MC74VHC1GT32DTTG [ONSEMI]

AHC/VHC SERIES, 2-INPUT OR GATE, PDSO5, SC-59, SOT-23, TSOP-5;
MC74VHC1GT32DTTG
型号: MC74VHC1GT32DTTG
厂家: ONSEMI    ONSEMI
描述:

AHC/VHC SERIES, 2-INPUT OR GATE, PDSO5, SC-59, SOT-23, TSOP-5

转换器 电平转换器 栅
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MC74VHC1GT32  
2-Input OR Gate/CMOS  
Logic Level Shifter  
The MC74VHC1GT32 is an advanced high speed CMOS 2–input OR  
gate fabricated with silicon gate CMOS technology. It achieves high speed  
operation similar to equivalent Bipolar Schottky TTL while maintaining  
CMOS low power dissipation.  
http://onsemi.com  
The internal circuit is composed of three stages, including a buffer  
output which provides high noise immunity and stable output.  
MARKING  
The device input is compatible with TTL–type input thresholds and the  
output has a full 5 V CMOS level output swing. The input protection  
circuitry on this device allows overvoltage tolerance on the input,  
allowing the device to be used as a logic–level translator from 3.0 V  
CMOS logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V  
CMOS Logic while operating at the high–voltage power supply.  
The MC74VHC1GT32 input structure provides protection when  
voltages up to 7 V are applied, regardless of the supply voltage. This  
allows the MC74VHC1GT32 to be used to interface 5 V circuits to 3 V  
DIAGRAMS  
SC–88A / SOT–353/SC–70  
DF SUFFIX  
d
VN  
CASE 419A  
Pin 1  
d = Date Code  
circuits. The output structures also provide protection when V  
= 0 V.  
CC  
These input and output structures help prevent device destruction caused  
by supply voltage – input/output voltage mismatch, battery backup, hot  
insertion, etc.  
TSOP–5/SOT–23/SC–59  
DT SUFFIX  
d
VN  
CASE 483  
High Speed: t  
= 3.5 ns (Typ) at V  
= 5 V  
PD  
Low Power Dissipation: I  
CC  
= 2 µA (Max) at T = 25°C  
Pin 1  
CC  
A
d = Date Code  
TTL–Compatible Inputs: V = 0.8 V; V = 2.0 V  
IL  
IH  
> 0.8 V ; V  
CMOS–Compatible Outputs: V  
< 0.1 V @Load  
OH  
CC OL CC  
Power Down Protection Provided on Inputs and Outputs  
Balanced Propagation Delays  
Pin and Function Compatible with Other Standard Logic Families  
Chip Complexity: FETs = 65; Equivalent Gates = 15  
PIN ASSIGNMENT  
1
2
3
4
5
IN B  
IN A  
GND  
OUT Y  
V
CC  
FUNCTION TABLE  
5
V
1
2
IN B  
IN A  
GND  
CC  
Inputs  
Output  
Y
A
B
L
L
L
H
L
L
H
H
H
H
H
4
OUT Y  
3
H
Figure 1. Pinout (Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
IN A  
IN B  
1  
OUT Y  
Figure 2. Logic Symbol  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
November, 2001 – Rev. 4  
MC74VHC1GT32/D  
MC74VHC1GT32  
MAXIMUM RATINGS (Note 1)  
Symbol  
Characteristics  
Value  
Unit  
V
V
V
V
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
–0.5 to +7.0  
–0.5 to +7.0  
–0.5 to 7.0  
CC  
V
IN  
V
= 0  
V
OUT  
CC  
High or Low State  
–0.5 to V  
CC  
+ 0.5  
I
I
I
I
Input Diode Current  
–20  
mA  
mA  
mA  
mA  
mW  
_C/W  
°C  
IK  
Output Diode Current  
DC Output Current, per Pin  
V
< GND; V > V  
OUT CC  
+20  
+25  
OK  
OUT  
OUT  
CC  
DC Supply Current, V  
CC  
and GND  
+50  
P
Power dissipation in still air  
Thermal resistance  
SC–88A, TSOP–5  
SC–88A, TSOP–5  
200  
D
q
333  
JA  
T
Lead temperature, 1 mm from case for 10 s  
Junction temperature under bias  
Storage temperature  
260  
L
J
T
+150  
–65 to +150  
°C  
T
°C  
stg  
V
ESD  
ESD Withstand Voltage  
Human Body Model (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
> 2000  
> 200  
N/A  
V
I
Latch–Up Performance  
Above V  
and Below GND at 125°C (Note 5)  
CC  
±500  
mA  
Latch–Up  
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those  
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional  
operation should be restricted to the Recommended Operating Conditions.  
