with 3–state outputs operating from a 2.3 to 3.6 V supply.  
High impedance TTL compatible inputs significantly reduce current  
loading to input drivers while TTL compatible outputs offer improved  
9
16  
SO–16  
D SUFFIX  
CASE 751B  
switching noise performance. A V specification of 5.5 V allows  
LCX257  
AWLYWW  
I
MC74LCX257 inputs to be safely driven from 5.0 V devices.  
Four bits of data from two sources can be selected using the Select  
input. The four outputs present the selected data in the true  
(non–inverted) form. The outputs may be switched to a high  
impedance state by placing a logic HIGH on the Output Enable (OE)  
input. Current drive capability is 24 mA at the outputs.  
1
8
9
16  
LCX  
257  
TSSOP–16  
DT SUFFIX  
CASE 948F  
Designed for 2.3 to 3.6 V V Operation  
ALYW  
CC  
5.0 V Tolerant – Interface Capability with 5.0 V TTL Logic  
Supports Live Insertion and Withdrawal  
8
1
I  
Specification Guarantees High Impedance When V = 0 V  
OFF  
CC  
9
16  
LVTTL Compatible  
LVCMOS Compatible  
24 mA Balanced Output Sink and Source Capability  
LCX257  
ALYW  
EIAJ SO–16  
M SUFFIX  
CASE 966  
8
1
Near Zero Static Supply Current in All Three Logic States (10 µA)  
Substantially Reduces System Power Requirements  
Latchup Performance Exceeds 500 mA  
A
L, WL  
Y
= Assembly Location  
= Wafer Lot  
= Year  
ESD Performance: Human Body Model >2000 V;  
Machine Model >200 V  
W, WW = Work Week  
ORDERING INFORMATION  
Device  
Package  
SO–16  
Shipping  
MC74LCX257D  
48 Units/Rail  
MC74LCX257DR2  
MC74LCX257DT  
MC74LCX257DTR  
SO–16  
2500 Units/Reel  
96 Units/Rail  
TSSOP–16  
TSSOP–16 2500 Units/Reel  
MC74LCX158DTR2 TSSOP–16 2500 Units/Reel  
EIAJ  
SO–16  
MC74LCX257M  
48 Units/Rail  
EIAJ  
SO–16  
MC74LCX257MEL  
2000 Units/Reel  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
April, 2001 – Rev. 2  
MC74LCX257/D  
MC74LCX257  
I0c I1c  
Zc  
I0d  
I1d  
2
V
OE  
Zd  
CC  
4
I0a  
Za  
Zb  
Zc  
Zd  
16  
15  
14  
13  
12  
11  
10  
9
3
I1a  
5
7
I0b  
6
I1b  
14  
12  
9
I0c  
1
2
3
4
5
6
7
8
I1a  
I1b  
13  
I0a  
S
Za I0b  
Zb GND  
I1c  
Figure 1. Pinout: 16–Lead Plastic Package  
11  
I0d  
(Top View)  
10  
I1d  
15  
OE  
1
S
Figure 2. Logic Diagram  
PIN NAMES  
Pins  
Function  
Source 0 Data Inputs  
Source 1 Data Inputs  
Output Enable Input  
Select Input  
l0n  
l1n  
OE  
S
Zn  
Outputs  
TRUTH TABLE  
Inputs  
Outputs  
OE  
H
L
S
X
H
H
L
l0n  
X
l1n  
X
Zn  
Z
X
L
L
L
X
H
X
H
L
L
L
L
L
H
X
H
H = High Voltage Level  
L
X
Z
=
=
=
Low Voltage Level  
High or Low Voltage Level and Transitions are Acceptable  
High Impedance State  
For ICC reasons, DO NOT FLOAT Inputs  
http://onsemi.com  
2
MC74LCX257  
ABSOLUTE MAXIMUM RATINGS*  
Symbol  
Parameter  
DC Supply Voltage  
Value  
Condition  
Unit  
V
V
V
V
–0.5 to +7.0  
CC  
I
DC Input Voltage  
–0.5 V +7.0  
V
I
DC Output Voltage  
–0.5 V +7.0  
Output in 3–State  
V
O
I
–0.5 V V + 0.5  
Output in HIGH or LOW State (Note 1.)  
V
O
CC  
I
I
DC Input Diode Current  
DC Output Diode Current  
–50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
–50  
+50  
V < GND  
O
OK  
V
O
> V  
CC  
I
I
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
±50  
O
±100  
±100  
CC  
GND  
T
–65 to +150  
STG  
*Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or  
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions  
is not implied.  
