MC74LVXU04DG [ONSEMI]

Hex Inverter(Unbuffered); 六反相器(无缓冲)
MC74LVXU04DG
型号: MC74LVXU04DG
厂家: ONSEMI    ONSEMI
描述:

Hex Inverter(Unbuffered)
六反相器(无缓冲)

栅极 触发器 逻辑集成电路 光电二极管
文件: 总6页 (文件大小:83K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74LVXU04  
Hex Inverter  
(Unbuffered)  
The MC74LVX04 is an advanced high speed CMOS unbuffered hex  
inverter. The inputs tolerate voltages up to 7.0 V, allowing the  
interface of 5.0 V systems to 3.0 V systems.  
http://onsemi.com  
MARKING  
Features  
High Speed: t = 4.1 ns (Typ) at V = 3.3 V  
PD  
CC  
DIAGRAMS  
Low Power Dissipation: I = 2 mA (Max) at T = 25°C  
CC  
A
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
14  
SOIC−14  
D SUFFIX  
CASE 751A  
LVXU04  
AWLYWW  
14  
Low Noise: V  
= 0.5 V (Max)  
OLP  
1
Pin and Function Compatible with Other Standard Logic Families  
Pb−Free Packages are Available*  
1
14  
TSSOP−14  
DT SUFFIX  
CASE 948G  
LVX  
U04  
ALYW  
14  
1
1
14  
74LVXU04  
ALYW  
SOEIAJ−14  
M SUFFIX  
CASE 965  
14  
1
1
A
=
=
=
=
Assembly Location  
Wafer Lot  
Year  
WL or L  
Y
WW or W  
Work Week  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
March, 2005 − Rev. 1  
MC74LVXU04/D  
MC74LVXU04  
V
A5  
13  
O5  
12  
A4  
11  
O4  
10  
A3  
9
O3  
8
1
CC  
2
4
A0  
O0  
O1  
O2  
O3  
O4  
O5  
14  
3
A1  
A2  
A3  
A4  
A5  
5
6
13  
11  
9
8
1
2
3
4
5
6
7
10  
12  
A0  
O0  
A1  
O1  
A2  
O2 GND  
14−Lead Pinout (Top View)  
PIN NAMES  
Pins  
Figure 1. Logic Diagram  
Function  
An  
On  
Data Inputs  
Outputs  
FUNCTION TABLE  
An  
On  
L
H
H
L
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC74LVXU04D  
SOIC−14  
55 Units / Rail  
55 Units / Rail  
MC74LVXU04DG  
SOIC−14  
(Pb−Free)  
MC74LVXU04DR2  
MC74LVXU04DR2G  
SOIC−14  
2500 Tape & Reel  
2500 Tape & Reel  
SOIC−14  
(Pb−Free)  
MC74LVXU04DT  
MC74LVXU04DTR2  
MC74LVXU04M  
TSSOP−14*  
TSSOP−14*  
SOEIAJ−14  
96 Units / Rail  
2500 Tape & Reel  
50 Units / Rail  
MC74LVXU04MG  
SOEIAJ−14  
(Pb−Free)  
50 Units / Rail  
MC74LVXU04MEL  
MC74LVXU04MELG  
SOEIAJ−14  
2000 Tape & Reel  
2000 Tape & Reel  
SOEIAJ−14  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*This package is inherently Pb−Free.  
http://onsemi.com  
2
MC74LVXU04  
MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
CC  
DC Supply Voltage  
*0.5 to )7.0  
*0.5 to )7.0  
V
IN  
DC Input Voltage  
V
V
OUT  
DC Output Voltage  
*0.5 to V )0.5  
V
CC  
I
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
Storage Temperature Range  
V < GND  
*20  
$20  
mA  
mA  
mA  
mA  
_C  
IK  
I
I
V
< GND  
O
OK  
I
$25  
OUT  
I
$50  
CC  
T
*65 to )150  
260  
STG  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature under Bias  
Thermal Resistance  
_C  
L
T
)150  
250  
_C  
_C/W  
J
q
SOIC  
TSSOP  
JA  
P
D
Power Dissipation in Still Air at 85_C  
SOIC  
TSSOP  
250  
mW  
MSL  
Moisture Sensitivity  
Flammability Rating  
ESD Withstand Voltage  
Level 1  
F
R
Oxygen Index: 30% − 35%  
UL 94−V0 @ 0.125 in  
V
ESD  
Human Body Model (Note 1)  
Machine Model (Note 2)  
> 2000  
> 200  
2000  
V
Charged Device Model (Note 3)  
I
Latchup Performance  
Above V and Below GND at 85_C (Note 4)  
$300  
mA  
Latchup  
CC  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
1. Tested to EIA/JESD22−A114−A.  
2. Tested to EIA/JESD22−A115−A.  
3. Tested to JESD22−C101−A.  
4. Tested to EIA/JESD78.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
3.6  
Unit  
V
V
CC  
Supply Voltage  
V
I
Input Voltage  
(Note 5)  
5.5  
V
V
O
Output Voltage  
(HIGH or LOW State)  
0
V
CC  
V
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
*40  
0
)85  
_C  
ns/V  
A
Dt/DV  
V
= 3.0 V $0.3 V  
100  
CC  
5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.  
http://onsemi.com  
3
 
