MC74LCX32SDR2 [ONSEMI]
LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, SSOP-14;型号: | MC74LCX32SDR2 |
厂家: | ONSEMI |
描述: | LVC/LCX/Z SERIES, QUAD 2-INPUT OR GATE, PDSO14, PLASTIC, SSOP-14 输入元件 光电二极管 逻辑集成电路 |
文件: | 总7页 (文件大小:141K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MC74LCX32
Low-Voltage CMOS Quad
2-Input OR Gate
With 5 V−Tolerant Inputs
The MC74LCX32 is a high performance, quad 2−input OR gate
operating from a 2.3 to 3.6 V supply. High impedance TTL compatible
inputs significantly reduce current loading to input drivers while TTL
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MARKING
DIAGRAMS
compatible outputs offer improved switching noise performance. A V
I
specification of 5.5 V allows MC74LCX32 inputs to be safely driven
from 5.0 V devices.
Current drive capability is 24 mA at the outputs.
14
SOIC−14
D SUFFIX
CASE 751A
LCX32G
AWLYWW
14
14
Features
1
1
Designed for 2.3 V to 3.6 V V Operation
CC
5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic
LVTTL Compatible
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
14
TSSOP−14
DT SUFFIX
CASE 948G
LCX
32
ALYWG
1
G
1
Near Zero Static Supply Current (10 mA) Substantially Reduces
System Power Requirements
A
L, WL
Y, YY
= Assembly Location
= Wafer Lot
= Year
Latchup Performance Exceeds 500 mA
ESD Performance:
Human Body Model >2000 V
Machine Model >200 V
W, WW = Work Week
G or G
= Pb−Free Package
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
(Note: Microdot may be in either location)
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
October, 2012 − Rev. 8
MC74LCX32/D
MC74LCX32
1
V
A2
13
B2
12
O2
11
A3
10
B3
9
O3
8
A0
CC
3
6
O0
O1
O2
O3
2
4
14
B0
A1
5
B1
A2
13
11
8
12
10
9
B2
A3
B3
1
2
3
4
5
6
7
A0
B0
O0
A1
B1
O1 GND
Figure 1. Pinout: 14−Lead (Top View)
Figure 2. Logic Diagram
PIN NAMES
TRUTH TABLE
Inputs
Pins
Function
Data Inputs
Outputs
An, Bn
On
An
L
Bn
L
On
L
Outputs
L
H
L
H
H
H
H
H
H
H = High Voltage Level
L = Low Voltage Level
For I reasons, DO NOT FLOAT Inputs
CC
MAXIMUM RATINGS
Symbol
Parameter
Value
Condition
Units
V
V
CC
DC Supply Voltage
−0.5 to +7.0
V
I
DC Input Voltage
−0.5 V +7.0
V
I
V
O
DC Output Voltage
−0.5 V V + 0.5
Output in HIGH or LOW State.(Note 1)
V
O
CC
I
DC Input Diode Current
DC Output Diode Current
−50
V < GND
mA
mA
mA
mA
mA
mA
C
IK
I
I
−50
+50
V < GND
O
OK
V
O
> V
CC
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
Moisture Sensitivity
50
O
I
100
100
CC
I
GND
T
−65 to +150
STG
MSL
Level 1
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. I absolute maximum rating must be observed.
O
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2
MC74LCX32
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Type
Max
Units
V
CC
Supply Voltage
Operating
Data Retention Only
V
2.0
1.5
2.5, 3.3
2.5, 3.3
3.6
3.6
V
Input Voltage
0
0
5.5
V
V
I
V
O
Output Voltage (HIGH or LOW State) (3−State)
V
CC
I
HIGH Level Output Current
mA
OH
V
CC
V
CC
V
CC
= 3.0 V − 3.6 V
= 2.7 V − 3.0 V
= 2.3 V − 2.7 V
−24
−12
−8
I
OL
LOW Level Output Current
mA
V
CC
V
CC
V
CC
= 3.0 V − 3.6 V
= 2.7 V − 3.0 V
= 2.3 V − 2.7 V
+24
+12
+8
T
Operating Free−Air Temperature
−40
+85
10
C
A
Dt/DV
Input Transition Rise or Fall Rate, V from 0.8 V to 2.0 V, V = 3.0 V
0
ns/V
IN
CC
DC ELECTRICAL CHARACTERISTICS
T
A
= −40C to +85C
Symbol
Characteristic
Condition
Min
1.7
2.0
Max
Units
V
IH
HIGH Level Input Voltage (Note 1.)
2.3 V V 2.7 V
V
CC
2.7 V V 3.6 V
CC
V
LOW Level Input Voltage (Note 1.)