1. I absolute maximum rating must be observed.  
O
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Type  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
2.0  
1.5  
2.5, 3.3  
2.5, 3.3  
3.6  
3.6  
V
V
V
Input Voltage  
0
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
(3–State)  
0
0
V
CC  
5.5  
O
I
HIGH Level Output Current  
LOW Level Output Current  
V
V
V
= 3.0 V – 3.6 V  
= 2.7 V – 3.0 V  
= 2.3 V – 2.7 V  
–24  
–12  
–8  
mA  
mA  
OH  
CC  
CC  
CC  
I
OL  
V
CC  
V
CC  
V
CC  
= 3.0 V – 3.6 V  
= 2.7 V – 3.0 V  
= 2.3 V – 2.7 V  
+24  
+12  
+8  
T
Operating Free–Air Temperature  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V,  
–40  
0
+85  
10  
°C  
A
t/V  
ns/V  
IN  
V
CC  
= 3.0 V  
http://onsemi.com  
3
MC74LCX257  
DC ELECTRICAL CHARACTERISTICS  
T
A
= –40°C to +85°C  
Symbol  
Characteristic  
Condition  
Min  
1.7  
2.0  
Max  
Unit  
V
V
V
HIGH Level Input Voltage (Note 2.)  
2.3 V V 2.7 V  
V
IH  
CC  
2.7 V V 3.6 V  
CC  
LOW Level Input Voltage (Note 2.)  
HIGH Level Output Voltage  
2.3 V V 2.7 V  
0.7  
0.8  
V
V
IL  
CC  
2.7 V V 3.6 V  
CC  
2.3 V V 3.6 V; I = –100 µA  
V
– 0.2  
OH  
CC  
OH  
CC  
V
= 2.3 V; I = –8 mA  
1.8  
2.2  
2.4  
2.2  
CC  
OH  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = –12 mA  
OH  
= 3.0 V; I = –18 mA  
OH  
= 3.0 V; I = –24 mA  
OH  
V
LOW Level Output Voltage  
2.3 V V 3.6 V; I = 100 µA  
0.2  
0.6  
0.4  
0.4  
0.55  
±5  
V
OL  
CC  
OL  
V
CC  
= 2.3 V; I = 8 mA  
OL  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = 12 mA  
OL  
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
I
Input Leakage Current  
3–State Output Current  
2.3 V V 3.6 V; 0 V V 5.5 V  
µA  
µA  
I
CC  
I
2.3 V 3.6 V; 0 V V 5.5 V;  
±5  
OZ  
CC  
O
V = V or V  
IL  
I
IH  
I
I
Power–Off Leakage Current  
Quiescent Supply Current  
V
= 0 V; V or V = 5.5 V  
10  
10  
µA  
µA  
OFF  
CC  
I
O
2.3 V 3.6 V; V = GND or V  
CC  
CC  
CC  
I
2.3 V 3.6 V; 3.6 V or V 5.5 V  
±10  
500  
CC  
I
O
I  
CC  
Increase in I per Input  
2.3 V 3.6 V; V = V – 0.6 V  
µA  
CC  
CC  
IH  
CC  
2. These values of V are used to test DC electrical characteristics only.  
I
AC CHARACTERISTICS t = t = 2.5 ns; R = 500 Ω  
R
F
L
Limits  
= –40°C to +85°C  
T
A
V
CC  
= 3.3 V ± 0.3 V  
V
CC  
= 2.7 V  
V
CC  
= 2.5 V ± 0.2 V  
C = 50 pF  
L
C = 50 pF  
L
C = 30 pF  
L
Symbol  
Parameter  
Propagation Delay  
In to Zn  
Waveform  
Min  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
Max  
6.0  
6.0  
7.0  
7.0  
7.0  
7.0  
5.5  
5.5  
1.0  
1.0  
Min  
Max  
6.5  
6.5  
8.5  
8.5  
8.5  
8.5  
6.0  
6.0  
Min  
Max  
7.2  
7.2  
9.1  
9.1  
9.1  
9.1  
6.6  
6.6  
Unit  
t
t
t
t
t
t
t
t
t
t
1
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
ns  
PLH  
PHL  
PLH  
PHL  
PZH  
PZL  
Propagation Delay  
S to Zn  
1, 2  
3
ns  
ns  
ns  
ns  
Output Enable Time to  
High and Low Level  
Output Disable Time From  
High and Low Level  
Output–to–Output Skew  
(Note 3.)  
3
PHZ  
PLZ  
OSHL  
OSLH  
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t  
guaranteed by design.  
) or LOW–to–HIGH (t  
); parameter  
OSHL  
OSLH  
http://onsemi.com  
4
MC74LCX257  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25°C  
Typ  
Symbol  
Characteristic  
Dynamic LOW Peak Voltage  
(Note 4.)  
