MC74LCX32SDR2 [ONSEMI]

LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, SSOP-14;
MC74LCX32SDR2
型号: MC74LCX32SDR2
厂家: ONSEMI    ONSEMI
描述:

LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, SSOP-14

输入元件 光电二极管 逻辑集成电路
文件: 总7页 (文件大小:141K)
中文:  中文翻译
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MC74LCX32  
Low-Voltage CMOS Quad  
2-Input OR Gate  
With 5 VTolerant Inputs  
The MC74LCX32 is a high performance, quad 2input OR gate  
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible  
inputs significantly reduce current loading to input drivers while TTL  
http://onsemi.com  
MARKING  
DIAGRAMS  
compatible outputs offer improved switching noise performance. A V  
I
specification of 5.5 V allows MC74LCX32 inputs to be safely driven  
from 5.0 V devices.  
Current drive capability is 24 mA at the outputs.  
14  
SOIC14  
D SUFFIX  
CASE 751A  
LCX32G  
AWLYWW  
14  
14  
Features  
1
1
Designed for 2.3 V to 3.6 V V Operation  
CC  
5.0 V Tolerant Inputs Interface Capability With 5.0 V TTL Logic  
LVTTL Compatible  
LVCMOS Compatible  
24 mA Balanced Output Sink and Source Capability  
14  
TSSOP14  
DT SUFFIX  
CASE 948G  
LCX  
32  
ALYWG  
1
G
1
Near Zero Static Supply Current (10 mA) Substantially Reduces  
System Power Requirements  
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
Latchup Performance Exceeds 500 mA  
ESD Performance:  
Human Body Model >2000 V  
Machine Model >200 V  
W, WW = Work Week  
G or G  
= PbFree Package  
NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AECQ100  
Qualified and PPAP Capable  
(Note: Microdot may be in either location)  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
October, 2012 Rev. 8  
MC74LCX32/D  
MC74LCX32  
1
V
A2  
13  
B2  
12  
O2  
11  
A3  
10  
B3  
9
O3  
8
A0  
CC  
3
6
O0  
O1  
O2  
O3  
2
4
14  
B0  
A1  
5
B1  
A2  
13  
11  
8
12  
10  
9
B2  
A3  
B3  
1
2
3
4
5
6
7
A0  
B0  
O0  
A1  
B1  
O1 GND  
Figure 1. Pinout: 14Lead (Top View)  
Figure 2. Logic Diagram  
PIN NAMES  
TRUTH TABLE  
Inputs  
Pins  
Function  
Data Inputs  
Outputs  
An, Bn  
On  
An  
L
Bn  
L
On  
L
Outputs  
L
H
L
H
H
H
H
H
H
H = High Voltage Level  
L = Low Voltage Level  
For I reasons, DO NOT FLOAT Inputs  
CC  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Condition  
Units  
V
V
CC  
DC Supply Voltage  
0.5 to +7.0  
V
I
DC Input Voltage  
0.5 V +7.0  
V
I
V
O
DC Output Voltage  
0.5 V V + 0.5  
Output in HIGH or LOW State.(Note 1)  
V
O
CC  
I
DC Input Diode Current  
DC Output Diode Current  
50  
V < GND  
mA  
mA  
mA  
mA  
mA  
mA  
C  
IK  
I
I
50  
+50  
V < GND  
O
OK  
V
O
> V  
CC  
I
DC Output Source/Sink Current  
DC Supply Current Per Supply Pin  
DC Ground Current Per Ground Pin  
Storage Temperature Range  
Moisture Sensitivity  
50  
O
I
100  
100  
CC  
I
GND  
T
65 to +150  
STG  
MSL  
Level 1  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. I absolute maximum rating must be observed.  
O
http://onsemi.com  
2
 
