MC74VHC1G125DBVT1G [ONSEMI]
单非逆变缓冲器，3 态;
| 型号： | MC74VHC1G125DBVT1G |
| 厂家： | 
ONSEMI |
| 描述： | 单非逆变缓冲器，3 态 |
| 文件： | 总15页 (文件大小：478K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
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MARKING
DIAGRAMS
Noninverting 3-State Buffer
MC74VHC1G125,
MC74VHC1GT125
The MC74VHC1G125 / MC74VHC1GT125 is a single
non−inverting 3−state buffer in tiny footprint packages. The
MC74VHC1G125 has CMOS−level input thresholds while the
MC74VHC1GT125 has TTL−level input thresholds.
The internal circuit is composed of three stages, including a buffered
3−state output which provides high noise immunity and stable output.
The input structures provide protection when voltages up to 5.5 V
are applied, regardless of the supply voltage. This allows the device to
be used to interface 5 V circuits to 3 V circuits. Some output structures
SC−88A
DF SUFFIX
CASE 419A
XX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XXX MG
G
SOT−953
P5 SUFFIX
CASE 527AE
X M
1
also provide protection when V = 0 V and when the output voltage
CC
UDFN6
1.45 x 1.0
CASE 517AQ
exceeds V . These input and output structures help prevent device
CC
XM
X M
X M
destruction caused by supply voltage − input/output voltage mismatch,
battery backup, hot insertion, etc.
1
1
UDFN6
1.2 x 1.0
CASE 517AA
Features
• Designed for 2.0 V to 5.5 V V Operation
CC
• 3.5 ns t at 5 V (typ)
PD
• Inputs/Outputs Over−Voltage Tolerant up to 5.5 V
UDFN6
1.0 x 1.0
CASE 517BX
• I
Supports Partial Power Down Protection
• Source/Sink 8 mA at 3.0 V
OFF
1
• Available in SC−88A, SC−74A, SOT−953 and UDFN6 Packages
• Chip Complexity < 100 FETs
XX
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
• −Q Suffix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q100 Qualified and
PPAP Capable
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ORDERING INFORMATION
OE
A
EN
Y
See detailed ordering, marking and shipping information in the
package dimensions section on page 8 of this data sheet.
Figure 1. Logic Symbol
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
April, 2023 − Rev. 22
MC74VHC1G125/D
MC74VHC1G125, MC74VHC1GT125
V
V
A
OE
1
CC
CC
OE
1
2
3
6
5
V
CC
5
5
1
A
2
GND
2
A
NC
Y
GND
3
OE
3
Y
Y
4
4
GND
4
(SOT−953)
(SC−88A / SC−74A)
(UDFN6)
Figure 2. Pinout (Top View)
PIN ASSIGNMENT (SOT−953)
PIN ASSIGNMENT
(SC−88A / SC−74A)
PIN ASSIGNMENT (UDFN)
Pin
Function
Pin
Function
Pin
Function
1
OE
1
A
1
OE
2
3
4
5
A
GND
Y
2
3
4
5
GND
OE
Y
2
3
4
5
6
A
GND
Y
V
CC
V
CC
NC
V
CC
FUNCTION TABLE
Input
Output
OE
A
L
Y
L
L
L
H
X
H
Z
H
X = Don’t Care
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2
MC74VHC1G125, MC74VHC1GT125
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
V
CC
DC Supply Voltage
DC Input Voltage
DC Output Voltage
−0.5 to +6.5
−0.5 to +6.5
V
IN
V
V
OUT
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
V
CC
−0.5 to +6.5
−0.5 to +6.5
Power−Down Mode (V = 0 V)
CC
I
DC Input Diode Current
V
< GND
< GND
−20
−20
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
OUT
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
25
OUT
I
or I
50
CC
GND
T
−65 to +150
260
STG
T
Lead Temperature, 1 mm from Case for 10 secs
Junction Temperature Under Bias
Thermal Resistance (Note 2)
°C
L
T
+150
°C
J
q
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
377
320
324
254
154
°C/W
JA
P
D
Power Dissipation in Still Air
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
332
390
386
491
812
mW
MSL
Moisture Sensitivity
