MC74LVXT4052DG [ONSEMI]
Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS; 模拟多路复用器/多路解复用器高性能硅栅CMOS
| 型号： | MC74LVXT4052DG |
| 厂家： | 
ONSEMI |
| 描述： | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS |
| 文件： | 总9页 (文件大小：149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74AC86, MC74ACT86
Quad 2−Input Exclusive−OR
Gate
Features
• Outputs Source/Sink 24 mA
• Pb−Free Packages are Available
http://onsemi.com
PDIP−14
N SUFFIX
CASE 646
14
1
SOIC−14
D SUFFIX
CASE 751A
MAXIMUM RATINGS
14
Rating
Symbol
Value
Unit
1
DC Supply Voltage (Referenced to GND)
V
CC
−0.5 to
+7.0
V
TSSOP−14
DT SUFFIX
CASE 948G
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
V
−0.5 to
CC
V
V
in
14
V
+0.5
1
V
out
−0.5 to
V
CC
+0.5
SOEIAJ−14
M SUFFIX
CASE 965
DC Input Current, per Pin
I
±20
mA
mA
mA
°C
in
14
DC Output Sink/Source Current, per Pin
I
±50
±50
out
CC
1
DC V or GND Current per Output Pin
I
CC
Storage Temperature
T
stg
−65 to
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Pinout: 14−Lead Packages Conductors
(Top View)
V
CC
14
13
12
11
10
9
8
1
2
3
4
5
6
7
GND
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 8
MC74AC86/D
MC74AC86, MC74ACT86
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
5.0
5.0
Max
6.0
Unit
′AC
2.0
4.5
0
V
Supply Voltage
V
V
CC
′ACT
5.5
V , V
in out
DC Input Voltage, Output Voltage (Ref. to GND)
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
@ 3.0 V
@ 4.5 V
@ 5.5 V
@ 4.5 V
@ 5.5 V
−
150
40
25
10
8.0
−
−
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
−
−
−
−
−
ns/V
t , t
r
f
−
−
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
t , t
ns/V
r
f
−
T
J
Junction Temperature (PDIP)
Operating Ambient Temperature Range
Output Current − High
−
140
85
°C
°C
T
A
−40
−
25
−
I
−24
24
mA
mA
OH
OL
I
Output Current − Low
−
−
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
CC
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
in
DC CHARACTERISTICS
74AC
74AC
T
A
=
−40°C to
+85°C
T
A
= +25°C
V
CC
Typ
Guaranteed Limits
(V)
Symbol
Parameter
Minimum High Level
Input Voltage
Unit
Conditions
= 0.1 V
or V − 0.1 V
CC
V
V
V
3.0
4.5
5.5
1.5
2.25
2.75
2.1
2.1
V
OUT
IH
3.15
3.85
3.15
3.85
V
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
= 0.1 V
Maximum Low Level
Input Voltage
IL
OUT
V
V
or V − 0.1 V
CC
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
I
= −50 mA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
−12 mA
−24 mA
−24 mA
V
V
I
OH
V
OL
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
I
= 50 mA
OUT
Maximum Low Level
Output Voltage
*V = V or V
IN
IL
IH
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
12 mA
24 mA
24 mA
V
I
OL
I
IN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
V = V , GND
I
CC
I
I
I
5.5
5.5
−
−
−
−
75
mA
mA
V
V
= 1.65 V Max
= 3.85 V Min
†Minimum Dynamic
Output Current
OLD
OHD
CC
OLD
−75
OHD
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V
= V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE:
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V
.
CC
IN
CC
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2
MC74AC86, MC74ACT86
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74AC
74AC
T
= −40°C
A
T
A
= +25°C
to +85°C
C
= 50 pF
C
= 50 pF
L
L
V
(V)
*
Fig.
No.
CC
Min
Typ
Max
Min
Max
Symbol
Parameter
Unit
3.3
5.0
2.0
1.5
6.0
4.5
11.5
8.5
1.5
1.0
12.5
9.0
Propagation Delay
Inputs to Outputs
t
t
ns
3−5
3−5
PLH
3.3
5.0
2.0
1.5
6.5
4.5
11.5
8.5
1.5
1.0
12.5
9.5
Propagation Delay
Inputs to Outputs
ns
PHL
*Voltage Range 3.3 V is 3.3 V ±0.3 V
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
74ACT
74ACT
T
A
=
−40°C to
+85°C
T
A
= +25°C
V
CC
(V)
Typ
Guaranteed Limits
Symbol
Parameter
Unit
Conditions
V
V
V
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
= 0.1 V
Minimum High Level
Input Voltage
IH
OUT
V
V
V
or V − 0.1 V
CC
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
OUT
= 0.1 V
Maximum Low Level
Input Voltage
IL
or V − 0.1 V
CC
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
I
= −50 mA
Minimum High Level
Output Voltage
OH
OUT
*V = V or V
IH
IN
IL
4.5
5.5
−
−
3.86
4.86
3.76
4.76
V
V
V
−24 mA
−24 mA
I
I
OH
V
OL
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
= 50 mA
OUT
Maximum Low Level
Output Voltage
*V = V or V
IN
IL
IH
4.5
5.5
−
−
0.36
0.36
0.44
0.44
24 mA
24 mA
I
OL
I
IN
Maximum Input
Leakage Current
5.5
±0.1
±1.0
mA
V = V , GND
I CC
DI
Additional Max. I /Input
5.5
5.5
5.5
0.6
−
−
−
−
1.5
75
mA
mA
mA
V = V − 2.1 V
CCT
CC
I
CC
I
V
OLD
V
OHD
= 1.65 V Max
†Minimum Dynamic
Output Current
OLD
I
−
−75
= 3.85 V Min
OHD
CC
I
Maximum Quiescent
Supply Current
5.5
−
4.0
40
mA
V = V or GND
IN CC
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
74ACT
74ACT
T
= −40°C
A
T
A
= +25°C
to +85°C
C
= 50 pF
C
= 50 pF
L
L
V
(V)
*
Fig.