2. Tested to EIA/JESD22–A114–A  
3. Tested to EIA/JESD22–A115–A  
4. Tested to JESD22–C101–A  
5. Tested to EIA/JESD78  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Characteristics  
Min  
3.0  
0.0  
Max  
5.5  
5.5  
5.5  
Unit  
V
V
V
V
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
CC  
V
IN  
V
= 0  
0.0  
0.0  
V
OUT  
CC  
High or Low State  
V
CC  
T
Operating Temperature Range  
Input Rise and Fall Time  
–55  
+125  
°C  
A
t , t  
r
V
CC  
V
CC  
= 3.3 V ± 0.3 V  
= 5.0 V ± 0.5 V  
0
0
100  
20  
ns/V  
f
DEVICE JUNCTION TEMPERATURE VERSUS  
TIME TO 0.1% BOND FAILURES  
Junction  
Temperature °C  
FAILURE RATE OF PLASTIC = CERAMIC  
UNTIL INTERMETALLICS OCCUR  
Time, Hours  
Time, Years  
80  
1,032,200  
419,300  
178,700  
79,600  
37,000  
17,800  
8,900  
117.8  
47.9  
20.4  
9.4  
90  
100  
110  
120  
130  
140  
1
4.2  
1
10  
100  
1000  
2.0  
TIME, YEARS  
1.0  
Figure 3. Failure Rate vs. Time Junction  
Temperature  
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2
MC74VHC1GT32  
DC ELECTRICAL CHARACTERISTICS  
V
CC  
T
A
= 25°C  
T
A
85°C  
–55 T 125°C  
A
Symbol  
Parameter  
Test Conditions  
(V)  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Unit  
V
V
V
Minimum High–Level  
Input Voltage  
3.0  
4.5  
5.5  
1.4  
2.0  
2.0  
1.4  
2.0  
2.0  
1.4  
2.0  
2.0  
V
IH  
Maximum Low–Level  
Input Voltage  
3.0  
4.5  
5.5  
0.53  
0.8  
0.8  
0.53  
0.8  
0.8  
0.53  
0.8  
0.8  
V
IL  
V
I
= V or V  
= –50 µA  
3.0  
4.5  
2.9  
4.4  
3.0  
4.5  
2.9  
4.4  
2.9  
4.4  
V
V
Minimum High–Level  
Output Voltage  
IN  
OH  
IH  
IL  
OH  
V
IN  
= V or V  
IH IL  
V
= V or V  
IH  
IN  
OH  
OH  
IL  
I
I
= –4 mA  
= –8 mA  
3.0  
4.5  
2.58  
3.94  
2.48  
3.80  
2.34  
3.66  
V
I
= V or V  
IH  
3.0  
4.5  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
V
V
OL  
Maximum Low–Level  
Output Voltage  
IN  
OL  
IL  
= 50 µA  
V
IN  
= V or V  
IH IL  
V
= V or V  
IH  
IN  
OL  
OL  
IL  
I
I
= 4 mA  
= 8 mA  
3.0  
4.5  
0.36  
0.36  
0.44  
0.44  
0.52  
0.52  
I
I
I
I
Maximum Input  
Leakage Current  
V
= 5.5 V or GND  
0 to  
5.5  
±0.1  
±1.0  
±1.0  
µA  
µA  
mA  
µA  
IN  
IN  
Maximum Quiescent  
Supply Current  
V
IN  
= V  
CC  
or GND  
5.5  
5.5  
0.0  
2.0  
20  
40  
CC  
Quiescent Supply  
Current  
Input: V = 3.4 V  
IN  
1.35  
0.5  
1.50  
5.0  
1.65  
10  
CCT  
OPD  
Output Leakage  
Current  
V
OUT  
= 5.5 V  
AC ELECTRICAL CHARACTERISTICS (C  
= 50 pF, Input t = t = 3.0ns)  
load  
r
f
T
A
= 25°C  
T
A
85°C  
–55 T 125°C  
A
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Maximum  