Condition  
Min  
Max  
Unit  
V
V
OLP  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
0.8  
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
0.6  
V
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage  
(Note 4.)  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
–0.8  
–0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
V
L
IH  
IL  
4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Unit  
pF  
C
C
C
V
V
7
8
IN  
CC  
I
CC  
CC  
Input/Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
I/O  
PD  
CC  
I
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
CC  
25  
pF  
CC  
I
http://onsemi.com  
5
MC74LCX257  
V
CC  
V
CC  
Vmi  
Vmi  
Vmi  
Vmi  
In, S  
S
0V  
V
0V  
t
t
t
t
PHL  
PLH  
PHL  
PLH  
V
OH  
OH  
Vmo  
Vmo  
Vmo  
Vmo  
Zn  
Zn  
V
OL  
V
OL  
WAVEFORM 1 – NON–INVERTING PROPAGATION DELAYS  
= t = 2.5 ns, 10% to 90%; f = 1.0 MHz; t = 500 ns  
WAVEFORM 2 – INVERTING PROPAGATION DELAYS  
= t = 2.5 ns, 10% to 90%; f = 1.0 MHz; t = 500 ns  
t
R
t
R
F
W
F
W
V
CC  
Vmi  
Vmi  
OE  
0V  
t
t
t
t
PZH  
PHZ  
V
V
CC  
OH  
– 0.3V  
Vmo  
Vmo  
Zn  
0V  
PZL  
PLZ  
3.0V  
Zn  
V
OL  
+ 0.3V  
GND  
WAVEFORM 3 – OUTPUT ENABLE AND DISABLE TIMES  
t
R
= t = 2.5 ns, 10% to 90%; f = 1.0 MHz; t = 500 ns  
F W  
Vcc  
2.7 V  
1.5 V  
1.5 V  
Symbol  
Vmi  
3.3 V + 0.3 V  
1.5 V  
2.5 V + 0.2 V  
Vcc/2  
Vmo  
1.5 V  
Vcc/2  
V
HZ  
V
LZ  
V
+ 0.3 V  
– 0.3 V  
V
+ 0.3 V  
V
+ 0.15 V  
– 0.15 V  
OL  
OL  
OL  
V
OH  
V
OH  
– 0.3 V  
V
OH  
Figure 3. AC Waveforms  
http://onsemi.com  
6
MC74LCX257  
PACKAGE DIMENSIONS  
SO–16  
D SUFFIX  
CASE 751B–05  
ISSUE J  
–A–  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
16  
9
8
–B–  
P 8 PL  
M
S
B
0.25 (0.010)  
1
G
MILLIMETERS  
INCHES  
MIN  
0.386  
DIM MIN  
MAX  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00  
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
F
R X 45  
K
_
C
G
J
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
–T–  
SEATING  
PLANE  
K
M
P
R
J
M
7
0
_
_
_
_
D
16 PL  
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
M
S
S
A
0.25 (0.010)  
T
B
TSSOP–16  
DT SUFFIX  
CASE 948F–01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982..  
16X KREF  
M
S
S
0.10 (0.004)  
T
U
V
2. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.CONTROLLING DIMENSION:  
MILLIMETER.  
S
U
0.15 (0.006) T  
K
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
K1  
16  
9
2X L/2  
J1  
B
SECTION N–N  
L
–U–  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE -W-.  
J
PIN 1  
IDENT.  
8
1
N
0.25 (0.010)  
S
0.15 (0.006) T  
U
A
M
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
–V–  
A
B
4.90  
4.30  
---  
5.10 0.193  
4.50 0.169  
N
C
1.20  
---  
F
D
0.05  
0.50  
0.15 0.002  
0.75 0.020  
F
G
H
0.65 BSC  
0.026 BSC  
DETAIL E  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007  
0.20 0.004  
0.16 0.004  
0.30 0.007  
0.25 0.007  
0.011  
0.008  
0.006  
0.012  
0.010  
J
J1  
K
–W–  
C
K1  
L
6.40 BSC  
_
0.252 BSC  
0
M
0
8
8
_
_
_
0.10 (0.004)  
H
DETAIL E  
SEATING  
PLANE  
–T–  
D
G
http://onsemi.com  
7
MC74LCX257  
PACKAGE DIMENSIONS  
SOIC EIAJ–16  
M SUFFIX  
CASE 966–01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
16  
9
L
E
Q
1
H
E
M
_
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
1
8
L
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
MIN  
---  
A
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
A
---  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
A
1
0.20 0.002  
0.50 0.014  
0.27 0.007  
b
c
D
E
10.50 0.390  
5.45 0.201  
A
1
b
0.13 (0.005)  
e
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
M
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
0
10  
0.90 0.028  
10  
_
0.035  
0.031  
M
Q
0
_
_
_
0.70  
---  
1
Z
0.78  
---  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
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For additional information, please contact your local  
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MC74LCX257/D  

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