No.
CC
Min
Typ
Max
Min
Max
Symbol
Parameter
Unit
t
t
Propagation Delay
Propagation Delay
5.0
1.5
8.5
9.5
1.0
1.0
10.0
ns
3−5
3−5
PLH
5.0
1.5
7.0
9.5
10.5
ns
PHL
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
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3
MC74AC86, MC74ACT86
CAPACITANCE
Symbol
Value
Typ
Parameter
Unit
pF
Test Conditions
C
C
Input Capacitance
Power Dissipation Capacitance
4.5
35
V
CC
V
CC
= 5.0 V
= 5.0 V
IN
pF
PD
ORDERING INFORMATION
Device
†
Package
Shipping
MC74AC86N
PDIP−14
MC74AC86NG
PDIP−14
(Pb−Free)
25 Units / Rail
MC74ACT86N
PDIP−14
MC74ACT86NG
PDIP−14
(Pb−Free)
MC74AC86D
SOIC−14
55 Units / Rail
2500 / Tape & Reel
55 Units / Rail
MC74AC86DG
SOIC−14
(Pb−Free)
MC74AC86DR2
SOIC−14
MC74AC86DR2G
SOIC−14
(Pb−Free)
MC74ACT86D
SOIC−14
MC74ACT86DG
SOIC−14
(Pb−Free)
MC74ACT86DR2
MC74ACT86DR2G
SOIC−14
SOIC−14
(Pb−Free)
2500 / Tape & Reel
2000 / Tape & Reel
MC74AC86DTR2
MC74ACT86DTR2
MC74ACT86MEL
MC74ACT86MELG
TSSOP−14*
TSSOP−14*
SOEIAJ−14
SOEIAJ−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
4
MC74AC86, MC74ACT86
MARKING DIAGRAMS
PDIP−14
SOIC−14
TSSOP−14
SOEIAJ−14
MC74AC86N
AWLYYWWG
AC86G
AWLYWW
AC
86
74ACT86
ALYWG
ALYWG
G
ACT86G
AWLYWW
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
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5
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
14
1
8
7
B
INCHES
MILLIMETERS
A
F
DIM
A
B
C
D
F
MIN
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
0.715
0.240
0.145
0.015
0.040
L
N
C
G
H
J
K
L
M
N
0.100 BSC
2.54 BSC
0.052
0.008
0.115
0.290
−−−
0.095
0.015
0.135
0.310
10
1.32
0.20
2.92
7.37
−−−
0.38
2.41
0.38
3.43
7.87
10
−T−
SEATING
PLANE
J
_
_
K
0.015
0.039
1.01
D 14 PL
H
G
M
M
0.13 (0.005)
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6
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−A−
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
SEATING
PLANE
J
M
K
1.27 BSC
D 14 PL
0.19
0.10
0
M
S
S
0.25 (0.010)
T
B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
NOTES:
14X K REF
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
M
S
S
V
0.10 (0.004)
T
U
S
0.15 (0.006) T
U
N
0.25 (0.010)
14
8
2X L/2
M
B
L
N
−U−
PIN 1
IDENT.
F
7
1
DETAIL E
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
K
0.15 (0.006) T
U
A
−V−
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
A
B
C
D
F
G
H
J
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
J J1
1.20
−−− 0.047
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N−N
0.65 BSC
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
0.50
0.09
0.09
0.19
J1
K
−W−
C
K1 0.19
L
M
6.40 BSC
0.252 BSC
0.10 (0.004)
0
8
0
8
_
_
_
_
SEATING
PLANE
−T−
H
G
DETAIL E
D
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
01.34X6
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
MC74AC86, MC74ACT86
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
14
8
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
H
E
_
E
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
7
1
DETAIL P
Z
D
MILLIMETERS
INCHES
MIN
−−−
VIEW P
DIM MIN
MAX
MAX
0.081
0.008
0.020
0.008
0.413
0.215
A
e
A
−−−
0.05
0.35
0.10
9.90
5.10
2.05
c
A
1
b
c
0.20 0.002
0.50 0.014
0.20 0.004
D
E
e
10.50 0.390
5.45 0.201
A
b
1
1.27 BSC
0.050 BSC
H
M
7.40
0.50
1.10
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
0.13 (0.005)
E
0.10 (0.004)
0.50
L
E
M
0
10
0.90 0.028
10
_
0.035
0.056
0
_
_
_
Q
1
0.70
−−−
Z
1.42
−−−
ON Semiconductor and
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