MC74LCX32  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Type  
Max  
Units  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
V
2.0  
1.5  
2.5, 3.3  
2.5, 3.3  
3.6  
3.6  
V
Input Voltage  
0
0
5.5  
V
V
I
V
O
Output Voltage (HIGH or LOW State) (3State)  
V
CC  
I
HIGH Level Output Current  
mA  
OH  
V
CC  
V
CC  
V
CC  
= 3.0 V 3.6 V  
= 2.7 V 3.0 V  
= 2.3 V 2.7 V  
24  
12  
8  
I
OL  
LOW Level Output Current  
mA  
V
CC  
V
CC  
V
CC  
= 3.0 V 3.6 V  
= 2.7 V 3.0 V  
= 2.3 V 2.7 V  
+24  
+12  
+8  
T
Operating FreeAir Temperature  
40  
+85  
10  
C  
A
Dt/DV  
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V  
0
ns/V  
IN  
CC  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 40C to +85C  
Symbol  
Characteristic  
Condition  
Min  
1.7  
2.0  
Max  
Units  
V
IH  
HIGH Level Input Voltage (Note 1.)  
2.3 V V 2.7 V  
V
CC  
2.7 V V 3.6 V  
CC  
V
LOW Level Input Voltage (Note 1.)  
HIGH Level Output Voltage  
2.3 V V 2.7 V  
0.7  
0.8  
V
V
IL  
CC  
2.7 V V 3.6 V  
CC  
V
OH  
2.3 V V 3.6 V; I = 100 mA  
V
CC  
0.2  
CC  
OH  
V
= 2.3 V; I = 8 mA  
1.8  
2.2  
2.4  
2.2  
CC  
OH  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = 12 mA  
OH  
= 3.0 V; I = 18 mA  
OH  
= 3.0 V; I = 24 mA  
OH  
V
LOW Level Output Voltage  
2.3 V V 3.6 V; I = 100 mA  
0.2  
0.6  
0.4  
0.4  
0.55  
10  
V
OL  
CC  
OL  
V
CC  
= 2.3 V; I = 8 mA  
OL  
V
CC  
V
CC  
V
CC  
= 2.7 V; I = 12 mA  
OL  
= 3.0 V; I = 16 mA  
OL  
= 3.0 V; I = 24 mA  
OL  
I
Power Off Leakage Current  
Input Leakage Current  
V
= 0, V = 5.5 V or V = 5.5 V  
OUT  
mA  
mA  
mA  
mA  
OFF  
CC  
IN  
I
IN  
V
CC  
V
CC  
= 3.6 V, V = 5.5 V or GND  
5  
IN  
I
Quiescent Supply Current  
= 3.6 V, V = 5.5 V or GND  
10  
CC  
IN  
DI  
Increase in I per Input  
2.3 V 3.6 V; V = V 0.6 V  
500  
CC  
CC  
CC  
IH  
CC  
1. These values of V are used to test DC electrical characteristics only.  
I
http://onsemi.com  
3
 
MC74LCX32  
AC CHARACTERISTICS (t = t = 2.5 ns; R = 500 W)  
R
F
L
Limits  
T
A
= 40C to +85C  
V
CC  
= 3.3 V 0.3 V  
V
CC  
= 2.7 V  
V
CC  
= 2.5 V 0.2 V  
C = 50 pF  
L
C = 50 pF  
L
C = 30 pF  
L
Symbol  
Parameter  
Waveform  
Min  
Max  
Min  
Max  
Min  
Max  
Units  
t
t
Propagation Delay Time  
Input to Output  
1
1.5  
1.5  
5.5  
5.5  
1.5  
1.5  
6.2  
6.2  
1.5  
1.5  
6.6  
6.6  
ns  
PLH  
PHL  
t
t
OutputtoOutput Skew  
(Note 2)  
1.0  
1.0  
ns  
OSHL  
OSLH  
2. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGHtoLOW (t  
) or LOWtoHIGH (t  
); parameter  
OSHL  
OSLH  
guaranteed by design.  
DYNAMIC SWITCHING CHARACTERISTICS  
T
A
= +25C  
Symbol  
Characteristic  
Condition  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
Min  
Typ  
Max  
Units  
V
OLP  
Dynamic LOW Peak Voltage  
(Note 3)  
V
CC  
V
CC  
0.8  
0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
V
OLV  
Dynamic LOW Valley Voltage  
(Note 3)  
V
CC  
V
CC  
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V  
0.8  
0.6  
V
L
IH  
IL  
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V  
L
IH  
IL  
3. Number of outputs defined as “n”. Measured with “n1” outputs switching from HIGHtoLOW or LOWtoHIGH. The remaining output is  
measured in the LOW state.  
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Condition  
= 3.3 V, V = 0 V or V  
Typical  
Units  
pF  
C
V
V
7
8
IN  
CC  
I
CC  
CC  
C
Output Capacitance  
= 3.3 V, V = 0 V or V  
pF  
OUT  
CC  
I
C
Power Dissipation Capacitance  
10 MHz, V = 3.3 V, V = 0 V or V  
CC  
25  
pF  
PD  
CC  
I
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74LCX32DR2G  
SOIC14  
(PbFree)  
2500 Tape & Reel  
96 Units / Rail  
MC74LCX32DTG  
TSSOP14  
(PbFree)  
MC74LCX32DTR2G  
NLV74LCX32DTR2G*  
TSSOP14  
(PbFree)  
2500 Tape & Reel  
2500 Tape & Reel  
TSSOP14  
(PbFree)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP  
Capable.  
http://onsemi.com  
4
 