HIGH Level Output Voltage
2.3 V V 2.7 V
0.7
0.8
V
V
IL
CC
2.7 V V 3.6 V
CC
V
OH
2.3 V V 3.6 V; I = −100 mA
V
CC
− 0.2
CC
OH
V
= 2.3 V; I = −8 mA
1.8
2.2
2.4
2.2
CC
OH
V
CC
V
CC
V
CC
= 2.7 V; I = −12 mA
OH
= 3.0 V; I = −18 mA
OH
= 3.0 V; I = −24 mA
OH
V
LOW Level Output Voltage
2.3 V V 3.6 V; I = 100 mA
0.2
0.6
0.4
0.4
0.55
10
V
OL
CC
OL
V
CC
= 2.3 V; I = 8 mA
OL
V
CC
V
CC
V
CC
= 2.7 V; I = 12 mA
OL
= 3.0 V; I = 16 mA
OL
= 3.0 V; I = 24 mA
OL
I
Power Off Leakage Current
Input Leakage Current
V
= 0, V = 5.5 V or V = 5.5 V
OUT
mA
mA
mA
mA
OFF
CC
IN
I
IN
V
CC
V
CC
= 3.6 V, V = 5.5 V or GND
5
IN
I
Quiescent Supply Current
= 3.6 V, V = 5.5 V or GND
10
CC
IN
DI
Increase in I per Input
2.3 V 3.6 V; V = V − 0.6 V
500
CC
CC
CC
IH
CC
1. These values of V are used to test DC electrical characteristics only.
I
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3
MC74LCX32
AC CHARACTERISTICS (t = t = 2.5 ns; R = 500 W)
R
F
L
Limits
T
A
= −40C to +85C
V
CC
= 3.3 V 0.3 V
V
CC
= 2.7 V
V
CC
= 2.5 V 0.2 V
C = 50 pF
L
C = 50 pF
L
C = 30 pF
L
Symbol
Parameter
Waveform
Min
Max
Min
Max
Min
Max
Units
t
t
Propagation Delay Time
Input to Output
1
1.5
1.5
5.5
5.5
1.5
1.5
6.2
6.2
1.5
1.5
6.6
6.6
ns
PLH
PHL
t
t
Output−to−Output Skew
(Note 2)
1.0
1.0
ns
OSHL
OSLH
2. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
) or LOW−to−HIGH (t
); parameter
OSHL
OSLH
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25C
Symbol
Characteristic
Condition
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
Min
Typ
Max
Units
V
OLP
Dynamic LOW Peak Voltage
(Note 3)
V
CC
V
CC
0.8
0.6
V
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
L
IH
IL
V
OLV
Dynamic LOW Valley Voltage
(Note 3)
V
CC
V
CC
= 3.3 V, C = 50 pF, V = 3.3 V, V = 0 V
−0.8
−0.6
V
L
IH
IL
= 2.5 V, C = 30 pF, V = 2.5 V, V = 0 V
L
IH
IL
3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Condition
= 3.3 V, V = 0 V or V
Typical
Units
pF
C
V
V
7
8
IN
CC
I
CC
CC
C
Output Capacitance
= 3.3 V, V = 0 V or V
pF
OUT
CC
I
C
Power Dissipation Capacitance
10 MHz, V = 3.3 V, V = 0 V or V
CC
25
pF
PD
CC
I
ORDERING INFORMATION
Device
†
Package
Shipping
MC74LCX32DR2G
SOIC−14
(Pb−Free)
2500 Tape & Reel
96 Units / Rail
MC74LCX32DTG
TSSOP−14
(Pb−Free)
MC74LCX32DTR2G
NLV74LCX32DTR2G*
TSSOP−14
(Pb−Free)
2500 Tape & Reel
2500 Tape & Reel
TSSOP−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
MC74LCX32
V
CC
Vmi
Vmi
An, Bn
0 V
t
t
PLH
PHL
V
OH
OL
Vmo
Vmo
On
V
WAVEFORM 1 − PROPAGATION DELAYS
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns
t
R
F
W
Vcc
2.7 V
1.5 V
1.5 V
Symbol
Vmi
3.3 V + 0.3 V
1.5 V
2.5 V + 0.2 V
Vcc/2
Vmo
1.5 V
Vcc/2
Figure 3. AC Waveforms
V
CC
PULSE
GENERATOR
DUT
R
T
C
R
L
L
C = 50 pF at V = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)
L
CC
C = 30 pF at V = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)
L
CC
R = R = 500 W or equivalent
L
1
R = Z
of pulse generator (typically 50 W)
T
OUT
Figure 4. Test Circuit
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5
MC74LCX32
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T U
A
−V−
K1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
−W−
C
J1
K
K1 0.19
0.10 (0.004)
L
M
6.40 BSC
0.252 BSC
SEATING
PLANE
−T−
H
G
0
8
0
8
DETAIL E
_
_
_
_
D
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MC74LCX32
PACKAGE DIMENSIONS
SOIC−14 NB
CASE 751A−03
ISSUE K
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
14
8
7
A3
E
H
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
L
DETAIL A
1
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
13X b
M
M
B
0.25
A
A1
A3
b
D
E
1.35
0.10
0.19
0.35
8.55
3.80
1.75 0.054 0.068
0.25 0.004 0.010
0.25 0.008 0.010
0.49 0.014 0.019
8.75 0.337 0.344
4.00 0.150 0.157
M
S
S
0.25
C A
B
DETAIL A
h
A
X 45
_
e
H
h
L
1.27 BSC
0.050 BSC
6.20 0.228 0.244
0.50 0.010 0.019
1.25 0.016 0.049
5.80
0.25
0.40
0
M
A1
e
M
7
0
7
_
_
_
_
SEATING
PLANE
C
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MC74LCX32/D
相关型号:
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