Level 1
−
−
V
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
I
Latchup Performance (Note 4)
100
mA
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
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3
MC74VHC1G125, MC74VHC1GT125
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
2.0
0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
DC Input Voltage
V
IN
5.5
V
V
OUT
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
0
0
0
V
5.5
5.5
V
CC
Power−Down Mode (V = 0 V)
CC
T
Operating Temperature Range
Input Rise and Fall Time
−55
+125
°C
A
t , t
r
V = 2.0 V
CC
0
0
0
0
20
20
10
5
ns/V
f
V
CC
V
CC
V
CC
= 2.3 V to 2.7 V
= 3.0 V to 3.6 V
= 4.5 V to 5.5 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (MC74VHC1G125)
T
A
= 25°C
−40°C ≤ T ≤ 85°C
−55°C ≤ T ≤ 125°C
A
A
Test
V
CC
Min
1.5
2.1
3.15
3.85
−
Typ
−
Max
−
Min
1.5
2.1
3.15
3.85
−
Max
−
Min
1.5
2.1
3.15
3.85
−
Max
−
Conditions
(V)
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
Symbol
Parameter
Unit
V
IH
High−Level Input
Voltage
V
−
−
−
−
−
−
−
−
−
−
−
−
V
IL
Low−Level Input
Voltage
−
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
V
−
−
−
−
−
−
−
−
−
−
−
−
V
OH
High−Level Output
Voltage
V
= V or V
IN
OH
OH
OH
OH
OH
IH
IL
I
I
I
I
I
= −50 mA
= −50 mA
= −50 mA
= −4 mA
= −8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
−
−
−
−
−
−
1.9
2.9
4.4
2.48
3.80
−
−
−
−
−
1.9
2.9
4.4
2.34
3.66
−
−
−
−
−
−
V
OL
Low−Level Output
Voltage
V
= V or V
V
IN
OL
OL
OL
OL
OL
IH
IL
I
I
I
I
I
= 50 mA
= 50 mA
= 50 mA
= 4 mA
= 8 mA
2.0
3.0
4.5
3.0
4.5
−
−
−
−
−
0.0
0.0
0.0
−
0.1
0.1
−
−
−
−
−
0.1
0.1
−
−
−
−
−
0.1
0.1
0.1
0.1
0.1
0.36
0.36
0.44
0.44
0.52
0.52
−
I
Input Leakage
Current
V
= 5.5 V or
2.0
−
−
−
−
−
−
−
−
0.1
0.25
1.0
−
−
−
−
1.0
2.5
10
−
−
−
−
1.0
2.5
10
mA
mA
mA
mA
IN
IN
GND
to 5.5
I
3−State Output
Leakage Current
V
= 0 V to
5.5
0.0
5.5
OZ
OUT
5.5 V
I
Power Off Leakage
Current
V
V
= 5.5 V or
= 5.5 V
OFF
IN
OUT
I
Quiescent Supply
Current
V
= V or
1.0
20
40
CC
IN
CC
GND
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4
MC74VHC1G125, MC74VHC1GT125
DC ELECTRICAL CHARACTERISTICS (MC74VHC1GT125)
T
A
= 25°C
−40°C ≤ T ≤ 85°C
−55°C ≤ T ≤ 125°C
A
A
Test
V
CC
Min
1.0
1.4
2.0
2.0
−
Typ
−
Max
−
Min
1.0
1.4
2.0
2.0
−
Max
−
Min
1.0
1.4
2.0
2.0
−
Max
−
Conditions
(V)
2.0
3.0
4.5
5.5
2.0
3.0
4.5
5.5
Symbol
Parameter
Unit
V
IH
High−Level Input
Voltage
V
−
−
−
−
−
−
−
−
−
−
−
−
V
IL
Low−Level Input
Voltage
−
0.28
0.45
0.8
0.8
0.28
0.45
0.8
0.8
0.28
0.45
0.8
0.8
V
V
−
−
−
−
−
−
−
−
−
−
−
−
V
OH
High−Level Output
Voltage
V
= V or V
IN
OH
OH
OH
OH
OH
IH
IL
I
I
I
I
I
= −50 mA
= −50 mA
= −50 mA
= −4 mA
= −8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
−
−
−
−
−
−
1.9
2.9
4.4
2.48
3.80
−
−
−
−
−
1.9
2.9
4.4
2.34
3.66
−
−
−
−
−
−
V
OL
Low−Level Output
Voltage
V
= V or V
V
IN
OL
OL
OL
OL
OL
IH
IL
I
I
I
I
I
= 50 mA
= 50 mA
= 50 mA
= 4 mA
= 8 mA
2.0
3.0
4.5
3.0
4.5
−
−
−
−
−
0.0
0.0
0.0
−
0.1
0.1
−
−
−
−
−
0.1
0.1
−
−
−
−
−
0.1
0.1
0.1
0.1
0.1
0.36
0.36
0.44
0.44
0.52
0.52
−
I
Input Leakage
Current
V
= 5.5 V or
2.0
−
−
−
−
−
−
−
−
−
−
0.1
0.25
1.0
−
−
−
−
−
1.0
2.5
10
−
−
−
−
−
1.0
2.5
10
mA
mA
mA
mA
mA
IN
IN
GND
to 5.5
I
3−State Output
Leakage Current
V
= 0 V to
5.5
0
OZ
OUT
5.5 V
I
Power Off Leakage
Current
V
V
= 5.5 V or
= 5.5 V
OFF
IN
OUT
I
Quiescent Supply
Current
V
= V or
5.5
5.5
1.0
20
40
CC
IN
CC
GND
I
Increase in
One Input: V
1.35
1.5
1.65
CCT
IN
Quiescent Supply
Current per Input
Pin
= 3.4 V; Other