Propogation Delay,  
Input A or B to Y  
Test Conditions  
Unit  
t
t
,
V
V
= 3.3 ± 0.3 V  
C
C
= 15 pF  
= 50 pF  
4.8  
6.1  
7.9  
11.4  
9.5  
13.0  
11.5  
15.5  
ns  
PLH  
PHL  
CC  
L
L
= 5.0 ± 0.5 V  
C
C
= 15 pF  
= 50 pF  
3.7  
4.4  
5.5  
7.5  
6.5  
8.5  
8.0  
10.0  
CC  
L
L
C
Maximum Input  
Capacitance  
5.5  
10  
10  
10  
pF  
pF  
IN  
Typical @ 25°C, V  
= 5.0 V  
CC  
11  
C
Power Dissipation Capacitance (Note 6)  
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
Average operating current can be obtained by the equation: I  
PD  
6. C  
PD  
= C V is used to determine the no–load dynamic  
f + I . C  
CC(OPR)  
V .  
CC  
PD CC in CC PD  
2
power consumption; P = C  
V  
f + I  
in CC  
D
PD  
CC  
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3
MC74VHC1GT32  
TEST POINT  
OUTPUT  
50%  
PLH  
50% V  
t
Input A or B  
Output Y  
CC  
DEVICE  
UNDER  
TEST  
GND  
t
C *  
L
PHL  
V
OH  
50% V  
CC  
V
OL  
*Includes all probe and jig capacitance  
Figure 4. Switching Waveforms  
Figure 5. Test Circuit  
DEVICE ORDERING INFORMATION  
Device Nomenclature  
Device  
Temp  
Range  
Identifier  
Tape &  
Reel  
Suffix  
Circuit  
Package  
Suffix  
Package  
Type  
Tape and Reel  
Size  
Indicator  
MC  
Function  
Technology  
Device Order Number  
SC–88A /  
SOT–353  
/ SC–70  
178 mm (7”)  
3000 Unit  
MC74VHC1GT32DFT1  
74  
74  
74  
VHC1G  
VHC1G  
VHC1G  
T32  
T32  
T32  
DF  
T1  
T2  
T1  
SC–88A /  
SOT–353  
/ SC–70  
178 mm (7”)  
3000 Unit  
MC74VHC1GT32DFT2  
MC74VHC1GT32DTT1  
MC  
DF  
TSOPS /  
SOT–23  
/ SC–59  
178 mm (7”)  
3000 Unit  
MC  
DT  
http://onsemi.com  
4
MC74VHC1GT32  
TAPE TRAILER  
(Connected to Reel Hub)  
NO COMPONENTS  
160 mm MIN  
TAPE LEADER  
NO COMPONENTS  
400 mm MIN  
COMPONENTS  
DIRECTION OF FEED  
CAVITY TOP TAPE  
TAPE  
Figure 6. Tape Ends for Finished Goods  
TAPE DIMENSIONS mm  
4.00  
4.00  
Ğ1.50 TYP  
2.00  
1.75  
3.50 $0.50  
8.00 $0.30  
1
Ğ1.00 MIN  
DIRECTION OF FEED  
Figure 7. SC–70–5/SC–88A/SOT–353 DFT1 Reel Configuration/Orientation  
TAPE DIMENSIONS mm  
4.00  
4.00  
Ğ1.50 TYP  
2.00  
1.75  
3.50 $0.50  
8.00 $0.30  
1
Ğ1.00 MIN  
DIRECTION OF FEED  
Figure 8. SC–70/SC–88A/SOT–353 DFT2 and SOT23–5/TSOP–5/SC59–5 DTT1 Reel Configuration/Orientation  
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5
MC74VHC1GT32  
t MAX  
13.0 mm $0.2 mm  
(0.512 in $0.008 in)  
1.5 mm MIN  
(0.06 in)  
50 mm MIN  
(1.969 in)  
20.2 mm MIN  
(0.795 in)  
A
FULL RADIUS  
G
Figure 9. Reel Dimensions  
REEL DIMENSIONS  
Tape Size  
T and R Suffix  
A Max  
G
t Max  
8 mm  
T1, T2  