MC74LCX32  
V
CC  
Vmi  
Vmi  
An, Bn  
0 V  
t
t
PLH  
PHL  
V
OH  
OL  
Vmo  
Vmo  
On  
V
WAVEFORM 1 PROPAGATION DELAYS  
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
t
R
F
W
Vcc  
2.7 V  
1.5 V  
1.5 V  
Symbol  
Vmi  
3.3 V + 0.3 V  
1.5 V  
2.5 V + 0.2 V  
Vcc/2  
Vmo  
1.5 V  
Vcc/2  
Figure 3. AC Waveforms  
V
CC  
PULSE  
GENERATOR  
DUT  
R
T
C
R
L
L
C = 50 pF at V = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)  
L
CC  
C = 30 pF at V = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)  
L
CC  
R = R = 500 W or equivalent  
L
1
R = Z  
of pulse generator (typically 50 W)  
T
OUT  
Figure 4. Test Circuit  
http://onsemi.com  
5
MC74LCX32  
PACKAGE DIMENSIONS  
TSSOP14  
CASE 948G  
ISSUE B  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
8
2X L/2  
M
B
L
N
U−  
PIN 1  
IDENT.  
F
7
1
DETAIL E  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
S
K
0.15 (0.006) T U  
A
V−  
K1  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
G
H
J
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION NN  
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
W−  
C
J1  
K
K1 0.19  
0.10 (0.004)  
L
M
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
T−  
H
G
0
8
0
8
DETAIL E  
_
_
_
_
D
SOLDERING FOOTPRINT*  
7.06  
1
0.65  
PITCH  
01.34X6  
14X  
1.26  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
MC74LCX32  
PACKAGE DIMENSIONS  
SOIC14 NB  
CASE 751A03  
ISSUE K  
NOTES:  
D
A
B
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE PROTRUSION  
SHALL BE 0.13 TOTAL IN EXCESS OF AT  
MAXIMUM MATERIAL CONDITION.  
4. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD PROTRUSIONS.  
14  
8
7
A3  
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER  
SIDE.  
L
DETAIL A  
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
13X b  
M
M
B
0.25  
A
A1  
A3  
b
D
E
1.35  
0.10  
0.19  
0.35  
8.55  
3.80  
1.75 0.054 0.068  
0.25 0.004 0.010  
0.25 0.008 0.010  
0.49 0.014 0.019  
8.75 0.337 0.344  
4.00 0.150 0.157  
M
S
S
0.25  
C A  
B
DETAIL A  
h
A
X 45  
_
e
H
h
L
1.27 BSC  
0.050 BSC  
6.20 0.228 0.244  
0.50 0.010 0.019  
1.25 0.016 0.049  
5.80  
0.25  
0.40  
0
M
A1  
e
M
7
0
7
_
_
_
_
SEATING  
PLANE  
C
SOLDERING FOOTPRINT*  
6.50  
14X  
1.18  
1
1.27  
PITCH  
14X  
0.58  
DIMENSIONS: MILLIMETERS  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,  
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. SCILLC  
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any  
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without  
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications  
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC  
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where  
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,  
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture  
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
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Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC74LCX32/D  

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