Input at V or
CC
GND
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5
MC74VHC1G125, MC74VHC1GT125
AC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
Typ
4.5
6.4
3.5
4.5
4.5
6.4
3.5
4.5
6.5
8.0
4.8
7.0
4.0
6.0
−40°C ≤ T ≤ 85°C
−55°C ≤ T ≤ 125°C
A
A
Min
−
Max
8.0
11.5
5.5
7.5
8.0
11.5
5.1
7.1
9.7
13.2
6.8
8.8
10
Min
−
Max
9.5
Min
−
Max
12.0
16.0
8.5
Symbol
Parameter
Conditions
C = 15 pF
V
(V)
Unit
CC
t
t
t
,
Propagation Delay,
A to Y
(Figures 3 and 4)
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
ns
PLH
L
t
PHL
C = 50 pF
L
−
−
13.0
6.5
−
C = 15 pF
L
−
−
−
C = 50 pF
L
−
−
8.5
−
10.5
11.5
15.0
8.5
,
Output Enable
Time, OE to Y
(Figures 3 and 4)
C = 15 pF
L
−
−
9.5
−
ns
ns
PZL
t
PZH
C = 50 pF
L
−
−
13.0
6.0
−
C = 15 pF
L
−
−
−
C = 50 pF
L
−
−
8.0
−
10.5
14.5
18.0
10.0
12.0
10
,
Output Disable
Time, OE to Y
(Figures 3 and 4)
C = 15 pF
L
−
−
11.5
15.0
8.0
−
PLZ
t
PHZ
C = 50 pF
L
−
−
−
C = 15 pF
L
−
−
−
C = 50 pF
L
−
−
10.0
10
−
C
Input Capacitance
Output Capacitance
−
−
−
pF
pF
IN
C
Output in
High
−
−
−
−
−
−
OUT
Impedance
State
Typical @ 25°C, V = 5.0 V
CC
8.0
C
Power Dissipation Capacitance (Note 5)
pF
PD
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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6
MC74VHC1G125, MC74VHC1GT125
OPEN
Test
Switch
C , pF
L
R , W
L
V
CC
GND
Position
t
/ t
Open
See AC Characteristics Table
X
PLH PHL
R
L
t
/ t
V
1 k
1 k
PLZ PZL
CC
t
/ t
GND
DUT
OUTPUT
PHZ PZH
X = Don’t Care
R
T
C *
L
C includes probe and jig capacitance
L
R is Z
of pulse generator (typically 50 W)
T
OUT
f = 1 MHz
Figure 3. Test Circuit
V
CC
t = 3 ns
r
t = 3 ns
f
V
CC
90%
90%
INPUT
V
mi
V
mi
V
mi
V
mi
INPUT
GND
~V
10%
10%
GND
t
t
PLZ
PZL
t
t
PLH
PHL
CC
V
OH
V
V
OUTPUT
OUTPUT
mo
V
V
V
V
OUTPUT
OUTPUT
mo
mo
V
+ V
OL
OL
Y
V
V
V
OL
t
t
PHZ
PZH
t
t
PLH
PHL
V
OH
OH
V
− V
OH
Y
mo
mo
mo
V
OL
~0 V
Figure 4. Switching Waveforms
V , V
mo
t
, t
t
, t , t , t
PZL PLZ PZH PHZ
V
CC
, V
V
mi
, V
V , V
Y
PLH PHL
3.0 to 3.6
4.5 to 5.5
V
/2
/2
V
CC
V
CC
/2
/2
V
CC
V
CC
/2
/2
0.3
0.3
CC
CC
V
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7
MC74VHC1G125, MC74VHC1GT125
ORDERING INFORMATION
Device
Pin 1 Orientation
(See below)
†
Packages
Specific Device Code
Shipping
MC74VHC1G125DFT1G
SC−88A
W0
Q2
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
(Contact onsemi)
MC74VHC1G125DFT2G
(Contact onsemi)
SC−88A
SC−88A
SC−88A
SC−88A
SC−88A
SC−88A
W0
W0
W1
W1
W1
W1
Q4
Q2
Q2
Q4
Q2
Q4
MC74VHC1G125DFT1G−Q
(Contact onsemi)
MC74VHC1GT125DFT1G
(Contact onsemi)
MC74VHC1GT125DFT2G
(Contact onsemi)
MC74VHC1GT125DFT1G−Q
(Contact onsemi)
MC74VHC1GT125DFT2G−Q
(Contact onsemi)
MC74VHC1G125DBVT1G
MC74VHC1GT125DBVT1G
MC74VHC1G125P5T5G
SC−74A
SC−74A
SOT−953
SOT−953
W0
W1
T
Q4
Q4
Q2
Q2
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
8000 / Tape & Reel
MC74VHC1GT125P5T5G
(Contact onsemi)
TBD
MC74VHC1G125MU1TCG
(Contact onsemi)
UDFN6, 1.45 x 1.0, 0.5P
TBD
Q4
3000 / Tape & Reel
MC74VHC1GT125MU1TCG
MC74VHC1GT125MU2TCG
UDFN6, 1.45 x 1.0, 0.5P
UDFN6, 1.2 x 1.0, 0.4P
UDFN6, 1.0 x 1.0, 0.35P
D
7
Q4
Q4
Q4
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
MC74VHC1G125MU3TCG
(Contact onsemi)
TBD
MC74VHC1GT125MU3TCG
UDFN6, 1.0 x 1.0, 0.35P
L
Q4
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*−Q Suffix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
DATE 18 JAN 2018
SCALE 2:1
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
PLANE
END VIEW
C
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