MC74LVXU04  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T = −40 to 85°C  
A
V
CC  
V
Min  
Typ  
Max  
Min  
1.5  
2.0  
2.4  
Max  
Symbol  
Parameter  
Test Conditions  
Unit  
V
IH  
High−Level Input Voltage  
2.0  
3.0  
3.6  
1.5  
2.0  
2.4  
V
V
Low−Level Input Voltage  
High−Level Output Voltage  
2.0  
3.0  
3.6  
0.5  
0.8  
0.8  
0.5  
0.8  
0.8  
V
V
V
IL  
V
OH  
I
I
I
= −50 mA  
= −50 mA  
= −4 mA  
2.0  
3.0  
3.0  
1.9  
2.9  
2.58  
2.0  
3.0  
1.9  
2.9  
2.48  
OH  
OH  
OH  
(V = V or V )  
in  
IH  
IL  
V
OL  
Low−Level Output Voltage  
(V = V or V )  
I
OL  
I
OL  
I
OL  
= 50 mA  
= 50 mA  
= 4 mA  
2.0  
3.0  
3.0  
0.0  
0.0  
0.1  
0.1  
0.36  
0.1  
0.1  
0.44  
in  
IH  
IL  
I
Input Leakage Current  
V
V
= 5.5 V or GND  
3.6  
3.6  
±0.1  
±1.0  
mA  
mA  
in  
in  
I
Quiescent Supply Current  
= V or GND  
2.0  
20.0  
CC  
in  
CC  
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)  
r
f
T
A
= 25°C  
T = −40 to 85°C  
A
Min  
Typ  
Max  
Min  
Max  
Symbol  
Parameter  
Test Conditions  
Unit  
Propagation Delay, Input to  
Output  
t
t
,
V
V
= 2.7V  
C = 15 pF  
C = 50 pF  
L
5.4  
7.9  
10.1  
13.6  
1.0  
1.0  
12.5  
16.0  
ns  
PLH  
CC  
L
PHL  
= 3.3 ± 0.3V C = 15 pF  
4.1  
6.6  
6.2  
9.7  
1.0  
1.0  
7.5  
11.0  
CC  
L
C = 50 pF  
L
t
t
Output−to−Output Skew  
(Note 6)  
V
CC  
V
CC  
= 2.7V  
= 3.3 ±0.3V C = 50 pF  
C = 50 pF  
1.5  
1.5  
1.5  
1.5  
ns  
OSHL  
OSLH  
L
L
6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t  
) or LOW−to−HIGH (t  
); parameter  
OSHL  
OSLH  
guaranteed by design.  
CAPACITIVE CHARACTERISTICS  
T
A
= 25°C  
T = −40 to 85°C  
A
Min  
Typ  
4
Max  
Min  
Max  
Symbol  
Parameter  
Unit  
pF  
Cin  
Input Capacitance  
Power Dissipation Capacitance (Note 7)  
10  
10  
C
18  
pF  
PD  
7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
no−load dynamic power consumption; P = C V  
) = C V f + I /6 (per buffer). C is used to determine the  
CC(OPR  
PD CC in CC PD  
2
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
NOISE CHARACTERISTICS (Input t = t = 3.0 ns, C = 50 pF, V = 3.3 V, Measured in SOIC Package)  
r
f
L
CC  
T
A
= 25°C  
Typ  
0.3  
Max  
Symbol  
Characteristic  
Unit  
V
V
Quiet Output Maximum Dynamic V  
0.5  
−0.5  
2.0  
OLP  
OLV  
OL  
V
Quiet Output Minimum Dynamic V  
−0.3  
V
OL  
V
IHD  
Minimum High Level Dynamic Input Voltage  
Maximum Low Level Dynamic Input Voltage  
V
V
ILD  
0.8  
V
TEST POINT  
V
CC  
A
OUTPUT  
50%  
DEVICE  
UNDER  
TEST  
GND  
t
t
PHL  
PLH  
C *  
L
O
50% V  
CC  
*Includes all probe and jig capacitance  
Figure 2. Switching Waveforms  
Figure 3. Test Circuit  
http://onsemi.com  
4
 