178 mm  
(7 in)  
8.4 mm, + 1.5 mm, –0.0  
(0.33 in + 0.059 in, –0.00)  
14.4 mm  
(0.56 in)  
DIRECTION OF FEED  
BARCODE LABEL  
POCKET  
HOLE  
Figure 10. Reel Winding Direction  
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6
MC74VHC1GT32  
PACKAGE DIMENSIONS  
SC–88A/SOT–353/SC–70  
DF SUFFIX  
5–LEAD PACKAGE  
CASE 419A–01  
ISSUE E  
A
G
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
V
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
5
1
4
3
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
–B–  
S
2
0.026 BSC  
0.65 BSC  
---  
0.004  
0.004  
0.004  
0.010  
0.012  
---  
0.10  
0.10  
0.10  
0.25  
0.30  
K
N
S
V
0.008 REF  
0.20 REF  
M
M
B
0.2 (0.008)  
D 5 PL  
0.079  
0.012  
0.087  
0.016  
2.00  
0.30  
2.20  
0.40  
N
J
C
K
H
0.5 mm (min)  
1.9 mm  
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7
MC74VHC1GT32  
PACKAGE DIMENSIONS  
TSOP–5/SOT–23/SC–59  
DT SUFFIX  
5–LEAD PACKAGE  
CASE 483–01  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
ISSUE A  
D
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD  
FINISH THICKNESS. MINIMUM LEAD THICKNESS  
IS THE MINIMUM THICKNESS OF BASE  
MATERIAL.  
5
4
3
B
C
S
1
2
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
L
G
A
B
C
D
G
H
J
2.90  
1.30  
0.90  
0.25  
0.85  
0.013  
0.10  
0.20  
1.25  
0
3.10 0.1142 0.1220  
1.70 0.0512 0.0669  
1.10 0.0354 0.0433  
0.50 0.0098 0.0197  
1.00 0.0335 0.0413  
0.100 0.0005 0.0040  
0.26 0.0040 0.0102  
0.60 0.0079 0.0236  
1.55 0.0493 0.0610  
A
J
0.05 (0.002)  
K
L
H
M
K
M
S
10  
0
3.00 0.0985 0.1181  
10  
_
_
_
_
2.50  
0.094  
2.4  
0.037  
0.95  
0.074  
1.9  
0.037  
0.95  
0.028  
0.7  
0.039  
1.0  
inches  
mm  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or  
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attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.  
PUBLICATION ORDERING INFORMATION  
Literature Fulfillment:  
JAPAN: ON Semiconductor, Japan Customer Focus Center  
4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031  
Phone: 81–3–5740–2700  
Literature Distribution Center for ON Semiconductor  
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Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada  
Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada  
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ON Semiconductor Website: http://onsemi.com  
For additional information, please contact your local  
Sales Representative.  
N. American Technical Support: 800–282–9855 Toll Free USA/Canada  
MC74VHC1GT32/D  

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