GENERIC
SOLDERING FOOTPRINT*
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
= Specific Device Code
= Date Code
2.40
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE M
SCALE 2:1
DATE 11 APR 2023
GENERIC MARKING
DIAGRAM*
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
XXXMG
G
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
STYLE 1:
STYLE 2:
STYLE 3:
PIN 1. ANODE 1
2. N/C
STYLE 4:
STYLE 5:
PIN 1. BASE
PIN 1. ANODE
2. EMITTER
3. BASE
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
4. COLLECTOR
5. CATHODE
4. CATHODE 3
5. CATHODE 4
5. GATE 2
STYLE 9:
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
STYLE 7:
STYLE 8:
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
PIN 1. BASE
2. EMITTER
3. BASE
PIN 1. CATHODE
2. COLLECTOR
3. N/C
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
4. COLLECTOR
5. COLLECTOR
4. BASE
5. EMITTER
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
DATE 03 SEP 2010
1
SCALE 8:1
EDGE OF PACKAGE
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
REFERENCE
Bottom View
MILLIMETERS
2X
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
(Optional)
A
0.10
C
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
b
D
E
0.127 REF
2X
0.15
0.25
0.10
C
C
1.20 BSC
1.00 BSC
A3
e
0.40 BSC
L
0.30
0.40
0.15
0.50
(A3)
L1 0.00
L2 0.40
0.10
0.08
A1
DETAIL B
Side View
(Optional)
A
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
10X
C
SIDE VIEW
C
A1
X M
5X L
3
1
X
M
= Specific Device Code
= Date Code
L2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
6X b
6
4
0.10
0.05
C
A B
e
C
NOTE 3
MOUNTING FOOTPRINT*
BOTTOM VIEW
6X
0.42
6X
0.22
0.40
PITCH
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON22068D
6 PIN UDFN, 1.2X1.0, 0.4P
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
1
SCALE 4:1
DATE 15 MAY 2008
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10
C A B
NOTE 3
0.05
C
BOTTOM VIEW
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON30313E
UDFN6, 1.45x1.0, 0.5P
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
SCALE 4:1
DATE 18 MAY 2011
NOTES:
A
B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
REFERENCE
2X
0.10
C
MILLIMETERS
DIM MIN
MAX
0.55
0.05
A
A1
A3
b
0.45
0.00
0.13 REF
2X
0.10
C
TOP VIEW
0.12
0.22
A3
D
E
e
L
1.00 BSC
1.00 BSC
0.35 BSC
0.05
C
C
A
0.25
0.30
0.35
0.40
L1
0.05
A1
RECOMMENDED
SEATING
PLANE
C
SIDE VIEW
e
SOLDERING FOOTPRINT*
05.4X8
6X
0.22
5X L
3
1
L1
1.18
6
4
1
0.35
6X b
0.53
PKG
PITCH
M
0.10
C
C
A B
OUTLINE
DIMENSIONS: MILLIMETERS
M
NOTE 3
0.05
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
X M
1
X
= Specific Device Code
M = Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON56787E
UDFN6, 1x1, 0.35P
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
DATE 02 AUG 2011
SCALE 4:1
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
H
E
INDICATOR
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
e
0.80
0.35 BSC
HE
L
L2
L3
0.95
1.00
0.175 REF
0.10
1.05
5X
L
0.05
−−−
0.15
0.15
−−−
5X
5X
GENERIC
MARKING DIAGRAM*
L3
L2
XM
1
5X
b
0.08 X
Y
BOTTOM VIEW
X
M
= Specific Device Code
= Month Code
SOLDERING FOOTPRINT*
*This information is generic. Please refer
to device data sheet for actual part
marking.
5X
0.35
5X
0.20
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
PACKAGE
OUTLINE
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON26457D
SOT−953
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
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