MC74LVXU04  
PACKAGE DIMENSIONS  
SOIC−14  
D SUFFIX  
CASE 751A−03  
ISSUE G  
NOTES:  
−A−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
14  
8
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
−B−  
P 7 PL  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
M
M
B
0.25 (0.010)  
7
1
G
F
R X 45  
_
C
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
G
J
K
M
P
R
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
−T−  
SEATING  
PLANE  
J
M
K
D 14 PL  
M
S
S
0.25 (0.010)  
T
B
A
1.27 BSC  
0.19  
0.10  
0
7
0
7
_
_
_
_
5.80  
0.25  
6.20 0.228 0.244  
0.50 0.010 0.019  
TSSOP−14  
DT SUFFIX  
CASE 948G−01  
ISSUE A  
NOTES:  
14X K REF  
1. DIMENSIONING AND TOLERANCING PER  
M
S
S
V
ANSI Y14.5M, 1982.  
0.10 (0.004)  
T
U
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
−U−  
L
N
PIN 1  
IDENT.  
F
7
1
DETAIL E  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE −W−.  
S
K
0.15 (0.006) T U  
A
K1  
−V−  
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
A
B
C
D
F
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
J J1  
1.20  
−−− 0.047  
0.15 0.002 0.006  
0.75 0.020 0.030  
SECTION N−N  
G
H
J
J1  
K
0.65 BSC  
0.026 BSC  
0.60 0.020 0.024  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
0.50  
0.09  
0.09  
0.19  
−W−  
C
0.10 (0.004)  
K1 0.19  
L
M
6.40 BSC  
0.252 BSC  
SEATING  
PLANE  
−T−  
H
G
DETAIL E  
D
0
8
0
8
_
_
_
_
http://onsemi.com  
5
MC74LVXU04  
PACKAGE DIMENSIONS  
SOEIAJ−14  
M SUFFIX  
CASE 965−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
14  
8
E
Q
1
H
E
_
E
M
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
L
7
1
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
A
e
c
MILLIMETERS  
INCHES  
MIN  
−−−  
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
b
A
1
A
1
b
c
0.20 0.002  
0.50 0.014  
0.27 0.007  
M
0.13 (0.005)  
0.10 (0.004)  
D
E
e
10.50 0.390  
5.45 0.201  
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
E
L
L
E
M
0
10  
0.90 0.028  
10  
_
0.035  
0.056  
0
_
_
_
Q
0.70  
−−−  
1
Z
1.42  
−−−  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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Order Literature: http://www.onsemi.com/litorder  
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Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MC74LVXU04/D  

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